JP2014221558A5 - - Google Patents
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- Publication number
- JP2014221558A5 JP2014221558A5 JP2014158040A JP2014158040A JP2014221558A5 JP 2014221558 A5 JP2014221558 A5 JP 2014221558A5 JP 2014158040 A JP2014158040 A JP 2014158040A JP 2014158040 A JP2014158040 A JP 2014158040A JP 2014221558 A5 JP2014221558 A5 JP 2014221558A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- release film
- release
- resin layer
- film according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 28
- 239000004793 Polystyrene Substances 0.000 claims description 6
- 229920000728 polyester Polymers 0.000 claims description 6
- 229920002223 polystyrene Polymers 0.000 claims description 6
- 229920000098 polyolefin Polymers 0.000 claims description 4
- -1 polypropylene Polymers 0.000 claims description 4
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-Methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 239000011528 polyamide (building material) Substances 0.000 claims description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014158040A JP5999146B2 (ja) | 2011-10-31 | 2014-08-01 | 離型フィルム |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011238809 | 2011-10-31 | ||
JP2011238809 | 2011-10-31 | ||
JP2014158040A JP5999146B2 (ja) | 2011-10-31 | 2014-08-01 | 離型フィルム |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012035473A Division JP5644791B2 (ja) | 2011-10-31 | 2012-02-21 | 離型フィルム |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014221558A JP2014221558A (ja) | 2014-11-27 |
JP2014221558A5 true JP2014221558A5 (he) | 2015-05-21 |
JP5999146B2 JP5999146B2 (ja) | 2016-09-28 |
Family
ID=48711504
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012035473A Active JP5644791B2 (ja) | 2011-10-31 | 2012-02-21 | 離型フィルム |
JP2014158040A Expired - Fee Related JP5999146B2 (ja) | 2011-10-31 | 2014-08-01 | 離型フィルム |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012035473A Active JP5644791B2 (ja) | 2011-10-31 | 2012-02-21 | 離型フィルム |
Country Status (1)
Country | Link |
---|---|
JP (2) | JP5644791B2 (he) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6299933B2 (ja) * | 2016-03-30 | 2018-03-28 | 住友ベークライト株式会社 | プリント回路基板製造用離型フィルムおよび成型品の製造方法 |
CN108221477B (zh) * | 2016-12-09 | 2020-06-19 | 松本涂层科技(昆山)有限公司 | 一种柔性线路板压合用阻胶离型纸及其制备方法 |
JP2018178106A (ja) * | 2017-04-06 | 2018-11-15 | 積水化学工業株式会社 | 離型フィルム |
CN107234764B (zh) * | 2017-07-07 | 2023-11-07 | 昆山致信天城电子材料有限公司 | 一种耐高段差的高温离型膜及制造工艺 |
JP7343030B1 (ja) | 2022-09-29 | 2023-09-12 | 住友ベークライト株式会社 | 離型フィルムおよび成型品の製造方法 |
JP7343029B1 (ja) | 2022-09-29 | 2023-09-12 | 住友ベークライト株式会社 | 離型フィルム |
CN115534461B (zh) * | 2022-11-29 | 2023-03-28 | 苏州博理新材料科技有限公司 | 一种五层离型膜及其制备方法和用途 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03293126A (ja) * | 1990-04-11 | 1991-12-24 | Sumitomo Bakelite Co Ltd | 離型多層フィルム |
JPH04286640A (ja) * | 1991-03-15 | 1992-10-12 | Sumitomo Bakelite Co Ltd | 多層フイルム |
JP2002079630A (ja) * | 2000-06-28 | 2002-03-19 | Sumitomo Bakelite Co Ltd | 離型多層フィルム及びカバーレイ成形方法 |
JP2003276140A (ja) * | 2002-03-25 | 2003-09-30 | Sumitomo Bakelite Co Ltd | 離型多層フィルム及びカバーレイ成形方法 |
JP2005014598A (ja) * | 2003-05-30 | 2005-01-20 | Mitsubishi Plastics Ind Ltd | 離型用積層フィルム |
TWI476103B (zh) * | 2003-07-01 | 2015-03-11 | Sumitomo Bakelite Co | A release film and a method of manufacturing a flexible printed wiring board using the release film |
JP4826196B2 (ja) * | 2005-10-05 | 2011-11-30 | 住友ベークライト株式会社 | 離型フィルムおよび回路基板の製造方法 |
JP4598644B2 (ja) * | 2005-10-06 | 2010-12-15 | 積水化学工業株式会社 | 多層離型フィルム及び多層離型フィルムの製造方法 |
JP2007175885A (ja) * | 2005-12-27 | 2007-07-12 | Asahi Kasei Chemicals Corp | 離型フィルム |
JP5353217B2 (ja) * | 2008-12-11 | 2013-11-27 | 住友ベークライト株式会社 | 離型フィルム並びにそれを用いた接着方法及び回路基板の製造方法 |
-
2012
- 2012-02-21 JP JP2012035473A patent/JP5644791B2/ja active Active
-
2014
- 2014-08-01 JP JP2014158040A patent/JP5999146B2/ja not_active Expired - Fee Related
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