JP2013025935A - Light source unit of semiconductor type light source of vehicular lamp and vehicular lamp - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve watertightness in use as a vehicular lamp.SOLUTION: The light source unit includes a light source part 10 and a socket part 11. The light source part 10 includes a plurality of light-emitting chips 40-44 of a semiconductor type light source. The socket part 11 is an integrally molded component consisting of a radiation member 8, power feeding members 91-93 and an insulation member 7. At an interface between the radiation member 8 and the insulation member 7 at an intermediate part 111 of the socket part 11, an adhesion part 2 adhering with each other is provided. As a result, watertightness can be improved.

Description

  The present invention relates to a light source unit of a semiconductor-type light source for a vehicle lamp. The present invention also relates to a vehicular lamp using a semiconductor-type light source as a light source.

  This type of light source unit is conventionally known (for example, Patent Document 1). Hereinafter, a conventional light source unit will be described. A conventional light source unit is provided with a plurality of LED chips on a base, a support on the base, and a plurality of heat radiation fins and a base on the support.

JP 2009-21264 A

  Since such a light source unit is used for a vehicular lamp, it is important to consider water tightness.

  The problem to be solved by the present invention is that it is important to consider water tightness in use as a vehicular lamp.

  The present invention (the invention according to claim 1) includes a light source unit and a socket unit, the light source unit has a light emitting chip of a semiconductor type light source, and the socket unit is attached with the light source unit, and the light source unit A heat dissipating member that radiates heat generated in the outside, a power supplying member that is electrically connected to the light source unit and supplies power to the light source unit, and at least a part of the heat dissipating member and an intermediate part of the power supplying member are packaged and the heat dissipating member And an insulating member that incorporates the power feeding member in an insulated state from each other, and in the intermediate part of the socket portion where the insulating member covers the intermediate portion of the power feeding member, the insulating member is Located on the outside of the power supply member, the heat dissipation member is positioned on the outside of the insulating member and the power supply member, and an adhesion portion that is in close contact with each other is provided at the interface between the heat dissipation member and the insulation member in the middle portion of the socket portion. That And features.

  In this invention (the invention according to claim 2), the insulating member in the intermediate portion of the socket portion is integrally provided with a flange portion that presses the packing against the vehicle lamp, and the heat radiating member in the intermediate portion of the socket portion is provided. The flange portion is integrally provided corresponding to the flange portion of the insulating member, and at the interface between the flange portion of the heat radiating member and the flange portion of the insulating member, a close contact portion that is in close contact with each other is provided. It is characterized by that.

  In this invention (the invention according to claim 3), the socket portion is integrally provided with a connector portion constituted by a part of the insulating member and a part of the power supply member, and the insulating member constituting the connector portion The extension part is integrally extended to a part of the socket part, and the close contact part that is in close contact with each other is provided at the interface between the heat dissipation member in the middle part of the socket part and the extension part of the insulating member. It is characterized by.

  In this invention (the invention according to claim 4), the close contact portion is provided on at least one of the wall surface of the concave portion or the convex wall surface provided on the heat radiating member and the wall surface of the concave portion or the convex portion of the heat radiating member. It is characterized by comprising a biting surface of an insulating member that bites and adheres closely.

  In this invention (invention according to claim 5), the concave portion or the convex portion of the heat radiating member of the close contact portion is provided so as to be recessed or protruded in the opening / closing direction of a molding die for molding the heat radiating member. It is characterized by.

  This invention (invention according to claim 6) is characterized in that the close contact portion is provided at or near a portion of the insulating member in contact with a molding die for integrally molding the socket portion.

  This invention (invention concerning Claim 7) is the semiconductor of the lamp housing for vehicles of any one of the said Claims 1-6 arrange | positioned in the lamp housing and lamp lens which divide a lamp chamber, and a lamp chamber A light source unit of a mold light source.

  Since the light source unit of the semiconductor light source of the vehicle lamp according to the present invention (the invention according to claim 1) is provided with a close contact portion that is in close contact with the interface between the heat dissipation member and the insulating member at the intermediate portion of the socket portion. Even if a gap is formed at the interface between the heat radiating member and the insulating member due to the difference in thermal expansion coefficient between the heat radiating member and the insulating member, the close contact portion causes water to enter the light source portion through the socket portion. Can be prevented. Thus, when used as a vehicular lamp, water tightness is considered.

  In addition, in the light source unit of the semiconductor light source of the vehicular lamp according to the present invention (the invention according to claim 1), the insulating member is located outside the power supply member and the heat radiating member is insulated at the intermediate portion of the socket portion. Since it is located outside the member and the power supply member, the insulating member in the intermediate portion of the socket portion contracts in a direction in which it is pressed from all directions toward the power supply member from the outside to the inside during curing. As a result, in the light source unit of the semiconductor type light source of the vehicular lamp according to the present invention (invention according to claim 1), the insulating member and the power feeding member in the intermediate portion of the socket portion are in close contact with each other. Watertightness is ensured between the insulating member and the power supply member in the intermediate portion.

  The light source unit of the semiconductor light source of the vehicle lamp according to the present invention (the invention according to claim 2) includes a flange portion of the insulating member that presses the packing against the vehicle lamp, and a flange portion of the heat dissipating member at an intermediate portion of the socket portion. Since the contact portion that is in close contact with each other is provided at the interface of the vehicle, the vehicle lamp is connected to the water through the socket portion that is positioned outside the vehicle lamp by the contact portion that is located outside the vehicle lamp (outside the lamp chamber). It is possible to prevent the light source unit located inside the lamp (in the lamp chamber) from entering.

  The light source unit of the semiconductor-type light source of the vehicle lamp according to the present invention (the invention according to claim 3) includes an extension portion extending from a part of the insulating member constituting the connector portion and heat dissipation in the intermediate portion of the socket portion. Since a close contact portion that is in close contact with each other is provided at the interface with the member, the vehicle is connected to the water through the socket portion positioned outside the vehicle lamp by the close contact portion positioned outside the vehicle lamp (outside the lamp chamber). It is possible to prevent the light source unit located inside the lamp (inside the lamp chamber) from entering. Moreover, since the light source unit of the semiconductor-type light source of the vehicular lamp according to the present invention (the invention according to claim 3) can reduce the thickness of the extension portion, the degree of contraction of the extension portion and the close contact portion of the insulating member Therefore, the adhesiveness between the close contact portion of the heat dissipation member and the close contact portion of the insulating member is improved accordingly.

  The light source unit of the semiconductor-type light source of the vehicle lamp according to the present invention (the invention according to claim 4) is the thickness of the biting surface of the insulating member that bites into and adheres to the wall surface of the concave portion of the heat dissipation member or the wall surface of the convex portion. Therefore, the degree of shrinkage of the biting surface portion of the insulating member can be reduced, and accordingly, the concave wall surface of the heat dissipation member or the wall surface of the convex portion and the biting surface of the insulating member bite. Adhesion is improved. Moreover, in the light source unit of the semiconductor type light source of the vehicular lamp of the present invention (invention according to claim 4), the water intrusion path is detoured by the wall surface of the concave portion or the convex portion of the heat radiating member (that is, A fold is formed in the middle of the water ingress path), and the water ingress path can be extended longer. Thereby, the light source unit of the semiconductor-type light source of the vehicular lamp according to the present invention (the invention according to claim 4) can more reliably prevent water from entering the light source portion through the socket portion, and is watertight. Can be further improved.

  In the light source unit of the semiconductor light source of the vehicle lamp according to the present invention (the invention according to claim 5), the concave portion or the convex portion of the heat radiating member of the contact portion is recessed in the opening and closing direction of the molding die for molding the heat radiating member. Or even projecting, even if the heat dissipation member is provided with a concave or convex portion, the heat dissipation member is molded (die casting) without using a slide mold as the molding die for forming the heat dissipation member. can do. As a result, the light source unit of the semiconductor-type light source of the vehicular lamp according to the present invention (the invention according to claim 5) is provided with an existing molding die (molding die for molding the heat radiating member) on the concave or convex portion of the heat radiating member. It is only necessary to provide a convex portion or a concave portion that forms the portion, and it is possible to improve the adhesiveness between the heat radiating member and the insulating member and ensure the improved adhesiveness without adding additional cost to the molding die. .

  The light source unit of the semiconductor-type light source of the vehicle lamp according to the present invention (the invention according to claim 6) is provided with a close contact portion at or near a portion of the insulating member that contacts the molding die for integrally molding the socket portion. From the above, since the close contact portion of the insulating member is in close contact with the close contact portion of the heat radiating member in a state where the pressure of the molding die is applied, the close contact between the heat dissipating member and the insulating member is further improved and the improved adhesiveness is further improved. Can be secured.

  The vehicular lamp of the invention (invention according to claim 7) is a semiconductor light source for a vehicular lamp according to any one of claims 1 to 6, by means for solving the problems. The same effect as that of the light source unit can be achieved.

FIG. 1 shows Embodiment 1 of a semiconductor light source unit of a semiconductor light source of a vehicle lamp according to the present invention and Embodiment 1 of a vehicle lamp according to the present invention, in a state in which the light source unit is assembled to the vehicle lamp. It is a longitudinal cross-sectional view (vertical cross-sectional view). FIG. 2 is a bottom view showing a state in which the light source unit and the socket unit of the light source unit are assembled. FIG. 3 is a plan view showing a state in which the light source unit and the socket unit of the light source unit are assembled. FIG. 4 is an exploded perspective view showing an insulating member, a heat radiating member, and a power feeding member of the light source unit and the socket unit of the light source unit. FIG. 5 is an exploded perspective view showing a light source unit and a socket unit of the light source unit. FIG. 6 is a perspective view showing a state in which the light source unit and the socket unit of the light source unit are assembled. 7 is a cross-sectional view taken along line VII-VII in FIG. FIG. 8 is an explanatory longitudinal cross-sectional view (explanatory vertical cross-sectional view) showing a state where the socket portion of the light source unit is formed by a molding die. FIG. 9 is a plan view showing a heat radiating member of the socket portion of the light source unit. FIG. 10 is a bottom view showing the heat dissipating member of the socket portion of the light source unit. FIG. 11 is an enlarged plan view illustrating a substrate of the light source unit of the light source unit. 12 is a partially enlarged vertical sectional view (partially enlarged vertical sectional view) showing a second embodiment of a light source unit of a semiconductor-type light source of a vehicular lamp according to the present invention and a second embodiment of a vehicular lamp according to the present invention. Figure).

  Hereinafter, two examples of the embodiment (example) of the light source unit of the semiconductor-type light source of the vehicle lamp according to the present invention and two examples of the embodiment (example) of the vehicle lamp according to the present invention will be described in detail with reference to the drawings. Explained. In addition, this invention is not limited by this embodiment. 3 to 7, illustration of the control element and the wiring element is omitted.

(Description of Configuration of Embodiment 1)
FIGS. 1-11 shows Embodiment 1 of the light source unit of the semiconductor type light source of the vehicle lamp concerning this invention, and Embodiment 1 of the vehicle lamp concerning this invention. Hereinafter, the light source unit of the semiconductor-type light source of the vehicular lamp according to the first embodiment and the configuration of the vehicular lamp according to the first embodiment will be described. In FIG. 1, reference numeral 100 denotes a vehicular lamp in the first embodiment. In FIG. 11, the symbol “XX” is a horizontal direction (left-right direction) when the vehicle lamp 100 is mounted on a vehicle (not shown), and the symbol “YY” is the horizontal It is a vertical direction (vertical direction) orthogonal to the direction XX.

(Description of vehicle lamp 100)
The vehicle lamp 100 is a one-lamp tail / stop lamp in this example. That is, the vehicular lamp 100 uses a tail lamp function and a stop lamp function together with one lamp (one lamp, one lamp). The vehicle lamps 100 are respectively provided on the left and right of the rear part of a vehicle (not shown). The vehicle lamp 100 may be combined with other lamp functions (not shown) (for example, a backup lamp function and a turn signal lamp function) to form a rear combination lamp.

  As shown in FIG. 1, the vehicular lamp 100 includes a lamp housing 101, a lamp lens 102, a reflector 103, and a light source unit having a semiconductor light source as a light source, that is, a semiconductor light source of the vehicular lamp according to the first embodiment. The light source unit 1 and a driving circuit (not shown) for the semiconductor light source of the light source unit 1 are provided.

  The lamp housing 101 is made of, for example, a light impermeable member (for example, a resin member). The lamp housing 101 has a hollow shape in which one side is open and the other side is closed. A through hole 104 is provided in the closed portion of the lamp housing 101. The through hole 104 has a circular shape. A plurality of concave portions (not shown) and a plurality of stopper portions (not shown) are provided at substantially equal intervals on the edge of the through hole 104.

  The lamp lens 102 is made of, for example, a light transmissive member (for example, a transparent resin member or a glass member). The lamp lens 102 has a hollow shape in which one side is open and the other side is closed. The periphery of the opening of the lamp lens 102 and the periphery of the opening of the lamp housing 101 are fixed in a watertight manner. A lamp chamber 105 is defined by the lamp housing 101 and the lamp lens 102.

  The reflector 103 is a light distribution control unit that performs light distribution control so as to collect light emitted from the light source unit 1 at a focal point F (see FIGS. 2 and 3). The reflector 103 is disposed in the lamp chamber 105 and is fixed to the lamp housing 101 or the like. The reflector 103 is composed of, for example, a light impermeable member (for example, a resin member or a metal member). The reflector 103 has a hollow shape in which one side is open and the other side is closed. A through hole 106 is provided in the closed portion of the reflector 103 so as to communicate with the through hole 104 of the lamp housing 101. A reflective surface 107 is provided on the inner surface of the reflector 103. The reflector 103 is made of a separate member from the lamp housing 101, but may be a reflector integrated with the lamp housing. In this case, a reflecting surface is provided on a part of the lamp housing to provide a reflector function.

(Description of the light source unit 1)
As shown in FIGS. 2 to 11, the light source unit 1 includes a light source unit (optical component) 10, a socket unit (socket component) 11, and a cover unit (cover component) 12 as an optical component. The light source unit 10 and the cover unit 12 are attached to one end (upper end) of the socket unit 11. The light source unit 10 is covered by the cover unit 12.

  The light source unit 1 is mounted on the vehicular lamp 100 as shown in FIG. That is, the socket part 11 is detachably or fixedly attached to the lamp housing 101 via a packing (O-ring) 108. The light source unit 10 and the cover unit 12 are arranged in the lamp chamber 105 through the through hole 104 of the lamp housing 101 and the through hole 106 of the reflector 103 and on the reflecting surface 107 side of the reflector 103. Has been.

(Description of the light source unit 10)
2 to 11, the light source unit 10 includes a substrate 3 and a plurality of light emitting chips 40, 41, 42, 43, 44 (hereinafter referred to as "40- 44 ”), resistors RS, RT, RP and diodes DS, DT as control elements, and conductors 51, 52, 53, 54, 55, 56 (hereinafter referred to as“ 51-51 ”as wiring elements). 56 ”and the wire 6 and the conductive adhesive (not shown) and the mounting pad 60 and the wire pad 61, the conductive metal member 17, the heat conducting metal member 170, the surrounding wall member 18, And a sealing member 180.

(Description of substrate 3)
In this example, the substrate 3 is made of ceramic. As shown in FIGS. 3 to 7 and 11, the substrate 3 has a substantially octagonal plate shape when seen from the plane (top). Although not shown, the substrate 3 has a laminated structure, for example, a three-layer laminated structure. The thickness of the layer on the one surface (upper surface) side and the thickness of the layer on the other surface (lower surface) side are, for example, about 50 μm. The middle layer is thicker than the upper and lower layers.

  Although not shown, the substrate 3 is provided with at least two (in this example, two) fitting holes (or fitting recesses) for fixing and positioning (positioning) as fitting portions. Yes. Insertion holes 31, 32, and 33 through which the power supply members 91, 92, and 93 of the socket part 11 are inserted are provided by punching at substantially the center of the three sides (right side, left side, and lower side) of the substrate 3. A flat mounting surface 34 is provided on one surface (upper surface) of the substrate 3. A flat contact surface 35 is provided on the other surface (lower surface) of the substrate 3. A highly reflective surface 30 such as highly reflective paint or highly reflective vapor deposition may be further provided on the mounting surface 34 of the ceramic substrate 3 that is a highly reflective member.

  On the mounting surface 34 of the substrate 3, the five light emitting chips 40 to 44, the control elements RS, RT, RP, DS, DT, the wiring elements 51 to 56, 6, 60, 61, and the surrounding wall The member 18 is mounted (that is, provided by printing, baking, vapor deposition, adhesion, fitting, etc.).

  As shown in FIGS. 3 and 7, the conductive metal member 17 and the heat conductive metal member 170 are embedded in the substrate 3. That is, the upper surface layer and the intermediate layer corresponding to the insertion holes 31, 32, 33 of the substrate 3 are provided with recesses by punching. The conductive metal member 17 is embedded in the recess. The bottom surface layer and the intermediate layer corresponding to the five light emitting chips 40 to 44 of the substrate 3 are provided with holes by punching. The heat conducting metal member 170 is embedded in the hole.

(Description of light emitting chips 40 to 44)
The semiconductor-type light source composed of the five light-emitting chips 40 to 44 uses a self-luminous semiconductor-type light source (LED in this embodiment 1) such as LED and EL (organic EL). As shown in FIGS. 3 to 7 and 11, the light emitting chips 40 to 44 have a minute rectangular shape (square or rectangular shape) when viewed from the plane (upper direction perpendicular to the mounting surface 34 of the substrate 3). In this example, it is a bare chip. The five light emitting chips 40 to 44 emit light from one front surface and four side surfaces other than the surface mounted on the substrate 3.

  As shown in FIGS. 3 to 7 and 11, the five light emitting chips 40 to 44 are arranged at the focal point F of the reflector 103 of the optical system and the center (mounting rotation) of the socket portion 11 of the light source unit 1. (Center) One (40) is arranged in the vicinity of O, and four (41 to 44) are arranged on the circumference centered on the focal point F and the center O with gaps at substantially equal intervals. Yes.

  The five light emitting chips 40 to 44 are light emitting chips to which a small current is supplied. One light emitting chip 40 that is a light source of a tail lamp, that is, a first group of light emitting chips 40 and a large current (the light emitting chip). The light emitting chip is supplied with a large current (compared to the current supplied to 40), and the four light emitting chips 41 to 44, that is, the light source of the stop lamp, that is, the second group of light emitting chips 41 to 44, It is divided.

  One light emitting chip 40 of the tail lamp function (tail lamp light source) has four focus lamps and the center O and the stop lamp function (stop lamp light source) arranged on the circumference. It is arranged at the center of the light emitting chips 41 to 44. That is, one light emitting chip 40 having the tail lamp function is located in the middle of the five light emitting chips 40 to 44. The four light emitting chips 41 to 44 having the stop lamp function are connected in series in the forward direction (direction in which current flows).

  Of the five light emitting chips 40 to 44, one light emitting chip 40 having the tail lamp function is disposed at the center O of the substrate 3 and at or near the center O of the heat radiating member 8 described later. That is, the center of one light emitting chip 40 having the tail lamp function and the center O of the substrate 3 (center O of the heat radiating member 8 to be described later) are coincident or substantially coincide.

(Description of control elements RS, RT, RP, DS, DT)
As shown in FIG. 11, the control element includes resistors RS, RT, RP and diodes DS, DT. The control element controls light emission of the five light emitting chips 40 to 44.

  The resistors RS, RT, and RP are, for example, thin film resistors, thick film resistors, or SMD type resistors. The resistors RS and RT are adjustment resistors for obtaining a predetermined drive current value. That is, due to the variation in Vf (forward voltage characteristics) of the light emitting chips 40 to 44, the value of the drive current supplied to the light emitting chips 40 to 44 changes, and the brightness (light flux) of the light emitting chips 40 to 44 changes. Variations occur in brightness, brightness, and illuminance. For this purpose, by adjusting (trimming) the values of the resistors RS and RT, the value of the drive current supplied to the light emitting chips 40 to 44 is set to a predetermined value almost constant, thereby making the light emitting chip 40 It is possible to adjust (absorb) variations in brightness (luminous flux, luminance, luminous intensity, illuminance) of .about.44. Alternatively, the brightness (luminous flux, luminance, luminous intensity, illuminance) of the light emitting chips 40-44 is made constant while directly monitoring the brightness (luminous flux, luminance, luminous intensity, illuminance) of the light emitting chips 40-44. The values of the resistors RS and RT can be trimmed. In the trimming, for example, a part of the resistors RS and RT are cut or all are cut (open) by a laser to adjust the resistance value. Note that the resistance value increases by opening and trimming.

  The resistor RP is a pull-down resistor for detecting disconnection of the four light emitting chips 41 to 44 in the second group, which is a light source of a stop lamp. The resistor RP is connected in series between the rear stage (cathode side) of the diode DS having a stop lamp function and the power supply member 93 on the ground side.

  The resistor RT connected in series to the one light emitting chip 40 having the tail lamp function, the resistor RS connected in series to the four light emitting chips 41 to 44 having the stop lamp function, and the stop lamp The resistor RP connected in series in the subsequent stage of the functional diode DS is one, three, or two, respectively. The number of resistors RP is determined by the capacitance of the resistor and the variable width of the resistor to be adjusted. May change. That is, the number of the resistors RS, RT, RP is not limited. In the resistor RS, as shown in FIG. 11, the two left resistors RS are connected in parallel to each other, and the one right resistor RS is connected in series to the two left resistors RS. Yes.

  When the light source unit 1 is mounted on the vehicle lamp 100 (see FIG. 1), the resistor RS having a large heat generation capacity of the stop lamp function for supplying a large current is more than the five light emitting chips 40 to 44. It is arranged so as to be located at a higher position. This makes it possible to release the heat generated in the resistor RS upward without affecting the five light emitting chips 40 to 44 by utilizing the property that heat rises.

  The diodes DS and DT include, for example, bare chip diodes or SMD diodes. The light emitting chip 40 having the tail lamp function and the diode DT connected in series to the resistor RT, the four light emitting chips 41 to 44 having the stop lamp function and the resistor RS are connected in series. The diode DS is a diode having a reverse connection prevention function and a pulse noise protection function from the reverse direction.

(Description of wiring elements 51 to 56, 6, 60, 61)
As shown in FIG. 11, the wiring element includes conductors (patterns, conductor patterns) 51 to 56, five wires (wiring wires, gold wires, bonding wires) 6, and five mounting pads (first pads). 60 and five wire pads (second pad, bonding part, bonding pad) 61. The wiring elements 51 to 56, 6, 60, 61 are electrically connected to the power feeding members 91, 92, 93 of the socket part 11 through the conductive metal member 17, and the control elements RS, RT, Power is supplied to the five light emitting chips 40 to 44 through RP, DS, and DT.

  The conductors 51 to 56 are made of, for example, thin film wiring or thick film wiring of a conductive member. The conductors 51 to 56 are connected to the resistors RS, RT, RP and the diodes DS, DT. The conductors 51 to 56 are provided with the mounting pad 60 and the wire pad 61, respectively. Of the conductors 51 to 56, the areas of the conductors 52 to 56 that supply a large current to the four light emitting chips 41 to 44 having the stop lamp function are substantially equal. Thereby, the heat generated in the conductors 52 to 56 can be released almost evenly to the outside (the heat radiating member 8 described later) through the substrate 3.

  The same number of the mounting pads 60 as the five light emitting chips 40 to 44, five in this example, are arranged. The five light emitting chips 40 to 44 are bonded to the five mounting pads 60 via the conductive adhesive such as silver paste. The mounting pad 60 has a small rectangular (square or rectangular) shape when viewed from the plane (upper direction perpendicular to the mounting surface 34 of the substrate 3).

  The same number of the wire pads 61 as the five light emitting chips 40 to 44, in this example, five are provided (mounted). The wire pad 61 has a minute rectangular (square or rectangular) shape when viewed from the plane (upper direction perpendicular to the mounting surface 34 of the substrate 3).

  The same number of the wires 6 as the five light emitting chips 40 to 44, in this example, five wires, are bonded. That is, both ends of the five wires 6 are electrically connected to the five light emitting chips 40 to 44 and the five wire pads 61, respectively. Electrodes are provided at locations where the wires 6 of the light emitting chips 40 to 44 are bonded and locations where the light emitting chips 40 to 44 are bonded to the mounting pads 60 via the conductive adhesive. ing.

(Description of conductive metal member 17)
The conductive metal member 17 is made of a conductive metal, in this example, a copper-based alloy (CuW, CuMo, etc.) that can withstand the firing of the substrate (ceramic substrate) 3. In particular, it is made of CuW having a linear expansion coefficient substantially equal to or close to that of the substrate (ceramic substrate) 3. The conductive metal member 17 has a rectangular tube shape. The conductive metal member 17 is embedded in the concave portion of the upper surface layer and the intermediate layer of the substrate 3. One surface (upper surface) of the conductive metal member 17 and the mounting surface 34 of the substrate 3 are flush with each other. A part of the other surface (lower surface) of the conductive metal member 17 is covered with the lower surface layer of the substrate 3.

  The conductive metal member 17 is for electrically connecting the light source unit 10 and the socket unit 11. On one surface of the conductive metal member 17, the conductors 51, 52, 53 of the wiring element mounted on the mounting surface 34 of the substrate 3 of the light source unit 10 are formed by solder or conductive adhesive (not shown). Are electrically connected. One end portions of the power feeding members 91 to 93 of the socket portion 11 are electrically and mechanically connected to the conductive metal member 17 by, for example, welding (leather welding).

(Description of heat conducting metal member 170)
The heat conducting metal member 170 is made of a metal having a high thermal conductivity, in this example, a copper alloy (CuW, CuMo, etc.) that can withstand the firing of the substrate (ceramic substrate) 3, like the conductive metal member 17. . In particular, it is made of CuW having a linear expansion coefficient substantially equal to or close to that of the substrate (ceramic substrate) 3. The heat conducting metal member 170 has a plate shape of a circle or a rectangle (the shape is not limited). The heat conducting metal member 170 is embedded in the hole of the lower layer and the intermediate layer of the substrate 3. One surface (upper surface) of the heat conducting metal member 170 is covered with an upper surface layer of the substrate 3. The other surface (lower surface) of the heat conducting metal member 170 and the contact surface 35 of the substrate 3 are flush with each other. The heat conducting metal member 170 is heat generated in the light emitting chips 40 to 44, and conducts heat transmitted through the upper surface layer of the substrate 3 to the heat radiating member 8 of the socket portion 11.

(Description of the surrounding wall member 18)
The surrounding wall member 18 is made of an insulating member, for example, a resin, in this example, a resin having elasticity that can follow the expansion and contraction of the sealing member 180 (thermoplastic elastomer, olefinic TPO resin). ing. As shown in FIGS. 3 to 7, the surrounding wall member 18 includes all of the five light emitting chips 40 to 44, a part of the wiring element (that is, a part of the conductors 51 to 56 and five parts of the wiring element). All of the wires 6 and all of the five mounting pads 60 and all of the five wire pads 61 are formed in an annular shape. That is, the surrounding wall member 18 has an annular shape in which a central portion is a hollow portion and a peripheral portion is a wall portion. The wall thickness of the surrounding wall member 18 (the thickness from the inner peripheral surface to the outer peripheral surface of the wall portion) is substantially uniform (equal).

  The surrounding wall member 18 has a height sufficiently higher than the height of the light emitting chips 40 to 44 and the wire 6 of the wiring element. The surrounding wall member 18 is a member (bank, dam) that regulates the capacity (range) for filling (injecting, molding, molding) the sealing member 180 to a small capacity. On one end surface (lower end surface) of the wall portion of the surrounding wall member 18, there are at least two fitting convex portions (not shown) for fixing and positioning (positioning) as fitting portions (in this example, 2) It is provided corresponding to the fitting hole of the substrate 3. By fitting the fitting convex portion and the fitting hole to each other, the surrounding wall member 18 and the substrate 3 are fixed to each other and positioned.

  One end surface (lower end surface) of the wall portion of the surrounding wall member 18 fixed and positioned mutually with the substrate 3 by the fitting convex portion and the fitting hole is the mounting surface 34 of the substrate 3. It is bonded and fixed (mounted) with an adhesive (not shown). In this example, the adhesive uses an epoxy resin having a glass transition temperature in the vicinity of the upper limit temperature of the light emitting chips 40 to 44 and having an elastic modulus that decreases from about 20 ° C. before the glass transition temperature.

  A space in the hollow portion of the surrounding wall member 18 mounted on the substrate 3 and defined by the mounting surface 34 of the substrate 3 and the inner peripheral surface of the wall portion of the surrounding wall member 18. The five light emitting chips 40 to 44 and the five wire pads 61 are respectively mounted therein, the five wires 6 are bonded to each other, and the sealing member 180 is filled. ing. A location for filling the sealing member 180 into the hollow portion of the surrounding wall member 18 is a location where the wire 6 is not wired.

  Light (not shown) emitted from the light emitting chips 40 to 44 (particularly, the four side surfaces of the light emitting chips 40 to 44) is applied to the inner peripheral surface of the wall portion of the surrounding wall member 18 in a predetermined direction ( For example, a reflection surface is provided that reflects the light in the direction substantially the same as the direction of light emitted from one front surface of the light emitting chips 40 to 44. The reflection surface is inclined so as to extend from one end (lower end) to the other end (upper end) of the inner peripheral surface of the wall portion. The reflecting surface may be configured such that the entire surrounding wall member 18 is made of a highly reflective member, for example, the entire surrounding wall member 18 is whitened by containing titanium oxide in an elastomeric resin, or the surrounding wall. Only the inner peripheral surface of the wall portion of the member 18 is formed of a highly reflective member.

(Description of sealing member 180)
The sealing member 180 is made of a light transmissive member, for example, an epoxy resin. In this example, the sealing member 180 has a glass transition temperature in the vicinity of the upper limit temperature of the light emitting chips 40 to 44 and is elastic from about 20 ° C. before the glass transition temperature in the same manner as the adhesive. Use an epoxy resin that reduces the rate.

  The sealing member 180 includes the hollow portion of the surrounding wall member 18 mounted on the substrate 3 after the light emitting chips 40 to 44 are mounted on the substrate 3 and the wires 6 are bonded to each other. It is filled in a space defined by the mounting surface 34 of the substrate 3 and the inner peripheral surface of the wall portion of the surrounding wall member 18. When the sealing member 180 is cured, all of the five light emitting chips 40 to 44, a part of the conductors 51 to 56, the whole wire 6, the whole mounting pad 60, the whole wire pad 61, and the whole The conductive adhesive is sealed by the sealing member 180.

  The sealing member 180 includes all five light emitting chips 40 to 44, a part of the conductors 51 to 56, all the wires 6, all the mounting pads 60, all the wire pads 61, and the conductive adhesive. This prevents the external influence, for example, contact with other things or adhesion of dust, and protection from ultraviolet rays, sulfide gas, NOx and water. That is, the sealing member 180 protects the five light emitting chips 40 to 44 from disturbance.

(Description of socket part 11)
As shown in FIGS. 1 to 10, the socket portion 11 includes an insulating member 7, a heat radiating member 8, and three power feeding members 91, 92, and 93. The heat radiating member 8 having thermal conductivity and conductivity and the power feeding members 91 to 93 having conductivity are integrally incorporated in the insulating member 7 having insulation properties in an insulated state. At least a part (one end portion 84) of the heat radiating member 8 and an intermediate portion of the power feeding members 91 to 93 are covered with the insulating member 7. That is, at least a part of the heat radiating member 8 and the outside of the intermediate portion of the power feeding members 91 to 93 are covered with the insulating member 7. As a result, as shown in FIG. 7, in the intermediate portion 111 where the insulating member 7 of the socket portion 11 covers the intermediate portion of the power feeding members 91 to 93, the insulating member 7 is the power feeding members 91 to 93. The heat radiating member 8 is located outside the insulating member 7 and the power feeding members 91 to 93.

  The socket portion 11 has an integral structure of the insulating member 7, the heat radiating member 8, and the power feeding members 91 to 93. For example, the insulating member 7, the heat radiating member 8, and the power feeding members 91 to 93 are integrally formed by insert molding (integral molding). That is, as shown in FIG. 8, the socket portion 11 is integrally formed of the insulating member 7, the heat radiating member 8, and the power feeding members 91 to 93 by molding dies 20 and 21. It is a part.

  The socket portion 11 includes a portion of the insulating member 7 (connector fitting portion 73) and a portion of the power feeding members 91 to 93 (male terminals (male terminals) 910, 920, 930). The connector part 13 is provided integrally.

(Description of insulating member 7)
The insulating member 7 is provided with an attachment portion for attaching the light source unit 1 to the vehicular lamp 100 detachably or fixedly. The insulating member 7 is made of, for example, an insulating resin member. The insulating member 7 has a substantially cylindrical shape whose outer diameter is slightly smaller than the inner diameter of the through hole 104 of the lamp housing 101. On one end surface (upper end surface) of the insulating member 7, a convex portion 72 is integrally provided. A disc-shaped flange 71 that presses the packing 108 against the lamp housing 101 is integrally provided at one end (upper end) of the insulating member 7. At one end (upper end) of the insulating member 7, a plurality of, in this example, four mounting portions 70 are integrally provided so as to correspond to the concave portion of the lamp housing 101. Note that only three attachment portions 70 are shown in FIGS. 4 to 6.

  The mounting portion 70 is used to equip the vehicle lamp 100 with the light source unit 1. That is, a part of the socket part 11 on the cover part 12 side and the attachment part 70 are inserted into the through hole 104 and the recess of the lamp housing 101. In this state, the socket portion 11 is rotated around the center O axis, and the mounting portion 70 is brought into contact with the stopper portion of the lamp housing 101. At this time, the mounting portion 70 and the flange portion 71 sandwich the edge portion of the through hole 104 of the lamp housing 101 from above and below via the packing 108 (see FIG. 1).

  As a result, as shown in FIG. 1, the socket portion 11 of the light source unit 1 is detachably or fixedly attached to the lamp housing 101 of the vehicle lamp 100 via the packing 108. At this time, as shown in FIG. 1, the portion of the socket portion 11 that protrudes outward from the lamp housing 101 (the portion below the lamp housing 101 in FIG. 1) is the lamp chamber 105 of the socket portion 11. It is larger than the portion housed inside (the portion above the lamp housing 101 in FIG. 1).

  A concave connector fitting portion 73 is integrally provided at the other end portion (lower end portion) of the insulating member 7. An extension portion 74 is integrally extended to the connector fitting portion 73 of the insulating member 7. On one end surface (upper end surface) of the extension portion 74 of the insulating member 7, a single biting convex portion 75 is provided in an annular shape so as to surround the power supply members 91 to 93. On the other end surface (lower end surface) of the flange portion 71 of the insulating member 7, two biting convex portions 75 are provided in an annular shape so as to surround the power feeding members 91 to 93.

(Description of heat dissipation member 8)
The heat radiating member 8 is provided with the light source unit 10 and radiates heat generated by the light source unit 10 to the outside. The heat radiating member 8 is made of, for example, an aluminum die cast having thermal conductivity (also having conductivity). The heat radiating member 8 has one end portion (upper end portion) 84 having a disc shape and a fin shape from the intermediate portion to the other end portion (lower end portion) 85. A disc-shaped flange 86 is integrally provided at an intermediate portion of the heat radiating member 8 so as to correspond to the flange 71 of the insulating member 7.

  A contact surface 80 is provided on the upper surface of the one end portion 84 of the heat radiating member 8. The contact surface 80 of the heat radiating member 8 is bonded with a heat conductive medium (not shown) in a state where the contact surfaces 35 of the substrate 3 are in contact with each other. As a result, the light emitting chips 40 to 44 are positioned corresponding to locations where the vicinity of the center O of the heat radiating member 8 (the center O of the socket portion 11) is located via the substrate 3.

  The heat conductive medium is, for example, a heat conductive adhesive, and is made of an epoxy resin adhesive, a silicon resin adhesive, an acrylic resin adhesive, or the like as a material. Form, tape form, etc. The heat conductive medium may be a heat conductive grease in addition to the heat conductive adhesive.

  Insertion holes 81, 82, and 83 are formed at the center of the three sides (right side, left side, and lower side) of the heat radiating member 8 in the insertion holes 31 to 33 of the substrate 3 and the convex portion 72 of the insulating member 7. Each is provided correspondingly. In the insertion holes 81 to 83 of the heat radiating member 8 and the insertion holes 31 to 33 of the substrate 3, intermediate portions of the three power supply members 91 to 93 are inserted and inserted. The insulating member 7 is interposed between the heat radiating member 8 and the power feeding members 91 to 93. The heat radiating member 8 is in close contact with the insulating member 7. The power supply members 91 to 93 are in close contact with the insulating member 7. The insertion holes 81 to 83 of the heat radiating member 8 may be notches.

  The one end portion 84 of a part of the heat radiating member 8 is covered with the insulating member 7. A part of the heat radiating member 8 from one end surface (upper end surface) to the outer side surface of the flange portion 86 is covered with the flange portion 71 of the insulating member 7. A part of the other end surface (lower end surface) of the fin-shaped other end portion 85 of the heat radiating member 8 is covered with the extension portion 74 of the insulating member 7.

  A part of the other end face (lower end face) covered by the extension part 74 of the insulating member 7 out of the other end part 85 of the fin shape of the heat radiating member 8 is lowered to one end (upper end) side. A stepped portion 88 is provided. The step 88 of the other end portion 85 of the heat radiating member 8 is surrounded by the one biting recess 87 that the biting convex portion 75 of the insulating member 7 bites in and surrounds the power supply members 91 to 93. Thus, it is provided in an annular shape. The biting convex portion 75 of the insulating member 7 bites into a part of one end surface (upper end surface) of the flange portion 86 of the heat radiating member 8 which is covered by the flange portion 71 of the insulating member 7. Two biting recesses 87 that are in close contact with each other are provided in an annular shape so as to surround the power supply members 91 to 93.

(Description of power supply members 91-93)
The power supply members 91 to 93 are electrically connected to the light source unit 10 and supply power to the light source unit 10. The power feeding members 91 to 93 are made of, for example, a conductive metal member. One end portions (upper end portions) of the power supply members 91 to 93 have a divergent shape, and the insertion holes 81 to 83 of the heat dissipation member 8, the insertion holes 31 to 33 of the substrate 3, and the conductive metal member 17 It is inserted and inserted in each. One end portions of the power supply members 91 to 93 protrude from the convex portion 72 of the insulating member 7 and are electrically and mechanically connected to the conductive metal member 17 by, for example, welding (leather welding).

  The other end portions (lower end portions) of the power supply members 91 to 93 have a narrowed shape and are disposed in the connector portion 13. The other end portions of the power feeding members 91 to 93 constitute male terminals 910 to 930.

  An intermediate portion of the power feeding members 91 to 93 (that is, an intermediate portion from one end connected to the conductive metal member 17 to the male terminals 910 to 930) is covered with the insulating member 7.

(Description of connector portion 13 and connector 14)
The connector part 13 includes a part of the connector fitting part 73 of the insulating member 7 and a part of the male terminals 910 to 930 of the power feeding members 91 to 93. A connector 14 on the power supply side is attached to the connector portion 13 so as to be mechanically detachable and electrically connectable.

  The connector 14 is provided with a female terminal (female terminal) (not shown) that is electrically connected to the male terminals 910 to 930 of the connector portion 13. By attaching the connector 14 to the connector portion 13, the female terminal is electrically connected to the male terminals 910 to 930. Further, by removing the connector 14 from the connector portion 13, electrical connection between the female terminal and the male terminals 910 to 930 is interrupted.

  As shown in FIG. 1, the first female terminal and the second female terminal among the female terminals of the connector 14 are connected to a power supply (DC power supply battery) via harnesses 144 and 145 and a switch (not shown). (Not shown). A third female terminal among the female terminals of the connector 14 is grounded (grounded) via a harness 146. The connector portion 13 and the connector 14 are 3-pin (the three power feeding members 91 to 93, the three male terminals 910 to 930, and the three female terminals) type connector portions and connectors.

(Description of cover part 12)
The cover portion 12 is made of a light transmissive member. The cover unit 12 is provided with an optical control unit (not shown) such as a prism that optically controls and emits light from the five light emitting chips 40 to 44. The cover portion 12 is an optical component.

  As shown in FIG. 1, the cover part 12 is attached to one end part (one end opening part) of the cylindrical socket part 11 so as to cover the light source part 10. The cover portion 12 together with the sealing member 180 prevents the five light emitting chips 40 to 44 from being affected from the outside, for example, contact with other things or adhesion of dust, and It protects against ultraviolet rays, sulfur gas, NOx and water. That is, the cover 12 protects the five light emitting chips 40 to 44 from disturbance. In addition to the five light emitting chips 40 to 44, the cover portion 12 includes the resistors RS, RT, RP, the diodes DS, DT of the control element, the conductors 51 to 56 of the wiring element, and the wires. 6. The mounting pad 60, the wire pad 61, and the conductive adhesive are also protected from disturbance. The cover portion 12 may be provided with a vent hole (not shown).

(Explanation of adhesion part)
At the interface between the heat radiating member 8 and the insulating member 7 of the intermediate portion 111 of the socket portion 11, a close contact portion 2 that is in close contact with each other is provided. That is, the contact portion 2 is provided over the entire circumference so as to surround the power supply members 91 to 93 at the interface between the flange portion 86 of the heat radiating member 8 and the flange portion 71 of the insulating member 7. It has been. Further, the close contact portion 2 extends over the entire circumference so as to surround the power supply members 91 to 94 at the interface between the other end portion 85 of the heat radiating member 8 and the extension portion 74 of the insulating member 7. Is provided.

  The close contact portion 2 is a biting surface of the insulating member 7 that bites into and adheres to the wall surface of the biting recess 87 as the wall surface of the recess provided in the heat dissipation member 8 and the wall surface of the biting recess 87 of the heat dissipation member 8. And the surface of the biting convex portion 75. That is, the contact portion 2 includes the biting concave portion 87 of the heat radiating member 8 and the biting convex portion 75 of the insulating member 7.

  As shown in FIG. 8, the contact portion 2 is a portion in contact with or near the molding dies 20, 21 for integrally molding the socket portion 11 of the insulating member 7 (three solid arrows in FIG. 8 are indicated). Reference).

  The biting recess 87 of the heat radiating member 8 of the close contact portion 2 is provided so as to be recessed in the opening / closing direction (see the arrow A direction in FIG. 8) of a molding die (not shown) for molding the heat radiating member 8. It has been. The opening / closing direction of the molding die of the heat radiating member 8 (not shown) is substantially the same as the opening / closing direction A of the molding dies 20, 21 of the socket portion 11.

(Description of the operation of the first embodiment)
The light source unit 1 of the semiconductor-type light source of the vehicle lamp in the first embodiment and the vehicle lamp 100 in the first embodiment (hereinafter referred to as “the light source unit 1 and the vehicle lamp 100 in the first embodiment”) are as described above. The operation will be described below.

  First, the switch is operated to turn on the tail lamp. Then, the current (drive current) is supplied to one light emitting chip 40 having the tail lamp function through the control element and the wiring element having the tail lamp function. As a result, one light emitting chip 40 having a tail lamp function emits light.

  Light emitted from one light emitting chip 40 having the tail lamp function is transmitted through the sealing member 180, the air layer, and the cover portion 12 of the light source unit 1, and light distribution is controlled. A part of the light emitted from the light emitting chip 40 is reflected by the highly reflective surface 30 of the substrate 3 toward the cover unit 12. The light subjected to the light distribution control is transmitted through the lamp lens 102 of the vehicular lamp 100, is again subjected to the light distribution control, and is irradiated to the outside. Thereby, the vehicular lamp 100 irradiates the light distribution of the tail lamp function to the outside.

  Next, the switch is operated to turn on the stop lamp. Then, the current (drive current) is supplied to the four light emitting chips 41 to 44 having the stop lamp function through the control element and the wiring element having the stop lamp function. As a result, the four light emitting chips 41 to 44 having the stop lamp function emit light.

  Light emitted from the four light emitting chips 41 to 44 having the stop lamp function is transmitted through the sealing member 180, the air layer, and the cover portion 12 of the light source unit 1, and the light distribution is controlled. A part of the light emitted from the light emitting chips 41 to 44 is reflected by the highly reflective surface 30 of the substrate 3 to the cover unit 12 side. The light subjected to the light distribution control is transmitted through the lamp lens 102 of the vehicular lamp 100, is again subjected to the light distribution control, and is irradiated to the outside. Thereby, the vehicular lamp 100 irradiates the light distribution of the stop lamp function to the outside. The light distribution of the stop lamp function is brighter than the light distribution of the tail lamp function (the luminous flux, luminance, luminous intensity, and illuminance are large).

  Then, turn off the switch. Then, the current (drive current) is interrupted. As a result, one light emitting chip 40 or four light emitting chips 41 to 44 are extinguished. Thereby, the vehicular lamp 100 is turned off.

  Here, the heat generated in the light emitting chips 40 to 44 of the light source unit 10, the resistance of the control element, and the conductor of the diode and the wiring element is transmitted to the heat radiating member 8 through the substrate 3, the heat conducting metal member 170 and the heat conductive medium. The heat radiation member 8 radiates outside.

(Description of the effect of Embodiment 1)
The light source unit 1 and the vehicular lamp 100 according to the first embodiment are configured and operated as described above, and the effects thereof will be described below.

  The light source unit 1 and the vehicular lamp 100 according to the first embodiment are configured so that the contact portion 2 (the biting recess 87 of the heat dissipation member 8 and the biting recess 87 of the heat dissipation member 8) is in close contact with the interface between the heat dissipation member 8 and the insulating member 7 of the intermediate portion 111 of the socket portion 11. Even if a gap is formed at the interface between the heat dissipating member 8 and the insulating member 7 due to the difference in thermal expansion coefficient between the heat dissipating member 8 and the insulating member 7. The contact portion 2 can prevent water (not shown) from entering the light source portion 10 through the socket portion 11. Thus, when used as the vehicular lamp 100, water tightness is taken into consideration.

  Moreover, in the light source unit 1 and the vehicle lamp 100 according to the first embodiment, in the intermediate portion 111 of the socket portion 11, the insulating member 7 is located outside the power feeding members 91 to 93, and the heat radiating member 8 is the insulating member. 7 and the outside of the power supply members 91 to 93, the insulating member 7 in the intermediate portion 111 of the socket portion 11 contracts in the direction of being pressed from all directions toward the power supply members 91 to 93 from the outside to the inside during curing. As a result, in the light source unit 1 and the vehicle lamp 100 according to the first embodiment, the insulating member 7 and the power feeding members 91 to 93 in the intermediate portion 111 of the socket portion 11 are in close contact with each other. Watertightness is ensured between the insulating member 7 and the power supply members 91 to 93 in the portion 111.

  In the light source unit 1 and the vehicle lamp 100 according to the first embodiment, the flange portion 71 of the insulating member 7 and the flange portion 86 of the heat dissipating member 8 press the packing 108 to the vehicle lamp 100 at the intermediate portion 111 of the socket portion 11. Since the close contact portion 2 that is in close contact with each other is provided, the close contact portion 2 that is located outside the vehicle lamp 100 (outside the lamp chamber 105) causes water to be located outside the vehicle lamp 100. 11 can be prevented from entering the light source unit 10 located inside the vehicle lamp 100 (inside the lamp chamber 105).

  In the light source unit 1 and the vehicle lamp 100 according to the first embodiment, the intermediate portion 111 of the socket portion 11 includes an extension portion 74 extending from a part of the insulating member 7 constituting the connector portion 13 and the heat radiation member 8. Since the close contact portion 2 that closely contacts each other is provided at the interface with the other end portion 85, the contact portion 2 located outside the vehicle lamp 100 (outside the lamp chamber 105) causes water to flow outside the vehicle lamp 100. It is possible to prevent intrusion into the light source unit 10 located inside the vehicle lamp 100 (inside the lamp chamber 105) via the socket unit 11 located at the position. In addition, since the light source unit 1 and the vehicle lamp 100 according to the first embodiment can reduce the thickness of the extension portion 74, the degree of contraction of the extension portion 74 and the biting convex portion 75 of the insulating member 7 is reduced. Accordingly, the biting adhesion between the wall surface of the biting concave portion 87 of the heat radiating member 8 and the surface of the biting convex portion 75 of the insulating member 7 is improved.

  Since the light source unit 1 and the vehicular lamp 100 according to the first embodiment can reduce the thickness of the biting convex portion 75 of the insulating member 7 that bites into and adheres to the wall surface of the biting concave portion 87 of the heat radiating member 8, the insulating member 7, the degree of shrinkage of the biting convex portion 75 can be reduced, and accordingly, the biting adhesion between the wall surface of the biting concave portion 87 of the heat radiating member 8 and the surface of the biting convex portion 75 of the insulating member 7 is improved. Moreover, in the light source unit 1 and the vehicle lamp 100 according to the first embodiment, the water intrusion path is detoured by the wall surface of the biting recess 87 of the heat radiating member 8 (that is, a fold is formed in the middle of the water intrusion path). ), The water infiltration path can be extended longer. Thereby, the light source unit 1 and the vehicular lamp 100 according to the first embodiment can further reliably prevent water from entering the light source unit 10 through the socket unit 11, and can further improve water tightness. it can.

  In the light source unit 1 and the vehicle lamp 100 in the first embodiment, the biting recess 87 of the heat radiating member 8 of the close contact portion 2 is provided so as to be recessed in the opening / closing direction of the molding die for molding the heat radiating member 8. Even if the radiating member 8 is provided with the biting recess 87, the radiating member 8 can be molded (die cast molding) without using a slide mold as a molding die for molding the radiating member 8. As a result, the light source unit 1 and the vehicular lamp 100 according to the first embodiment are simply provided with a convex portion that forms the biting concave portion 87 of the heat radiating member 8 in an existing molding die (molding die that molds the heat radiating member). Thus, the adhesiveness between the heat radiating member 8 and the insulating member 7 can be improved and the improved adhesiveness can be ensured without adding any additional cost to the molding die.

  Since the light source unit 1 and the vehicular lamp 100 according to the first embodiment are provided with the close contact portion 2 at a location in contact with or near the molding dies 20 and 21 for integrally molding the socket portion 11 of the insulating member 7. In a state where the molding dies 20 and 21 are under pressure (see the three arrows in FIG. 8), the biting convex portion 75 of the close contact portion 2 of the insulating member 7 is the biting concave portion 87 of the close contact portion 2 of the heat radiating member 8. Therefore, the adhesion between the heat dissipation member 8 and the insulating member 7 can be further improved, and the improved adhesion can be further ensured.

(Description of Embodiment 2)
FIG. 12 shows Embodiment 2 of the light source unit of the semiconductor-type light source of the vehicle lamp according to the present invention and Embodiment 2 of the vehicle lamp according to the present invention. In the figure, the same reference numerals as those in FIGS. 1 to 11 denote the same components.

  The light source unit 1 and the vehicular lamp 100 according to the first embodiment are part of the other end surface (lower end surface) of the fin-shaped other end portion 85 of the heat radiating member 8 that is covered by the extension 74 of the insulating member 7. A step portion 88 is provided in the step portion 88, and a biting recess portion 87 is provided in the step portion 88. On the other hand, the light source unit and the vehicle lamp in the second embodiment are provided on the other end surface (lower end surface) of the fin-shaped other end portion 85 of the heat radiating member 8 that is covered by the extension 74 of the insulating member 7. The stepped portion 88 is not provided in part, but the biting recess 87 is directly provided in the other end portion 85.

  Since the light source unit and the vehicular lamp in the second embodiment are configured as described above, the same operational effects as those of the light source unit 1 and the vehicular lamp 100 in the first embodiment can be achieved. In particular, in the light source unit and the vehicle lamp in the second embodiment, since the heat radiating member 8 is not provided with a step portion, the structure of the molding die for molding the heat radiating member 8 is simplified correspondingly, and additional cost is added to the molding die. There is no such thing as applying.

(Description of examples other than Embodiments 1 and 2)
In the first and second embodiments, five light emitting chips 40 to 44 are used. However, in the present invention, the number of light emitting chips may be two to four, six or more. The number and layout of the light emitting chips used as the tail lamp function and the number and layout of the light emitting chips used as the stop lamp function are not particularly limited. That is, it is only necessary that a plurality of light emitting chips are mounted in a row or on the circumference. In addition, when a plurality of light emitting chips are arranged on the circumference, the light emitting chips do not have to be arranged at the center of the circumference. In addition, when two or more light emitting chips are arranged on the circumference, it is not necessary to arrange them at equal intervals.

  In the first and second embodiments, the dual function lamp of the tail / stop lamp is used. However, in the present invention, it can also be used for a dual function lamp of a combination lamp other than a dual function lamp of a tail stop lamp. That is, a light-emitting chip that is supplied with a small current and emits a small amount of light and a light-emitting chip that is supplied with a large current and emits a large amount of light can be substituted for a sub-filament having a small amount of light and a main filament having a large amount of light.

  Furthermore, in the said Embodiment 1, 2, it uses for the dual function lamp of a tail stop lamp. However, in the present invention, it can be used for a single-function lamp. That is, a plurality of light emitting chips can be used for a single function lamp instead of a single filament. Single function lamps include turn signal lamp, backup lamp, stop lamp, tail lamp, headlamp low beam lamp (passing headlamp), headlamp high beam lamp (running headlamp), fog lamp, clearance lamp, cornering lamp There is a detime running lamp.

  Furthermore, in the said Embodiment 1, 2, it uses for switching of two lamps, a tail lamp and a stop lamp. However, in the present invention, it can be used for switching three or more lamps, or can be used for one lamp that does not perform switching.

  Furthermore, in the first and second embodiments, the connector portion 13 is provided integrally with the socket portion 11. However, in the present invention, the connector portion 13 may not be provided integrally with the socket portion 11. In this case, a light source side connector is provided separately from the socket portion 11, and the light source side connector is electrically connected to the power supply member of the light source unit 1 (see the power supply members 91 to 93 of the first embodiment) via a harness. To be connected. By attaching the power source side connector 14 to the light source side connector, electricity is supplied to the light source unit 10, and by removing the power source side connector 14 from the light source side connector, electricity supply to the light source unit 10 is achieved. Blocked.

  Furthermore, in the first and second embodiments, the board 3 is provided with a fitting hole (fitting concave part), while the surrounding wall member 18 is provided with a fitting convex part. However, in this invention, the board 3 may be provided with a fitting convex part, while the surrounding wall member 18 may be provided with a fitting hole (fitting concave part). The concave portion) and the fitting convex portion may be provided, respectively, while the surrounding wall member 18 may be provided with the fitting convex portion and the fitting hole (fitting concave portion).

  In the first and second embodiments, the fin-shaped other end portion 85 of the heat radiating member 8 of the socket portion 11 is exposed from the insulating member 7. However, in the present invention, the other end portion 85 of the heat radiating member 8 of the socket portion 11 may be covered with the insulating member 7.

  Furthermore, in the first and second embodiments, the mounting direction of the power source side connector 14 to the connector portion 13 and the mounting direction of the light source unit 1 to the vehicle lamp 100 are the same (in parallel). is there. However, in the present invention, the mounting direction of the power supply side connector 14 to the connector portion 13 and the mounting direction of the light source unit 1 to the vehicle lamp 100 may intersect (orthogonal).

  Furthermore, in the first and second embodiments, after the wire pad 61 and the mounting pad 60 are mounted on the substrate 3, the surrounding wall member 18 is mounted on the substrate 3, and then the light emitting chips 40 to 40 are mounted on the substrate 3. 44 is mounted and the wire 6 is bonded. However, in this invention, you may interchange the mounting process of the surrounding wall member 18, the mounting process of the light emitting chips 40-44, and the bonding process of the wire 6. FIG.

  Furthermore, in the first and second embodiments, an epoxy resin is used as the sealing member 180. However, in the present invention, a resin other than an epoxy resin, for example, silicon may be used as the sealing member 180.

  Furthermore, in the first and second embodiments, an elastomeric resin is used as the surrounding wall member 18. However, in the present invention, a resin other than the elastomeric resin may be used as the surrounding wall member 18. However, when an epoxy resin is used as the sealing member 180, an elastomeric resin is used as the surrounding wall member 18 in order to relieve stress due to expansion and contraction of the epoxy resin.

  Furthermore, in the first and second embodiments, the reflecting surface is provided so as to incline toward the end from one end (lower end) to the other end (upper end) of the inner peripheral surface of the wall portion of the surrounding wall member 18. It is. However, in this invention, it is not necessary to provide a reflecting surface on the inner peripheral surface of the wall portion of the surrounding wall member. In this case, the inner peripheral surface of the wall portion of the surrounding wall member may be a vertical surface instead of an inclined surface.

  Furthermore, in the first and second embodiments, the wall thickness of the surrounding wall member 18 (thickness from the inner peripheral surface to the outer peripheral surface of the wall portion) is substantially uniform (equal). However, in the present invention, the wall thickness of the surrounding wall member may not be substantially uniform.

  Furthermore, in the first and second embodiments, the shape of the inner peripheral surface of the wall portion of the surrounding wall member 18 is circular, that is, four pieces as viewed in the direction perpendicular to the mounting surface 34 of the substrate 3. It has a circular shape concentric with the circumference of the light emitting chips 41 to 44. However, in the present invention, the shape of the inner peripheral surface of the wall portion of the surrounding wall member 18 is an ellipse or a shape based on the ellipse (that is, the curves of both ends in the major axis direction of the reference ellipse are defined as the reference ellipse). It may be a shape displaced toward the center side. In this case, a plurality of light emitting chips are arranged in a line in the major axis direction of an ellipse or a reference ellipse.

  Furthermore, in the first and second embodiments, the heat conducting metal member 170 is embedded in the substrate 3. However, in the present invention, the heat conducting metal member 170 need not be embedded in the substrate 3. In this case, only the conductive metal member 17 is embedded in the substrate 3.

  In the first and second embodiments, the substrate 3 has a three-layer structure. However, in the present invention, the substrate 3 may have a two-layer structure or a four-layer structure or more.

  Furthermore, in the first and second embodiments, two of the interfaces between the flange portion 71 of the insulating member 7 and the flange portion 86 of the heat dissipation member 8 are in close contact with each other at a location surrounding the power feeding members 91 to 93. The contact portion 2 (the biting convex portion 75 and the biting concave portion 87) is provided. However, in the present invention, one close contact portion 2 or three or more close contact portions 2 may be provided.

  Furthermore, in the first and second embodiments, the power feeding members 91 to 93 are surrounded in the interface between the extension portion 74 extending from the connector portion 13 of the insulating member 7 and the other end portion 85 of the heat radiating member 8. One contact portion 2 (a biting convex portion 75 and a biting concave portion 87) that is in close contact with each other is provided. However, in the present invention, two or more contact portions 2 may be provided.

  Furthermore, in the first and second embodiments, a portion of the interface between the flange portion 71 of the insulating member 7 and the flange portion 86 of the heat radiating member 8 that surrounds the power feeding members 91 to 93 and the connector of the insulating member 7. The close contact portion 2 (the biting convex portion 75 and the biting concave portion) which are in close contact with each other at the portion surrounding the power feeding members 91 to 93 in the interface between the extension portion 74 extending from the portion 13 and the other end portion 85 of the heat radiating member 8. 87). However, in the present invention, the close contact portion 2 (the biting convex portion 75 and the biting convex portion 75) which is in close contact with the portion surrounding the power feeding members 91 to 93 in the interface between the flange portion 71 of the insulating member 7 and the flange portion 86 of the heat radiating member 8. A biting recess 87) may be provided, or power feeding members 91 to 93 may be provided in the interface between the extension portion 74 extending from the connector portion 13 of the insulating member 7 and the other end portion 85 of the heat radiating member 8. You may provide the contact | adherence part 2 (The biting convex part 75 and the biting recessed part 87) mutually contact | adhered to the location to surround.

DESCRIPTION OF SYMBOLS 100 Vehicle lamp 101 Lamp housing 102 Lamp lens 103 Reflector 104 Through-hole 105 Lamp chamber 106 Through-hole 107 Reflecting surface 108 Packing 1 Light source unit 10 Light source part 11 Socket part 111 Intermediate part 12 Cover part 13 Connector part 14 Connector 144, 145, 146 Harness 17 Conductive metal member 170 Heat conducting metal member 18 Enclosure wall member 180 Sealing member 2 Adhering portion 20, 21 Molding mold of socket portion 3 Substrate 30 High reflection surface 31, 32, 33 Insertion hole 34 Mounting surface 35 Contact surface 40, 41, 42, 43, 44 Light emitting chip 51, 52, 53, 54, 55, 56 Conductor (wiring element)
6 Wire (Wiring element)
60 Mounting pads (wiring elements)
61 Wire pads (wiring elements)
7 Insulating member 70 Mounting portion 71 Gutter portion 72 Convex portion 73 Connector fitting portion 74 Extension portion 75 Biting convex portion (contact portion)
8 Heat-dissipating member 80 Contact surface 81, 82, 83 Insertion hole 84 One end part 85 Other end part 86 Gutter part 87 Biting recessed part 88 Step part 91, 92, 93 Power supply member 910, 920, 930 Male terminal A Opening / closing of mold Direction DS, DT Diode (control element)
F Focus O Center RS, RT, RP Resistance (control element)
XX Horizontal direction (left-right direction)
YY Vertical direction (vertical direction)

Claims (7)

In a light source unit of a semiconductor-type light source for a vehicle lamp,
A light source part and a socket part,
The light source unit has a light emitting chip of a semiconductor light source,
The socket part is
The light source unit is attached, and a heat radiating member that radiates heat generated in the light source unit to the outside,
A power supply member that is electrically connected to the light source unit and supplies power to the light source unit;
An insulating member that covers at least a part of the heat radiating member and an intermediate portion of the power feeding member, and incorporates the heat radiating member and the power feeding member in an insulated state;
Is an integrally molded part composed of
In the intermediate portion of the socket portion where the insulating member covers the intermediate portion of the power feeding member, the insulating member is located outside the power feeding member, and the heat dissipation member is disposed between the insulating member and the power feeding member. Located outside,
At the interface between the heat radiating member and the insulating member in the middle part of the socket part, a close contact part that is in close contact with each other is provided,
A light source unit for a semiconductor light source of a vehicular lamp. The insulating member in the intermediate portion of the socket portion is integrally provided with a flange portion that presses the packing against the vehicle lamp,
In the heat radiating member of the intermediate portion of the socket portion, a flange portion is integrally provided corresponding to the flange portion of the insulating member,
At the interface between the flange portion of the heat dissipation member and the flange portion of the insulating member, a close contact portion that is in close contact with each other is provided.
The light source unit of the semiconductor type light source of the vehicular lamp according to claim 1. The socket part is integrally provided with a connector part composed of a part of the insulating member and a part of the power supply member,
An extension portion is integrally extended to a part of the insulating member constituting the connector portion,
At the interface between the heat radiating member at the intermediate portion of the socket portion and the extension portion of the insulating member, a close contact portion that is in close contact with each other is provided.
The light source unit of the semiconductor type light source of the vehicular lamp according to claim 1 or 2. The contact portion is
At least one of the wall surface of the concave portion or the wall surface of the convex portion provided in the heat dissipation member, and
A biting surface of the insulating member that bites into and adheres to the wall surface of the concave portion or the convex portion of the heat dissipation member; and
Consist of,
The light source unit of the semiconductor type light source of the vehicle lamp of any one of Claims 1-3 characterized by the above-mentioned. The concave portion or the convex portion of the heat dissipation member of the close contact portion is provided so as to be recessed or protruded in the opening / closing direction of a molding die for molding the heat dissipation member.
The light source unit of the semiconductor type light source of the vehicular lamp according to claim 4. The contact portion is provided at or near a portion of the insulating member that is in contact with a molding die for integrally molding the socket portion.
The light source unit of the semiconductor type light source of the vehicle lamp of any one of Claims 1-5 characterized by the above-mentioned. In a vehicular lamp using a semiconductor-type light source as a light source,
A lamp housing and a lamp lens that partition the lamp chamber;
The light source unit of the semiconductor type light source of the vehicular lamp according to any one of claims 1 to 6, wherein the light source unit is disposed in the lamp chamber.
A vehicular lamp characterized by comprising:

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