JP2011146483A - Light source unit of semiconductor type light source of lighting fixture for vehicle, and lighting fixture for vehicle - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem of heat radiation of a light-emitting chip in a conventional light source unit. <P>SOLUTION: This invention includes a light source part 10 and a socket part 11. The light source part 10 includes a substrate 3 and the light-emitting chips 41-44. The light-emitting chips 41-44 are mounted on a mounting surface 34 of the substrate 3. The socket part 11 includes a heat dissipating member 8. A contact surface 35 of the substrate 3 and a contact surface 80 of the heat dissipating member 8 are in contact with each other. The light-emitting chips 41-44 are so positioned as to correspond to a place where the heat dissipating member 8 is positioned via the substrate 3. As a result, this invention solves the problem of heat radiation of the light-emitting chips 41-44. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a light source unit of a semiconductor-type light source for a vehicle lamp. The present invention also relates to a vehicular lamp using a semiconductor-type light source as a light source.

  This type of light source unit has been conventionally used (for example, Patent Document 1, Patent Document 2, and Patent Document 3). Hereinafter, a conventional light source unit will be described. In the light source unit of Patent Document 1, an LED bare chip is mounted on a lead frame and a resistor is connected to form a light emitting unit, and the light emitting unit is assembled into a holder and a base. The light source unit of Patent Document 2 is configured by mounting a plurality of LED chips on a substrate, arranging a reflector on the substrate, and covering the upper surface of the LED chip with a resin. In the light source unit of Patent Document 3, a plurality of LED chips are provided on the main surface of the base portion via a plurality of insulating heat sinks, the plurality of LED chips are sealed with a resin mold, and a support body and a plurality of LED chips are sealed on the back surface of the base portion. These heat radiation fins are provided, and a base is provided on the support.

  However, since the light source unit of Patent Document 1 and the light source unit of Patent Document 2 are not provided with means for radiating the heat generated in the LED bare chip and the LED chip to the outside, there is a problem in heat dissipation in the LED bare chip and the LED chip. is there. Moreover, since the light source unit of Patent Document 2 and the light source unit of Patent Document 3 are not provided with the LED chip on the substrate and the base portion because the control means for controlling the light emission of the LED chip is not provided, it is necessary to provide the control means separately. Therefore, there are problems that the number of parts is increased, the parts are enlarged, and the manufacturing cost is increased.

JP-A-2-205080 JP 2007-176219 A JP 2009-21264 A

  The problem to be solved by the present invention is that in the conventional light source unit, there are a problem in heat dissipation in the LED bare chip and the LED chip, and a problem that the number of parts increases, the parts become larger, and the manufacturing cost becomes higher. It is in.

  This invention (invention concerning Claim 1) is provided with the light source part and the socket part to which the light source part is attached, the light source part has the attachment member which has an attachment surface and a contact surface, and a semiconductor type light source. A light emitting chip, a control element that controls light emission of the light emitting chip, and a wiring element that supplies power to the light emitting chip via the control element, and the light emitting chip, the control element, and the wiring element are attached to the mounting surface of the mounting member The socket portion has an insulating member, a contact surface, and a heat radiating member that radiates heat (diverging, diffusing, heat radiation, heat radiating, heat diffusing) to the outside, and a power supply to the light source portion. A power supply member, the heat dissipation member and the power supply member are incorporated in the insulating member in an insulated state, and the contact surface of the mounting member and the contact surface of the heat dissipation member are in contact with each other , The light emitting chip is radiating part through the mounting member There located corresponding to the locations situated, characterized in that.

  In the present invention (the invention according to claim 2), a wiring element is wired between the light emitting chip and the control element, and the wiring element is provided with a connecting portion having a meandering shape or a detour shape. In addition, between the light emitting chip and the control element, a connection part of the wiring element and an insulating part as a mounting member to which the wiring element is not wired are alternately arranged. .

  Further, according to the present invention (the invention according to claim 3), a plurality of light emitting chips, control elements and wiring elements are arranged, and a plurality of light emitting chips, a plurality of control elements and a plurality of wiring elements are provided. Grouped by lamp function, the light emitting chip, control element, and wiring element of the group having a large heat generation capacity among the plurality of lamp functions are positioned corresponding to the portions having the large heat dissipation capacity of the heat dissipation member through the mounting member. It is characterized by.

  Furthermore, in the present invention (the invention according to claim 4), a plurality of light emitting chips, control elements, and wiring elements are arranged, and a plurality of light emitting chips, a plurality of control elements, and a plurality of wiring elements are provided. Light emitting chips and control elements of a group having a large heat generation capacity among a plurality of lamp functions. In addition, the wiring element is located at a location where the mounting member is not provided with a cutout or a location where there are few cutouts.

  Furthermore, according to the present invention (the invention according to claim 5), a plurality of light emitting chips are arranged, and each of the plurality of light emitting chips has at least a group that always emits light for each of a plurality of lamp functions and other groups. The light emitting chips of the group that are always grouped and emit light are arranged between the light emitting chips of other groups.

  Furthermore, in the present invention (the invention according to claim 6), the mounting member and the heat radiating member are combined, and the light emitting chip, the control element, and the wiring element are directly mounted on the heat radiating member that is also used as the mounting portion. It is characterized by that.

  Furthermore, the present invention (the invention according to claim 7) is the vehicle according to any one of claims 1 to 5, wherein the lamp housing and the lamp lens that define the lamp chamber and the lamp chamber are disposed. A light source unit of a semiconductor-type light source of a lamp.

  Furthermore, in the present invention (the invention according to claim 8), the socket part is attached to the lamp housing, the light source part is arranged in the lamp chamber, the light emitting chip is the center of the attachment member, and It is arrange | positioned in the center vicinity, The control element is arrange | positioned at the edge part of the attachment member and the edge part of the heat radiating member, It is characterized by the above-mentioned.

  Furthermore, the present invention (the invention according to claim 9) includes a light distribution control unit that controls light distribution of light emitted from the light emitting chip, and the light emitting chip is disposed in the vicinity of the focal point of the light distribution control unit. It is characterized by that.

  Furthermore, the present invention (invention according to claim 10) is characterized in that a plurality of light emitting chips are concentrated and arranged.

  According to the light source unit of the semiconductor light source of the vehicular lamp of the present invention (the invention according to claim 1), the heat generated in the light emitting chip is transmitted to the heat radiating member via the mounting member by means for solving the above-mentioned problems. Then, the heat radiating member emits radiation (divergence, diffusion, thermal radiation, heat dissipation, thermal diffusion) to the outside. As a result, the light source unit of the semiconductor-type light source of the vehicular lamp of the present invention (the invention according to claim 1) can solve the heat dissipation problem in the light emitting chip.

  In addition, the light source unit of the semiconductor type light source of the vehicular lamp according to the present invention (the invention according to claim 1) has the light emitting chip, the control element, and the wiring element mounted on the mounting surface of the mounting member. The number of points can be reduced, the parts can be reduced in size, and the manufacturing cost can be reduced.

  Further, in the light source unit of the semiconductor type light source of the vehicular lamp according to the present invention (the invention according to claim 2), the heat generated in the control element is applied to the wiring element by the insulating portion located between the light emitting chip and the control element. Thus, it is possible to reliably prevent the light from being transmitted to the light emitting chip. As a result, the light source unit of the semiconductor-type light source of the vehicular lamp according to the present invention (the invention according to claim 2) can surely prevent the temperature rise in the light emitting chip, and the light emission efficiency of the light emitting chip is improved accordingly. Is done.

  Furthermore, the light source unit of the semiconductor type light source for the vehicular lamp according to the present invention (the invention according to claim 3) is a light emitting chip, a control element or a wiring element of a group having a large heat generation capacity by means for solving the above problems. The heat generated in is transmitted to the portion of the heat dissipation member having a large heat dissipation capacity through the mounting member and radiated to the outside from the portion of the heat dissipation member having the large heat dissipation capacity. As a result, the light source unit of the semiconductor-type light source of the vehicle lamp according to the present invention (the invention according to claim 3) can efficiently radiate the heat generated in the light emitting chip, the control element, and the wiring element to the outside. Therefore, the light emission efficiency of the light emitting chip can be improved.

  Furthermore, the light source unit of the semiconductor type light source for the vehicular lamp according to the present invention (the invention according to claim 4) is a light emitting chip, a control element, and a wiring of a group having a large heat generation capacity by means for solving the above-mentioned problems. An element can be arrange | positioned in the location where a notch is provided among attachment members, or the location where there are few notches, ie, the attachment surface of a wide range among the attachment surfaces of an attachment member. As a result, the light source unit of the semiconductor-type light source of the vehicular lamp according to the present invention (the invention according to claim 4) has a wide range of mounting surfaces of the mounting members of the light emitting chips, the control elements, and the wiring elements of the group having a large heat generation capacity. The degree of freedom increases in the arrangement, that is, the layout. That is, the insulating portion of the invention according to claim 2 can be formed. Accordingly, heat generated in the light emitting chips, the control elements, and the wiring elements of the group having a large heat generation capacity can be efficiently radiated to the outside, and the light emission efficiency of the light emitting chips can be improved.

  Furthermore, in the light source unit of the semiconductor light source of the vehicular lamp according to the present invention (the invention according to claim 5), the light emitting chips of the group that always emit light are arranged between the light emitting chips of the other groups. The light emitting chips of the group that emits light can be brought close to each other. As a result, the light source unit of the semiconductor-type light source of the vehicular lamp according to the present invention (the invention according to claim 5) is provided between the light emitting chips of the group that always emits light when the light emitting chips of the group that always emits light. Since there is no light leakage, optical design becomes easy.

  Furthermore, the light source unit of the semiconductor-type light source for the vehicular lamp according to the present invention (the invention according to claim 6) generates heat in the light emitting chip, the control element, and the wiring element by means for solving the above-mentioned problems. It is directly transmitted to the heat radiating member and radiated from the heat radiating member to the outside. As a result, the light source unit of the semiconductor-type light source of the vehicle lamp according to the present invention (the invention according to claim 6) can efficiently radiate the heat generated in the light emitting chip, the control element, and the wiring element to the outside. Therefore, the light emission efficiency of the light emitting chip can be improved.

  Furthermore, the vehicular lamp according to the present invention (the invention according to claim 7) is a semiconductor for a vehicular lamp according to any one of claims 1 to 6, by means for solving the problems. The same effect as the light source unit of the mold light source can be achieved.

  Furthermore, the vehicle lamp of the present invention (the invention according to claim 8) emits light when the socket portion is attached to the lamp housing and the light source portion is arranged in the lamp chamber by means for solving the above-mentioned problems. Since the chip is positioned in the vicinity of the center of the socket portion via the mounting member and the heat radiating member, it is possible to minimize the fluctuation of the position of the light emitting chip in the lamp chamber. As a result, the vehicular lamp according to the present invention (the invention according to claim 8) can minimize the blur of light distribution, facilitate light distribution control and light distribution design, and contribute to traffic safety. be able to.

  Furthermore, in the vehicular lamp according to the present invention (the invention according to claim 9), since the light emitting chip is disposed in the vicinity of the focal point of the light distribution control unit, the optical design becomes easy.

  Furthermore, the vehicular lamp of the present invention (the invention according to claim 10) is suitable for a one-lamp type vehicular lamp because a plurality of light emitting chips are concentrated.

FIG. 1 shows a first embodiment of a light source unit of a semiconductor-type light source of a vehicular lamp according to the present invention, and is a plan view (viewed from above) of an arrangement state of light emitting chips, control elements, and wiring elements. FIG. 2 is also a plan view showing the first wiring element. FIG. 3 is also a plan view showing the second wiring element. FIG. 4 is also a plan view showing the third wiring element. FIG. 5 is also a plan view showing the fourth wiring element. FIG. 6 is also a plan view showing the fifth wiring element. FIG. 7 is a partially enlarged cross-sectional view showing the light source unit of the light source unit. FIG. 8 is also an electric circuit diagram showing a driving circuit for a semiconductor light source of the light source unit. FIG. 9 is also a plan view showing the heat radiating member. FIG. 10 is also an explanatory plan view showing the arrangement state of the light emitting chips. FIG. 11 is also an explanatory plan view showing the arrangement state of the light emitting chip and the control element. FIG. 12 is also an exploded perspective view showing the light source unit and the socket unit. FIG. 13 is also a plan view showing the assembled state of the light source unit and the socket unit. FIG. 14 is a rear view showing the assembled state of the light source unit and the socket unit. FIG. 15 is a cross-sectional view taken along line XV-XV in FIG. FIG. 16 is a cross-sectional view taken along line XVI-XVI in FIG. FIG. 17 is an explanatory plan view showing the arrangement of four light emitting chips. FIG. 18 is an explanatory plan view showing the arrangement of three light emitting chips. FIG. 19 is a longitudinal sectional view (vertical sectional view) showing Embodiment 1 of the vehicular lamp according to the present invention. FIG. 20 is also an explanatory diagram showing the lighting state of the tail lamp function. FIG. 21 is also an explanatory diagram showing the lighting state of the stop lamp function. FIG. 22 shows Example 2 of the light source unit of the semiconductor-type light source of the vehicle lamp according to the present invention, and is a longitudinal sectional view (vertical sectional view) of the light emitting chip, the control element, and the heat radiating member.

  Hereinafter, two examples of a light source unit of a semiconductor-type light source of a vehicular lamp according to the present invention and an example of a vehicular lamp according to the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

  1 to 21 show a first embodiment of a light source unit of a semiconductor-type light source of a vehicular lamp according to the present invention and an embodiment of a vehicular lamp according to the present invention.

  Hereinafter, the structure of the light source unit of the semiconductor light source of the vehicular lamp according to the first embodiment and the vehicular lamp according to the present embodiment will be described. In FIG. 19, reference numeral 100 denotes a vehicular lamp in this embodiment.

(Description of vehicle lamp 100)
The vehicle lamp 100 is a one-lamp tail / stop lamp in this example. In other words, the vehicular lamp 100 uses both a tail lamp function (see FIG. 20) and a stop lamp function (see FIG. 21) in one lamp (one lamp, one lamp). The vehicle lamps 100 are respectively provided on the left and right of the rear part of a vehicle (not shown). The vehicle lamp 100 may be combined with another lamp function (for example, a backup lamp function) (not shown) to form a rear combination lamp.

  As shown in FIG. 19, the vehicular lamp 100 includes a lamp housing 101, a lamp lens 102, a reflector 103, and a light source unit having a semiconductor light source as a light source, that is, a semiconductor light source of the vehicular lamp according to the first embodiment. The light source unit 1 and the semiconductor-type light source drive circuit 2 (see FIG. 8) of the light source unit 1 are provided.

  The lamp housing 101 is made of, for example, a light impermeable member (for example, a resin member). The lamp housing 101 has a hollow shape in which one side is open and the other side is closed. A through hole 104 is provided in the closed portion of the lamp housing 101.

  The lamp lens 102 is made of, for example, an impermeable member (for example, a transparent resin member or a glass member). The lamp lens 102 has a hollow shape in which one side is open and the other side is closed. The periphery of the opening of the lamp lens 102 and the periphery of the opening of the lamp housing 101 are fixed in a watertight manner. A lamp chamber 105 is defined by the lamp housing 101 and the lamp lens 102.

  The reflector 103 is a light distribution control unit that controls light distribution of the light emitted from the light source unit 1, and has a focal point F. The reflector 103 is disposed in the lamp chamber 105 and is fixed to the lamp housing 101 or the like. The reflector 103 is composed of, for example, a light impermeable member (for example, a resin member or a metal member). The reflector 103 has a hollow shape in which one side is open and the other side is closed. A through hole 106 is provided in the closed portion of the reflector 103 so as to communicate with the through hole 104 of the lamp housing 101. A reflective surface 107 is provided on the inner surface of the reflector 103. The reflector 103 is made of a separate member from the lamp housing 101, but may be a reflector integrated with the lamp housing. In this case, a reflecting surface is provided on a part of the lamp housing to provide a reflector function.

(Description of the light source unit 1)
As shown in FIGS. 12 to 19, the light source unit 1 includes a light source unit 10, a socket unit 11, and a cover unit 12. The light source unit 10 and the cover unit 12 are attached to one end (upper end) of the socket unit 11. The light source unit 10 is covered by the cover unit 12.

  The light source unit 1 is mounted on the vehicular lamp 100 as shown in FIG. That is, the socket portion 11 is attached to the lamp housing 101 via a waterproof packing (O-ring) 108 in a watertight manner and detachably. The light source unit 10 and the cover unit 12 are arranged in the lamp chamber 105 through the through hole 104 of the lamp housing 101 and the through hole 106 of the reflector 103 and on the reflecting surface 107 side of the reflector 103. Has been.

(Description of the light source unit 10)
As shown in FIGS. 1 to 13 and FIGS. 15 to 18, the light source unit 10 includes a substrate 3 as an attachment member, and a plurality of light emitting chips 41, 42, 43 in this example. , 44, two resistors 51, 52 and two diodes 53, 54 as control elements, and wirings 61, 62, 63, 64, 65, 66, 67, 68, 69 as wiring elements, It is to be prepared.

  In this example, the substrate 3 is made of ceramic. As shown in FIGS. 1, 9 to 13, and 15 to 18, the substrate 3 has a substantially octagonal plate shape when viewed from the plane (top). Notches 31, 32, and 33 are provided at substantially the center of the three sides (right side, left side, and lower side) of the substrate 3. A flat mounting surface 34 is provided on one surface (upper surface) of the substrate 3. A flat contact surface 35 is provided on the other surface (lower surface) of the substrate 3. The mounting surface 34 of the substrate 3 is provided with a highly reflective surface (not shown) such as highly reflective paint or highly reflective vapor deposition.

  The four light emitting chips 41 to 44, the two resistors 51 and 52, the two diodes 53 and 54, and the wirings 61 to 69 are attached to the mounting surface 34 of the substrate 3 ( That is, it is provided by mounting, printing, vapor deposition, etc.). 9 to 13 and FIGS. 15 to 18, in order to simplify the drawings, the two resistors 51 and 52, the two diodes 53 and 54, the wirings 61 to 69, and the notch 31 are used. In some cases, illustrations such as ~ 33 are omitted.

  The semiconductor-type light source composed of the four light-emitting chips 41 to 44 uses a self-luminous semiconductor-type light source (LED in this embodiment 1) such as LED and EL (organic EL). As shown in FIGS. 1, 10 to 13, 15, 17, and 18, the light emitting chips 41 to 44 are small rectangular (square or rectangular) semiconductor chips (from the top). Light source chip), and in this example, a bare chip. As shown in FIG. 17A, the four light emitting chips 41 to 44 include a focal point F of the reflector 103 of the optical system and a center (attachment rotation center) O of the socket portion 11 of the light source unit 1. The light source bulbs (bulb) filaments or discharge bulbs (HID lamps) are arranged in a row in the vicinity so as to be substantially the same as light emission by arc discharge. The four light emitting chips 41 to 44 are connected in series in the forward direction.

  The four light emitting chips 41 to 44 are a part of light emitting chips 43 and 44 having a tail lamp function (two in this example), and all light emitting chips 41 to 44 having a stop lamp function (four in this example). , Grouped into Of the four light emitting chips 41 to 44 arranged in one row, two light emitting chips 43 and 44 are used for the tail lamp function and the stop lamp function. Of the four light emitting chips 41 to 44 arranged in one row, the two light emitting chips 41 and 42 at both ends (both outside) are used only for the stop lamp function. The two light emitting chips 43 and 44 of the tail lamp function (hereinafter simply referred to as “tail lamp function”) also used as the stop lamp function are arranged between the two light emitting chips 41 and 42 having only the stop lamp function. Has been.

  The resistors 51 and 52 are, for example, thin film resistors or thick film resistors. The resistors 51 and 52 are adjustment resistors for obtaining a predetermined drive current value. That is, due to the variation in Vf (forward voltage characteristics) of the light emitting chips 41 to 44, the value of the drive current supplied to the light emitting chips 41 to 44 changes, and the brightness (light flux) of the light emitting chips 41 to 44 changes. Variation occurs in brightness and illuminance. For this purpose, by adjusting (trimming) the values of the resistors 51 and 52, the value of the drive current supplied to the light emitting chips 41 to 44 is set to a predetermined value to be almost constant, whereby the light emitting chip 41 is set. Variation (brightness, luminous intensity, illuminance) of .about.44 can be adjusted (absorbed). As shown in FIG. 7, the trimming is, for example, adjusting a resistance value by cutting out a part of the resistors 51 and 52 with a laser. Note that the resistance value increases by trimming.

  The resistor 51 connected in series to the two light emitting chips 43 and 44 having the tail lamp function and the resistor 52 connected in series to the four light emitting chips 41 to 44 having the stop lamp function are: In FIG. 8, one piece is arranged, but a plurality of pieces may be arranged depending on the capacitance of the resistor and the variable width of the resistor to be adjusted. For example, there are cases where two resistors are provided, or three resistors 51 having the tail lamp function and four resistors 52 having the stop lamp function are arranged as shown in FIG.

  The diodes 53 and 54 are, for example, bare chip diodes or SMD diodes. The diode 53 connected in series to the two light emitting chips 43 and 44 having the tail lamp function and the resistor 51, and the four light emitting chips 41 to 44 having the stop lamp function and the resistor 52 connected in series. The diode 54 is a diode having a reverse connection prevention function and a pulse noise protection function from the reverse direction.

  The wirings 61 to 69 are made of, for example, a thin film wiring or a thick film wiring or a wire of a conductive member. The wirings 61 to 69 supply power to the light emitting chips 41 to 44 through the resistors 51 and 52 and the diodes 53 and 54.

(Description of layout of light emitting chips 41 to 44, resistors 51 and 52, diodes 53 and 54, and wirings 61 to 69 and description of the drive circuit 2)
The four light emitting chips 41 to 44, the two resistors 51 and 52, the two diodes 53 and 54, and the wirings 61 to 69 are the layout diagram of the electrical component shown in FIG. As shown in the electrical circuit diagram of FIG. 8, they are arranged and connected.

  As shown in FIG. 2, the light-emitting chip 41 having the stop lamp function, the resistor 52, and the diode 54 are arranged and connected in series to the first wiring 61 having a thin film pattern or a thick film pattern. A connection portion 610 having a meandering shape or a detour shape is provided between the portion on the light emitting chip 41 side of the first wiring 61 and the portion on the resistor 52 and diode 54 side. As a result, a wide S1 is formed between the connection portion 610 and the portion on the light emitting chip 41 side. Further, a narrow S2 is formed between the connection portion 610 and the portion on the resistor 52 and diode 54 side. 1 and 2, four resistors 52 are illustrated, but the number of the resistors 52 is not limited, and may be 1 to 3, or 5 or more.

  As shown in FIG. 3, a bonding portion 631 and a light emitting chip 42 having the stop lamp function are arranged and connected in series to a third wiring 63 having a thin film pattern or a thick film pattern. A connection portion 630 having a meandering shape or a detour shape is provided between the light emitting chip 42 side portion and the bonding portion 631 side portion of the third wiring 63. As a result, a wide S3 is formed between the connection portion 630 and the portion on the light emitting chip 42 side. A second wire 62 of wire is connected in series to the light emitting chip 41 of the first wire 61 and the bonding portion 631 of the third wire 63.

  As shown in FIG. 4, the light emitting chip 43 having the tail lamp function, the resistor 51, the diode 53, and the bonding portion 651 are arranged and connected in series to the fifth wiring 65 having a thin film pattern or a thick film pattern. 1 and 4, three resistors 51 are illustrated, but the number of the resistors 51 is not limited and may be one, two, or four or more. A fourth wire 64 of a wire is connected in series to the light emitting chip 42 of the third wire 63 and the bonding portion 651 of the fifth wire 65.

  As shown in FIG. 5, the light emitting chip 44 having the tail lamp function and the bonding portion 671 are arranged and connected in series to the seventh wiring 67 having a thin film pattern or a thick film pattern. A sixth wire 66 of wire is connected in series to the light emitting chip 43 of the fifth wire 65 and the bonding portion 671 of the seventh wire 67.

  As shown in FIG. 6, a bonding portion 691 is arranged and connected to the ninth wiring 69 having a thin film pattern or a thick film pattern. An eighth wire 68 of a wire is connected in series to the light emitting chip 44 of the seventh wire 67 and the bonding portion 691 of the ninth wire 69.

  As described above, the light source unit 10 includes the substrate 3 as an attachment member, the light emitting chips 41 to 44 as semiconductor-type light sources, the resistors 51 and 52 and the diodes 53 and 54 as control elements, and a wiring element. The wirings 61 to 69 as described above are provided.

  As shown in FIG. 1, between the light emitting chips 41 to 44, the resistors 51 and 52, and the diodes 53 and 54, the connection portions 610, 630, and 650 of the wirings 61, 63, and 65, and The insulating portions of the substrate 3 where the wirings 61 to 69 are not wired, that is, the spaces S1 to S4 are alternately arranged.

  The four light emitting chips 41 to 44, the two resistors 51 and 52, the two diodes 53 and 54, and the nine wirings 61 to 69 are grouped according to the tail lamp function and the stop lamp function. Has been. The heat generation capacities of the light emitting chips 41 to 44 and the resistors 52 and the diodes 54 and the wirings 61 to 63 having the stop lamp function are the light emitting chips 43 and 44 and the resistors 51 and the diodes 53 and 53 having the tail lamp function. It is larger than the heat generation capacity in the wiring 65.

  Therefore, as shown in FIG. 10, the light emitting chips 41 to 44, the resistor 52, the diode 54, and the wirings 61 to 63 having the stop lamp function having a large heat generation capacity mainly pass through the substrate 3. In the heat radiating member 8 described later, the heat radiating member 8 is located corresponding to a portion having a large heat radiation capacity (a portion shaded in FIG. 10) 84. The location 84 is an upper half location of the substrate 3, and the location where the notches 31 to 33 and the later-described notches 81 to 83 are not provided in the substrate 3 and the later-described heat radiating member 8. There are few notches. The portion 84 has a larger area than the portion 85 described later.

  Note that the light emitting chips 43 and 44, the resistor 51, the diode 53, and the wiring 65 having the tail lamp function having a small heat generation capacity are places where the heat radiation capacity is small in the heat radiating member 8 to be described later via the substrate 3. It is located corresponding to 85 (the place where the lattice in FIG. 10 is given). The said location 85 is a location of the lower half of the said board | substrate 3, Comprising: The said notches 31-33 and the postscript notches 81-83 are provided in the said board | substrate 3 and the postscript heat radiating member 8. FIG.

  As shown in FIG. 11, the light emitting chips 41 to 44 are arranged at a center O of the substrate 3 and a portion in the vicinity of the center O of the heat radiating member 8 (a portion provided with a lattice in FIG. 11). ing. The resistors 51 and 52 and the diodes 53 and 54 are arranged on the edge of the substrate 3 and on the edge 87 of the heat radiating member 8 described later (the hatched portion in FIG. 11).

(Description of socket part 11)
As shown in FIGS. 12 to 16, the socket part 11 includes an insulating member 7, a heat radiating member 8, and three power feeding members 91, 92, and 93. The heat radiating member 8 having thermal conductivity and conductivity and the power feeding members 91 to 93 having conductivity are integrally incorporated in the insulating member 7 having insulation properties in an insulated state.

(Description of insulating member 7)
The insulating member 7 is made of, for example, an insulating resin member. The insulating member 7 has a substantially cylindrical shape. A mounting portion 70 is provided at one end (upper end) of the insulating member 7. The mounting portion 70 is used to equip the vehicle lamp 100 with the light source unit 1. That is, the mounting portion 70 is configured such that a part of the socket portion 11 on the cover 12 side is inserted into the through hole 104 of the lamp housing 101 and the socket portion 11 is rotated around the center O axis in this state. By rotating, the socket part 11 is attached to the lamp housing 101 via the waterproof packing 108 in a watertight and detachable manner.

  A light source side connector portion 13 is integrally provided at the other end portion (lower end portion) of the insulating member 7. A connector 14 on the power supply side is attached to the connector portion 13 so as to be mechanically detachable and electrically connectable.

(Description of heat dissipation member 8)
The heat radiating member 8 is made of, for example, an aluminum die casting or a resin member having thermal conductivity (also having conductivity). The heat radiating member 8 has one end portion (upper end portion) having a flat plate shape and a fin shape from the intermediate portion to the other end portion (lower end portion). A contact surface 80 is provided on the upper surface of one end of the heat radiating member 8. The contact surface 80 of the heat radiating member 8 is bonded with a heat conductive adhesive (not shown) in a state where the contact surfaces 35 of the substrate 3 are in contact with each other. As a result, the light emitting chips 41 to 44 are positioned corresponding to the locations where the vicinity 86 of the center O of the heat radiating member 8 is positioned via the substrate 3.

  At substantially the center of the three sides (right side, left side, and lower side) of the heat radiating member 8, notches 81, 82, and 83 are provided corresponding to the notches 31 to 33 of the substrate 3, respectively. The three power feeding members 91 to 93 are arranged in the notches 81 to 83 of the heat radiating member 8 and the notches 31 to 33 of the substrate 3, respectively. The insulating member 7 is interposed between the heat radiating member 8 and the power feeding members 91 to 93. The heat radiating member 8 is in close contact with the insulating member 7. The power supply members 91 to 93 are in close contact with the insulating member 7.

(Description of power supply members 91-93)
The power feeding members 91 to 93 are made of, for example, a conductive metal member. One end portions (upper end portions) of the power supply members 91 to 93 have a divergent shape, and are respectively located in the notches 81 to 83 of the heat dissipation member 8 and the notches 31 to 33 of the substrate 3. One end portions of the power supply members 91 to 93 are electrically connected to the wirings 65, 61, and 69 of the light source unit 10, respectively. In this way, the light source unit 10 is attached to one end portion (one end opening portion) of the cylindrical socket portion 11. Note that one end of the power supply members 91 to 93 may mechanically fix the substrate 3 to the heat dissipation member 8.

  The other end portions (lower end portions) of the power supply members 91 to 93 have a narrowed shape and are disposed in the connector portion 13. The other end portions of the power supply members 91 to 93 constitute male terminals (male terminals) 910, 920, and 930.

(Description of connector portion 13 and connector 14)
As shown in FIG. 8, the connector 14 is provided with female terminals (female terminals) 141, 142, and 143 that are electrically connected to the male terminals 910 to 930 of the connector portion 13. By attaching the connector 14 to the connector portion 13, the female terminals 141 to 143 are electrically connected to the male terminals 910 to 930. Further, by removing the connector 14 from the connector portion 13, the electrical connection between the female terminals 141 to 143 and the male terminals 910 to 930 is interrupted.

  As shown in FIGS. 8 and 19, the first female terminal 141 and the second female terminal 142 of the connector 14 are connected to a power source (DC power supply battery) 15 via harnesses 144 and 145 and a switch SW. ing. The third female terminal 143 of the connector 14 is grounded (grounded) via a harness 146. The connector portion 13 and the connector 14 are 3-pin connector portions and connectors (the three feeding members 91 to 93, the three male terminals 910 to 930, and the three female terminals 141 to 143). is there.

(Description of switch SW)
The switch SW is a three-position changeover switch including a movable contact 150, a first fixed contact 151, a second fixed contact 152, a third fixed contact 153, and a common fixed contact 154.

  When the movable contact 150 is switched to the position of the first fixed contact 151 (in the state shown by the one-dot chain line in FIG. 8), the current (drive current) causes the tail lamp function diode 53 and the resistor 51 to flow. In this state, the light is supplied to the two light emitting chips 43 and 44 having the tail lamp function. That is, the two light emitting chips 43 and 44 having the tail lamp function are supplied with a drive current through the diode 53 and the resistor 51 having the tail lamp function.

  When the movable contact 150 is switched to the position of the second fixed contact 152 (in the state shown by the two-dot chain line in FIG. 8), the current (driving current) is the diode 54 and the resistor 52 having the stop lamp function. Then, the light is supplied to the four light emitting chips 41 to 44 having the stop lamp function. That is, the four light emitting chips 41 to 44 having the stop lamp function are supplied with a driving current through the diode 54 and the resistor 52 having the stop lamp function.

  When the movable contact 150 is switched to the position of the third fixed contact 153 (in the state shown by the solid line in FIG. 8), the current supply to the four light emitting chips 41 to 44 is interrupted. State.

(Description of cover part 12)
The cover portion 12 is made of a light transmissive member. The cover unit 12 is provided with an optical control unit (not shown) such as a prism that optically controls and emits light from the four light emitting chips 41 to 44. As shown in FIG. 19, the cover portion 12 is attached to one end portion (one end opening portion) of the cylindrical socket portion 11 so as to cover the light source portion 10. The cover portion 12 prevents the four light emitting chips 41 to 44 from being influenced from the outside, for example, contact with other components or adhesion of dust. That is, the cover 12 protects the four light emitting chips 41 to 44 from disturbance.

  The light source unit 1 of the semiconductor-type light source of the vehicle lamp according to the first embodiment and the vehicle lamp 100 according to the present embodiment (hereinafter referred to as “the light source unit 1 and the vehicle lamp 100 according to the first embodiment”) are as described above. Hereinafter, the operation will be described.

  First, the movable contact 150 of the switch SW is switched to the first fixed contact 151. Then, the current (driving current) is supplied to the two light emitting chips 43 and 44 having the tail lamp function via the diode 53 and the resistor 51 having the tail lamp function. As a result, the two light emitting chips 43 and 44 having the tail lamp function emit light.

  Light emitted from the two light emitting chips 43 and 44 having the tail lamp function is transmitted through the cover portion 12 of the light source unit 1 and light distribution is controlled. A part of the light emitted from the light emitting chips 43 and 44 is reflected on the cover 12 side by the highly reflective surface of the substrate 3. The light subjected to the light distribution control is transmitted through the lamp lens 102 of the vehicular lamp 100, is again subjected to the light distribution control, and is irradiated to the outside. Thereby, the vehicular lamp 100 irradiates the light distribution of the tail lamp function shown in FIG. 20 to the outside.

  Next, the movable contact 150 of the switch SW is switched to the second fixed contact 152. Then, the current (drive current) is supplied to the four light emitting chips 41 to 44 having the stop lamp function via the diode 54 and the resistor 52 having the stop lamp function. As a result, the four light emitting chips 41 to 44 having the stop lamp function emit light. That is, in contrast to the two light emitting chips 43 and 44 having the tail lamp function that have been emitting light until now, the two light emitting chips 41 and 42 having the stop lamp function that have been extinguished until now are tail lamp functions that have been emitted until now. The two light emitting chips 43 and 44 emit new light.

  Light emitted from the four light emitting chips 41 to 44 having the stop lamp function is transmitted through the cover portion 12 of the light source unit 1 and light distribution is controlled. A part of the light emitted from the light emitting chips 41 to 44 is reflected by the highly reflective surface of the substrate 3 toward the cover unit 12. The light subjected to the light distribution control is transmitted through the lamp lens 102 of the vehicular lamp 100, is again subjected to the light distribution control, and is irradiated to the outside. Thereby, the vehicle lamp 100 irradiates the light distribution of the stop lamp function shown in FIG. 21 to the outside. The light distribution of the stop lamp function is brighter (the luminous flux, luminous intensity, and illuminance are large) compared to the light distribution of the tail lamp function.

  Then, the movable contact 150 of the switch SW is switched to the third fixed contact 153. Then, the current (drive current) is interrupted. As a result, the four light emitting chips 41 to 44 or the two light emitting chips 43 and 44 are extinguished. Thereby, the vehicular lamp 100 is turned off.

  The heat generated in the light emitting chips 41 to 44, the resistors 51 and 52, the diodes 53 and 54, and the wirings 61 to 69 of the light source unit 10 is transmitted to the heat radiating member 8 through the substrate 3. To be emitted.

  The light source unit 1 and the vehicular lamp 100 according to the first embodiment are configured and operated as described above, and the effects thereof will be described below.

  In the light source unit 1 and the vehicle lamp 100 according to the first embodiment, heat generated by the light emitting chips 41 to 44 is transmitted to the heat radiating member 8 through the substrate 3 of the mounting member, and the heat radiating member 8 (especially at the other end). Radiation (divergence, diffusion, thermal radiation, heat dissipation, thermal diffusion) is emitted from the fin-shaped portion) to the outside. Part of the heat is transmitted from the heat radiating member 8 to the insulating member 7 and radiated from the insulating member 7 to the outside. As a result, the light source unit 1 and the vehicle lamp 100 according to the first embodiment can solve the heat dissipation problem in the light emitting chips 41 to 44.

  Moreover, in the light source unit 1 and the vehicle lamp 100 according to the first embodiment, the light emitting chips 41 to 44, the resistors 51 and 52 of the control elements, the diodes 53 and 54, and the wirings 61 to 69 of the wiring elements are included in the substrate 3 of the mounting member. Since it is attached to the attachment surface 34, the number of parts can be reduced correspondingly, the parts can be reduced in size, and the manufacturing cost can be reduced.

  Further, the light source unit 1 and the vehicle lamp 100 according to the first embodiment include the control elements by the insulating portions S1 to S4 located between the light emitting chips 41 to 44 and the resistors 51 and 52 and the diodes 53 and 54 of the control element. The heat generated in the resistors 51 and 52 and the diodes 53 and 54 can be reliably prevented from being transmitted to the light emitting chips 41 to 44 via the wirings 61 to 69 of the wiring elements. As a result, the light source unit 1 and the vehicle lamp 100 according to the first embodiment can reliably prevent the temperature rise in the light emitting chips 41 to 44, and the light emission efficiency of the light emitting chips 41 to 44 is improved accordingly. .

  Further, the light source unit 1 and the vehicular lamp 100 according to the first embodiment are generated in the light-emitting chips 41 to 44 having a large heat generation capacity, the resistance 52 of the control element, the diode 54, and the wiring 61 to 69 of the wiring element. Heat is transmitted to the portion 84 having a large heat dissipation capacity of the heat radiating member 8 through the substrate 3 of the mounting member, and is radiated to the outside from the portion 84 having a large heat dissipation capacity of the heat radiating member 8. As a result, the light source unit 1 and the vehicle lamp 100 according to the first embodiment efficiently radiate heat generated in the light emitting chips 41 to 44, the control element resistance 52, the diode 54, and the wiring element wirings 61 to 69 to the outside. Accordingly, the light emission efficiency of the light emitting chips 41 to 44 can be improved accordingly.

  Furthermore, the light source unit 1 and the vehicle lamp 100 according to the first embodiment include the light-emitting chips 41 to 44 having a large heat generation capacity, the resistance 52 of the control element, the diode 54, and the wiring elements 61 to 69. A portion of the mounting member substrate 3 where the cutouts 31 to 33 are not provided or a portion where the cutouts 31 to 33 are few, that is, a wide range 84 of the mounting surface 34 of the mounting surface 34 of the mounting member substrate 3. Can be arranged. As a result, the light source unit 1 and the vehicle lamp 100 according to the first embodiment include the light emitting chips 41 to 44 having a large heat generation capacity, the light emitting chips 41 to 44 having the large heat generation capacity, the resistance 52 of the control element, the diode 54, and the wiring elements 61 to 69. The degree of freedom increases in the arrangement, that is, the layout, of the mounting member on the mounting surface 34 in the wide range 84 of the substrate 3. That is, the insulating portions S1 to S4 can be formed. Accordingly, the heat generated in the light emitting chips 41 to 44 having a large heat generation capacity, the resistance 52 of the control element, the diode 54, and the wirings 61 to 69 of the wiring element can be efficiently radiated to the outside. The luminous efficiency of 41 to 44 can be improved.

  Furthermore, in the light source unit 1 and the vehicle lamp 100 according to the first embodiment, the light emitting chips 43 and 44 of the group that always emit light, that is, the light emitting chips 43 and 44 of the tail lamp function (also using the stop lamp function), Since the light-emitting chip having a stop lamp function (light-emitting chip that emits light when the stop lamp function is used but does not emit light when the tail lamp function is used) 41 and 44 is disposed, 44 can be in close proximity to each other. As a result, the light source unit 1 and the vehicular lamp 100 according to the first embodiment always emit light when the light emitting chips 43 and 44 of the group that always emits light, that is, the light emitting chips 43 and 44 having the tail lamp function (also using the stop lamp function) are emitted. Since there is no light leakage between the light emitting chips 43 and 44 of the light emitting chips of the light emitting group, that is, the tail lamp function (also used in combination with the stop lamp function), the optical design is facilitated.

  Furthermore, the light source unit 1 and the vehicle lamp 100 according to the first embodiment are configured such that the socket portion 11 is rotated around the center O axis and attached to the lamp housing 101 by the attachment portion 70, and the light source portion 10 is placed in the lamp chamber 105. When arranged, the light emitting chips 41 to 44 are located in the vicinity of the center O of the socket portion 11 via the substrate 3 or the heat radiating member 8 of the mounting member, so that the position of the light emitting chips 41 to 44 in the lamp chamber 105 can be shaken. It can be made as small as possible. As a result, the light source unit 1 and the vehicular lamp 100 according to the first embodiment can minimize light distribution blur, facilitate light distribution control and light distribution design, and contribute to traffic safety. Can do.

  Furthermore, in the light source unit 1 and the vehicle lamp 100 according to the first embodiment, the light emitting chips 41 to 44, particularly the tail lamp function light emitting chips 43 and 44, are disposed in the vicinity of the focal point F of the reflector 103 as a light distribution control unit. Therefore, the optical design becomes easy.

  Furthermore, the light source unit 1 and the vehicle lamp 100 according to the first embodiment are suitable for a one-lamp type vehicle lamp because the four light emitting chips 41 to 44 are concentrated.

  FIG. 22 shows Embodiment 2 of the light source unit of the semiconductor-type light source of the vehicle lamp according to the present invention. In the figure, the same reference numerals as those in FIGS. 1 to 21 denote the same elements.

  The light source unit of the semiconductor-type light source of the vehicular lamp according to the second embodiment serves as both the mounting member substrate and the heat dissipation member 800. That is, the attachment surface 801 is provided on the one end surface 800 of the heat dissipation member 800. The light emitting chips 41 to 44, the resistors 51 and 52 of the control element, the diodes 53 and 54, and the wiring of the wiring element are directly attached to the attachment surface 801 of the heat radiating member 800. Note that between the mounting surface 801 of the heat dissipation member 800 and the light emitting chips 41 to 44, the resistances 51 and 52 of the control element, the diodes 53 and 54, and the wiring of the wiring element, the thermal resistance is low and the thickness is thin ( For example, a 100 μ) insulating layer 802 is formed. Since this insulating layer 802 has a low thermal resistance and is thin, the light emitting chips 41 to 44, the resistances 51 and 52 of the control element, the diodes 53 and 54, and the wiring of the wiring element are directly on the mounting surface 801 of the heat dissipation member 800. It is possible to achieve almost the same operation and effect as the attachment.

  In the light source unit of the semiconductor-type light source of the vehicle lamp in the second embodiment, heat generated in the light emitting chips 41 to 44, the resistors 51 and 52 of the control elements, the diodes 53 and 54, and the wiring of the wiring elements is directly applied to the heat radiating member 800. (The insulating layer 802 has a low thermal resistance and is thin, so that it can be almost ignored) and is transmitted and radiated from the heat radiating member 800 to the outside. As a result, the light source unit of the semiconductor-type light source of the vehicle lamp according to the second embodiment efficiently generates heat generated in the light emitting chips 41 to 44, the resistances 51 and 52 of the control element, the diodes 53 and 54, and the wiring of the wiring element. The light can be emitted to the outside, and the light emission efficiency of the light emitting chips 41 to 44 can be improved accordingly.

  In Examples 1 and 2, four light emitting chips 41 to 44 are used. However, in the present invention, there may be two light emitting chips, or three, five or more as shown in FIG. The number and layout of the light emitting chips used as the tail lamp function and the number and layout of the light emitting chips used as the stop lamp function are not particularly limited.

  Moreover, in the said Example 1, 2, it uses for a tail stop lamp. However, in the present invention, it can be used for a combination lamp other than the tail / stop lamp.

  Further, in the first and second embodiments, the lamp is used for switching between the two lamps of the tail lamp and the stop lamp. However, in the present invention, it can be used for switching between three or more lamps.

  Furthermore, in the said Example 1, 2, the four light emitting chips 41-44 are arrange | positioned in 1 row. However, in the present invention, the light emitting chips may be arranged in a circular shape on a square corner in a plurality of rows. For example, it may be arranged at four corners of a square as shown in FIG. 17B or at three corners of a triangle as shown in FIG.

  Furthermore, in the first and second embodiments, the light distribution is controlled by the cover portion 12 and the lamp lens 102. However, in the present invention, the light distribution may be controlled by at least one of the cover portion 12 and the lamp lens 102.

  In the first and second embodiments, all of the four light emitting chips 41 to 44 are used for the stop lamp function, and the two light emitting chips 43 and 44 are used for the tail lamp function. It is. However, in the present invention, all of the four light emitting chips 41 to 44 may be used for the stop lamp function, and the other two light emitting chips 41 and 42 may be used for the tail lamp function.

DESCRIPTION OF SYMBOLS 1 Light source unit 10 Light source part 11 Socket part 12 Cover part 13 Connector part 14 Connector 141 1st female terminal 142 2nd female terminal 143 3rd female terminal 144, 145, 146 Harness 15 Power supply 150 Movable contact 151 1st fixed contact 152 1st 2 fixed contact 153 3rd fixed contact 154 common fixed contact 100 vehicle lamp 101 lamp housing 102 lamp lens 103 reflector 104 through-hole 105 lamp chamber 106 through-hole 107 reflecting surface 108 waterproof packing 2 drive circuit 3 substrate (mounting member)
31, 32, 33 Notch 34 Mounting surface 35 Contact surface 41, 42, 43, 44 Light emitting chip 51, 52 Resistance
53, 54 Diode 61, 62, 63, 64, 65, 66, 67, 68, 69 Wiring 610, 630, 650 Connection part 631, 651, 671, 691 Bonding part 7 Insulating member 70 Mounting part 8 Heat radiation member 80 Contact Surface 81, 82, 83 Notch 84 Location where heat radiation capacity is large 85 Location where heat radiation capacity is small 86 Near center portion 87 Edge portions 91, 92, 93 Feed member 910 First male terminal 920 Second male terminal 930 Third male terminal F Focus O Center SW switch Between S1, S, S3, S4 (insulating part)

Claims (10)

In a light source unit of a semiconductor-type light source for a vehicle lamp,
A light source part, and a socket part to which the light source part is attached,
The light source unit includes a mounting member having a mounting surface and a contact surface, a light emitting chip of a semiconductor light source, a control element that controls light emission of the light emitting chip, and a wiring that supplies power to the light emitting chip via the control element An element, and the light emitting chip, the control element, and the wiring element are attached to an attachment surface of the attachment member,
The socket portion includes an insulating member, a heat radiating member having a contact surface and radiating heat generated by the light source portion to the outside, and a power feeding member for supplying power to the light source portion, and the heat radiating member and the The power supply member is incorporated in the insulating member in an insulated state,
The contact surface of the mounting member and the contact surface of the heat dissipation member are in contact with each other,
The light emitting chip is located corresponding to the location where the heat dissipation member is located via the mounting member.
A light source unit for a semiconductor light source of a vehicular lamp. The wiring element is wired between the light emitting chip and the control element,
The wiring element is provided with a connecting portion having a meandering shape or a detour shape,
Between the light emitting chip and the control element, the connection portions of the wiring elements and the insulating portions as the attachment members where the wiring elements are not wired are alternately arranged.
The light source unit of the semiconductor type light source of the vehicular lamp according to claim 1. A plurality of the light emitting chip, the control element and the wiring element are arranged,
The plurality of light emitting chips, the plurality of control elements, and the plurality of wiring elements are grouped for each of a plurality of lamp functions,
The light emitting chip, the control element, and the wiring element of the group having a large heat generation capacity among the plurality of lamp functions are positioned corresponding to locations where the heat dissipation capacity is large among the heat dissipation members via the mounting member.
The light source unit of the semiconductor type light source of the vehicular lamp according to claim 1 or 2. A plurality of the light emitting chip, the control element and the wiring element are arranged,
The plurality of light emitting chips, the plurality of control elements, and the plurality of wiring elements are grouped for each of a plurality of lamp functions,
Of the mounting member and the heat dissipating member, the place where the power feeding member is located is provided with a notch,
Among the plurality of lamp functions, the light emitting chip, the control element, and the wiring element of the group having a large heat generation capacity are provided in a portion of the mounting member where the notch is not provided or where the notch is provided. To position,
The light source unit of the semiconductor type light source of the vehicle lamp of any one of Claims 1-3 characterized by the above-mentioned. A plurality of the light emitting chips are arranged,
The plurality of light emitting chips are grouped into at least a group that always emits light and other groups for each of a plurality of lamp functions,
The light emitting chips of the group that always emit light are arranged between the light emitting chips of other groups,
The light source unit of the semiconductor type light source of the vehicle lamp of any one of Claims 1-4 characterized by the above-mentioned. The mounting member and the heat radiating member are combined,
The light emitting chip, the control element, and the wiring element are directly attached to the heat radiating member that also serves as the attachment part,
The light source unit of the semiconductor type light source of the vehicle lamp of any one of Claims 1-5 characterized by the above-mentioned. In a vehicular lamp using a semiconductor-type light source as a light source,
A lamp housing and a lamp lens that partition the lamp chamber;
The light source unit of the semiconductor type light source of the vehicular lamp according to any one of claims 1 to 6, wherein the light source unit is disposed in the lamp chamber.
A vehicular lamp characterized by comprising: The socket portion is attached to the lamp housing,
The light source unit is disposed in the lamp chamber,
The light emitting chip is disposed in the center of the mounting member and in the vicinity of the center of the heat dissipation member,
The control element is arranged at an edge of the mounting member and an edge of the heat dissipation member.
The vehicular lamp according to claim 7. A light distribution control unit for controlling light distribution of light emitted from the light emitting chip;
The light emitting chip is disposed in the vicinity of the focal point of the light distribution control unit,
The vehicular lamp according to claim 7 or 8, wherein the vehicular lamp is provided. A plurality of the light emitting chips are arranged in a concentrated manner.
The vehicular lamp according to any one of claims 7 to 9.

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