JP2014220264A5 - - Google Patents

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Publication number
JP2014220264A5
JP2014220264A5 JP2013096010A JP2013096010A JP2014220264A5 JP 2014220264 A5 JP2014220264 A5 JP 2014220264A5 JP 2013096010 A JP2013096010 A JP 2013096010A JP 2013096010 A JP2013096010 A JP 2013096010A JP 2014220264 A5 JP2014220264 A5 JP 2014220264A5
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JP
Japan
Prior art keywords
substrate
mark
measurement
pattern
lithographic apparatus
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JP2013096010A
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English (en)
Japanese (ja)
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JP6245838B2 (ja
JP2014220264A (ja
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Priority to JP2013096010A priority Critical patent/JP6245838B2/ja
Priority claimed from JP2013096010A external-priority patent/JP6245838B2/ja
Priority to US14/263,876 priority patent/US9257262B2/en
Publication of JP2014220264A publication Critical patent/JP2014220264A/ja
Publication of JP2014220264A5 publication Critical patent/JP2014220264A5/ja
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JP2013096010A 2013-04-30 2013-04-30 リソグラフィ装置、リソグラフィ方法、および物品の製造方法 Active JP6245838B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013096010A JP6245838B2 (ja) 2013-04-30 2013-04-30 リソグラフィ装置、リソグラフィ方法、および物品の製造方法
US14/263,876 US9257262B2 (en) 2013-04-30 2014-04-28 Lithography apparatus, lithography method, and method of manufacturing article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013096010A JP6245838B2 (ja) 2013-04-30 2013-04-30 リソグラフィ装置、リソグラフィ方法、および物品の製造方法

Publications (3)

Publication Number Publication Date
JP2014220264A JP2014220264A (ja) 2014-11-20
JP2014220264A5 true JP2014220264A5 (enExample) 2016-06-23
JP6245838B2 JP6245838B2 (ja) 2017-12-13

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ID=51789553

Family Applications (1)

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JP2013096010A Active JP6245838B2 (ja) 2013-04-30 2013-04-30 リソグラフィ装置、リソグラフィ方法、および物品の製造方法

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US (1) US9257262B2 (enExample)
JP (1) JP6245838B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014220263A (ja) * 2013-04-30 2014-11-20 キヤノン株式会社 リソグラフィ装置、及び物品の製造方法
WO2017108453A1 (en) * 2015-12-24 2017-06-29 Asml Netherlands B.V. Methods of controlling a patterning process, device manufacturing method, control system for a lithographic apparatus and lithographic apparatus
JP6791051B2 (ja) * 2017-07-28 2020-11-25 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム描画装置及びマルチ荷電粒子ビーム描画方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59124129A (ja) 1982-12-29 1984-07-18 Fujitsu Ltd 電子ビ−ム露光方法
JPH03152540A (ja) * 1989-11-09 1991-06-28 Fujitsu Ltd マスク基板およびこれを用いたフォトマスクの作成方法
JP3370317B2 (ja) * 1991-07-18 2003-01-27 大日本印刷株式会社 アライメントパターンを有するパターン版の描画方法及びその方法によって描画されたパターン版
WO1999050712A1 (en) * 1998-03-26 1999-10-07 Nikon Corporation Exposure method and system, photomask, method of manufacturing photomask, micro-device and method of manufacturing micro-device
JP4454706B2 (ja) * 1998-07-28 2010-04-21 キヤノン株式会社 電子ビーム露光方法及び装置、ならびにデバイス製造方法
JP4151286B2 (ja) * 2002-03-14 2008-09-17 日本電気株式会社 重ね合わせ露光方法と露光装置
JP2004128196A (ja) * 2002-10-02 2004-04-22 Hitachi High-Technologies Corp 電子線描画装置と電子線描画方法
US7897942B1 (en) 2007-12-20 2011-03-01 Kla-Tencor Corporation Dynamic tracking of wafer motion and distortion during lithography

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