JP2015118779A - Lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lighting device which improves the airtightness on an interface between a light emitting unit including a radiator and a resin socket.SOLUTION: A lighting device includes: a metal radiator; a wiring board disposed on the radiator and including an insulation substrate and a conductor pattern formed on the insulation substrate; a light emitting element disposed on the radiator and electrically connected with the conductor pattern; and a resin socket integrally holding the radiator and the wiring board. The resin socket covers a wiring board side surface, a radiator side surface, and a partial region on the wiring board. The resin socket forms an adhesion interface with a resin surface exposed on an upper surface of the wiring board.

Description

  The present invention relates to an illuminating device including a resin socket, and more particularly to an illuminating device for a vehicle including a metal radiator (heat sink).

  Patent Document 1 discloses a socket-type light source unit in which a heat radiating member and a resin member fixed to a substrate on which a light emitting element is mounted are integrated by integral molding. The heat radiating member extends outside the lamp chamber, and dissipates heat from the light emitting chip to the outside of the lamp chamber.

JP 2012-084279 A

  In the light source unit as in Patent Document 1, when a metal heat radiating member such as aluminum is used as the heat radiating member, the adhesion with the resin member is not sufficient.

  Therefore, when this light source unit is installed in the lamp room of a vehicular lamp that requires airtightness, the airtightness of the lamp room is impaired through the interface between the heat radiating member and the resin member as a waterproof / dustproof effect. There was a problem that could be lost.

  Further, the inventors of the present application have also studied a measure for improving the airtightness by filling an adhesive between the resin member and the heat radiating member, but according to this configuration, the number of parts and the number of processing steps increase. There has been a problem of outgassing from the adhesive.

  Accordingly, the present invention solves the above-described problems and improves the airtightness at the interface between the light emitting unit having the light emitting element mounted on the radiator and the resin member, and the vehicle in which the lighting device is attached to the lamp chamber. The purpose is to provide lighting equipment.

The lighting device of the present invention includes a metal radiator, a wiring board that is disposed on the radiator and includes an insulating substrate and a conductor pattern formed on the insulating substrate, and a conductor pattern that is disposed on the radiator. And a resin socket that integrally holds the radiator and the wiring board.
The wiring board has a resin exposed portion on the top surface, the resin socket covers the wiring substrate side surface, the radiator side surface, and a partial region on the wiring substrate, and the resin socket is joined to the resin exposed portion on the top surface of the wiring substrate. It is characterized by being.

  The vehicular lamp of the present invention includes a housing, an outer lens that covers the light irradiation side opening of the housing, and the lighting device that is attached so as to close an attachment hole formed in the housing.

The manufacturing method of the illuminating device of the present invention includes: (a) a step of bonding a wiring board on which a conductor pattern is formed on a metal radiator; and (b) a light emitting element on the radiator or the wiring board. And (c) a step of forming a resin socket that integrally holds the radiator and the wiring board by insert molding.
In the step (c), the resin socket covers the side surface of the wiring board, the side surface of the heat radiating portion, and a partial region on the wiring board, and is formed on the resin exposed portion on the wiring board.

According to the lighting device and the manufacturing method of the lighting device of the present invention, the interface path between the light emitting unit having the light emitting element mounted on the radiator and the resin socket is blocked, and the airtightness at the interface between the light emitting unit and the resin socket is reduced. An improved lighting device can be provided.
And according to the vehicle lamp of this invention, the vehicle lamp which improved the airtightness of the lamp chamber can be provided by using the illuminating device of this invention as a light source of a vehicle lamp.

(A) It is a perspective view of the illuminating device of the Example of this invention. (B) It is the schematic of the vehicle lamp of the Example of this invention. It is a schematic top view of the illuminating device of the Example of this invention. (A) It is a schematic sectional drawing in alignment with the AA in FIG. (B) It is the elements on larger scale of the B section in (a). (C) It is a schematic sectional drawing in alignment with CC line in FIG. (A) It is a schematic sectional drawing of the vicinity of the light emitting element mounting area in the illuminating device of Example 1 of this invention, (b) It is a schematic sectional drawing near the light emitting element mounting area | region in the illuminating device of Example 2 of this invention.

  Hereinafter, preferred embodiments of the present invention will be described in detail. The embodiments described below are preferable specific examples of the present invention, and thus various technically preferable limitations are given. However, the scope of the present invention particularly limits the present invention in the following description. As long as there is no description, it is not restricted to these embodiments.

  Below, the illuminating device 10 which concerns on Example 1 of this invention, and the vehicle lamp 100 which attached this illuminating device 10 are demonstrated, referring FIGS. 1-3 and FIG. 4 (a).

[Lighting device 10]
1A is a perspective view of a lighting device 10 according to an embodiment of the present invention, FIG. 2 is a schematic top view of the lighting device according to the embodiment of the present invention, and FIG. FIG. 3B is a partially enlarged view of a portion C in FIG. 3A, FIG. 3C is a schematic cross-sectional view along the line BB in FIG. 2, and FIG. a) It is a schematic sectional drawing of the light emitting element mounting area vicinity in the illuminating device of a present Example.

  The lighting device 10 includes a light emitting unit 4 including a light emitting device 2 on a radiator 1, a resin socket 5, and a control circuit package 6, and is used as a light source of a vehicular lamp 100, for example.

  The light emitting unit 4 includes a radiator 1 and a light emitting device 2 disposed on the radiator 1.

The radiator 1 is made of a metal material such as aluminum or copper.
In this embodiment, the radiator 1 is made of aluminum manufactured by extrusion molding. The radiator 1 is formed with a block-shaped main body having a flat upper surface for disposing the light emitting device, and a plurality of radiation fins extending in the direction opposite to the light emitting device mounting side.

The light-emitting device 2 includes a light-emitting element 22 that is electrically connected to the conductor pattern 21b on the wiring board 21 and fixed on the heat dissipation device 1.
The wiring substrate 21 includes an insulating substrate 21 a and a conductor pattern 21 b made of metal formed on the insulating substrate for supplying power to the light emitting element 22. The outermost surface of the end region of the wiring board is configured as a resin surface.

In the present embodiment, the light emitting device 2 includes a light emitting element 22 bonded onto the radiator 1 via an adhesive 23, a wiring substrate 21 bonded onto the radiator 1 with an adhesive sheet 3, and the light emitting element 22. Conductive wires 24 that electrically connect the conductor pattern 21b on the wiring board 21 are provided.
In the present embodiment, the light emitting element 22 is composed of a plurality of red light emitting LED chips, and is bonded onto the radiator 1 via an adhesive 23 made of a silicone resin in which a thermally conductive filler is dispersed.
In the present embodiment, the LED chip 22 is electrically connected to the conductor pattern on the wiring board via a conductive wire made of Au at the electrode formed on the upper surface. 1 to 4, only one LED chip is shown for simplicity of explanation.
In the present embodiment, the wiring board 21 is bonded onto the radiator 1 by an adhesive sheet 3 made of an epoxy resin. In this embodiment, the wiring board 21 covers an insulating substrate 21a made of a glass epoxy substrate, a conductor pattern 21b in which a Cu foil and a metal plating layer are formed on the insulating substrate 21a, and a conductor pattern 21b. It is comprised from the resist layer 21c as an insulating protective film.
In this embodiment, the resist layer 21c is made of an epoxy resin. The resist layer 21c contains light-reflecting particles made of titanium dioxide, and also has a function of reflecting on the surface when light from the LED chip 22 enters.
In the present embodiment, the resist layer 21c is a conductor pattern 21a excluding a region connecting the conductive wire 24 connected to the light emitting element 22 in the conductor pattern 21b and a region connecting the external power supply terminal 11. It is formed to cover almost the entire upper area.
In the present embodiment, a peripheral wall 25 is formed on the resist layer 21c so as to surround the LED chip mounting region. The peripheral wall body 25 is made of a silicone resin containing light reflective particles made of titanium dioxide. The inside of the peripheral wall body 25 is filled with a sealing resin 26 made of a silicone resin, and the LED chip 22 and the conductive wire 24 are sealed.
In the present embodiment, the surface of the resist layer 21c is exposed in the end region of the wiring board.

The resin socket 5 is made of a resin material, and a thermoplastic resin such as PET (polyethylene terephthalate) can be suitably used. The outer shape of the resin socket 5 is substantially cylindrical, and the side surface of the radiator 1, the side surface of the wiring substrate 21, and the wiring substrate 21 are integrally held to hold the radiator 1 and the wiring substrate 2 in the light emitting device 2. It is formed in a shape that continuously covers a partial region of the upper surface. That is, the resin socket 5 is formed so as to go around from the side surface of the wiring board 21 to a part of the upper surface so as to embed the light emitting unit 4. In FIG. 2, the end 21B of the wiring board 21 existing under the resin socket 5 is indicated by a dotted line.
As shown in FIG. 3B, the resin socket 5 has a portion that wraps around the upper surface of the wiring board 21 in close contact with the resin surface exposed on the upper surface of the wiring board 21, that is, the resin exposed portion 21 </ b> A. Yes.

The resin socket 5 is connected to a housing 51 for attaching a control circuit package 6 for controlling power supply and electrical characteristics to the light emitting device 2 and a connector for supplying power to the control circuit package 6 from the outside. A connector connecting portion 52 is formed. Further, on the outer periphery of the resin socket 5, an engaging claw 5a and a flange 5b for attaching the lighting device 10 to a vehicle lamp or the like are integrally formed.
The control circuit package 6 includes arbitrary control elements such as a resistor, a protection element, and a capacitor, and controls a drive current to the light emitting element. The control circuit package 6 is electrically connected to the light emitting element 22 in the light emitting device 2.

In this embodiment, the resin socket 5 is made of PET resin (polyethylene terephthalate), and is formed by insert molding the light emitting unit 4.
In this embodiment, the light emitting unit 4 is integrally embedded in the resin socket 5, and the heat radiating fins of the radiator 1 are exposed to the outside of the resin socket 5.

  The resin socket 5 in the lighting device 10 of the present invention forms a bonding surface on the light emitting unit 4, the side surface of the radiator 1, the side surface (end surface) of the wiring substrate 21, and the upper surface of the wiring substrate 21. In particular, as shown in FIG. 3B, the resin socket 5 is in close contact with the resin exposed portion 21 </ b> A on the upper surface of the wiring board at the joint surface on the upper surface of the wiring board 21, so High adhesion is obtained. That is, the wiring board 21 and the resin socket 5 can form a bonding interface through the resist layer 21c, thereby forming a close contact interface between the resist layer and the resin socket, thereby obtaining high adhesion. As a result, the airtightness of the interface between the light emitting unit 4 and the resin socket 5 can be improved.

  In particular, the resin socket 5 is formed by integral molding including the light emitting unit 4, that is, the resin socket 5 is formed around the light emitting unit 4 by injection molding, so that the resin exposure on the upper surfaces of the resin socket 5 and the wiring substrate 21 is achieved. A close contact interface can be formed with the portion 21A. This is arranged on the resin exposed portion 21A on the upper surface of the wiring substrate 21 during molding (on the resist layer 21c in this embodiment) so that the melted and softened resin material of the resin socket covers a predetermined region of the light emitting unit 4. It is to be done. That is, since the melted and softened resin is surely wetted and cured on the resin exposed portion 21 </ b> A on the upper surface of the wiring substrate 21, an adhesion interface can be formed between the resin surface of the wiring substrate 21.

  Therefore, according to the illuminating device 10 of this invention, the airtightness of the light emission unit 4 provided with the heat radiator 1 and the resin socket 5 can be improved, without increasing a number of parts and a manufacturing process.

About the illuminating device 10 of a present Example, the airtight test was done by the method shown by the US Federal Motor Vehicle Safety Standard (FMVSS) Part564. The lighting device 10 of the present example was attached to a pressure chamber (a test container with an air pressure generator) and submerged, and the presence or absence of bubbles from inside was confirmed. As a result, even at a test pressure (internal pressure) of 1.2 atmospheres, it was confirmed that no air bubbles were generated and the airtightness could be maintained.
On the other hand, when a lighting device having a configuration in which the resin socket 5 does not go around to the upper part of the wiring board was produced as a comparative sample and the same airtightness test was performed, the airtightness could not be maintained at a test pressure of 1.2 atmospheres.
The airtightness test was performed without forming a communication hole from the control circuit package housing portion to the connector connection portion.

[Vehicle lamp 100]
Then, the vehicle lamp 100 of a present Example provided with the illuminating device 10 of this invention is demonstrated based on FIG.1 (b).

The vehicular lamp 100 of the present embodiment is configured as a rear combination lamp disposed on the left and right of the rear portion of the vehicle.
The vehicular lamp of the present embodiment has a mounting hole 7a formed in the housing in a lamp chamber defined by a housing 7 made of molded resin and a translucent outer lens 8 covering the light irradiation side opening. The lighting device 10 is attached to be closed.
In the vehicular lamp 100 of the present embodiment, the lighting device 10 engages the engaging claw 5a formed on the resin socket 5 with the peripheral edge of the mounting hole 7a of the housing 7, and the flange 5b of the resin socket 5 is O−. It is attached by contacting the housing 7 with the ring 9 in between.

  According to the vehicular lamp provided with the lighting device of the present invention, since the airtightness at the interface between the resin socket 5 and the light emitting unit 4 in the lighting device 10 is maintained, the airtightness of the lamp chamber can be maintained. .

[Method for Manufacturing Lighting Device 10 of Example 1 of the Present Invention]
Next, the manufacturing method of the illuminating device 10 of Example 1 of this invention is demonstrated.

First, the light emitting unit 4 in which the light emitting device 2 is arranged on the radiator 1 is prepared.
A wiring board 21 is bonded to the radiator 1 made of an extruded product of aluminum via an epoxy resin bonding sheet 3. As the wiring substrate 21, a glass epoxy substrate 21a having a conductor pattern 21b made of a laminated structure of Cu foil and metal plating and a resist layer 21c made of an epoxy resin covering the conductor pattern 21b was used.
Next, the LED chip is bonded onto the radiator 1 with an adhesive 23 made of a silicone resin containing a thermally conductive filler, and the electrode formed on the upper surface of the LED chip 22 and the conductor pattern 21b are made of Au. Connection is made via a conductive wire 24.
Subsequently, the peripheral wall body 25 is formed by coating and curing on the wiring board so as to surround the LED chip mounting region using a silicone resin containing reflective particles, and the inner space surrounded by the peripheral wall body is transparent. The sealing resin 26 made of a light silicone resin was filled and cured to be sealed.

The light emitting unit 4 was placed in an injection mold, and a resin socket 5 in which the light emitting unit 4 was embedded was formed by insert molding using PET resin.
The resin socket 5 is formed in a shape including an accommodating portion 51 to which the control circuit package 6 is attached, a connector connecting portion 52, an engaging claw 5a provided on the outer periphery for attaching the lighting device, and the like.

  A separately prepared control circuit package 6 is attached, and the lighting device 10 is completed.

  Below, the illuminating device 10 which concerns on Example 2 of this invention is demonstrated, referring FIGS. 1-3 and FIG.4 (b).

  In the illumination device 10 according to the second embodiment, the light emitting element 22 in the light emitting unit 4 is disposed on the wiring board 21, the resist layer is not formed, and the inner wall as the peripheral wall body 25 has an inclined surface. The configuration other than that the molded product is arranged is the same as the configuration of the illumination device of the first embodiment.

Like the lighting device 10 of the present embodiment, the light emitting device 2 on the radiator 1 can also use the light emitting element 22 having the upper electrode and the lower electrode, and the conductive pattern 21b on the wiring substrate 21 is electrically conductive. By mounting with the adhesive 23, the lower electrode can be connected to the conductor pattern 21 b, and the upper electrode and the conductor pattern 21 b can be connected via the conductive wire 24.
In the illumination device 10 of the present embodiment, no resist layer is formed on the wiring substrate 21, but the surface of the glass epoxy substrate 21 a, that is, the epoxy resin surface is exposed in the region where the resin socket 5 overlaps. . Therefore, a close contact interface between the epoxy resin surface (resin exposed portion) 21A and the resin socket 5 is formed.

  That is, as long as the resin surface is exposed in the region where the resin socket 5 overlaps upward, the configuration and manufacturing method of the light emitting device 2 on the radiator 1 can be arbitrary.

  Also in the lighting device 10 of the present embodiment, the airtightness at the interface between the light emitting unit 4 and the resin socket 5 can be improved by forming a close contact interface between the epoxy resin surface and the resin socket 5.

  The lighting device of the present invention and the vehicular lamp using the lighting device are not limited to the above-described embodiments, and various modifications may be made without departing from the scope of the present invention. .

  For example, in the above embodiment, an LED chip is used as the semiconductor light emitting element, but an LD (laser diode) chip can be used instead of the LED chip. Moreover, the thing of the luminescent color according to a use can be used suitably.

  For example, the light emitting device can be appropriately provided with a wavelength conversion member such as a phosphor, and an optical member such as a light scattering member, a light guide member, a reflection member, and a condenser lens.

  For example, in the light emitting device, the light emitting element may be mounted on the heat dissipation member via an adhesive, or may be formed on a wiring board or a wiring part. When the light emitting element is arranged on the wiring board or the wiring part, the light emitting element may be mounted on the wiring board or the wiring part before the wiring board is bonded to the heat dissipation part.

  For example, the insulating substrate is not limited to glass epoxy resin, and other resin substrates, ceramic substrates, and the like can also be used.

  For example, the resin surface (resin exposed portion) exposed on the wiring board can be formed of an insulating protective film (resist layer) that covers the wiring portion as in the first embodiment, as in the second embodiment. In the case where a resin insulating substrate is used, the insulating substrate may be configured such that the upper surface of the insulating substrate is exposed.

  For example, in the above embodiment, the resin surface (resin exposed portion) exposed on the upper surface of the wiring board is preferably formed in the entire overlapping region of the resin socket. However, the resin surface is not formed in the entire region. However, the effect of improving airtightness can be obtained.

  For example, in the second embodiment, the configuration in which the conductive pattern does not exist in the wiring board end region where the resin socket overlaps is shown. However, the conductive pattern may extend to the region. In this case, by forming a resin layer such as a resist layer on the conductive pattern in the region, the resin surface exposed on the upper surface of the wiring board can be formed over the entire overlapping region of the resin socket.

  For example, the vehicular lamp can be appropriately provided with optical members such as a reflector, an inner lens, and a condenser lens.

For example, the vehicle lamp may be a headlamp, DRL (Daytime Running Lamp), fog lamp, back lamp, side turn lamp, rear fog lamp, high mount stop lamp, license plate lamp, etc. in addition to the rear combination lamp. It can be configured as a vehicular lamp.

1: Radiator 2: Light emitting device 21: Wiring substrate 21a: Insulating substrate 21b: Conductive pattern 21c: Resist layer 21A: Resin surface 21B: Wiring substrate end 22: Light emitting element (LED chip)
23: Adhesive 24: Conductive wire 25: Peripheral wall body 26: Sealing resin 3: Adhesive sheet 4: Light emitting unit 5: Resin socket 5a: Engaging claw 5b: Flange 51: Housing portion 52: Connector connecting portion 6: Control circuit Package 7: Housing 8: Outer lens 9: O-ring 10: Lighting device 100: Vehicle lamp

Claims (6)

A metal radiator,
A wiring board that is disposed on the radiator and includes a board and a conductor pattern formed on the board;
A light emitting element disposed on the radiator and electrically connected to the conductor pattern;
A resin socket that integrally holds the radiator and the wiring board;
The wiring board has a resin exposed portion on the upper surface,
The resin socket covers the substrate side surface, the radiator side surface, and a partial region on the substrate,
The lighting device, wherein the resin socket is joined to the resin exposed portion of the wiring board. The wiring board has a resist layer covering the conductor pattern,
The lighting device according to claim 1, wherein the resist layer constitutes the resin exposed portion. The lighting device according to claim 1, wherein the resin socket is joined to the substrate through the resin exposed portion over the entire circumference of the substrate. An adhesive interface is formed between the resin socket and the resin exposed portion by forming the resin socket by curing the melt-softened resin on the resin exposed portion. The lighting device according to any one of claims 1 to 3. A housing;
An outer lens covering the light irradiation side opening of the housing;
The lighting device according to any one of claims 1 to 4, wherein the lighting device is attached so as to close an attachment hole formed in the housing.
The vehicular lamp, wherein the radiator is extended outside a lamp chamber defined by the housing, the outer lens, and the lighting device. (A) a step of bonding a wiring board on which a conductor pattern is formed on a substrate on a metal radiator;
(B) mounting a light emitting element on the radiator or the wiring board;
(C) forming a resin socket that integrally holds the radiator and the wiring board by insert molding,
In the step (c), the resin socket covers the side surface of the wiring board, the side surface of the heat dissipation part, and a partial region on the wiring board, and is formed on the resin exposed part on the wiring board. A method for manufacturing a lighting device.

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