JP2020198174A - Vehicular lighting device and vehicular lighting fixture - Google Patents

Abstract

To provide a vehicular lighting device capable of suppressing a material of a coating part from flowing out, and a vehicular lighting fixture.SOLUTION: The vehicular lighting device comprises: a socket; and a light emission module which is provided on one end part of the socket. The light emission module has: a substrate which is plate-like and has a wiring pattern provided on a surface on the opposite side from the socket side; at least one light emitting element which is electrically connected to the wiring pattern; at least one resistance which is film-like and is electrically connected to the wiring pattern; a coating part which covers the resistance; and at least one flowing-out suppression part which is provided on the opposite side of the resistance from a peripheral edge side of the substrate when the socket is viewed along a direction along a center axis. The flowing-out suppression part is at least one of a recessed part opened on a surface where the wiring pattern is provided, of the substrate, a hole which penetrates the substrate, and a projection part provided on a surface where the wiring pattern is provided, of the substrate.SELECTED DRAWING: Figure 2

Description

Embodiments of the present invention relate to vehicle lighting devices and vehicle lighting fixtures.

There is a vehicle lighting device including a socket and a light emitting module provided on one end side of the socket. The light emitting module is provided with a substrate, and a light emitting element, a resistor, and the like are provided on the substrate. In addition, a film-like resistor may be used as the resistor.

Here, since the forward voltage characteristics of the light emitting element vary, if the applied voltage between the anode terminal and the ground terminal is made constant, the brightness (luminous flux, brightness, luminous intensity) of the light emitted from the light emitting element is made constant. , Illuminance) varies. Therefore, by adjusting the resistance value of the resistor connected in series with the light emitting element, the value of the current flowing through the light emitting element, and by extension, the brightness of the light emitted from the light emitting element is kept within a predetermined range.

When the resistor is a film-like resistor, the resistance value can be increased by irradiating the resistor with laser light to remove a part of the resistor. In this case, the material contained inside the resistor is exposed to the processed portion. Therefore, the material exposed to the processed portion may change in quality due to oxygen or moisture contained in the atmosphere, and the resistance value may change with time.

Therefore, in general, the resistance is covered with a resin after processing with a laser beam. For example, the molten resin is applied to a resistor and heated to cure the resin. However, when the molten resin is applied to the resistor, or when the applied resin is heated and cured, the resin may flow out. If the resin flows out, the resin may adhere to the pads or elements provided in the wiring pattern, or the film thickness of the resin covering the resistor may become thin.
Therefore, it has been desired to develop a technique capable of suppressing the outflow of the material of the covering portion.

Japanese Unexamined Patent Publication No. 2016-195099

An object to be solved by the present invention is to provide a vehicle lighting device and a vehicle lighting device capable of suppressing the outflow of the material of the covering portion.

The vehicle lighting device according to the embodiment includes a socket and a light emitting module provided on one end side of the socket. The light emitting module has a plate shape and a substrate having a wiring pattern provided on a surface opposite to the socket side; and at least one light emitting element electrically connected to the wiring pattern; a film shape. At least one resistor presented and electrically connected to the wiring pattern; a coating covering the resistor; and a peripheral side of the substrate of the resistor when the socket is viewed from a direction along the central axis. It has at least one outflow control portion provided on the opposite side of the; The outflow suppressing portion includes a recess that opens in the surface of the substrate on which the wiring pattern is provided, a hole that penetrates the substrate, and a convex portion of the substrate that is provided in the surface of the substrate that is provided with the wiring pattern. At least one of.

According to the embodiment of the present invention, it is possible to provide a vehicle lighting device and a vehicle lighting device capable of suppressing the outflow of the material of the covering portion.

It is a schematic perspective view for exemplifying the vehicle lighting device which concerns on this embodiment. FIG. 5 is a schematic plan view of the vehicle lighting device in FIG. 1 as viewed from the A direction. (A) to (d) are schematic plan views for exemplifying the form of the outflow control portion. It is a schematic partial sectional view for exemplifying a vehicle lamp.

Hereinafter, embodiments will be illustrated with reference to the drawings. In each drawing, similar components are designated by the same reference numerals and detailed description thereof will be omitted as appropriate.

(Vehicle lighting device)
The vehicle lighting device 1 according to the present embodiment can be provided in, for example, an automobile or a railroad vehicle. Examples of the vehicle lighting device 1 provided in an automobile include a front combination light (for example, a combination of a daytime running lamp (DRL), a position lamp, a turn signal lamp, etc.) and a rear combination. Examples thereof include those used for lights (for example, a combination of a stop lamp, a tail lamp, a turn signal lamp, a back lamp, a fog lamp, etc.). However, the use of the vehicle lighting device 1 is not limited to these.

FIG. 1 is a schematic perspective view for exemplifying the vehicle lighting device 1 according to the present embodiment.
FIG. 2 is a schematic plan view of the vehicle lighting device 1 in FIG. 1 as viewed from the A direction.
As shown in FIGS. 1 and 2, the vehicle lighting device 1 may be provided with a socket 10, a light emitting module 20, and a power feeding terminal 30.

The socket 10 may be provided with a mounting portion 11, a bayonet 12, a flange 13, a heat radiation fin 14, and a connector holder 15.
The mounting portion 11 can be provided on one surface of the flange 13. The outer shape of the mounting portion 11 can be columnar. The outer shape of the mounting portion 11 can be, for example, a columnar shape. The mounting portion 11 may have a recess 11a that opens on the end surface on the side opposite to the flange 13 side.

The mounting portion 11 may be provided with at least one slit 11b. A corner portion of the substrate 21 can be provided inside the slit 11b. The size (width) of the slit 11b in the circumferential direction of the mounting portion 11 can be slightly larger than the size of the corner portion of the substrate 21. In this way, the substrate 21 can be positioned by inserting the corner portion of the substrate 21 into the slit 11b.

Further, if the slit 11b is provided, the planar shape of the substrate 21 can be increased. Therefore, the number of elements mounted on the substrate 21 can be increased. Alternatively, since the external dimensions of the mounting portion 11 can be reduced, the mounting portion 11 can be miniaturized, and the vehicle lighting device 1 can be miniaturized.

The bayonet 12 can be provided on the outer surface of the mounting portion 11. For example, the bayonet 12 projects outward of the vehicle lighting device 1. The bayonet 12 can face the flange 13. A plurality of bayonets 12 can be provided. The bayonet 12 can be used when the vehicle lighting device 1 is attached to the housing 101 of the vehicle lighting equipment 100. The bayonet 12 can be used for twist lock.

The flange 13 may have a plate shape. For example, the flange 13 may have a disc shape. The outer surface of the flange 13 can be located outside the vehicle lighting device 1 with respect to the outer surface of the bayonet 12.

The heat radiating fin 14 can be provided on the side of the flange 13 opposite to the mounting portion 11 side. At least one heat radiation fin 14 can be provided. For example, the socket 10 illustrated in FIG. 1 is provided with a plurality of heat radiation fins 14. The plurality of heat radiation fins 14 can be provided side by side in a predetermined direction. The heat radiation fin 14 may have a plate shape.

The connector holder 15 can be provided on the side of the flange 13 opposite to the side on which the mounting portion 11 is provided. The connector holder 15 may have a tubular shape. The connector 105 having the sealing member 105a is inserted inside the connector holder 15. Therefore, the cross-sectional shape of the hole of the connector holder 15 can be made to match the cross-sectional shape of the connector 105 having the seal member 105a.

The heat generated in the light emitting module 20 is mainly transferred to the heat radiation fins 14 via the mounting portion 11 and the flange 13. The heat transferred to the heat radiating fins 14 can be mainly discharged to the outside from the heat radiating fins 14. Therefore, it is preferable that the socket 10 is formed of a material having a high thermal conductivity in consideration of transferring the heat generated in the light emitting module 20 to the outside. The material having high thermal conductivity can be, for example, a metal such as aluminum.

Further, in recent years, it has been desired to reduce the weight of the vehicle lighting device 1. Therefore, it is preferable that the socket 10 is formed by using a high thermal conductive resin. The high thermal conductivity resin can be, for example, a resin such as PET (Polyethylene terephthalate) or nylon (Nylon) mixed with a filler using an inorganic material. The inorganic material can be, for example, ceramics such as aluminum oxide or carbon.

Further, a part of the elements constituting the socket 10 may be formed of metal, and the remaining elements may be formed of high thermal conductive resin.
However, if the socket 10 is formed using a highly thermally conductive resin, the heat generated in the light emitting module 20 can be efficiently dissipated. In addition, the weight of the vehicle lighting device 1 can be reduced. In this case, the mounting portion 11, the bayonet 12, the flange 13, the heat radiation fin 14, and the connector holder 15 can be integrally formed by using an injection molding method or the like.

The light emitting module 20 can be provided on one end side of the socket 10. The light emitting module 20 can be provided inside the recess 11a.
The light emitting module 20 (board 21) can be adhered to the bottom surface 11a1 of the recess 11a. In this case, the adhesive is preferably an adhesive having high thermal conductivity. For example, the adhesive can be an adhesive mixed with a filler using an inorganic material. The inorganic material is preferably a material having high thermal conductivity (for example, ceramics such as aluminum oxide and aluminum nitride). The thermal conductivity of the adhesive can be, for example, 0.5 W / (m · K) or more and 10 W / (m · K) or less.

Further, the light emitting module 20 (board 21) may be provided on the bottom surface 11a1 of the recess 11a via a layer made of heat conductive grease (heat radiating grease). The type of heat conductive grease is not particularly limited, but for example, it may be a mixture of modified silicone and a filler using a material having high thermal conductivity (for example, ceramics such as aluminum oxide and aluminum nitride). it can. The thermal conductivity of the heat conductive grease can be, for example, 1 W / (m · K) or more and 5 W / (m · K) or less.

Further, a heat transfer portion can be provided between the light emitting module 20 (board 21) and the bottom surface 11a1 of the recess 11a. For example, the heat transfer portion has a plate shape and can be formed of a metal such as aluminum, an aluminum alloy, copper, or a copper alloy. For example, the heat transfer portion may be adhered to the bottom surface 11a1 of the recess 11a using the adhesive having high thermal conductivity described above, embedded in the bottom surface 11a1 of the recess 11a using the insert molding method, or the heat transfer grease described above may be applied. It can be attached to the bottom surface 11a1 of the recess 11a via the recess 11a.

The light emitting module 20 can include a substrate 21, a light emitting element 22, a resistor 23, and a control element 24.
The substrate 21 may have a plate shape. The planar shape of the substrate 21 can be, for example, a quadrangle. The material and structure of the substrate 21 are not particularly limited. For example, the substrate 21 can be formed from an inorganic material such as ceramics (for example, aluminum oxide or aluminum nitride), an organic material such as paper phenol or glass epoxy, or the like. Further, the substrate 21 may be a metal plate whose surface is coated with an insulating material. When the surface of the metal plate is covered with an insulating material, the insulating material may be made of an organic material or an inorganic material. When the amount of heat generated by the light emitting element 22 is large, it is preferable to form the substrate 21 using a material having high thermal conductivity from the viewpoint of heat dissipation. Examples of the material having high thermal conductivity include ceramics such as aluminum oxide and aluminum nitride, high thermal conductivity resin, and a metal plate whose surface is coated with an insulating material. Further, the substrate 21 may have a single-layer structure or may have a multi-layer structure.

Further, a wiring pattern 21a can be provided on the surface of the substrate 21 opposite to the socket 10 side. The wiring pattern 21a may be provided with, for example, a mounting pad 21a1, a connection pad 21a2, and a test pad 21a3. For example, a light emitting element 22, a resistor 23, a control element 24, and the like can be electrically connected to the mounting pad 21a1. For example, the power supply terminal 30 can be soldered to the connection pad 21a2. The test pad 21a3 can be used when performing a continuity test, a characteristic test, or the like. The wiring pattern 21a can be formed by using, for example, a screen printing method or the like. The wiring pattern 21a can be formed from, for example, a material containing silver as a main component, a material containing copper as a main component, or the like.

The light emitting element 22 can be provided on the substrate 21. The light emitting element 22 can be electrically connected to the wiring pattern 21a provided on the substrate 21. At least one light emitting element 22 can be provided. In the case of the vehicle lighting device 1 illustrated in FIGS. 1 and 2, two light emitting elements 22 are provided. When a plurality of light emitting elements 22 are provided, the plurality of light emitting elements 22 can be connected in series. Further, the light emitting element 22 can be connected in series with the resistor 23.

The light emitting element 22 can be, for example, a light emitting diode, an organic light emitting diode, a laser diode, or the like.
The light emitting element 22 can be a chip-shaped light emitting element, a surface mount type light emitting element, a bullet type light emitting element, or the like having a lead wire. However, considering the miniaturization of the substrate 21 and the miniaturization of the vehicle lighting device 1, it is preferable to use a chip-shaped light emitting element. The light emitting element 22 illustrated in FIGS. 1 and 2 is a chip-shaped light emitting element.

The chip-shaped light emitting element 22 can be mounted on the wiring pattern 21a by a COB (Chip On Board). When the light emitting element 22 is an upper and lower electrode type light emitting element or an upper electrode type light emitting element, the light emitting element 22 can be electrically connected to the wiring pattern 21a by, for example, a wire bonding method. When the light emitting element 22 is a flip-chip type light emitting element, the light emitting element 22 can be directly connected to the wiring pattern 21a. The light emitting element 22 illustrated in FIGS. 1 and 2 is an upper and lower electrode type light emitting element.

The upper surface (light emitting surface) of the light emitting element 22 is directed to the front side of the vehicle lighting device 1. The light emitting element 22 mainly emits light toward the front side of the vehicle lighting device 1. The number, size, arrangement, etc. of the light emitting elements 22 are not limited to those illustrated, and can be appropriately changed depending on the size, application, and the like of the vehicle lighting device 1.

The resistor 23 can be provided on the substrate 21. The resistor 23 can be electrically connected to the wiring pattern 21a provided on the substrate 21. At least one resistor 23 can be provided. In the case of the vehicle lighting device 1 illustrated in FIGS. 1 and 2, four resistors 23 are provided. The resistor 23 can be a film-like resistor. The material of the resistor 23 can be, for example, ruthenium oxide (RuO ₂ ). The resistor 23 can be formed, for example, by using a screen printing method and a firing method. If the resistor 23 is a film-shaped resistor, the contact area between the resistor 23 and the substrate 21 can be increased, so that heat dissipation can be improved. Further, a plurality of resistors 23 can be formed at one time. Therefore, productivity can be improved. In addition, it is possible to suppress variations in resistance values among the plurality of resistors 23.

Here, since the forward voltage characteristics of the light emitting element 22 vary, if the applied voltage between the anode terminal and the ground terminal is made constant, the brightness of the light emitted from the light emitting element 22 (luminous flux, brightness, Luminous intensity, illuminance) will vary. Therefore, the value of the current flowing through the light emitting element 22 can be set within a predetermined range by the resistor 23 so that the brightness of the light emitted from the light emitting element 22 is within a predetermined range. In this case, by changing the resistance value of the resistor 23, the value of the current flowing through the light emitting element 22 can be kept within a predetermined range.

Since the resistor 23 is a film-like resistor, the resistance value can be increased by removing a part of the resistor 23. For example, if the resistor 23 is irradiated with a laser beam, a part of the resistor 23 can be easily removed. The number, size, arrangement, etc. of the resistors 23 are not limited to those illustrated, and can be appropriately changed according to the number, specifications, and the like of the light emitting elements 22.

The control element 24 can be provided on the substrate 21. The control element 24 can be electrically connected to the wiring pattern 21a. The control element 24 can be provided to prevent the reverse voltage from being applied to the light emitting element 22 and to prevent pulse noise from the reverse direction from being applied to the light emitting element 22. The control element 24 can be, for example, a diode. The control element 24 can be, for example, a surface mount type diode, a diode having a lead wire, or the like. The control element 24 illustrated in FIGS. 1 and 2 is a surface mount diode.

In addition, a pull-down resistor may be provided to detect continuity of the light emitting element 22 and prevent erroneous lighting.

When the light emitting element 22 is a chip-shaped light emitting element, the light emitting module 20 may be further provided with a frame portion 25 and a sealing portion 26.
The frame portion 25 can be adhered onto the substrate 21. The frame portion 25 may have a frame shape. At least one light emitting element 22 can be provided in the region surrounded by the frame portion 25. For example, the frame portion 25 can surround a plurality of light emitting elements 22. The frame portion 25 can be formed of resin. The resin can be, for example, a thermoplastic resin such as PBT (polybutylene terephthalate), PC (polycarbonate), PET, nylon (Nylon), PP (polypropylene), PE (polyethylene), PS (polystyrene) and the like.

Further, particles such as titanium oxide can be mixed with the resin to improve the reflectance with respect to the light emitted from the light emitting element 22. The particles are not limited to titanium oxide particles, and particles made of a material having a high reflectance to the light emitted from the light emitting element 22 may be mixed. Further, the frame portion 25 can be formed of, for example, a white resin. That is, the frame portion 25 can have a function of defining the formation range of the sealing portion 26 and a function of a reflector.

The case where the frame portion 25 is molded by an injection molding method or the like and the molded frame portion 25 is adhered to the substrate 21 has been illustrated, but the present invention is not limited to this. The frame portion 25 can also be formed, for example, by applying the melted resin on the substrate 21 in a frame shape using a dispenser or the like and curing the frame portion 25.

Further, the frame portion 25 can be omitted. When the frame portion 25 is omitted, a dome-shaped sealing portion 26 that covers the light emitting element 22 can be provided. If the frame portion 25 is provided, the formation range of the sealing portion 26 can be defined. Therefore, it is possible to suppress an increase in the plane size of the sealing portion 26, so that the substrate 21 can be downsized, and the vehicle lighting device 1 can be downsized.

The sealing portion 26 can be provided in the area surrounded by the frame portion 25. The sealing portion 26 can be provided so as to cover the area surrounded by the frame portion 25. The sealing portion 26 can be provided so as to cover the light emitting element 22. The sealing portion 26 can be formed from a translucent material. The sealing portion 26 can be formed, for example, by filling a region surrounded by the frame portion 25 with a resin. The resin can be filled by using, for example, a liquid quantitative discharge device such as a dispenser. The resin to be filled can be, for example, a silicone resin or the like. Further, the sealing portion 26 can include a phosphor. The phosphor can be, for example, a YAG-based phosphor (yttrium-aluminum-garnet-based phosphor). However, the type of phosphor can be appropriately changed so as to obtain a predetermined emission color according to the application of the vehicle lighting device 1.

When the light emitting element 22 is a surface mount type light emitting element, a bullet type, or other light emitting element having a lead wire, the frame portion 25 and the sealing portion 26 can be omitted. However, as described above, considering the miniaturization of the substrate 21, it is preferable that the light emitting element 22 is a chip-shaped light emitting element, and the frame portion 25 and the sealing portion 26 are provided.

A plurality of power supply terminals 30 may be provided. The plurality of power supply terminals 30 can be provided inside the socket 10. The plurality of power feeding terminals 30 can be formed in a rod shape. The plurality of power feeding terminals 30 project from the bottom surface 11a1 of the recess 11a and can be soldered to the connection pad 21a2 of the wiring pattern 21a provided on the substrate 21. The ends of the plurality of power supply terminals 30 on the heat radiation fin 14 side can be exposed inside the connector holder 15. The connector 105 can be fitted to the plurality of power supply terminals 30 exposed inside the connector holder 15. The plurality of power feeding terminals 30 can be formed of, for example, a metal such as a copper alloy. The number, shape, arrangement, material, and the like of the power feeding terminals 30 are not limited to those illustrated, and can be changed as appropriate.

As described above, the socket 10 is preferably formed of a material having high thermal conductivity. However, a material having high thermal conductivity may have conductivity. For example, a highly thermally conductive resin containing a filler made of carbon, a metal, or the like has conductivity. Therefore, in the case of the socket 10 having conductivity, an insulating portion can be provided between the plurality of power feeding terminals 30 and the socket 10. When the socket 10 is formed of an insulating high thermal conductive resin (for example, a high thermal conductive resin containing a filler made of ceramics), the insulating portion can be omitted. In this case, the socket 10 can hold a plurality of power supply terminals 30.

Here, as described above, when adjusting the resistance value of the film-shaped resistor 23, the resistor 23 is irradiated with a laser beam to remove a part of the resistor 23. When a part of the resistor 23 is removed, the material contained inside the resistor 23 is exposed to the processed portion 23a. Therefore, the material exposed to the processed portion 23a may be altered by oxygen or moisture contained in the atmosphere, and the resistance value of the resistor 23 may change with time.

Therefore, the light emitting module 20 according to the present embodiment may be further provided with a covering portion 27 that covers the resistor 23. The covering portion 27 has a film shape and can cover at least the processed portion 23a. However, the material exposed on the surface other than the processed portion 23a of the resistor 23 may also be deteriorated. Therefore, it is preferable that the covering portion 27 covers the entire resistance 23. When a plurality of resistors 23 are provided, the covering portion 27 may cover the plurality of resistors 23.

The covering portion 27 can be formed from, for example, an insulating and chemically stable material. The covering portion 27 may include, for example, a resin or a glass material. The resin can be, for example, a silicone resin or the like. For example, the covering portion 27 can be formed by applying a molten material on the resistor 23 and curing the resistor 23.

However, when the molten material is applied to the resistor, or when the applied material is cured by heating or the like, the material may flow out. If the material flows out, the material may adhere to elements such as the connection pad 21a2, the test pad 21a3, and the control element 24, or the film thickness of the coating portion 27 covering the resistor 23 may become thin. For example, if the material adheres to the connection pad 21a2, it may be difficult to solder the power supply terminal 30. For example, if the material adheres to the test pad 21a3, it may be difficult to perform a continuity test, a characteristic test, or the like. For example, if the material adheres to the element, the commercial value may decrease. If the film thickness of the covering portion 27 becomes too thin, the resistance 23 may not be protected.

In this case, it is conceivable to adjust the viscosity and chixo property of the molten material to suppress the outflow of the material. However, if the viscosity and the thixophilicity are adjusted to suppress the outflow of the material, it may become difficult for the material to spread or it may take time for the material to spread. In addition, the viscosity and thixophilicity may change depending on working conditions such as temperature.

Therefore, the vehicle lighting device 1 according to the present embodiment is provided with an outflow control unit 21b. The outflow suppression unit 21b can be provided, for example, on the surface of the substrate 21 on which the wiring pattern 21a is provided. For example, the outflow suppression portion 21b can be a recess opened in the surface of the substrate 21 provided with the wiring pattern 21a, a hole penetrating the substrate 21, or the like. Further, for example, the outflow suppression portion 21b can be a convex portion provided on the surface of the substrate 21 on which the wiring pattern 21a is provided. As shown in FIGS. 1 and 2, when the socket 10 is viewed from the direction along the central axis 10a (when viewed from the direction A in FIG. 1), the outflow suppression portion 21b is a substrate of the resistor 23. It can be provided on the side opposite to the peripheral side of 21. The outflow suppressing portion 21b may be provided on one side of the resistor 23, may be provided on a plurality of sides of the resistor 23, or may be provided so as to surround the resistor 23. ..

3 (a) to 3 (d) are schematic plan views for exemplifying the form of the outflow control portion.
As shown in FIGS. 1, 2 and 3 (a), the outflow suppressing portion 21b1 can have a form extending along the side of the resistor 23. Further, as shown in FIGS. 3 (b) to 3 (d), a plurality of outflow control units 21b2 to 21b4 can be provided. The plurality of outflow suppressing portions 21b2 to 21b4 can be provided side by side along the side of the resistor 23. In this case, if the distance between the outflow control units 21b2 to 21b4 is increased, the number of outflow control units 21b2 to 21b4 can be reduced, so that the manufacturing cost can be reduced. By reducing the distance between the outflow suppressing portions 21b2 to 21b4, the effect of suppressing the outflow of the material of the covering portion 27 can be enhanced.

In this case, as shown in FIG. 3B, a gap may be provided between the outflow suppressing portions 21b2. Further, as shown in FIG. 3C, the outflow control unit 21b3 and the adjacent outflow control unit 21b3 can be brought into contact with each other. Further, as shown in FIG. 3D, the outflow control unit 21b4 and the adjacent outflow control unit 21b4 can be connected to each other. If the outflow control unit 21b4 and the adjacent outflow control unit 21b4 are connected, the same effect as that of the form illustrated in FIG. 3A can be obtained.

The form of the outflow control portion can be appropriately selected depending on the viscosity and thixophilicity of the material of the coating portion 27. However, as illustrated in FIG. 3A, the outflow suppressing portion 21b1 has a form extending along the side of the resistor 23, or as illustrated in FIG. 3D, a plurality of outflows. If the suppressing portions 21b4 are connected, the outflow of the material can be suppressed even when the viscosity or the thixo property of the material changes or varies due to a change in temperature, for example. The planar shapes of the plurality of outflow control portions are not limited to those illustrated. However, as illustrated in FIGS. 3 (b) to 3 (d), if the planar shape of the outflow control portion is a circle or a part of a circle, laser machining becomes easy and the manufacturing cost should be reduced. Can be done.

The width W and the depth of the outflow suppressing portion 21b can be appropriately changed depending on the viscosity and thixophilicity of the material. The width W can be dimensioned in the direction in which the outflow suppressing portion 21b extends or in the direction orthogonal to the direction in which the plurality of outflow suppressing portions 21b are lined up. For example, when the material is a silicone resin or the like, the width W can be 20 μm or more and 2 mm or less, and the depth can be 50 μm or more and 1 mm or less.

When the outflow suppressing portion 21b is a recess or a through hole, it can be formed by irradiating the substrate 21 with a laser beam. Further, when the substrate 21 is formed of ceramics, the substrate 21 having the outflow suppressing portion 21b can be formed by firing the plate material forming the recesses and through holes.

Further, as described above, the outflow suppressing portion 21b may be a convex portion provided on the surface of the substrate 21. The planar shape of the outflow suppressing portion 21b, which is a convex portion, can be, for example, the same as that illustrated in FIGS. 3 (a) to 3 (d). The height of the outflow suppressing portion 21b, which is a convex portion, can be, for example, the same as the depth of the outflow suppressing portion 21b, which is the concave portion described above. The outflow suppressing portion 21b, which is a convex portion, can be formed, for example, by linearly applying a resin or the like to the surface of the substrate 21, or by firing a plate material having the convex portion formed therein.

As described above, at least one outflow control unit 21b can be provided. The outflow suppressing portion 21b can be at least one of a concave portion, a through hole, and a convex portion. When the outflow suppressing portion 21b is a recess or a through hole, a part of the covering portion 27 may be provided inside the outflow suppressing portion 21b. When the outflow suppressing portion 21b is a convex portion, a part of the covering portion 27 may adhere to the convex portion. If the outflow suppressing portion 21b is provided, it is possible to suppress the outflow of the material of the covering portion 27.

Here, the film-like resistor 23 can be formed by a screen printing method or the like. In this case, if the outflow suppressing portion 21b is a convex portion, the mask used in the screen printing method or the like may interfere with the outflow suppressing portion 21b, making it difficult to form the resistor 23. If the outflow suppressing portion 21b is a recess and a through hole, the mask and the outflow suppressing portion 21b do not interfere with each other when forming the resistor 23, so that the resistance 23 can be easily formed. Therefore, the outflow suppressing portion 21b is preferably a recess and a through hole. However, considering the strength of the substrate 21, it is more preferable that the outflow suppressing portion 21b is a recess that opens on the surface of the substrate 21.

(Vehicle lamps)
Next, the vehicle lamp 100 will be illustrated.
In the following, as an example, a case where the vehicle lamp 100 is a front combination light provided in an automobile will be described. However, the vehicle lamp 100 is not limited to the front combination light provided in the automobile. The vehicle lighting equipment 100 may be any vehicle lighting equipment provided in an automobile, a railroad vehicle, or the like.

FIG. 4 is a schematic partial cross-sectional view for exemplifying the vehicle lamp 100.
As shown in FIG. 4, the vehicle lighting device 100 may be provided with the vehicle lighting device 1, the housing 101, the cover 102, the optical element portion 103, the seal member 104, and the connector 105.

A vehicle lighting device 1 can be attached to the housing 101. The housing 101 can hold the mounting portion 11. The housing 101 may have a box shape with one end side open. The housing 101 can be formed of, for example, a resin that does not transmit light. On the bottom surface of the housing 101, a mounting hole 101a into which a portion of the mounting portion 11 provided with the bayonet 12 is inserted can be provided. A recess into which the bayonet 12 provided in the mounting portion 11 is inserted can be provided on the peripheral edge of the mounting hole 101a. Although the case where the mounting hole 101a is directly provided in the housing 101 has been illustrated, a mounting member having the mounting hole 101a may be provided in the housing 101.

When the vehicle lighting device 1 is attached to the vehicle lighting device 100, the portion of the mounting portion 11 provided with the bayonet 12 is inserted into the mounting hole 101a to rotate the vehicle lighting device 1. Then, for example, the bayonet 12 is held in the fitting portion provided on the peripheral edge of the mounting hole 101a. Such a mounting method is called a twist lock.

The cover 102 can be provided so as to close the opening of the housing 101. The cover 102 can be formed of a translucent resin or the like. The cover 102 may also have a function such as a lens.

The light emitted from the vehicle lighting device 1 is incident on the optical element unit 103. The optical element unit 103 can reflect, diffuse, guide light, collect light, form a predetermined light distribution pattern, and the like of the light emitted from the vehicle lighting device 1. For example, the optical element unit 103 illustrated in FIG. 4 is a reflector. In this case, the optical element unit 103 can reflect the light emitted from the vehicle lighting device 1 to form a predetermined light distribution pattern.

The seal member 104 can be provided between the flange 13 and the housing 101. The seal member 104 may be annular. The sealing member 104 can be formed from an elastic material such as rubber or silicone resin.

When the vehicle lighting device 1 is attached to the vehicle lighting device 100, the seal member 104 is sandwiched between the flange 13 and the housing 101. Therefore, the internal space of the housing 101 can be sealed by the sealing member 104. Further, the bayonet 12 is pressed against the housing 101 by the elastic force of the seal member 104. Therefore, it is possible to prevent the vehicle lighting device 1 from being detached from the housing 101.

The connector 105 can be fitted to the ends of a plurality of power supply terminals 30 exposed inside the connector holder 15. A power supply (not shown) or the like can be electrically connected to the connector 105. Therefore, by fitting the connector 105 to the ends of the plurality of power supply terminals 30, it is possible to electrically connect the power source and the like (not shown) and the light emitting element 22.

Further, the connector 105 may be provided with a seal member 105a. When the connector 105 having the sealing member 105a is inserted into the connector holder 15, the inside of the connector holder 15 is sealed so as to be watertight. The sealing member 105a has an annular shape and can be formed of an elastic material such as rubber or silicone resin.

Although some embodiments of the present invention have been illustrated above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other embodiments, and various omissions, replacements, changes, etc. can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the scope of the invention described in the claims and the equivalent scope thereof. In addition, the above-described embodiments can be implemented in combination with each other.

1 Vehicle lighting device, 10 socket, 10a central axis, 11 mounting part, 11a recess, 11a1 bottom surface, 12 bayonet, 13 flange, 14 heat dissipation fin, 20 light emitting module, 21 board, 21a wiring pattern, 21a1 mounting pad, 21a2 connection Pad, 21a3 test pad, 21b outflow control part, 22 light emitting element, 23 resistance, 23a processed part, 27 covering part, 100 vehicle lighting equipment, 101 housing

Claims (7)

With socket;
With a light emitting module provided on one end side of the socket;
Equipped with
The light emitting module
With a board having a plate shape and having a wiring pattern provided on the surface opposite to the socket side;
With at least one light emitting element electrically connected to the wiring pattern;
With at least one resistor that is membranous and electrically connected to the wiring pattern;
With the coating covering the resistor;
When the socket is viewed from the direction along the central axis, with at least one outflow suppressing portion of the resistor provided on the side opposite to the peripheral side of the substrate;
Have,
The outflow suppressing portion includes a recess opened in the surface of the substrate provided with the wiring pattern, a hole penetrating the substrate, and a convex portion provided on the surface of the substrate provided with the wiring pattern. A vehicle lighting device that is at least one of. When the outflow suppressing portion is a recess or a hole penetrating the substrate,
The vehicle lighting device according to claim 1, wherein a part of the covering portion is provided inside the outflow control portion. The vehicle lighting device according to claim 1 or 2, wherein the outflow control unit extends along the side of the resistor. A plurality of the outflow control portions are provided.
The vehicle lighting device according to claim 1 or 2, wherein the plurality of outflow control units are provided side by side along the side of the resistor. The vehicle lighting device according to any one of claims 1 to 4, wherein the substrate includes ceramics. The vehicle lighting device according to any one of claims 1 to 5, wherein the socket contains a high thermal conductive resin. With the vehicle lighting device according to any one of claims 1 to 6.
With the housing to which the vehicle lighting device is attached;
Vehicle lighting fixtures equipped with.

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