JP5899923B2 - Semiconductor type light source for vehicle lamp, semiconductor type light source unit for vehicle lamp, vehicle lamp - Google Patents

Description

  The present invention relates to a semiconductor-type light source for a vehicular lamp. The present invention also relates to a semiconductor-type light source unit for a vehicle lamp. Furthermore, the present invention relates to a vehicular lamp using a semiconductor light source unit as a light source.

  This type of semiconductor-type light source is conventionally known (for example, Patent Document 1). Hereinafter, a conventional semiconductor light source will be described. A conventional semiconductor light source has a plurality of LED chips mounted on a substrate, a reflector is disposed on the substrate via an adhesive, and the reflector is filled with a transparent resin, that is, a sealing member. Is covered with a sealing member. In the conventional semiconductor-type light source, three LED chips that are light sources of the tail lamp are arranged at equal intervals on a concentric small circle, and six LED chips that are light sources of the stop lamp are on a concentric great circle. Are arranged at equal intervals.

JP 2007-176219 A

  In such a semiconductor light source, it is important to efficiently irradiate the light distribution pattern of the tail lamp and the light distribution pattern of the stop lamp, respectively, using a common optical system for the tail lamp and the stop lamp. Further, in such a semiconductor-type light source, the capacity of the sealing member is reduced in order to reduce stress due to thermal expansion or contraction of the sealing member due to lighting / extinguishing of the LED chip or a change in the temperature of the usage environment. It is important to make the volume as small as possible.

  Problems to be solved by the present invention are that the light distribution pattern of the tail lamp and the light distribution pattern of the stop lamp are each efficiently irradiated, and that the capacity of the sealing member is made as small as possible. is there.

  The present invention (invention according to claim 1) includes a substrate having a mounting surface, a plurality of semiconductor light emitting elements mounted on the mounting surface of the substrate, a control element for controlling light emission of the semiconductor light emitting element, and a control element A wiring element that feeds power to the semiconductor light emitting element through the ring, a ring-shaped surrounding wall member that surrounds all of the plurality of semiconductor light emitting elements, a plurality of mounting surfaces of the substrate, and a plurality of recesses formed in the surrounding wall member A light-transmitting sealing member that seals the semiconductor light-emitting element, wherein the plurality of semiconductor light-emitting elements are one semiconductor light-emitting element that is a light source of a tail lamp and at least four light sources that are light sources of a stop lamp A semiconductor light emitting element, and one semiconductor light emitting element that is a light source of the tail lamp is disposed at or near the center of the substrate, and at least four semiconductor light emitting elements that are light sources of the stop lamp Chi four semiconductor light emitting elements are arranged at four corners of a square on a circle around the one semiconductor light emitting element or near a light source of the tail lamp, characterized in that.

  According to the present invention (the invention according to claim 2), four semiconductor light emitting elements out of at least four semiconductor light emitting elements that are light sources of stop lamps are provided with one semiconductor light emitting element that is a light source of tail lamps or the vicinity thereof. It is characterized by four square corners on the center circle and arranged in a cross shape on the top, bottom, left and right.

  According to the present invention (the invention according to claim 3), the wiring element has at least five mounting pads mounted on the mounting surface of the substrate, and at least five semiconductor light emitting elements are electrically connected to at least five mounting pads, respectively. At least five conductive adhesives, and a mounting pad of one semiconductor light emitting element that is a light source of a tail lamp, or at least four semiconductor light emitting elements that are a light source of a stop lamp Mounting pads for four semiconductor light emitting elements respectively arranged in a square at four corners, at least one side of which is opposed to the other, one semiconductor light emitting element that is the light source of the tail lamp Of the mounting pads and four of the at least four semiconductor light emitting devices that are the light sources of the stop lamps, each of which is arranged in a cross at four corners of a square. Against a line segment connecting the center of the mounting pad of the conductive light emitting elements respectively, orthogonal, and wherein the.

  This invention (the invention according to claim 4) is characterized in that the light source of the stop lamp comprises four semiconductor light emitting elements, and the surrounding wall member has a circular shape.

  According to the present invention (the invention according to claim 5), the light source of the stop lamp is composed of six semiconductor light emitting elements, and the four semiconductor light emitting elements as the light source of the stop lamp are vertically or horizontally crossed or square. The remaining two semiconductor light-emitting elements that are the light sources of the stop lamps are respectively arranged in the horizontal direction on the left and right sides of the four semiconductor light-emitting elements. The remaining two semiconductor light emitting elements are characterized by having an ellipse or a shape based on the ellipse whose major axis is the arrangement direction of the two semiconductor light emitting elements.

  This invention (invention concerning Claim 6) is a vehicle according to any one of claims 1 to 5, which is attached to a socket part formed by combining an insulating member, a heat radiating member, and a power feeding member. And a semiconductor-type light source for a lamp.

  The present invention (the invention according to claim 7) comprises a lamp housing and a lamp lens that define a lamp chamber, and a semiconductor light source unit for a vehicle lamp according to claim 6, wherein the socket portion is attached to the lamp housing. The semiconductor light source is disposed in the lamp chamber.

  In the semiconductor-type light source of the vehicular lamp according to the present invention (the invention according to claim 1), one semiconductor light-emitting element that is a light source of the tail lamp is disposed at or near the center of the substrate. Therefore, the arrangement of the tail lamp shown in FIG. Optical characteristics (that is, the luminance is the highest luminance at the center (V-0 °, H-0 °) point, the second luminance at the left and right (V-0 °, H-5 °) points, (V-5 [deg.], H-0 [deg.]) At the 3rd place, left and right (V-0 [deg.], H-10 [deg.]) At the 4th place, and up, down, left and right (V-10) °, H-5 °) and 5th place brightness at the top, bottom, left and right (V-5 °, H-10 °) points, and 6th place at top, bottom, left and right (V-5 °, H-20 °) points. The brightness of the tail lamp is almost the same as that of the taillight (long light distribution characteristic).

  The semiconductor light source of the vehicular lamp according to the present invention (the invention according to claim 1) is a light source for a tail lamp, of which at least four semiconductor light emitting elements are at least four semiconductor light emitting elements that are light sources for a stop lamp. Since the light emitting characteristics of the stop lamp shown in FIG. 5 (that is, the luminance is the center (V-0 °, H -0 °) is the highest luminance, left and right (V-0 °, H-5 °) is the second highest luminance, and upper and lower (V-5 °, H-0 °) is the third highest The luminance is 4th in the left and right (V-0 °, H-10 °) points, the vertical and horizontal (V-10 °, H-5 °) points, and the vertical and horizontal (V-5) points. The brightness is 5th at the point (°, H-10 °), and is (V-5 °, H- 0 °) substantially coincides with the (next) long light distribution characteristics) in the left and right stop lamps is 6-position of the luminance at the point.

  Thus, the semiconductor light source of the vehicular lamp of the present invention (the invention according to claim 1) uses a common optical system for the tail lamp and the stop lamp, and uses a light distribution pattern for the tail lamp and a light distribution pattern for the stop lamp. Can be irradiated efficiently.

  The semiconductor-type light source of the vehicle lamp according to the present invention (the invention according to claim 1) has a semiconductor light-emitting element that is a light source of a tail lamp arranged at or near the center of a substrate, and a light source of a stop lamp. Of the at least four semiconductor light-emitting elements, four semiconductor light-emitting elements are arranged in four square corners on one semiconductor light-emitting element that is the light source of the tail lamp or a circle centered around the semiconductor light-emitting element. For this reason, the semiconductor light source of the vehicular lamp according to the present invention (the invention according to claim 1) is a conventional semiconductor light source (that is, three LED chips that are light sources of a tail lamp are arranged on a concentric small circle, etc. The surrounding wall member can be made smaller compared to a conventional semiconductor light source which is arranged at intervals and has six LED chips which are light sources of stop lamps arranged at equal intervals on a large concentric circle. . Thereby, the capacity | capacitance of a sealing member can be made into the smallest capacity | capacitance as much as the surrounding wall member is made small. In addition, the manufacturing cost can be reduced by reducing the capacity of the sealing member.

  In the semiconductor-type light source of the vehicle lamp of the present invention (the invention according to claim 2), one semiconductor light-emitting element that is a light source of the tail lamp is disposed at or near the center of the substrate. It almost matches the light distribution characteristic of the tail lamp shown. The semiconductor light source of the vehicular lamp according to the present invention (the invention according to claim 2) includes four semiconductor light-emitting elements among at least four semiconductor light-emitting elements that are light sources of stop lamps, which are tail lamp light sources. Since the four squares are arranged on a circle centered on one semiconductor light emitting element or its vicinity and are arranged in a cross shape on the top, bottom, left, and right, respectively, the light distribution characteristics of the stop lamp shown in FIG. Thus, the semiconductor-type light source of the vehicular lamp of the present invention (the invention according to claim 2) uses a common optical system for the tail lamp and the stop lamp, and uses a light distribution pattern for the tail lamp and a light distribution pattern for the stop lamp. Can be irradiated efficiently.

  The semiconductor-type light source of the vehicle lamp according to the present invention (the invention according to claim 2) has a semiconductor light-emitting element, which is a light source of a tail lamp, disposed at or near the center of the substrate, and a light source of a stop lamp. Of the at least four semiconductor light-emitting elements, four semiconductor light-emitting elements are crossed vertically, horizontally, and squarely on one semiconductor light-emitting element that is the light source of the tail lamp or a circle centered around it. Respectively. For this reason, the semiconductor type light source of the vehicular lamp of the present invention (invention according to claim 2) is similar to the conventional semiconductor light source of the vehicular lamp of the above invention (invention according to claim 1). The surrounding wall member can be made smaller than the mold light source. Thereby, the capacity | capacitance of a sealing member can be made into the smallest capacity | capacitance as much as the surrounding wall member is made small. In addition, the manufacturing cost can be reduced by reducing the capacity of the sealing member.

  In particular, the semiconductor-type light source of the vehicular lamp according to the present invention (the invention according to claim 2) includes at least four semiconductor light-emitting elements among at least four semiconductor light-emitting elements that are the light sources of the stop lamps. The light distribution characteristics of the rear fog lamp shown in FIG. 6 (that is, the brightness is large) are formed as four squares on a circle centered on one semiconductor light-emitting element or its vicinity, and are arranged in a cross on the top, bottom, left, and right. Characteristics of a rear fog lamp having high brightness in the crosses (HL-10 ° to HR-10 °, VU-5 ° to VD-5 °) shown by the solid line and low brightness in the rhombus shape shown by the broken line) Almost matches. As a result, since the semiconductor-type light source of the vehicular lamp according to the present invention (the invention according to claim 1) can be used as a rear fog lamp, it is not necessary to separately manufacture or manage the rear fog lamp. Manufacturing costs and management costs can be reduced.

  The semiconductor-type light source of the vehicle lamp according to the present invention (the invention according to claim 3) is a mounting pad of one semiconductor light-emitting element that is a light source of a tail lamp, or at least four semiconductor light-emitting elements that are light sources of a stop lamp Mounting pads of the four semiconductor light emitting elements respectively disposed in the four corners of the semiconductor chip, at least one side of which is opposed to the other, one semiconductor light emitting element that is the light source of the tail lamp Line segments connecting the centers of the mounting pads and the centers of the mounting pads of the four semiconductor light emitting elements arranged at the four corners of the square among the at least four semiconductor light emitting elements that are the light sources of the stop lamp. Orthogonal. A mounting pad for one semiconductor light-emitting element that is a light source for the tail lamp, and a mounting pad for four semiconductor light-emitting elements that are respectively arranged at four corners of a square among at least four semiconductor light-emitting elements that are a light source for the stop lamp; The gap between the two can be a distance that does not contact each other, or a distance that does not allow a plurality of wiring patterns mounted on the substrate to contact each other. Thereby, the surrounding wall member can be made small, and the capacity of the sealing member can be made as small as possible. In addition, the manufacturing cost can be reduced by reducing the capacity of the sealing member.

  The semiconductor-type light source of the vehicle lamp according to the present invention (the invention according to claim 4) is such that the light source of the stop lamp is composed of four semiconductor light emitting elements, and the surrounding wall member has a circular shape. Compared with a rectangle, an oval, and an ellipse, the stress of a sealing member can be suppressed low. As a result, since the stress due to thermal expansion and contraction of the sealing member can be reduced, peeling of the semiconductor light emitting element and the wiring element can be surely prevented, and the reliability of the product can be improved.

  The semiconductor-type light source of the vehicular lamp according to the present invention (the invention according to claim 5) is that the light source of the stop lamp is composed of six semiconductor light-emitting elements, and the four semiconductor light-emitting elements that are the light sources of the stop lamp are vertically and horizontally The remaining two semiconductor light emitting elements, which are arranged in a cross or in four corners of the square, are arranged horizontally on the left and right sides of the four semiconductor light emitting elements, respectively, The member has an ellipse or a shape based on the ellipse whose major axis is the direction of arrangement of the remaining two semiconductor light emitting elements. As a result, the semiconductor-type light source of the vehicular lamp according to the present invention (invention according to claim 5) can reduce the capacity of the sealing member as compared with a rectangular or circular shape of the surrounding wall member. .

  The semiconductor-type light source unit for a vehicle lamp according to the present invention (the invention according to claim 6) achieves the same effect as the semiconductor-type light source for a vehicle lamp according to any one of the first to fifth aspects. be able to.

  The vehicular lamp of this invention (the invention according to claim 7) can achieve the same effect as the semiconductor light source unit of the vehicular lamp of claim 6.

1 shows a first embodiment of a semiconductor-type light source of a vehicular lamp according to the present invention, a first embodiment of a semiconductor-type light source unit of a vehicular lamp according to the present invention, and an embodiment of a vehicular lamp according to the present invention. FIG. 2 is a longitudinal sectional view, ie, a vertical sectional view, illustrating the first embodiment, in a state where the semiconductor light source unit is assembled to the vehicle lamp. FIG. 2 is a perspective view showing the semiconductor light source unit in a state in which the light source unit (semiconductor type light source) and the socket unit are assembled. FIG. 3 is a front view (seen in the direction of arrow III in FIG. 2) showing the semiconductor-type light source unit in a state where the light source part (semiconductor-type light source) and the socket part are assembled. FIG. 4 is an enlarged plan view showing the surrounding wall member, the five semiconductor light emitting elements, and the wiring elements (five conductive adhesives and five mounting pads). FIG. 5 is an explanatory diagram showing the light distribution characteristics of the tail lamp and the light distribution characteristics of the stop lamp. FIG. 6 is an explanatory diagram showing the light distribution characteristics of the rear fog lamp. FIG. 7 shows the light source luminous flux, the maximum luminous intensity (Max luminous intensity), and the outgoing luminous flux when the four semiconductor light emitting elements, which are the light sources of the stop lamps, are respectively arranged in a cross shape and at four corners of a square. It is explanatory drawing shown about the case where it has arrange | positioned, and the case where it arrange | positions in a straight line. FIG. 8 shows the overall evaluation (total) in a straight line when the four semiconductor light-emitting elements, which are the light sources of the stop lamps, are arranged in a cross shape, in a case where they are respectively arranged in four corners of a square. It is explanatory drawing shown about the case where it has arrange | positioned. FIG. 9 shows a second embodiment of a semiconductor light source of a vehicular lamp according to the present invention, a second embodiment of a semiconductor light source unit of a vehicular lamp according to the present invention, and an implementation of a vehicular lamp according to the present invention. It is a perspective view which shows the form 2 and shows the semiconductor type light source unit of the state which assembled | attached the light source part (semiconductor type light source) and the socket part. FIG. 10 is a front view (seen in the direction of arrow X in FIG. 9) showing the semiconductor light source unit in a state where the light source part (semiconductor light source) and the socket part are assembled. FIG. 11 is an enlarged plan view showing the surrounding wall member, the five semiconductor light emitting elements, and the wiring elements (five conductive adhesives and five mounting pads). FIG. 12 shows a third embodiment of the semiconductor light source of the vehicular lamp according to the present invention, a third embodiment of the semiconductor light source unit of the vehicular lamp according to the present invention, and the implementation of the vehicular lamp according to the present invention. FIG. 10 is an enlarged plan view of the surrounding wall member, five semiconductor light emitting elements, and wiring elements (five conductive adhesives and five mounting pads) according to the third embodiment. FIG. 13 shows a fourth embodiment of a semiconductor light source for a vehicular lamp according to the present invention, a fourth embodiment of a semiconductor light source unit of a vehicular lamp according to the present invention, and an implementation of a vehicular lamp according to the present invention. FIG. 9 is a plan view of the surrounding wall member and seven semiconductor light emitting elements according to the fourth embodiment. FIG. 14 shows a fifth embodiment of a semiconductor light source for a vehicular lamp according to the present invention, a fifth embodiment of a semiconductor light source unit of a vehicular lamp according to the present invention, and an implementation of a vehicular lamp according to the present invention. FIG. 10 is a plan view of the surrounding wall member and seven semiconductor light emitting elements according to the fifth embodiment.

  Hereinafter, an embodiment (Example) of a semiconductor-type light source of a vehicle lamp according to the present invention, an embodiment (Example) of a semiconductor-type light source unit of a vehicle lamp according to the present invention, and a vehicle according to the present invention Five examples of the lamp embodiment will be described in detail with reference to the drawings. In addition, this invention is not limited by this embodiment.

(Description of Configuration of Embodiment 1)
Hereinafter, the semiconductor light source of the vehicle lamp in the first embodiment, the semiconductor light source unit of the vehicle lamp in the first embodiment, and the configuration of the vehicle lamp in the first embodiment will be described. In FIG. 1, reference numeral 100 denotes a vehicular lamp in the first embodiment.

(Description of vehicle lamp 100)
The vehicle lamp 100 is a one-lamp tail / stop lamp in this example. That is, the vehicular lamp 100 uses a tail lamp function and a stop lamp function in combination with one lamp, that is, one lamp and one lamp. The vehicle lamps 100 are respectively provided on the left and right of the rear part of a vehicle (not shown). The vehicle lamp 100 may be combined with other lamp functions (not shown) such as a backup lamp function and a turn signal lamp function to constitute a rear combination lamp.

  As shown in FIG. 1, the vehicle lamp 100 includes a lamp housing 101, a lamp lens 102, and a reflector 103, and the semiconductor-type light source unit 1 of the vehicle lamp according to the first embodiment.

  The lamp housing 101 is made of, for example, a light impermeable member, for example, a resin member. The lamp housing 101 has a hollow shape in which one side is open and the other side is closed. A mounting hole 104 is provided in the closed portion of the lamp housing 101. The mounting hole 104 has a circular shape. A plurality of concave portions (not shown) and a plurality of stopper portions (not shown) are provided at substantially equal intervals on the edge of the mounting hole 104.

  The lamp lens 102 is made of, for example, a light transmissive member such as a transparent resin member or a glass member. The lamp lens 102 has a hollow shape in which one side is open and the other side is closed. The periphery of the opening of the lamp lens 102 and the periphery of the opening of the lamp housing 101 are fixed in a watertight manner. A lamp chamber 105 is defined by the lamp housing 101 and the lamp lens 102.

  The reflector 103 is a light distribution control unit that performs light distribution control so that the light emitted from the semiconductor light source unit 1 is collected at a focal point F (see FIG. 3). The reflector 103 is disposed in the lamp chamber 105 and is fixed to the lamp housing 101 or the like. The reflector 103 is made of, for example, a light impermeable member, such as a resin member or a metal member. The reflector 103 has a hollow shape in which one side is open and the other side is closed. A through hole 106 is provided in the closed portion of the reflector 103 so as to communicate with the mounting hole 104 of the lamp housing 101. A reflective surface 107 is provided on the inner surface of the reflector 103. The reflector 103 is made of a separate member from the lamp housing 101, but may be a reflector integrated with the lamp housing. In this case, a reflecting surface is provided on a part of the lamp housing to provide a reflector function.

(Description of the semiconductor light source unit 1)
As shown in FIGS. 1 to 3, the semiconductor-type light source unit 1 includes a light source unit 10 as a semiconductor-type light source, a socket unit 11, and a lens unit 12 as an optical component. The light source unit 10 is attached to one end (upper end) of the socket unit 11. The lens portion 12 is fixedly or detachably attached to one end portion of the socket portion 11. The light source unit 10 is covered with the cap-shaped or cover-shaped lens unit 12.

  As shown in FIG. 1, the semiconductor light source unit 1 is mounted on the vehicular lamp 100. That is, the socket part 11 is detachably attached to the lamp housing 101 via a packing (O-ring) 108. The light source unit 10 and the lens unit 12 are arranged in the lamp chamber 105 through the mounting hole 104 of the lamp housing 101 and the through hole 106 of the reflector 103 and on the reflecting surface 107 side of the reflector 103. Has been.

(Description of the light source unit 10)
2 to 4, the light source unit 10 includes a substrate 3 and a plurality of semiconductor light emitting elements (LED chips) 40, 41, 42, 43, 44 (hereinafter referred to as “40˜ 44 ”, a resistance (not shown) and a diode (not shown) as control elements, a wiring pattern (not shown) and bonding wires (not shown) as wiring elements, Five conductive adhesives 600, 610, 620, 630, 640 (hereinafter may be referred to as “600-640”) and five mounting pads 601, 611, 621, 631, 641 (hereinafter, “ 601 to 641 ”and a wire pad (not shown), the surrounding wall member 18, and the sealing member 180.

(Description of socket part 11)
As shown in FIGS. 1 to 3, the socket portion 11 includes an insulating member 7, a heat radiating member 8, and three power feeding members 91, 92, and 93. The heat radiating member 8 having thermal conductivity and conductivity and the power feeding members 91 to 93 having conductivity are integrally incorporated in the insulating member 7 having insulation properties in an insulated state.

  The socket portion 11 has an integral structure of the insulating member 7, the heat radiating member 8, and the power feeding members 91 to 93. For example, the insulating member 7, the heat radiating member 8, and the power feeding members 91 to 93 are integrally formed by insert molding (integral molding). Or the said insulating member 7 and the said electric power feeding members 91-93 are comprised integrally by insert molding, and the said heat radiation member 8 is integrally attached to the said insulating member 7 and the said electric power feeding members 91-93 of an integral structure. is there. Alternatively, the power feeding members 91 to 93 are integrally assembled to the insulating member 7, and the heat radiating member 8 is integrally attached to the integrally assembled insulating member 7 and the power feeding members 91 to 93.

(Description of assembly structure of semiconductor light source unit 1)
As shown in FIGS. 1 to 3, the semiconductor-type light source unit 1 includes a surface of the heat radiating member 8 of the socket portion 11 in which the insulating member 7, the heat radiating member 8, and the power feeding members 91 to 93 are integrally molded. And the contact surface on the back surface of the substrate 3 on which the semiconductor light emitting elements 40 to 44 of the light source unit 10 are mounted and sealed are arranged in close contact with each other. At the same time, the power supply members 91 to 93 of the socket portion 11 and the wiring pattern of the substrate 3 are connected to the contact surface of the heat radiating member 8 and the contact of the substrate 3 via a connection member 17. While being in close contact with the surface, it is firmly electrically connected. That is, one end portion of the power supply members 91 to 93 protruding from the surface side of the heat radiating member 8 of the socket portion 11 is inserted into the cutout hole of the connection member 17, and one end portion of the power supply members 91 to 93 is inserted. And the connecting member 17 are electrically and mechanically connected by elastic contact, caulking, welding, or the like. On the other hand, the connecting member 17 is mechanically connected to the substrate 3 by fitting or the like, and electrically connected to the wiring pattern of the substrate 3 by solder or a conductive adhesive. The connection member 17 maintains a close state between the back surface of the substrate 3 and the surface of the heat dissipation member 8. As a result, the semiconductor light source unit 1 is excellent in heat dissipation performance. Further, the electrical connection state between the power feeding members 91 to 93 of the socket portion 11 and the wiring pattern of the substrate 3 is maintained. As a result, the electrical circuit connection state is strengthened.

(Description of substrate 3)
In this example, the substrate 3 is made of ceramic. As shown in FIGS. 2 and 3, the substrate 3 has a substantially octagonal plate shape when viewed from the top, that is, from above. Insertion holes through which the power feeding members 91, 92, and 93 of the socket portion 11 are inserted are provided at substantially the center of the right side, the left side, and the lower side of the three sides of the substrate 3. A flat mounting surface 34 is provided on the upper surface of one surface of the substrate 3. A flat contact surface is provided on the lower surface of the other surface of the substrate 3. A highly reflective surface 30 such as highly reflective paint or highly reflective vapor deposition may be further provided on the mounting surface 34 of the ceramic substrate 3 that is a highly reflective member.

  On the mounting surface 34 of the substrate 3, the five semiconductor light emitting elements 40 to 44, the control element, the wiring elements 600 to 640, 601 to 641, and the surrounding wall member 18 are mounted.

(Description of the semiconductor light emitting elements 40 to 44)
The semiconductor-type light source composed of the five semiconductor light-emitting elements 40 to 44 uses a self-luminous semiconductor-type light source such as an LED or an EL (organic EL), and in this Embodiment 1, an LED is used. As shown in FIGS. 2 to 4, the semiconductor light emitting elements 40 to 44 are semiconductors having a small rectangular shape, that is, a square or a rectangular shape when viewed from a plane, that is, from a direction perpendicular to the mounting surface 34 of the substrate 3. It consists of a chip (light source chip), and in this example, it consists of a bare chip. The five semiconductor light emitting elements 40 to 44 emit light from one front surface and four side surfaces other than the surface mounted on the substrate 3.

  The five semiconductor light emitting elements 40 to 44 include one semiconductor light emitting element 40 that is a light source of a tail lamp and four semiconductor light emitting elements 41 to 44 that are light sources of a stop lamp. That is, the five semiconductor light emitting elements 40 to 44 are semiconductor light emitting elements to which a small current is supplied, and one semiconductor light emitting element 40 that is a light source of a tail lamp, that is, the first group of semiconductor light emitting elements 40, A semiconductor light emitting device to which a large current, that is, a large current compared to the current supplied to the semiconductor light emitting device 40, is supplied, and four semiconductor light emitting devices 41 to 44 that are light sources of stop lamps, ie, second The semiconductor light emitting elements 41 to 44 are grouped into groups.

  As shown in FIGS. 3 and 4, one semiconductor light emitting element 40 that is a light source of a tail lamp includes a focal point F of the reflector 103 of an optical system and the center of the socket portion 11 of the semiconductor light source unit 1. And it is arranged at the mounting rotation center O, that is, at the center O of the substrate 3 or in the vicinity thereof. That is, the center of one semiconductor light emitting element 40 having the tail lamp function and the center O of the substrate 3 and the center O of the heat radiating member 8 coincide with or substantially coincide with each other.

  The four semiconductor light emitting elements 41 to 44 that are the light sources of the stop lamps are arranged in a cross shape vertically and horizontally on the circle centered on one semiconductor light emitting element 40 that is the light source of the tail lamp or its vicinity. Yes. The four semiconductor light emitting elements 41 to 44 having the stop lamp function are connected in series in the forward direction, that is, the direction in which current flows.

(Description of control element)
The resistor and the diode are mounted on the substrate 3 and are electrically connected between the power feeding members 91 to 93 of the socket portion 11 and the five semiconductor light emitting elements 40 to 44 via the wiring elements. It is connected to the. The resistor and the diode are elements that control current supplied to the five semiconductor light emitting elements 40 to 44.

(Description of wiring elements 600 to 640, 601 to 641)
As shown in FIG. 4, the wiring element includes a plurality of wiring patterns, five bonding wires, five conductive adhesives 600 to 640, five mounting pads 601 to 641, and five pieces. A wire pad. The wiring elements 600 to 640 and 601 to 641 are electrically connected to the power supply members 91, 92, and 93 of the socket portion 11 through the connection member 17, and the five semiconductors are connected through the control element. Power is supplied to the light emitting elements 40 to 44.

  The plurality of wiring patterns are made of, for example, thin film wiring or thick film wiring of a conductive member. The resistor and the diode are connected to the plurality of wiring patterns. The plurality of wiring patterns are provided with the mounting pads 601 to 641 and the wire pads, respectively. Among the plurality of wiring patterns, the area of the wiring pattern that supplies a large current to the semiconductor light emitting elements 41 to 44 having the stop lamp function is substantially equal. Thereby, the heat generated in the plurality of wiring patterns can be released almost uniformly to the external heat radiating member 8 through the substrate 3. The plurality of wiring patterns are wired at predetermined intervals (gap).

  As shown in FIG. 4, the same number of the mounting pads 601 to 641 as the five semiconductor light emitting elements 40 to 44, five in this example, are arranged on the cross with gaps at almost equal intervals. ing. The five semiconductor light emitting elements 40 to 44 are bonded to the five mounting pads 601 to 641 through conductive adhesives 600 to 640 such as silver paste, respectively. The mounting pads 601 to 641 form a minute rectangular square or rectangle when viewed from the plane, that is, from the top and from the direction perpendicular to the mounting surface 34 of the substrate 3.

  The conductive adhesives 600 to 640 have a minute circular shape when seen from the plane. That is, the conductive adhesives 600 to 640 form a minute circular shape when seen from a plane by dripping (stamp). The diameter of the circular conductive adhesives 600 to 640 is larger than the length of one side of the square semiconductor light emitting elements 40 to 44. One side of the square mounting pads 601 to 641 is larger than the diameter of the circular conductive adhesives 600 to 640.

(Description of the surrounding wall member 18)
The surrounding wall member 18 is made of an insulating member such as a resin, in this example, a resin having elasticity that can follow the expansion and contraction of the sealing member 180, such as a thermoplastic elastomer or an olefinic TPO resin. It is configured. As shown in FIGS. 2 to 4, the surrounding wall member 18 includes all of the five semiconductor light emitting elements 40 to 44 and a part of the wiring element, that is, a part of the plurality of wiring patterns and the five. The bonding wires, the five conductive adhesives 600 to 640, the five mounting pads 601 to 641, and the five wire pads all have an annular shape.

  The surrounding wall member 18 has a height sufficiently higher than the height of the bonding wires of the semiconductor light emitting elements 40 to 44 and the wiring element. The surrounding wall member 18 is a member that regulates the capacity of filling the sealing member 180 to a small capacity.

  A circle drawn by the bottom of the inner wall surface of the surrounding wall member 18 on the lower end surface of the one end surface of the surrounding wall member 18 is at least two fitting protrusions for temporary fixing and positioning, that is, positioning. It is integrally provided on a diagonal line passing through the center of the ring shape. On the other hand, the board 3 is provided with at least two fitting holes for temporary fixing and positioning as fitting parts corresponding to the fitting convex parts. By fitting the fitting convex portion and the fitting hole to each other, the surrounding wall member 18 and the substrate 3 are fixed to each other and positioned.

  The lower end surface of one end surface of the surrounding wall member 18 that is temporarily fixed to the substrate 3 and positioned by the fitting convex portion and the fitting hole is bonded to the mounting surface 34 of the substrate 3 with an adhesive ( (Not shown) is adhesively fixed or mounted.

  In the surrounding wall member 18 mounted on the substrate 3, in the space defined by the mounting surface 34 of the substrate 3 and the inner peripheral surface of the surrounding wall member 18, The semiconductor light emitting elements 40 to 44 and the five wire pads are mounted, the five bonding wires are bonded, and the sealing member 180 is filled.

  The adhesive and the sealing member 180 are made of the same resin member. In this example, the adhesive and the sealing member 180 have low elastic characteristics in the high temperature environment region of the semiconductor light emitting devices 40 to 44, and the adhesive and the sealing member 180 in the high temperature environment region and the It consists of a member that absorbs the expansion and contraction of the surrounding wall member 18, for example, a phenyl silicone resin member. The adhesive and the sealing member 180 may be made of the same resin member, for example, a methyl silicone resin member, an epoxy resin member, or a polyurethane resin member (urethane resin member). May be.

  On the inner peripheral surface of the surrounding wall member 18, light emitted from the semiconductor light emitting elements 40 to 44, particularly the four side surfaces of the semiconductor light emitting elements 40 to 44, is transmitted in a predetermined direction, for example, the semiconductor light emitting elements 40 to 40. A reflecting surface 181 is provided to reflect light in the same direction as the direction of light emitted from the front surface 44. As shown in FIG. 4, the reflecting surface 181 is inclined so as to extend from the lower end of one end of the inner peripheral surface of the surrounding wall member 18 to the upper end of the other end. The reflective surface 181 is configured such that the entire surrounding wall member 18 is made of a highly reflective member, or, for example, titanium oxide is contained in the resin of the surrounding wall member 18 such as PBT, PPA, etc. Are formed white, or only the inner peripheral surface of the surrounding wall member 18 is formed of a highly reflective member.

(Description of the shape of the inner peripheral surface of the surrounding wall member 18)
The shape of the inner peripheral surface of the surrounding wall member 18 is the contour shape of the portion where the mounting surface 34 of the substrate 3 and the inner peripheral surface of the surrounding wall member 18 are in contact, that is, the inner periphery of the surrounding wall member 18. It is the outline shape of the angle | corner which a surface and a bottom face make. As shown in FIGS. 2 to 4, the shape of the inner peripheral surface of the surrounding wall member 18 is a circular shape when viewed in the direction perpendicular to the mounting surface 34 of the substrate 3.

  The reflection surface 181 on the inner peripheral surface of the surrounding wall member 18 is inclined so as to extend from the lower end at one end to the upper end at the other end. Therefore, the contour shape of the angle formed by the inner peripheral surface and the upper surface of the surrounding wall member 18, that is, the contour shape of the upper end of the inner peripheral surface of the surrounding wall member 18 is a circular shape, and the surrounding wall The contour shape of the angle formed by the inner peripheral surface and the bottom surface of the member 18, that is, a shape that is slightly larger than the lower end contour shape of the inner peripheral surface of the surrounding wall member 18. The inner peripheral surface of the surrounding wall member 18 is not necessarily an inclined surface but may be a vertical surface. In this case, the lower end contour shape of the inner peripheral surface of the surrounding wall member 18 and the upper end contour shape of the inner peripheral surface of the surrounding wall member 18 are substantially the same.

  As shown in FIGS. 2 to 4, the shape of the outer peripheral surface of the surrounding wall member 18 is a shape that is slightly larger than the shape of the inner peripheral surface of the surrounding wall member 18, that is, a circular shape. The wall thickness of the surrounding wall member 18, that is, the thickness from the inner circumferential surface to the outer circumferential surface of the surrounding wall member 18 is substantially uniform. That is, the shape and size of the cross section of the surrounding wall member 18 are uniform or almost uniform. The cross section of the surrounding wall member 18 is a surface cut by a plane orthogonal to the inner and outer peripheral surfaces of the surrounding wall member 18. By making the wall thickness of the surrounding wall member 18 substantially uniform, the five semiconductor light emitting elements 40 to 44 and a part of the wiring elements (one of the plurality of wiring patterns) sealed by the sealing member 180 are formed. And the five bonding wires and the five mounting pads 601 to 641 and the five wire pads and the five conductive adhesives 600 to 640) are uniformly stressed by the sealing member 180 Since it can be (equal), adverse effects due to stress bias can be prevented.

(Description of sealing member 180)
The sealing member 180 is the same resin member as the adhesive and is made of a light transmissive member. The sealing member 180 is formed by the surrounding wall member 18 fitted and fixed to the substrate 3 after the semiconductor light emitting elements 40 to 44 are mounted on the substrate 3 and the bonding wires are bonded. The formed recess is filled. By curing the sealing member 180, all of the five semiconductor light emitting elements 40 to 44, a part of the plurality of wiring patterns, all of the bonding wires, all of the mounting pads 601 to 641, and all of the wire pads. In addition, the conductive adhesives 600 to 640 are sealed by the sealing member 180.

  The sealing member 180 includes all of the five semiconductor light emitting elements 40 to 44, a part of the plurality of wiring patterns, all of the bonding wires, all of the mounting pads 601 to 641, all of the wire pads, and the conductivity. The adhesives 600 to 640 are protected from the influence from the outside, for example, contact of other materials and adhesion of dust, and are protected from ultraviolet rays, sulfide gas, NOx and water. That is, the sealing member 180 protects the five semiconductor light emitting elements 40 to 44 from disturbance.

(Description of insulating member 7)
The insulating member 7 is provided with an attachment portion 70 for attaching the semiconductor light source unit 1 to the vehicular lamp 100 detachably or fixedly. The insulating member 7 is made of, for example, an insulating resin member. The insulating member 7 has a substantially cylindrical shape whose outer diameter is slightly smaller than the inner diameter of the mounting hole 104 of the lamp housing 101. A flange portion 71 is integrally provided at an upper end portion of one end portion of the insulating member 7. In the upper end portion of the one end portion of the insulating member 7, a plurality of, in this example, four mounting portions 70 are integrally provided so as to correspond to the concave portion of the lamp housing 101.

  The mounting portion 70 is used to equip the vehicular lamp 100 with the semiconductor light source unit 1. That is, a part of the socket portion 11 on the lens portion 12 side and the mounting portion 70 are inserted into the mounting hole 104 and the concave portion of the lamp housing 101. In this state, the socket portion 11 is rotated around the center O axis, and the mounting portion 70 is brought into contact with the stopper portion of the lamp housing 101. At this time, the mounting portion 70 and the flange portion 71 sandwich the edge of the mounting hole 104 of the lamp housing 101 from above and below via the packing 108 (see FIG. 1).

  As a result, as shown in FIG. 1, the socket portion 11 of the semiconductor light source unit 1 is detachably or fixedly attached to the lamp housing 101 of the vehicular lamp 100 via the packing 108. At this time, as shown in FIG. 1, a portion of the socket portion 11 that protrudes outward from the lamp housing 101, that is, a portion below the lamp housing 101 in FIG. 1 is in the lamp chamber 105 of the socket portion 11. Is larger than the portion housed in the lamp housing 101, that is, the portion above the lamp housing 101 in FIG.

  On the upper end surface of the one end surface of the insulating member 7, a convex portion is integrally provided. A light source connector 13 is integrally provided at the lower end of the other end of the insulating member 7. A connector 14 on the power supply side is attached to the connector portion 13 so as to be mechanically detachable and electrically connectable.

(Description of heat dissipation member 8)
The heat radiating member 8 radiates heat generated by the light source unit 10 to the outside. The heat dissipating member 8 is made of, for example, an aluminum die casting or a resin member having heat conductivity and conductivity. The heat dissipating member 8 has a flat shape at the upper end at one end and a fin shape from the middle to the lower end at the other end. A contact surface is provided on the upper surface of one end of the heat radiating member 8. The heat radiating member 8 is bonded to the contact surface with a heat conductive medium (not shown) in a state where the contact surfaces of the substrate 3 are in contact with each other. As a result, the semiconductor light emitting elements 40 to 44 are positioned corresponding to the center O of the heat radiating member 8 and the portion near the center O of the socket portion 11 through the substrate 3. .

  The heat conductive medium is, for example, a heat conductive adhesive, and is made of an epoxy resin adhesive, a silicone resin adhesive, an acrylic resin adhesive, etc. Form, tape form, etc. The heat conductive medium may be a heat conductive grease in addition to the heat conductive adhesive.

  Cutouts are provided in the center of the right side, the left side, and the lower side of the three sides of the heat radiating member 8 so as to correspond to the insertion hole of the substrate 3 and the convex portion of the insulating member 7, respectively. The three power supply members 91 to 93 are disposed in the notch of the heat dissipation member 8 and the insertion hole of the substrate 3, respectively. The insulating member 7 is interposed between the heat radiating member 8 and the power feeding members 91 to 93. The heat radiating member 8 is in close contact with the insulating member 7. The power supply members 91 to 93 are in close contact with the insulating member 7.

(Description of power supply members 91-93)
The power supply members 91 to 93 supply power to the light source unit 10. The power feeding members 91 to 93 are made of, for example, a conductive metal member. The upper end portions of the one end portions of the power supply members 91 to 93 have a divergent shape, and are respectively located in the notches of the heat radiating member 8 and the insertion holes of the substrate 3. One end portions of the power supply members 91 to 93 protrude from the convex portion of the insulating member 7 and are electrically and mechanically connected to the connection member 17.

  The lower ends of the other end portions of the power supply members 91 to 93 have a narrowed shape and are disposed in the connector portion 13. The other ends of the power supply members 91 to 93 constitute male terminals, that is, male terminals.

(Description of connecting member 17)
The connecting member 17 is composed of a member having conductivity, elasticity, malleability, ductility, and plasticity, for example, a member such as phosphor bronze or brass. The connecting member 17 electrically connects the light source unit 10 and the socket unit 11.

  That is, the connection member 17 is mechanically connected to the substrate 3 by fitting or the like, and is connected to the conductor of the wiring element of the substrate 3 by solder or a conductive adhesive (not shown). Electrically connected. On the other hand, the connection member 17 is electrically and mechanically connected to one end of the power supply members 91 to 93 by elastic contact, crimping, welding, or the like.

(Description of connector portion 13 and connector 14)
The connector 14 is provided with a female terminal, that is, a female terminal (not shown) that is electrically connected to the male terminal of the connector portion 13. By attaching the connector 14 to the connector portion 13, the female terminal is electrically connected to the male terminal. Further, by removing the connector 14 from the connector portion 13, the electrical connection between the female terminal and the male terminal is interrupted.

  As shown in FIG. 1, the first female terminal and the second female terminal among the female terminals of the connector 14 are connected to a power source, for example, a DC power source battery (not shown) via harnesses 144 and 145 and a switch (not shown). (Not shown). A third female terminal of the female terminals of the connector 14 is grounded or grounded via a harness 146. The connector portion 13 and the connector 14 are 3-pin type connector portions and connectors. That is, they are a three-pin type connector portion and a connector including the three power supply members 91 to 93, the three male terminals, and the three female terminals.

(Description of the lens unit 12)
The lens unit 12 is made of a light transmissive member. The lens unit 12 is provided with an optical control unit (not shown) such as a prism that optically controls and emits light from the five semiconductor light emitting elements 40 to 44. The lens unit 12 is an optical component.

  As shown in FIG. 1, the lens portion 12 is attached to one end opening of one end portion of the cylindrical socket portion 11 so as to cover the light source portion 10. The lens portion 12 together with the sealing member 180 prevents the five semiconductor light emitting elements 40 to 44 from being affected from the outside, for example, contact with other things or adhesion of dust, and It protects against ultraviolet rays, sulfur gas, NOx and water. That is, the lens unit 12 protects the five semiconductor light emitting elements 40 to 44 from disturbance. In addition to the five semiconductor light emitting elements 40 to 44, the lens unit 12 includes the resistance of the control element, the plurality of wiring patterns of the diode and the wiring element, the bonding wire, and the mounting pads 601 to 601. 641, the wire pad, and the conductive adhesives 600 to 640 are also protected from disturbance. The lens portion 12 may be provided with a vent (not shown).

(Description of the operation of the first embodiment)
The semiconductor-type light source (light source unit 10) of the vehicular lamp according to the first embodiment, the semiconductor-type light source unit 1 of the vehicular lamp according to the first embodiment, and the vehicular lamp 100 according to the first embodiment (hereinafter referred to as “the first embodiment”). The semiconductor light source (the light source unit 10), the semiconductor light source unit 1, and the vehicular lamp 100) is configured as described above, and the operation thereof will be described below.

  First, the switch is operated to turn on the tail lamp. Then, a current is supplied to one semiconductor light emitting element 40 having a tail lamp function. As a result, one semiconductor light emitting element 40 having a tail lamp function emits light.

  The light emitted from one semiconductor light emitting element 40 having the tail lamp function is transmitted through the sealing member 180, the air layer, and the lens portion 12 of the semiconductor light source unit 1, and the light distribution is controlled. A part of the light emitted from the semiconductor light emitting element 40 is reflected by the highly reflective surface 30 of the substrate 3 to the lens unit 12 side. The light subjected to the light distribution control is transmitted through the lamp lens 102 of the vehicular lamp 100, is again subjected to the light distribution control, and is irradiated to the outside. Thereby, the vehicular lamp 100 irradiates the light distribution of the tail lamp function to the outside.

  Next, the switch is operated to turn on the stop lamp. Then, a current is supplied to the four semiconductor light emitting elements 41 to 44 having a stop lamp function. As a result, the four semiconductor light emitting elements 41 to 44 having the stop lamp function emit light.

  Light emitted from the four semiconductor light emitting elements 41 to 44 having the stop lamp function is transmitted through the sealing member 180, the air layer, and the lens portion 12 of the semiconductor light source unit 1, and the light distribution is controlled. A part of the light emitted from the semiconductor light emitting elements 41 to 44 is reflected by the highly reflective surface 30 of the substrate 3 to the lens unit 12 side. The light subjected to the light distribution control is transmitted through the lamp lens 102 of the vehicular lamp 100, is again subjected to the light distribution control, and is irradiated to the outside. Thereby, the vehicular lamp 100 irradiates the light distribution of the stop lamp function to the outside. The light distribution of the stop lamp function is brighter, that is, the luminous flux, the luminance, the luminous intensity, and the illuminance are larger than the light distribution of the tail lamp function.

  Here, heat generated in the semiconductor light emitting elements 40 to 44 of the light source unit 10, the resistance of the control element, and the conductors of the diode and the wiring element is transmitted to the heat radiating member 8 through the substrate 3 and the heat conductive medium, and this heat dissipation Radiated from the member 8 to the outside.

(Description of the effect of Embodiment 1)
The semiconductor-type light source, that is, the light source unit 10, the semiconductor-type light source unit 1, and the vehicular lamp 100 according to the first embodiment is configured and operated as described above. The effects will be described below.

  In the semiconductor type light source, that is, the light source unit 10, the semiconductor type light source unit 1, and the vehicle lamp 100 in the first embodiment, one semiconductor light emitting element 40 that is a light source of the tail lamp is disposed at or near the center O of the substrate 3. 5, the light distribution characteristic of the tail lamp shown in FIG. 5 (that is, the luminance is 4.0 cd (Japan, Europe) or 2.0 cd (US) having the highest luminance at the center (V-0 °, H-0 °)). In the left and right (V-0 °, H-5 °) points, the luminance of the second place is 3.6 cd (Japan, Europe) or 1.8 cd (US), and the upper and lower (V-5 °, H-0). °) point is 2.8 cd (Japan, Europe) or 0.8 cd (USA) at the 3rd place, and 1.4 cd at the 4th place at the left and right (V-0 °, H-10 °) points. (Japan, Europe) or 0.8cd (US) 0.8 cd (Japan, Europe) or 5th place at the top and bottom (V-10 °, H-5 °) and top / bottom / left / right (V-5 °, H-10 °) points. The light distribution characteristics of a tail lamp which is 4 cd (US) and is 0.4 cd (Japan, Europe) or 0.3 cd (US) with 6th brightness at the top, bottom, left and right (V-5 °, H-20 °) points ).

  In addition, the semiconductor-type light source, that is, the light source unit 10, the semiconductor-type light source unit 1, and the vehicular lamp 100 according to the first embodiment includes four semiconductor light-emitting elements 41 to 44, which are stop lamp light sources, as light sources for tail lamps. Since the semiconductor light emitting elements 40 or their neighborhoods are arranged in a cross shape on the top, bottom, left, and right, respectively, a light distribution characteristic of the stop lamp shown in FIG. 5 (that is, the luminance is the center (V-0 °, H It is 60 cd (Japan, Europe) or 80 cd (US) with the highest luminance at the point (−0 °), and 54 cd (Japan, Europe) with the second highest luminance at the left and right (V-0 °, H-5 °) points. It is 70 cd (US), and it is 42 cd (Japan, Europe) or 40 cd (US) with 3rd brightness at the upper and lower (V-5 °, H-0 °) points, and (V-0 °, H − The luminance is 21 cd (Japan, Europe) or 30 cd (US) at the 4th place at the 0 ° point, the (V-10 °, H-5 °) point on the top, bottom, left and right, and the (V-5 °, H) on the top, bottom, left and right. 12 cd (Japan, Europe) or 16 cd (US) at the 5th place at the (-10 °) point, and 6 cd (Japan, Europe) at the 6th place at the top, bottom, left, and right (V-5 °, H-20 °) points. (Europe) or 10 cd (USA) stop lamp light distribution characteristics).

  In particular, the semiconductor-type light source, that is, the light source unit 10, the semiconductor-type light source unit 1, and the vehicular lamp 100 according to the first embodiment includes four semiconductor light-emitting elements 41 to 44 that are light sources for stop lamps, and 1 that is a light source for tail lamps. Since each of the semiconductor light emitting elements 40 is arranged in a square shape on a circle centering around the semiconductor light emitting device 40 and in a cross shape on the upper, lower, left, and right sides, that is, on the four corners of a thick solid rhombus in FIG. The light distribution characteristic of the stop lamp shown in FIG. 5 can be obtained efficiently. That is, the four semiconductor light emitting elements 41 to 44 that are the light sources of the stop lamps are respectively arranged in the four corners of a square on a circle centered on one semiconductor light emitting element 40 that is the light source of the tail lamp or the vicinity thereof. Comparison is made with a semiconductor-type light source (see the semiconductor-type light source of FIGS. 9 to 12). It is assumed that the distances between the four semiconductor light emitting elements 41 to 44 that are the light source of the stop lamp and the one semiconductor light emitting element 40 that is the light source of the tail lamp are substantially equal. The semiconductor-type light source to be compared needs the luminance distribution shown by the broken-line square in FIG. 5 in order to obtain the light distribution characteristic of the stop lamp shown in FIG. On the other hand, in order to obtain the light distribution characteristic of the stop lamp shown in FIG. 5, the semiconductor-type light source in Example 1 has a luminance distribution indicated by a thick solid diamond in FIG. 5, that is, a broken line in FIG. About half of the luminance distribution shown in the square is sufficient. Thus, the semiconductor-type light source in Example 1 can obtain the light distribution characteristic of the stop lamp shown in FIG. 5 most efficiently.

  As described above, the semiconductor-type light source, that is, the light source unit 10, the semiconductor-type light source unit 1, and the vehicular lamp 100 according to the first embodiment uses a common optical system for the tail lamp and the stop lamp, and the light distribution pattern and stop of the tail lamp. The light distribution pattern of the lamp can be irradiated efficiently.

  The semiconductor-type light source, that is, the light source unit 10, the semiconductor-type light source unit 1, and the vehicular lamp 100 according to the first embodiment includes four semiconductor light-emitting elements 41 to 44 that are light sources of stop lamps and one light source that is a tail lamp light source. Since the semiconductor light emitting element 40 or the vicinity thereof is arranged in a cross shape in the vertical and horizontal directions on the circle, the light distribution characteristics of the rear fog lamp shown in FIG. -10 ° to HR-10 °, VU-5 ° to VD-5 °), high luminance of 150 cd or more, and almost the same as the characteristics of the rear fog lamp having low luminance of 75 cd or more in the rhombus shape indicated by the broken line) To do. As a result, the semiconductor-type light source, that is, the light source unit 10, the semiconductor-type light source unit 1, and the vehicular lamp 100 according to the first embodiment can also be used as a rear fog lamp, so that the rear fog lamp can be separately manufactured or managed. Therefore, manufacturing costs and management costs can be reduced.

  Here, the characteristics of the semiconductor-type light source in the first embodiment, that is, the light source unit 10, and the semiconductor-type light source in which five semiconductor light-emitting elements are arranged in a straight line (one semiconductor light-emitting element for a tail lamp is arranged at the center, The characteristics of a semiconductor light source in which two semiconductor light emitting elements for stop lamps are arranged on both sides will be described with reference to FIGS.

  7 and 8, in the “Chip arrangement”, □ is one semiconductor light emitting element for tail lamp, black square is four semiconductor light emitting elements for stop lamp, and the right end is in the first embodiment. This is a semiconductor light source, and the left end is a semiconductor light source arranged in a straight line. In FIG. 7, four semiconductor light emitting elements for stop lamps of each semiconductor type light source are turned on, and light emitted from the four semiconductor light emitting elements for the stop lamps is 10 m ahead through a convex lens (not shown). 2 shows an isoluminous curve when the screen is irradiated (isoluminous curve obtained by simulation). FIG. 8 shows a comprehensive evaluation of each light source. That is, the double circle is 5 points, the circle is 3 points, the triangle is 1 point, and the cross is 0 points. In each item, “Stop light distribution” is an evaluation when only the light distribution of the stop lamp is formed using an optical system dedicated to the stop lamp. “Tail light distribution” is an evaluation when only a tail lamp light distribution is formed using an optical system dedicated to the tail lamp. The “T / S common optical system” is an evaluation when the light distribution of the tail lamp and the light distribution of the stop lamp are formed using a common optical system of the tail lamp and the stop lamp. “R / Fog light distribution” is an evaluation when the light distribution of the rear fog lamp is formed using a common optical system of the tail lamp and the stop lamp. “Reliability (stress)” is an evaluation of relaxation and reduction of stress due to thermal expansion and contraction of the sealing member due to the shape of the surrounding wall member. “Total” is a total evaluation obtained by summing up the evaluation scores of each item.

  As shown in FIG. 7, the light source luminous flux of the semiconductor-type light source in the first embodiment is 30 (lm), and the light source luminous flux of the semiconductor-type light source in which the semiconductor light emitting element is in a straight line is 30 (lm). ,Match. Further, the emitted light beam of the semiconductor light source in the first embodiment is 11.09 (lm), and the emitted light beam of the semiconductor light source in which the semiconductor light emitting element is in a straight line is 11.18 (lm). Almost matches. However, the maximum luminous intensity (Max) of the semiconductor-type light source in the first embodiment is 15965 cd, and the maximum luminous intensity (Max) of the semiconductor-type light source in which the semiconductor light emitting element is in a straight line is 1,3771 cd, and there is a slight difference between the two. There is. That is, the maximum luminous intensity (Max) of the semiconductor-type light source in the first embodiment is larger than the maximum luminous intensity (Max) of the semiconductor-type light source in which the semiconductor light emitting element is in a straight line, and there is a margin.

  As a result, as shown in FIG. 8, the semiconductor light source in the first embodiment uses a common optical system for the tail lamp and the stop lamp rather than the semiconductor light source in which the semiconductor light emitting elements are in a straight line. The pattern and the light distribution pattern of the stop lamp can be irradiated efficiently, and are suitable for the light distribution characteristics of the rear fog lamp. That is, in a semiconductor light source with a straight line semiconductor light emitting element, when an optical system suitable for the light distribution of a stop lamp that requires high brightness is used, the light distribution of the tail lamp is not suitable because it is almost square. On the other hand, when an optical system suitable for the light distribution of the tail lamp is used, the light distribution of the stop lamp is unnecessarily widened to the left and right, and the luminous flux at the center portion is lowered. Further, it is not suitable for the light distribution of a rear fog lamp having high brightness in the upper, lower, left and right crosses.

  As described above, the semiconductor-type light source according to Embodiment 1 is superior in comprehensive evaluation to the semiconductor-type light source in which the semiconductor light-emitting elements are straight.

  In the semiconductor type light source, that is, the light source unit 10, the semiconductor type light source unit 1, and the vehicular lamp 100 according to the first embodiment, one semiconductor light emitting element 40 that is a light source of the tail lamp is disposed at or near the center O of the substrate 3. In addition, the four semiconductor light emitting elements 41 to 44 that are the light sources of the stop lamps are respectively arranged in a cross shape on the top, bottom, left, and right on a circle centering on one semiconductor light emitting element 40 that is the light source of the tail lamp or its vicinity. . Therefore, the semiconductor-type light source, that is, the light source unit 10, the semiconductor-type light source unit 1, and the vehicular lamp 100 according to the first embodiment has a conventional semiconductor-type light source (that is, three LED chips that are light sources of the tail lamps are concentrically arranged. Compared to a conventional semiconductor-type light source in which six LED chips, which are light sources of a stop lamp, are arranged at equal intervals on a concentric great circle), the surrounding wall member 18 is arranged on a small circle at equal intervals. Can be reduced. Thereby, the capacity | capacitance of the sealing member 180 can be made as small as possible by the part which makes the surrounding wall member 18 small. In addition, the manufacturing cost can be reduced by reducing the capacity of the sealing member 180.

  In the semiconductor-type light source, that is, the light source unit 10, the semiconductor-type light source unit 1, and the vehicular lamp 100 according to the first embodiment, the surrounding wall member 18 has a circular shape, so that the shape of the surrounding wall member is rectangular, oval, or elliptical. In comparison, the stress of the sealing member 180 can be suppressed low (see FIG. 8). As a result, since the stress due to thermal expansion and contraction of the sealing member 180 can be reduced, the semiconductor light emitting elements 40 to 44 and the wiring elements can be reliably prevented from being peeled off, and the reliability of the product can be improved. it can.

(Description of Embodiment 2)
9 to 11 show a semiconductor-type light source, that is, a light source unit 10A, a semiconductor-type light source unit 1A, and a vehicular lamp according to a second embodiment of the present invention. Hereinafter, the semiconductor-type light source, that is, the light source unit 10A, the semiconductor-type light source unit 1A, and the vehicle lamp in the second embodiment will be described. In the figure, the same reference numerals as those in FIGS. 1 to 8 denote the same components.

  In the semiconductor light source in the first embodiment, that is, the light source unit 10, the semiconductor light source unit 1, and the vehicle lamp 100, one semiconductor light emitting element 40, which is a light source of the tail lamp, is arranged at or near the center O of the substrate 3. In addition, the four semiconductor light emitting elements 41 to 44 that are the light sources of the stop lamps are respectively arranged in a cross shape on the top, bottom, left, and right on a circle centering on one semiconductor light emitting element 40 that is the light source of the tail lamp or its vicinity. Is. The semiconductor-type light source, that is, the light source unit 10A, the semiconductor-type light source unit 1A, and the vehicle lamp in the second embodiment has one semiconductor light-emitting element 40 that is a light source of the tail lamp disposed at or near the center O of the substrate 3, and The four semiconductor light emitting elements 41 to 44, which are the light sources of the stop lamps, are respectively arranged in the four corners of a square on a circle centering on one semiconductor light emitting element 40, which is the light source of the tail lamp, or the vicinity thereof. is there.

  The mounting pads 601 to 641 are from a plane, that is, from the top, and viewed from the direction perpendicular to the mounting surface 34 of the substrate 3. This is a combination of shapes (quarter arc shape). That is, the side of the mounting pad 601 of one semiconductor light emitting element 40 that is the light source of the tail lamp is circular, and the side of the mounting pads 611 to 641 of the four semiconductor light emitting elements 41 to 44 that are the light sources of the stop lamp. The side facing the side of the mounting pad 601 of one semiconductor light emitting element 40 that is the light source of the tail lamp is arcuate. As a result, the side of the mounting pad 601 of one semiconductor light emitting element 40 that is the light source of the tail lamp and the side of the mounting pads 611 to 641 of the four semiconductor light emitting elements 41 to 44 that are the light sources of the stop lamp are For line segment 2 connecting the center of mounting pad 601 of one semiconductor light emitting element 40 as a light source and the center of mounting pads 611 to 641 of four semiconductor light emitting elements 41 to 44 as a light source of a stop lamp, respectively. , Orthogonal.

  The semiconductor-type light source, that is, the light source unit 10A, the semiconductor-type light source unit 1A, and the vehicle lamp in the second embodiment are the same as the semiconductor-type light source, that is, the light source unit 10, the semiconductor-type light source unit 1, and the vehicle lamp 100 in the first embodiment. Almost the same effect can be achieved.

  Here, the characteristics of the semiconductor-type light source, that is, the light source unit 10A in Embodiment 2 and the characteristics of the semiconductor-type light source in which five semiconductor light-emitting elements are arranged in a straight line will be described with reference to FIGS.

  As shown in FIG. 7, the light source luminous flux of the semiconductor-type light source in the second embodiment is 30 (lm), the light source luminous flux of the semiconductor-type light source in which the semiconductor light emitting element is in a straight line is 30 (lm), ,Match. Further, the emitted light beam of the semiconductor-type light source in the second embodiment is 10.79 (lm), and the emitted light beam of the semiconductor-type light source in which the semiconductor light emitting element is in a straight line is 11.18 (lm). Almost matches. However, the maximum luminous intensity (Max) of the semiconductor-type light source in the second embodiment is 15124 cd, and the maximum luminous intensity (Max) of the semiconductor-type light source in which the semiconductor light emitting element is in a straight line is 13771 cd, and there is a slight difference between the two. There is. That is, the maximum luminous intensity (Max) of the semiconductor-type light source in the second embodiment is larger and more marginal than the maximum luminous intensity (Max) of the semiconductor-type light source in which the semiconductor light-emitting elements are in a straight line.

  As a result, as shown in FIG. 8, the semiconductor-type light source according to the second embodiment uses a common optical system for the tail lamp and the stop lamp rather than the semiconductor-type light source in which the semiconductor light emitting elements are in a straight line. The pattern and the light distribution pattern of the stop lamp can be irradiated efficiently, and are suitable for the light distribution characteristics of the rear fog lamp. That is, in a semiconductor light source with a straight line semiconductor light emitting element, when an optical system suitable for the light distribution of a stop lamp that requires high brightness is used, the light distribution of the tail lamp is not suitable because it is almost square. On the other hand, when an optical system suitable for the light distribution of the tail lamp is used, the light distribution of the stop lamp is unnecessarily widened to the left and right, and the luminous flux at the center portion is lowered. Further, it is not suitable for the light distribution of a rear fog lamp having high brightness in the upper, lower, left and right crosses.

  As described above, the semiconductor-type light source in the second embodiment is slightly inferior in the comprehensive evaluation than the semiconductor-type light source in the first embodiment, but the semiconductor light-emitting element is more comprehensive in the evaluation than the semiconductor-type light source in a straight line. Are better.

  The semiconductor-type light source, that is, the light source unit 10A, the semiconductor-type light source unit 1A, and the vehicular lamp in the second embodiment are the sides of the mounting pad 601 of one semiconductor light-emitting element 40 that is the light source of the tail lamp and the light source of the stop lamp. The sides of the mounting pads 611 to 641 of the four semiconductor light emitting elements 41 to 44 are the center of the mounting pad 601 of one semiconductor light emitting element 40 that is the light source of the tail lamp and the four semiconductor light emitting elements that are the light source of the stop lamp. It is orthogonal to the line segment 2 that connects the centers of the mounting pads 611 to 641 of 41 to 44 respectively. As a result, the semiconductor-type light source, that is, the light source unit 10A, the semiconductor-type light source unit 1A, and the vehicular lamp in the second embodiment is a mounting pad 601 of one semiconductor light-emitting element 40 that is a light source of a tail lamp and a light source of a stop lamp. A distance between the four semiconductor light emitting elements 41 to 44 and the mounting pads 611 to 641 so that they do not contact each other, or a plurality of wiring patterns mounted on the substrate 3 do not contact each other. For example, a minimum required gap of 0.3 mm to 0.5 mm. Thereby, the surrounding wall member 18A can be made small, and the capacity of the sealing member 180 can be made as small as possible. In addition, the manufacturing cost can be reduced by reducing the capacity of the sealing member 180.

  In the second embodiment, the side of the mounting pad 601 of one semiconductor light emitting element 40 that is a light source of a tail lamp is circular, and the mounting pads 611 of four semiconductor light emitting elements 41 to 44 that are light sources of a stop lamp are used. The sides of ˜641 have an arc shape (or a straight line orthogonal to the line segment 2 connecting the centers). However, in the present invention, only the side of the mounting pad 601 of one semiconductor light emitting element 40 that is the light source of the tail lamp is circular, and the mounting pads 611 of the four semiconductor light emitting elements 41 to 44 that are the light sources of the stop lamp are formed. The sides of 641 may be minute squares or rectangles, or the sides of the mounting pad 601 of one semiconductor light emitting element 40 that is a light source of a tail lamp are minute squares or rectangles, and four light sources of a stop lamp. The sides of the mounting pads 611 to 641 of the semiconductor light emitting elements 41 to 44 may be arcuate (or a straight line orthogonal to the line segment 2 connecting the centers).

  Further, the sides of the mounting pads 601 to 641 may be straight lines orthogonal to the line segment 2 connecting the center of the mounting pad 601 and the center of the mounting pads 611 to 641.

(Description of Embodiment 3)
FIG. 12 shows Embodiment 3 of the semiconductor-type light source, that is, the light source unit, the semiconductor-type light source unit, and the vehicle lamp according to the present invention. Hereinafter, the semiconductor light source, that is, the light source unit, the semiconductor light source unit, and the vehicle lamp in the third embodiment will be described. In the figure, the same reference numerals as those in FIGS. 1 to 11 denote the same components.

  In the semiconductor light source in the first embodiment, that is, the light source unit 10, the semiconductor light source unit 1, and the vehicle lamp 100, one semiconductor light emitting element 40, which is a light source of the tail lamp, is arranged at or near the center O of the substrate 3. In addition, the four semiconductor light emitting elements 41 to 44 that are the light sources of the stop lamps are respectively arranged in a cross shape on the top, bottom, left, and right on a circle centering on one semiconductor light emitting element 40 that is the light source of the tail lamp or its vicinity. Is. Further, in the semiconductor-type light source, that is, the light source unit 10A, the semiconductor-type light source unit 1A, and the vehicle lamp in the second embodiment, one semiconductor light-emitting element 40 that is a light source of the tail lamp is disposed at or near the center O of the substrate 3. In addition, the four semiconductor light emitting elements 41 to 44 that are the light source of the stop lamp are respectively arranged in four square corners on a circle centering on one semiconductor light emitting element 40 that is the light source of the tail lamp or the vicinity thereof. To do. In addition, the semiconductor-type light source in the second embodiment, that is, the light source unit 10A, the semiconductor-type light source unit 1A, and the vehicle lamp, includes a side of the mounting pad 601 of one semiconductor light-emitting element 40 that is a light source of the tail lamp, The sides of the mounting pads 611 to 641 of the four semiconductor light emitting elements 41 to 44 that are light sources are arranged at the center of the mounting pad 601 of one semiconductor light emitting element 40 that is the light source of the tail lamp and the four light sources of the stop lamp. The semiconductor light emitting elements 41 to 44 are orthogonal to the line segments connecting the centers of the mounting pads 611 to 641 respectively.

  The semiconductor-type light source, that is, the light source unit, the semiconductor-type light source unit, and the vehicle lamp in the third embodiment is similar to the semiconductor-type light source, that is, the light source unit 10A, the semiconductor-type light source unit 1A, and the vehicle lamp in the second embodiment. One semiconductor light emitting element 40, which is a light source of the light source, is arranged at or near the center O of the substrate 3, and four semiconductor light emitting elements 41 to 44, which are light sources of a stop lamp, are one light source of a tail lamp. Each of the semiconductor light emitting elements 40 is arranged at four corners of a square on a circle centering on the vicinity thereof. Further, in the semiconductor type light source, that is, the light source unit, the semiconductor type light source unit, and the vehicle lamp in the third embodiment, the mounting pads 601 to 641 form a minute square or rectangle.

  The semiconductor-type light source, that is, the light source unit, the semiconductor-type light source unit, and the vehicle lamp in the third embodiment has a slightly larger surrounding wall member 18B, but the semiconductor-type light source, that is, the light source unit 10 and the semiconductor-type light source unit in the first embodiment. 1 and the vehicle lamp 100, and the semiconductor-type light source in the second embodiment, that is, the light source unit 10A, the semiconductor-type light source unit 1A, and the vehicle lamp, can achieve substantially the same operational effects.

(Description of Embodiment 4)
FIG. 13 shows Embodiment 4 of the semiconductor-type light source, that is, the light source unit, the semiconductor-type light source unit, and the vehicle lamp according to the present invention. Hereinafter, the semiconductor-type light source, that is, the light source unit, the semiconductor-type light source unit, and the vehicle lamp in the fourth embodiment will be described. In the figure, the same reference numerals as those in FIGS. 1 to 12 denote the same components.

  In the semiconductor light source in the first embodiment, that is, the light source unit 10, the semiconductor light source unit 1, and the vehicle lamp 100, one semiconductor light emitting element 40, which is a light source of the tail lamp, is arranged at or near the center O of the substrate 3. In addition, four semiconductor light emitting elements 41 to 44, which are light sources for the stop lamp, are arranged in a cross shape vertically, horizontally, and horizontally on one semiconductor light emitting element 40, which is the light source for the tail lamp, or a circle centered around the semiconductor light emitting elements 40. The surrounding wall member 18 has a circular shape.

  In the semiconductor type light source, that is, the light source unit, the semiconductor type light source unit, and the vehicle lamp in the fourth embodiment, the light source of the stop lamp is composed of six semiconductor light emitting elements 41 to 46, and the surrounding wall member 18C is based on an ellipse or an ellipse. Make the shape. That is, the four semiconductor light emitting elements 41 to 44 that are the light sources of the stop lamps are respectively arranged in a cross on the top, bottom, left, and right as in the first embodiment. The remaining two semiconductor light emitting elements 45 and 46 that are the light sources of the stop lamps are respectively arranged in the horizontal direction HH on the left and right sides of the four semiconductor light emitting elements 41 to 44.

  The surrounding wall member 18C has an ellipse whose major axis is the arrangement direction (horizontal direction HH) of the remaining two semiconductor light emitting elements 45 and 46, or a shape based on the ellipse. The shape based on the ellipse is a curve at both ends in the major axis direction of the reference ellipse, and is a reference from a point that is more than a distance that the inner peripheral surface of the surrounding wall member 18C and the wiring element do not contact each other. The curve on the opposite side of the center of the ellipse is displaced toward the center of the reference ellipse, so that the inner peripheral surface of the surrounding wall member 18C extends from the left and right semiconductor light emitting elements 45 and 46 in the major axis direction (horizontal direction HH). And the semiconductor light emitting elements 41 to 46 have a shape of a displacement curve passing through a point separated by a distance that is not in contact with each other.

  Since the semiconductor-type light source, that is, the light source unit, the semiconductor-type light source unit, and the vehicle lamp in the fourth embodiment has the above-described configuration, the semiconductor-type light source, that is, the light source unit 10 and the semiconductor-type light source unit 1 in the first embodiment, and The substantially same operation effect as the vehicular lamp 100 can be achieved. Moreover, in the semiconductor-type light source, that is, the light source unit, the semiconductor-type light source unit, and the vehicular lamp according to Embodiment 4, the capacity of the sealing member 180 is smaller than that of the surrounding wall member 18C. be able to.

(Description of Embodiment 5)
FIG. 14 shows Embodiment 5 of a semiconductor-type light source, that is, a light source unit, a semiconductor-type light source unit, and a vehicle lamp according to the present invention. Hereinafter, the semiconductor-type light source, that is, the light source unit, the semiconductor-type light source unit, and the vehicle lamp in Embodiment 5 will be described. In the figure, the same reference numerals as those in FIGS. 1 to 13 denote the same components.

  The semiconductor-type light source, that is, the light source unit 10A, the semiconductor-type light source unit 1A, and the vehicle lamp in the second embodiment, and the semiconductor-type light source, that is, the light source unit, the semiconductor-type light source unit, and the vehicle lamp in the third embodiment are tail lamps. One semiconductor light emitting element 40, which is a light source of the light source, is arranged at or near the center O of the substrate 3, and four semiconductor light emitting elements 41 to 44, which are light sources of a stop lamp, are one light source of a tail lamp. Each of the surrounding light-emitting elements 40 is arranged in a square shape on a circle centered around the semiconductor light-emitting element 40 or its vicinity, and the surrounding wall members 18A and 18B form a circular shape.

  In the semiconductor-type light source, that is, the light source unit, the semiconductor-type light source unit, and the vehicle lamp in the fifth embodiment, the light source of the stop lamp is composed of six semiconductor light emitting elements 41 to 46, and the surrounding wall member 18C is based on an ellipse or an ellipse. Make the shape. That is, the four semiconductor light emitting elements 41 to 44 that are the light sources of the stop lamps are respectively arranged in the four corners of the square as in the second and third embodiments. The remaining two semiconductor light emitting elements 45 and 46 that are the light sources of the stop lamps are respectively arranged in the horizontal direction HH on the left and right sides of the four semiconductor light emitting elements 41 to 44. The surrounding wall member 18C has an ellipse whose major axis is the arrangement direction (horizontal direction HH) of the remaining two semiconductor light emitting elements 45 and 46, or a shape based on the ellipse.

  Since the semiconductor-type light source, that is, the light source unit, the semiconductor-type light source unit, and the vehicle lamp in the fifth embodiment are configured as described above, the semiconductor-type light source, that is, the light source unit 10A and the semiconductor-type light source unit 1A in the second embodiment, It is possible to achieve substantially the same function and effect as those of the vehicular lamp and the semiconductor light source, that is, the light source unit, the semiconductor light source unit, and the vehicular lamp in the third embodiment. Moreover, in the semiconductor-type light source, that is, the light source unit, the semiconductor-type light source unit, and the vehicular lamp in the fifth embodiment, the capacity of the sealing member 180 is made smaller than that of the surrounding wall member 18C. be able to.

DESCRIPTION OF SYMBOLS 100 Vehicle lamp 101 Lamp housing 102 Lamp lens 103 Reflector 104 Mounting hole 105 Lamp chamber 106 Through-hole 107 Reflecting surface 108 Packing 1, 1A Semiconductor type light source unit 10, 10A Light source part (semiconductor type light source)
DESCRIPTION OF SYMBOLS 11 Socket part 12 Lens part 13 Connector part 14 Connector 144, 145, 146 Harness 17 Connection member 18, 18A, 18B, 18C Enclosure wall member 180 Sealing member 181 Reflective surface 2 Line segment 3 Substrate 30 High reflective surface 34 Mounting surface 40 , 41, 42, 43, 44, 45, 46 Semiconductor light emitting device 600, 610, 620, 630, 640 Conductive adhesive (wiring device)
601, 611, 621, 631, 641 Mounting pad (wiring element)
7 Insulating member 70 Mounting portion 71 Hut 8 Radiating member 91, 92, 93 Feed member F Focus O Center HH Horizontal direction

Claims (7)

A substrate having a mounting surface;
A plurality of semiconductor light emitting elements mounted on the mounting surface of the substrate;
A control element for controlling light emission of the semiconductor light emitting element;
A wiring element that feeds power to the semiconductor light emitting element via the control element;
An annular surrounding wall member disposed on the mounting surface of the substrate and surrounding all of the plurality of semiconductor light emitting elements;
A light-transmitting sealing member that seals the plurality of semiconductor light-emitting elements in the recess formed in the mounting surface of the substrate and the surrounding wall member;
With
The plurality of semiconductor light emitting elements are composed of one semiconductor light emitting element which is a light source of a tail lamp and at least four semiconductor light emitting elements which are light sources of a stop lamp,
One semiconductor light-emitting element that is a light source of a tail lamp is disposed at or near the center of the substrate,
Of the at least four semiconductor light-emitting elements that are the light sources of the stop lamps, four of the semiconductor light-emitting elements are square four on a circle centered on one semiconductor light-emitting element that is the light source of the tail lamp or its vicinity. It is arranged at each corner,
The surrounding wall member includes two groups, a first group including one semiconductor light emitting element that is a light source of a tail lamp and a second group including at least four semiconductor light emitting elements that are a light source of a stop lamp. A semiconductor type light source for a vehicular lamp characterized by surrounding the semiconductor light emitting element . Of the at least four semiconductor light-emitting elements that are the light sources of the stop lamps, four of the semiconductor light-emitting elements are square four on a circle centered on one semiconductor light-emitting element that is the light source of the tail lamp or its vicinity. The corners are arranged in a cross on the top, bottom, left and right,
The semiconductor-type light source of the vehicular lamp according to claim 1. The wiring elements include at least five mounting pads mounted on the mounting surface of the substrate, and at least five semiconductor light emitting elements that are electrically connected to the at least five mounting pads, respectively. A conductive adhesive, and
The four semiconductors arranged in the four corners of the square among the mounting pads of one of the semiconductor light emitting elements as a light source of a tail lamp or at least four of the semiconductor light emitting elements as a light source of a stop lamp At least one side of the mounting pad of the light emitting element, the side facing the other is at least a center of the mounting pad of one semiconductor light emitting element that is a light source of a tail lamp and a light source of a stop lamp Orthogonal to the line segments connecting the centers of the mounting pads of the four semiconductor light emitting elements respectively disposed in the four corners of the square among the four semiconductor light emitting elements,
The semiconductor-type light source of the vehicular lamp according to claim 1 or 2. The light source of the stop lamp is composed of the four semiconductor light emitting elements,
The surrounding wall member has a circular shape;
The semiconductor light source of the vehicular lamp according to any one of claims 1 to 3. The light source of the stop lamp is composed of six semiconductor light emitting elements,
The four semiconductor light emitting elements that are the light sources of the stop lamps are respectively arranged in a cross on the top, bottom, left and right, or four corners of a square,
The remaining two semiconductor light emitting elements that are the light sources of the stop lamps are respectively disposed horizontally on the left and right sides of the four semiconductor light emitting elements,
The surrounding wall member has an ellipse having a major axis direction of the arrangement direction of the remaining two semiconductor light emitting elements or a shape based on an ellipse.
The semiconductor-type light source of the vehicular lamp according to any one of claims 1 to 4. A socket portion formed by combining an insulating member, a heat radiating member, and a power feeding member;
The semiconductor-type light source of the vehicle lamp according to any one of claims 1 to 5, which is attached to the socket portion,
Comprising
A semiconductor-type light source unit for a vehicular lamp. A lamp housing and a lamp lens that partition the lamp chamber;
A semiconductor-type light source unit for a vehicular lamp according to claim 6;
With
The socket portion is attached to the lamp housing, and the semiconductor light source is disposed in the lamp chamber;
A vehicular lamp characterized by the above.