JP2014213911A5 - - Google Patents

Claims (5)

The second metal sheet-like object on which the frame plate of the electronic component tray is formed is superimposed on the first metal sheet-like object on which the bottom plate of the electronic component tray is formed, and the movable plate is inserted into the movable plate insertion portion of the frame plate. Next, the third metal sheet on which the cover plate of the electronic component tray is formed is overlaid, and the bottom plate, the frame plate, and the cover plate are welded at a plurality of locations by spot welding, thereby mounting the chip-shaped electronic component tray. In the manufacturing method,
The frame portion of the first metal sheet is provided with a plurality of spot welding positioning holes for the first metal sheet, and the bottom plate is provided with a plurality of vacuum suction holes.
The frame portion of the second metal sheet is provided with a plurality of spot welding positioning holes for the second metal sheet, and the frame plate has one or more U-shaped movable plate insertion portions. Bumping prevention protrusion is provided on the opening end side of the movable plate insertion part, and biasing the movable plate in the direction of the opening end is opposed to the U-shaped opening end. Means are provided,
The movable plate is provided with a plurality of chip-shaped electronic component insertion portions and a stopper recess that locks the movable plate so that it does not jump out of the movable plate insertion portion by a projection preventing projection provided on the frame plate. Furthermore, a buffer member that absorbs manufacturing tolerance errors in the dimensions of the chip-shaped electronic component is provided on the long side portion of the opening of the chip-shaped electronic component insertion portion, and the opening of the chip-shaped electronic component insertion portion is further provided. The length in the longitudinal direction (long side) is 3 to 4 times the thickness of the chip-shaped electronic component and is 0.2 mm to 3 mm, and the short side length is the cover. The length of the short side of the opening of the chip-like electronic component insertion portion provided on the plate is longer by the size of the buffer member,
The frame portion of the third metal sheet is provided with a plurality of spot welding positioning holes for the third metal sheet, and the chip plate provided on the movable plate is provided on the cover plate of the chip electronic component tray. The same number of chip-shaped electronic component insertion portions are provided at the same interval as the electronic component insertion portion, and the size of the opening of the chip-shaped electronic component insertion portion is stored vertically in the longitudinal direction (long side). It is longer than the length of the upper surface or lower surface of the fixed chip-shaped electronic component, and the length of the short side is slightly longer than the thickness of the chip-shaped electronic component to be stored and fixed,
The relative position is determined by the spot welding positioning hole of the first metal sheet, the spot welding positioning hole of the second metal sheet, and the spot welding positioning hole of the third metal sheet, and the bottom plate and the frame plate A chip-shaped electronic component tray manufacturing method characterized by spot welding a cover plate.   2. The manufacturing method of a chip-shaped electronic component tray according to claim 1, wherein the shape of the protrusion preventing protrusion provided on the frame plate is a convex shape, a triangular shape or a trapezoidal shape.   2. The method of manufacturing a chip-shaped electronic component tray according to claim 1, wherein any one of the first metal sheet, the second metal sheet, and the third metal sheet is processed by etching. The manufacturing method characterized by the above-mentioned.   2. The method for manufacturing a chip-shaped electronic component tray according to claim 1, wherein any one of the first metal sheet, the second metal sheet, and the third metal sheet is machined. Or a manufacturing method characterized by being a sintered metal. 2. The method of manufacturing an electronic component-like electronic component tray according to claim 1, wherein the frame plate on which the second metal sheet-like material is formed is provided with two or four movable plate insertion portions. A featured manufacturing method.