JP2014216348A - Illuminating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an illuminating device in which inclining installation of a surrounding wall member can be prevented.SOLUTION: An illuminating device includes a substrate, a wiring pattern provided on the surface of the substrate, a light-emitting element provided on the wiring pattern, a surrounding wall member provided to surround the light-emitting element, a joint provided between the substrate and the surrounding wall member, and a coating part provided around the wiring pattern that is provided at least in a region where the surrounding wall member is installed between the substrate and the joint.

Description

  Embodiments described below generally relate to lighting devices.

A substrate, a wiring pattern provided on the surface of the substrate, a plurality of light emitting diodes (LEDs) provided on the wiring pattern, and a circle bonded to the surface of the substrate so as to surround the plurality of light emitting diodes There is an illuminating device including an annular surrounding wall member and a sealing portion provided inside the surrounding wall member.
In such an illuminating device, since the light emitting diode is provided inside the surrounding wall member, a linear wiring pattern extending below the surrounding wall member in the thickness direction of the surrounding wall member is provided.
If there are irregularities due to the linear wiring pattern in the area where the surrounding wall member is installed, the surrounding wall member may be inclined and installed. If the surrounding wall member is installed at an inclination, the light distribution characteristics vary, the adhesive application state varies, the airtightness / adhesion strength decreases, or the resin filled inside the surrounding wall member is surrounded by the surrounding wall. There is a risk of leakage to the outside of the member.

JP 2013-25935 A

  The problem to be solved by the present invention is to provide an illuminating device that can prevent the surrounding wall member from being inclined and installed.

  An illumination device according to an embodiment includes: a substrate; a wiring pattern provided on a surface of the substrate; a light emitting element provided on the wiring pattern; and an enclosure wall member provided so as to surround the light emitting element. A joint provided between the substrate and the surrounding wall member; between the substrate and the joint, provided at least in a region where the surrounding wall member is installed; And a covering portion provided around the wiring pattern.

  According to the embodiment of the present invention, it is possible to provide an illuminating device that can suppress the surrounding wall member from being inclined.

It is a schematic perspective view for illustrating the illuminating device 1 which concerns on this Embodiment. It is a schematic exploded view for illustrating the illuminating device 1 which concerns on this Embodiment. 3 is a schematic plan view of a light emitting unit 20. FIG. It is a schematic cross section for illustrating the case where the coating | coated part 29 is not provided. 4 is a schematic cross-sectional view for illustrating a covering portion 29. FIG. 4 is a schematic cross-sectional view for illustrating a covering portion 29. FIG. It is a schematic cross section for illustrating the coating | coated part 39 which concerns on other embodiment. (A), (b) is a schematic cross section for illustrating the coating | coated part 39 which concerns on other embodiment. It is a schematic diagram for illustrating the area | region where the surrounding wall member 26 which concerns on other embodiment is installed. It is a schematic diagram for illustrating the area | region where the surrounding wall member 26 which concerns on other embodiment is installed.

The first invention includes: a substrate; a wiring pattern provided on a surface of the substrate; a light emitting element provided on the wiring pattern; an enclosure wall member provided so as to surround the light emitting element; A joint provided between the substrate and the surrounding wall member; and between the substrate and the joint, provided at least in a region where the surrounding wall member is installed. And a covering portion provided around the wiring pattern.
According to this lighting device, the surrounding wall member can be prevented from being inclined.

According to a second invention, in the first invention, the covering portion is provided on a first portion provided to cover an area where the surrounding wall member is installed, and on the first portion, And a second portion provided around the first portion provided on the wiring pattern.
According to this lighting device, the surrounding wall member can be prevented from being inclined. Moreover, the malfunction by the pinhole etc. of a coating | coated part can be suppressed and by extension, the reliability of an illuminating device can further be improved.

According to a third invention, in the first invention, the covering portion is an area where the surrounding wall member is installed, and the third portion provided around the wiring pattern, the wiring pattern, and the wiring pattern And a fourth part provided on the third part.
According to this lighting device, the surrounding wall member can be prevented from being inclined. Moreover, the malfunction by the pinhole etc. of a coating | coated part can be suppressed and by extension, the reliability of an illuminating device can further be improved.

4th invention is the illuminating device which further comprised the support part provided in the area | region where the said surrounding wall member is installed in 1st invention. And the said coating | coated part is provided at the circumference | surroundings of the said wiring pattern provided in the area | region in which the said surrounding wall member is installed, and the circumference | surroundings of the said support part.
According to this lighting device, it is possible to further suppress the surrounding wall member from being inclined.

A fifth invention is the lighting device according to the fourth invention, wherein the support portion is connected to the wiring pattern.
According to this lighting device, it is possible to further suppress the surrounding wall member from being inclined.

According to a sixth invention, in the fourth or fifth invention, the covering portion includes a first portion provided so as to cover an area where the surrounding wall member is installed, and the first portion. An illumination having a periphery of the first portion provided on the wiring pattern and a second portion provided on the periphery of the first portion provided on the support portion. Device.
According to this lighting device, it is possible to further suppress the surrounding wall member from being inclined. Moreover, the malfunction by the pinhole etc. of a coating | coated part can be suppressed and by extension, the reliability of an illuminating device can further be improved.

According to a seventh invention, in the fourth or fifth invention, the covering portion is an area where the surrounding wall member is installed, and is provided around the wiring pattern and around the support portion. 3, and a fourth portion provided on the wiring pattern, on the support portion, and on the third portion.
According to this lighting device, the surrounding wall member can be prevented from being inclined. Moreover, the malfunction by the pinhole etc. of a coating | coated part can be suppressed and by extension, the reliability of an illuminating device can further be improved.

  An eighth invention is the lighting device according to any one of the first to seventh inventions, further comprising: a power supply terminal electrically connected to the wiring pattern; and a socket fitted to the power supply terminal. is there.

Hereinafter, embodiments will be illustrated with reference to the drawings. In addition, in each drawing, the same code | symbol is attached | subjected to the same component and detailed description is abbreviate | omitted suitably.
1 and 2 are schematic perspective views for illustrating the lighting device 1 according to the present embodiment.
FIG. 1 is a schematic perspective view of the lighting device 1, and FIG. 2 is a schematic exploded view of the lighting device 1.
In FIGS. 1 and 2, the sealing portion 27 is omitted to make the drawing easier to see.
FIG. 3 is a schematic plan view of the light emitting unit 20.

As shown in FIGS. 1 and 2, the lighting device 1 is provided with a main body 10, a light emitting unit 20, a power feeding unit 30, and a socket 40.
The main body portion 10 is provided with a storage portion 11, a flange portion 12, and fins 13. The storage portion 11 has a cylindrical shape and protrudes from one surface of the flange portion 12. A light emitting unit 20 is stored inside the storage unit 11. Further, the power supply terminal 31 of the power supply unit 30 protrudes inside the storage unit 11.

The flange portion 12 has a disk shape, and the storage portion 11 is provided on one surface, and the fins 13 are provided on the other surface.
A plurality of fins 13 are provided so as to protrude from the surface of the flange portion 12. The plurality of fins 13 have a plate shape and function as heat radiating fins.

The main body unit 10 has a function of housing the light emitting unit 20 and the power feeding unit 30 and the like, and a function of releasing heat generated in the light emitting unit 20 and the power feeding unit 30 to the outside of the lighting device 1.
Therefore, the main body 10 can be formed from a material having high thermal conductivity in consideration of releasing heat to the outside. For example, the main body 10 can be formed from aluminum, an aluminum alloy, a high thermal conductivity resin, or the like. The high thermal conductive resin is, for example, a resin such as PET or nylon mixed with fibers or particles such as carbon or aluminum oxide having high thermal conductivity.
In this case, a portion such as the fin 13 that discharges heat to the outside can be formed from a material having high thermal conductivity, and the other portion can be formed from a resin or the like.

  In the case where the main part of the main body 10 is made of a conductive material, the periphery of the power supply terminal 31 is made of an insulating material (to ensure electrical insulation between the power supply terminal 31 and the conductive material of the main body 10. (Not shown), and a conductive material may be arranged around it. The insulating material is, for example, a resin or the like, and a material having high thermal conductivity is preferable. Further, the main body 10 may be provided with an attaching part that can be attached to and detached from the vehicular lamp.

As shown in FIG. 3, the light emitting section 20 includes a substrate 21, a light emitting element 22, a control element 23, a wiring pattern 24, a wiring 25, an enclosing wall member 26, a sealing section 27, a joining section 28, and a covering section 29. Is provided.
The substrate 21 is provided inside the storage unit 11 of the main body unit 10.
The substrate 21 has a plate shape, and a wiring pattern 24 is provided on the surface.
The material and structure of the substrate 21 are not particularly limited. For example, the substrate 21 can be formed of an inorganic material (ceramics) such as aluminum oxide or aluminum nitride, or an organic material such as paper phenol or glass epoxy. Moreover, the board | substrate 21 may coat | cover the surface of a metal plate with the insulator. When the surface of the metal plate is covered with an insulator, the insulator may be made of an organic material or may be made of an inorganic material.

In this case, when the light emitting element 22 generates a large amount of heat, it is preferable to form the substrate 21 using a material having high thermal conductivity from the viewpoint of heat dissipation. Examples of the material having a high thermal conductivity include ceramics such as aluminum oxide and aluminum nitride, a high thermal conductive resin, and a metal plate whose surface is covered with an insulator.
Further, the substrate 21 may be a single layer or a multilayer.

A plurality of light emitting elements 22 are mounted on a wiring pattern 24 provided on the surface of the substrate 21.
The light emitting element 22 may have an electrode (not shown) on the surface (upper surface) opposite to the side provided on the wiring pattern 24. The electrodes (not shown) may be provided on the surface (lower surface) provided on the wiring pattern 24 and on the surface (upper surface) opposite to the side provided on the wiring pattern 24. It may be provided only on the surface.

  The electrode provided on the lower surface of the light emitting element 22 is electrically connected to the mounting pad 24b provided on the wiring pattern 24 through a conductive thermosetting material such as silver paste. An electrode (not shown) provided on the upper surface of the light emitting element 22 is electrically connected to a wiring pad 24 c provided on the wiring pattern 24 via a wiring 25.

The light emitting element 22 may be, for example, a light emitting diode, an organic light emitting diode, a laser diode, or the like.
The upper surface, which is the light emission surface of the light emitting element 22, is directed to the front side of the lighting device 1, and mainly emits light toward the front side of the lighting device 1.
The number, size, and the like of the light emitting elements 22 are not limited to those illustrated, and can be appropriately changed according to the size, use, and the like of the lighting device 1.

The control element 23 is mounted on the wiring pattern 24.
The control element 23 controls the current flowing through the light emitting element 22. That is, the control element 23 controls the light emission of the light emitting element 22.
The number and size of the control elements 23 are not limited to those illustrated, and can be appropriately changed according to the number and specifications of the light emitting elements 22.

The wiring pattern 24 is provided on at least one surface of the substrate 21.
The wiring pattern 24 can be provided on both surfaces of the substrate 21, but it is preferable to provide the wiring pattern 24 on one surface of the substrate 21 in order to reduce the manufacturing cost.
The wiring pattern 24 is provided with an input terminal 24a.
A plurality of input terminals 24a are provided. The power supply terminal 31 of the power supply unit 30 is electrically connected to the input terminal 24a. Therefore, the light emitting element 22 is electrically connected to the power feeding unit 30 via the wiring pattern 24.

The wiring 25 electrically connects an electrode (not shown) provided on the upper surface of the light emitting element 22 and a wiring pad 24 c provided on the wiring pattern 24.
The wiring 25 can be, for example, a wire whose main component is gold. However, the material of the wiring 25 is not limited to a material mainly composed of gold, and may be a material mainly composed of copper, a material mainly composed of aluminum, or the like.

  The wiring 25 is electrically connected to an electrode (not shown) provided on the upper surface of the light emitting element 22 and a wiring pad 24c provided on the wiring pattern 24 by, for example, ultrasonic welding or heat welding. The wiring 25 can be electrically connected to an electrode (not shown) provided on the upper surface of the light emitting element 22 and a wiring pad 24 c provided on the wiring pattern 24 by using, for example, a wire bonding method.

  In addition, circuit components (not shown) can be provided as necessary. A circuit component (not shown) can be mounted on the wiring pattern 24, for example.

The surrounding wall member 26 is provided on the substrate 21 so as to surround the plurality of light emitting elements 22. The surrounding wall member 26 has, for example, an annular shape, and the plurality of light emitting elements 22 are exposed at the central portion 26a. In addition, the shape of the surrounding wall member 26 may be an elliptical shape or a polygonal shape such as a quadrangle, a hexagon, or an octagon, and is not particularly limited to the shape.
The surrounding wall member 26 can be formed from, for example, a resin such as PBT (polybutylene terephthalate) or PC (polycarbonate), ceramics, or the like.
Further, when the material of the surrounding wall member 26 is resin, particles such as titanium oxide can be mixed to improve the reflectance with respect to the light emitted from the light emitting element 22.
Note that the particles are not limited to titanium oxide particles, and particles made of a material having a high reflectance with respect to light emitted from the light emitting element 22 may be mixed.
Moreover, the surrounding wall member 26 can also be formed from white resin, for example.

The side wall surface 26b on the central portion 26a side of the surrounding wall member 26 is an inclined surface. A part of the light emitted from the light emitting element 22 is reflected by the side wall surface 26 b of the surrounding wall member 26 and emitted toward the front side of the lighting device 1.
Further, a part of the light emitted from the light emitting element 22 toward the front side of the lighting device 1 and totally reflected by the top surface of the sealing portion 27 (interface between the sealing portion 27 and the outside air) The light is reflected by the side wall surface 26b on the side of the central portion 26a of the surrounding wall member 26 and irradiated again toward the front side of the lighting device 1.

  That is, the surrounding wall member 26 can also have the function of a reflector. In addition, the form of the surrounding wall member 26 is not necessarily limited to what was illustrated, and can be changed suitably.

The sealing portion 27 is provided at the central portion 26a of the surrounding wall member 26 (see FIG. 5). The sealing portion 27 is provided so as to cover the inner side of the surrounding wall member 26.
The sealing portion 27 is formed from a light-transmitting material. The sealing part 27 can be formed from, for example, a silicone resin.
The sealing portion 27 can be formed, for example, by filling the central portion 26a of the surrounding wall member 26 with resin. The filling of the resin can be performed using, for example, a liquid dispensing apparatus such as a dispenser.

  If the central portion 26a of the surrounding wall member 26 is filled with resin, mechanical contact from the outside to the light emitting element 22, the wiring pattern 24 exposed to the central portion 26a of the surrounding wall member 26, the wiring 25, and the like is suppressed. Can do. Moreover, it can suppress that air, a water | moisture content, etc. adhere to the wiring pattern 24 exposed to the light emitting element 22, the center part 26a of the surrounding wall member 26, the wiring 25, etc. FIG. Therefore, the reliability with respect to the illuminating device 1 can be improved.

Further, the sealing portion 27 can include a phosphor. The phosphor may be, for example, a YAG phosphor (yttrium / aluminum / garnet phosphor).
For example, when the light emitting element 22 is a blue light emitting diode and the phosphor is a YAG phosphor, the YAG phosphor is excited by the blue light emitted from the light emitting element 22, and yellow fluorescence is emitted from the YAG phosphor. Radiated. Then, the blue light and the yellow light are mixed, whereby white light is emitted from the lighting device 1. In addition, the kind of fluorescent substance and the kind of light emitting element 22 are not necessarily limited to what was illustrated, and can be suitably changed according to the use of the illuminating device 1, etc. so that a desired luminescent color may be obtained.

The joining portion 28 joins the surrounding wall member 26 and the substrate 21 via the covering portion 29.
The joining portion 28 has a film shape and is provided between the surrounding wall member 26 and the covering portion 29. The joining portion 28 can be formed, for example, by curing a silicone adhesive or an epoxy adhesive.

The joint portion 28 can be formed by the following procedure, for example.
First, a silicone-based adhesive or an epoxy-based adhesive is applied on the covering portion 29.
For example, an adhesive is applied on the covering portion 29 using a dispenser or the like.
Next, the adhesive is cured by evaporating the solvent and the like to form the joint portion 28, and the surrounding wall member 26 and the substrate 21 are joined via the covering portion 29.
For example, first, the surrounding wall member 26 is placed on the applied adhesive.
Subsequently, the surrounding wall member 26 is pressed to bring the adhesive into close contact with the surrounding wall member 26 and the position of the surrounding wall member 26 (adhesive thickness) is adjusted.
Thereafter, the adhesive is cured by evaporating the solvent.

Here, the viscosity of the adhesive before curing is preferably 1 Pa · s to 15 Pa · s. With such a viscosity, when applying using a dispenser or the like, it becomes easy to apply in an arbitrary shape.
In addition, with such a viscosity, the position of the surrounding wall member 26 can be stabilized when the adhesive is cured.

The covering portion 29 is provided between the substrate 21 and the joining portion 28.
Since the linear wiring pattern 24 is present in the region where the surrounding wall member 26 is installed, irregularities are formed.
The covering portion 29 is provided to flatten a region where the surrounding wall member 26 is installed. Furthermore, the covering portion 29 is provided to insulate the wiring pattern 24.

The coating | coated part 29 shall contain a glass material.
Details regarding the covering portion 29 will be described later.

The power feeding unit 30 is provided with a plurality of power feeding terminals 31.
The plurality of power supply terminals 31 extend inside the storage portion 11 and the flange portion 12. One end portion of the plurality of power supply terminals 31 protrudes from the bottom surface of the storage portion 11 and is electrically connected to the input terminal 24 a of the wiring pattern 24. The other ends of the plurality of power supply terminals 31 are exposed from the side opposite to the side on which the substrate 21 of the main body 10 is provided.

In addition, the number, arrangement | positioning, form, etc. of the electric power feeding terminal 31 are not necessarily limited to what was illustrated, and can be changed suitably.
The power feeding unit 30 may include a substrate (not shown) and circuit components such as a capacitor and a resistor. In addition, the board | substrate and circuit component which are not shown in figure can be provided in the inside of the accommodating part 11 or the flange part 12, for example.

The socket 40 is fitted to the ends of the plurality of power supply terminals 31 exposed on the side opposite to the side on which the substrate 21 of the main body 10 is provided.
The socket 40 is electrically connected to a power source (not shown).
Therefore, by fitting the socket 40 to the end of the power supply terminal 31, the power source (not shown) and the light emitting element 22 are electrically connected.
The socket 40 can be bonded to the element on the main body 10 side using, for example, an adhesive.

Next, the covering portion 29 will be further described.
FIG. 4 is a schematic cross-sectional view for illustrating a case where the covering portion 29 is not provided.
When the surrounding wall member 26 and the substrate 21 are joined through the joint portion 28, there is no portion where the linear wiring pattern 24 exists between the surrounding wall member 26 and the substrate 21, and there is no linear wiring pattern 24. Part is formed.
In this case, in the portion where the linear wiring pattern 24 is present, the distance between the surrounding wall member 26 and the substrate 21 is increased by the thickness dimension of the wiring pattern 24.

Therefore, as shown in FIG. 4, the surrounding wall member 26 may be inclined and joined to the surface of the substrate 21.
When the inclination angle θ of the surrounding wall member 26 with respect to the surface of the substrate 21 increases, the light distribution characteristics vary, the application state of the adhesive varies, the airtightness / adhesion strength decreases, or the inside of the surrounding wall member 26 is filled. There is a possibility that the resin thus leaked to the outside of the surrounding wall member 26.
In this case, if the bonding portion 28 is not provided on the wiring pattern 24, it is possible to suppress the surrounding wall member 26 from being inclined and bonded to the surface of the substrate 21.

  However, if the joint portion 28 is not provided on the wiring pattern 24, the fixing strength (adhesion strength) between the surrounding wall member 26 and the substrate 21 is lowered in the portion where the wiring pattern 24 extends. When the adhesion strength between the surrounding wall member 26 and the substrate 21 is partially reduced, the strength is partially weakened against external stress and thermal shock. For this reason, the airtightness between the surrounding wall member 26 and the substrate 21 is lowered, and there is a possibility that performance degradation due to intrusion of moisture / gas, poor conduction due to peeling of the sealing portion 27, and the like may occur.

Therefore, in the lighting device 1 according to the present embodiment, by providing the covering portion 29, the surrounding wall member 26 is prevented from being inclined and installed.
FIGS. 5 and 6 are schematic cross-sectional views for illustrating the covering portion 29.
5 is a cross-sectional view taken along line AA in FIG.
6 is a cross-sectional view taken along line BB in FIG.

As shown in FIGS. 5 and 6, the covering portion 29 is provided between the substrate 21 and the bonding portion 28. The covering portion 29 is an area where the surrounding wall member 26 is installed, and is provided around the wiring pattern 24. That is, the covering portion 29 is not provided on the wiring pattern 24.
The thickness dimension of the covering portion 29 is substantially the same as the thickness dimension of the wiring pattern 24.
Therefore, even if there is a linear wiring pattern 24 in the region where the surrounding wall member 26 is installed, the region where the surrounding wall member 26 is installed can be flattened by providing the covering portion 29.
As a result, the surrounding wall member 26 can be prevented from being inclined.

FIG. 7 and FIGS. 8A and 8B are schematic cross-sectional views for illustrating a covering portion 39 according to another embodiment.
FIG. 7 is a schematic cross-sectional view of a portion corresponding to the cross section along line AA in FIG.
8A and 8B are cross-sectional views taken along the line CC in FIG.
As shown in FIGS. 7 and 8A, the covering portion 39 is provided between the substrate 21 and the bonding portion 28. The covering portion 39 has a first portion 39a1 and a second portion 39b1. The first portion 39a1 and the second portion 39b1 are provided integrally. The first portion 39a1 and the second portion 39b1 can be formed from the same material. The first portion 39a1 and the second portion 39b1 may include the same glass material as that of the covering portion 29.
Furthermore, the covering portion 39 is provided to insulate the wiring pattern 24.

The first portion 39a1 is provided so as to cover an area where the surrounding wall member 26 is installed. Therefore, the first portion 39a1 is also provided on the wiring pattern 24 provided in the region where the surrounding wall member 26 is installed.
The thickness dimension of the first portion 39a1 is substantially the same as the thickness dimension of the wiring pattern 24.

The second portion 39b1 is provided on the first portion 39a1 and around the first portion 39a1 provided on the wiring pattern 24. That is, the second portion 39b1 is provided on the first portion 39a1, but is not provided on the first portion 39a1 provided on the wiring pattern 24.
The thickness dimension of the second portion 39b1 is substantially the same as the thickness dimension of the first portion 39a1.

As shown in FIGS. 7 and 8B, the covering portion 39 is provided between the substrate 21 and the bonding portion 28. The covering portion 39 has a third portion 39a2 and a fourth portion 39b2. The third portion 39a2 and the fourth portion 39b2 are provided integrally. The third portion 39a2 and the fourth portion 39b2 can be formed from the same material. The third portion 39a2 and the fourth portion 39b2 may include the same glass material as that of the covering portion 29.
Furthermore, the covering portion 39 is provided to insulate the wiring pattern 24.

  The third portion 39 a 2 is an area where the surrounding wall member 26 is installed, and is provided around the wiring pattern 24. That is, the third portion 39 a 2 is provided on the substrate 21, but is not provided on the wiring pattern 24.

The thickness dimension of the third portion 39a2 is substantially the same as the thickness dimension of the wiring pattern 24.
The fourth portion 39b2 is provided on the wiring pattern 24 and the third portion 39a2.
The thickness dimension of the fourth portion 39b2 is substantially the same as the thickness dimension of the third portion 39a2.

In this way, even if the linear wiring pattern 24 exists in the area where the surrounding wall member 26 is installed, the area where the surrounding wall member 26 is installed is flattened by providing the covering 39. be able to.
As a result, the surrounding wall member 26 can be prevented from being inclined.
Further, if the first portion 39a1 and the second portion 39b1 are formed from the same material, the surface state of the region where the joint portion 28 is provided can be made constant. Therefore, it is possible to stabilize the fixing strength between the surrounding wall member 26 and the substrate 21.

Moreover, when the illuminating device 1 is a vehicle-mounted illuminating device, it is necessary to take measures against troubles such as migration due to pinholes. Therefore, if the second portion 39b1 is stacked on the first portion 39a1, problems due to pinholes and the like can be suppressed, and the reliability of the lighting device 1 can be further improved.
In addition, if the fourth portion 39b2 is laminated on the third portion 39a2, it is possible to suppress problems due to pinholes and the like, and to further improve the reliability of the lighting device 1.

Further, according to the knowledge obtained by the present inventor, it is preferable to provide the covering portion 29 and the covering portion 39 so that the inclination angle θ of the surrounding wall member 26 with respect to the surface of the substrate 21 is 1 ° or less.
If the inclination angle of the surrounding wall member 26 with respect to the surface of the substrate 21 is set to 1 ° or less, an adverse effect on the light distribution characteristics can be suppressed.

  The shape and dimensions of the covering portion 29 and the covering portion 39, the number of layers constituting the covering portion 39, and the like are not limited to those illustrated, and can be changed as appropriate.

9 and 10 are schematic views for illustrating a region where the surrounding wall member 26 according to another embodiment is installed.
The wiring pattern 24 has various shapes depending on the number and layout of the light emitting elements 22. For this reason, the position where the wiring pattern 24 is provided may be unevenly distributed as viewed from the center position of the region where the surrounding wall member 26 is installed.
Even in such a case, by providing the covering portion 29 and the covering portion 39, the region where the surrounding wall member 26 is installed can be flattened.

  However, materials, manufacturing processes, and the like are different between the wiring pattern 24 and the covering portion 29 and the covering portion 39. Therefore, the thickness dimension of the covering part 29 and the covering part 39 may be slightly different from the thickness dimension of the wiring pattern 24. For example, the thickness dimension of the covering part 29 and the covering part 39 may differ from the thickness dimension of the wiring pattern 24 by about several μm.

  Therefore, as shown in FIGS. 9 and 10, the support portion 34 having the same thickness dimension as the wiring pattern 24 is provided in a portion where the distance between the wiring patterns 24 in the circumferential direction of the surrounding wall member 26 is long. Yes. If the support portion 34 is provided, the region having the same height as the wiring pattern 24 can be arranged almost evenly as viewed from the center position of the region where the surrounding wall member 26 is installed.

  Here, the material of the support portion 34 can be the same as the material of the wiring pattern 24. If the material of the support part 34 is the same as that of the wiring pattern 24, the support part 34 can be formed when the wiring pattern 24 is formed. Therefore, it becomes easy to make the thickness dimension of the support part 34 and the thickness dimension of the wiring pattern 24 uniform.

  The wiring pattern 24 and the support portion 34 can be formed using, for example, a screen printing method or a plating method.

In this case, as shown in FIG. 9, the support portion 34 can be provided separately from the wiring pattern 24.
Further, as shown in FIG. 10, the support portion 34 can be provided in connection with the wiring pattern 24.
If the support portion 34 is provided, the region having the same height as the wiring pattern 24 can be arranged almost evenly, so that the region where the surrounding wall member 26 is installed can be further flattened. .

Further, the width dimension of the support portion 34 may be longer or shorter than the thickness dimension of the surrounding wall member 26. Further, a part of the support portion 34 can be pulled out of the region where the surrounding wall member 26 is provided, and a circuit component can be mounted. In this way, the area of the substrate 21 can be used effectively, and as a result, the lighting device 1 can be reduced in size.
Note that the shape, arrangement, number, and the like of the support portions 34 are not limited to those illustrated, and can be appropriately changed according to the arrangement, shape, and the like of the wiring pattern 24.

9 and 10, the covering portion 29 and the covering portion 39 can be provided in the same manner as described above.
When the covering portion 29 is provided, the covering portion 29 is provided around the wiring pattern 24 provided in the region where the surrounding wall member 26 is installed and around the support portion 34. That is, the covering portion 29 is not provided on the wiring pattern 24 and the support portion 34.

  In the case where the covering portion 39 is provided, the first portion 39a1 is provided so as to cover an area where the surrounding wall member 26 is installed. Therefore, the first portion 39a1 is also provided on the wiring pattern 24 and the support portion 34 provided in the region where the surrounding wall member 26 is installed. The second portion 39b1 is on the first portion 39a1 and around the first portion 39a1 provided on the wiring pattern 24 and on the support portion 34. It is provided around. That is, the second portion 39b1 is provided on the first portion 39a1, but is provided on the first portion 39a1 provided on the wiring pattern 24 and on the support portion 34. It is not provided on the first portion 39a1.

Alternatively, the third portion 39 a 2 is an area where the surrounding wall member 26 is installed, and is provided around the wiring pattern 24 and the support portion 34. That is, the third portion 39 a 2 is provided on the substrate 21, but is not provided on the wiring pattern 24 and the support portion 34.
The fourth portion 39b2 is provided on the wiring pattern 24, the support portion 34, and the third portion 39a2.

The covering portion 29 and the covering portion 39 can be formed as follows, for example.
First, a glass paste is created.
The glass paste can include, for example, glass powder, a filler, and an organic solvent.
The glass powder can contain, for example, silicon, barium, calcium, bismuth, and the like.
The filler can include, for example, aluminum oxide.
The organic solvent can be, for example, toluene, xylene and the like.

Next, a glass paste is applied to a predetermined region on the surface of the substrate 21 using a screen printing method or the like.
When forming the covering portion 29, a glass paste is applied around the wiring pattern 24 in the region where the surrounding wall member 26 is installed.
In the case where the support part 34 is provided, a glass paste is applied around the wiring pattern 24 and around the support part 34 in the region where the surrounding wall member 26 is installed.
Further, the glass paste is also applied on the wiring pattern 24 other than the region where the surrounding wall member 26 is installed.

When forming the covering portion 39, a glass paste is applied so as to cover the region where the surrounding wall member 26 is installed and the wiring pattern 24 other than the region where the surrounding wall member 26 is installed. A layer to be the portion 39a1 is formed.
Subsequently, on the layer to be the first portion 39a1 in the region where the surrounding wall member 26 is installed, around the first portion 39a1 provided on the wiring pattern 24, and around the support portion 34 A glass paste is applied to form a layer to be the second portion 39b1.

At this time, a glass paste is applied also on the layer that becomes the first portion 39a1 other than the region where the surrounding wall member 26 is installed, thereby forming the layer that becomes the second portion 39b1.
Alternatively, a glass paste is applied around the region where the surrounding wall member 26 is installed, the wiring pattern 24 other than the region where the surrounding wall member 26 is installed, and the support portion 34, and the third portion 39a2 Forming a layer.

Subsequently, a glass paste is applied on the layer that becomes the third portion 39a2 in the region where the surrounding wall member 26 is installed, the wiring pattern 24, and the support portion 34, thereby forming the layer that becomes the fourth portion 39b2. To do.
At this time, a glass paste is applied also on the layer that becomes the third portion 39a2 other than the region where the surrounding wall member 26 is installed and on the wiring pattern 24 to form a layer that becomes the fourth portion 39b2. To do.
Next, the glass paste is baked to form the covering portion 29 and the covering portion 39.

  As mentioned above, although several embodiment of this invention was illustrated, these embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, changes, and the like can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and equivalents thereof. Further, the above-described embodiments can be implemented in combination with each other.

  DESCRIPTION OF SYMBOLS 1 Illuminating device, 10 main-body part, 11 accommodating part, 12 flange part, 13 fin, 20 light emission part, 21 board | substrate, 22 light emitting element, 23 control element, 24 wiring pattern, 25 wiring, 26 surrounding wall member, 27 sealing part 28 Joint part 29 Cover part 30 Power supply part 34 Support part 39 Cover part 39a1 1st part 39a2 3rd part 39b1 2nd part 39b2 4th part 40 socket

Claims (8)

A substrate;
A wiring pattern provided on the surface of the substrate;
A light emitting device provided on the wiring pattern;
An enclosing wall member provided so as to surround the light emitting element;
A joint provided between the substrate and the surrounding wall member;
A covering portion provided between the substrate and the joint portion and provided at least around the wiring pattern provided in a region where the surrounding wall member is installed;
A lighting device comprising:   The covering portion includes a first portion provided so as to cover an area where the surrounding wall member is installed, and the first portion provided on the wiring pattern on the first portion. The lighting device according to claim 1, further comprising: a second portion provided around the portion.   The covering portion is a region where the surrounding wall member is installed, and a third portion provided around the wiring pattern, and a fourth portion provided on the wiring pattern and the third portion. The lighting device according to claim 1, further comprising: Further comprising a support provided in a region where the surrounding wall member is installed;
The lighting device according to claim 1, wherein the covering portion is provided at least around the wiring pattern provided in a region where the surrounding wall member is installed and around the support portion.   The lighting device according to claim 4, wherein the support portion is connected to the wiring pattern.   The covering portion includes a first portion provided so as to cover an area where the surrounding wall member is installed, and the first portion provided on the wiring pattern on the first portion. The lighting device according to claim 4, further comprising: a second portion provided around the first portion and the second portion provided on the support portion.   The covering portion is an area in which the surrounding wall member is installed, and the third portion provided around the wiring pattern and around the support portion, above the wiring pattern, and on the support portion. The lighting device according to claim 4, further comprising: a top portion and a fourth portion provided on the third portion. A power supply terminal electrically connected to the wiring pattern;
A socket mated with the power supply terminal;
The illumination device according to any one of claims 1 to 7, further comprising:

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