JP4952939B2 - Electronic component manufacturing method and jig used in the method - Google Patents

Description

  The present invention relates to a method for manufacturing a so-called three-dimensional mounting type electronic component and a jig used in the manufacturing method. More specifically, the present invention relates to a method for forming a so-called secondary wiring on a substantially surface of the electronic component, and relates to a wiring forming method using an exposure process. The present invention also relates to an electronic component holding jig for holding the electronic component when performing wiring formation after the exposure processing and the processing, and forming secondary wiring in an easy and simple process.

  Along with the downsizing and higher performance of electronic devices, the electronic components can be stacked by stacking chip-shaped electronic components that have been conventionally arranged in a planar shape or by incorporating a plurality of chips in a single package. Methods for reducing the footprint have been adopted. Usually, such an electronic component such as a laminated type is such that after packaging, a wiring end portion of a built-in chip or the like is exposed on the side surface, and then further wiring for connecting each of these wiring end portions is connected to the component. It is obtained by a series of steps of forming on the side surface of the substrate. Such electronic components are collectively referred to as three-dimensional mounting type electronic components. However, each of the electronic components is very small compared to a so-called printed wiring board, and it is difficult to apply the conventional wiring forming technique using the so-called exposure method used for wiring formation on the printed wiring board as it is. there were.

  Therefore, in wiring formation for these electronic components, a substantially flat plate member is prepared in advance as an exposure jig, and after a plurality of electronic components are bonded to the surface of the member, exposure processing for these electronic components is collectively performed. A method of performing this has been proposed (see Patent Documents 1 and 2). The method using these exposure jigs usually includes a plurality of steps. In this step, secondary wiring is formed for each side surface of the three-dimensional mounting type electronic component. Specifically, first, predetermined one side surfaces of the plurality of electronic components are bonded to an exposure jig. A metal film is formed on the exposed side surface of the electronic component in this state, and further, each process such as exposure, development, etching, and cleaning is performed to form a pattern wiring on the side surface. Subsequently, these electronic components are peeled off from the exposure jig and washed. After completion of cleaning, drying, etc., this time, the pattern wiring formation surface is bonded to the exposure jig so that the secondary wiring can be formed on the predetermined one side surface. Subsequently, the formation of the pattern wiring, the peeling of the electronic parts from the exposure jig, the cleaning of the individual electronic parts, and the like are performed to collectively obtain the electronic parts after the formation of the plurality of pattern wirings.

JP-A-10-180601 Japanese Patent Laid-Open No. 11-218938

  In the pattern wiring forming method described above, it is necessary to peel the electronic component from the exposure jig after the pattern wiring is formed on one side surface of the electronic component. In this operation, not only the adhesive which is unnecessary in the manufacturing process of the original electronic equipment but also the release material is used, so that a complete removal operation from these electronic components is required. However, due to various circumstances such as the small size of the electronic components themselves and the presence of irregularities due to the formation of pattern wiring, etc., the deterioration of the wiring characteristics due to these materials when the pattern wiring is formed on other side surfaces, and also due to this There is a risk that the performance of the electronic component will deteriorate. Further, since one side surface having the formed pattern wiring is bonded to the jig and peeled off, there is a risk of damaging the pattern wiring.

  In addition, since the process of individually bonding the fine electronic components to the jig is repeated, it may be difficult to maintain an allowable value in the reproducibility, accuracy, etc. of the fixed position or fixed posture. In this case, there is a possibility that restrictions may arise in terms of miniaturization of the pattern wiring and narrowing of the interval between the wiring end portions of each built-in chip exposed on the side surface of the electronic component. Furthermore, since there are a process of repeating the bonding of a plurality of electronic components to the exposure jig a plurality of times, a process of peeling the electronic parts from the exposure jig, and a process of cleaning the electronic parts, these operations are required. The time is also increased, and a reduction in manufacturing lead time is required.

  The present invention has been devised in order to cope with the above-described problems. The number of steps can be reduced to shorten the lead time, the performance of the electronic component can be maintained to some extent, and the electronic component can be further reduced in size. The present invention also relates to a method for manufacturing an electronic component that can be realized, and to an exposure jig for performing the method.

In order to solve the above-described problems, an exposure jig according to the present invention is an exposure jig used when pattern wiring is formed on both opposite side surfaces of an electronic component using exposure development processing. The both side surfaces of the electronic component have a flat plate-like through-hole penetrating both sides of the flat plate shape and are bonded to the side surface of the through-hole. The adhesive plate has a thickness in which both end portions including each protrude from both sides of the flat plate shape, and can be fixed to both sides of the adhesive plate, and the both end portions of the electronic component protrude when fixed to the adhesive plate A pair of support plates having a possible thickness and a hole corresponding to each through hole in the adhesive plate, and closing a gap between the through hole of the adhesive plate when the electronic component is bonded , Have a, and adhesive plate and the pair of support plates is characterized in that a holding plate for holding the electronic component.

  In the above-described exposure jig, a base plate having a recess that supports the holding plate and has a depth that can accommodate one end portion of an electronic component that protrudes from the surface of the support plate when the holding plate is supported. It is preferable to further have. In this case, the holding plate is supported from the base plate on the surface of one support plate fixed to the adhesive plate. Furthermore, it is preferable that the holding plate can be inverted from any one surface side of the holding plate and supported by the base plate from the other surface side of the holding plate. In this case, the holding plate that was initially supported by the base plate on the surface of one support plate is supported by the base plate on the surface of the other support plate.

  In order to solve the above problems, an electronic component manufacturing method according to the present invention is an electronic component manufacturing method in which pattern wirings are formed on opposite side surfaces of an electronic component using the above-described exposure jig. A step of bonding the electronic component to the side surface of the through hole, a step of fixing the support plate on both sides of the bonding plate after the electronic component is bonded, and a holding plate, and both surfaces of the holding plate. A step of supplying a resist to each surface of the support plate to form a resist layer that covers one side of the electronic component, and a flattening process from the surface to the resist layer so that the one side of the electronic component is in the same plane One surface of an electronic component by obtaining a resist layer surface exposed to the surface, forming a metal film and a second resist layer on the resist layer surface, and exposing and developing the second resist layer Forming a pattern wiring, it is preferable to have a.

  In order to solve the above-described problem, an electronic component manufacturing method according to the present invention is a method for manufacturing an electronic component in which pattern wiring is formed on both opposing side surfaces of the electronic component. Bonding the orthogonal surface to the side surface of the through hole in the flat plate-like adhesive plate having a through hole, and projecting end portions each including one of both side surfaces of the electronic component from both surfaces of the adhesive plate; Support plates for fixing the support plates that project the end portions of the electronic components corresponding to the through holes and close the gaps between the through holes and the end portions of the electronic components on both sides of the adhesive plate to which the components are bonded and fixed. And an exposure and development process on one and the other side surfaces of both sides of the electronic component protruding from each surface of the support plate constituting the upper and lower surfaces of the holding plate Forming a pattern wiring on the both side surfaces by performing a plurality of processes, separating the pair of support plates from an adhesive plate for bonding and holding electronic components having the pattern wiring formed on both side surfaces, Separating the component from the adhesive plate and cleaning it.

  In the electronic component manufacturing method described above, the plurality of processes are performed by supplying a resist to a surface side of the support plate on which the end portion of the electronic component protrudes to cover the side surface of the electronic component. A step of planarizing the surface of the resist layer to obtain a resist layer surface in which one side surface of the electronic component is exposed in the same plane, a formation of a metal film on the resist layer surface, and a second step It is preferable to have a process including a formation process including the formation of a resist layer and the exposure and development process. Further, the flattening process in this case is preferably performed in a state where the holding plate is supported by a base plate that supports the holding plate from one surface side.

  Furthermore, in these manufacturing methods, the process including the formation process including the formation of the metal film on the resist layer surface and the formation of the second resist layer and the exposure development process forms the first metal film on the resist layer surface. A step of forming a second resist layer on the surface of the first metal film, and exposing and developing the second resist layer to form a pattern space having the first metal film surface as a bottom surface. A step of forming a second metal film on the first metal film in the pattern space, a step of removing the second resist layer, and a second metal film not having the second metal film on the upper surface. And removing a region of the one metal film. In this case, the planarization process applied to the surface of the resist layer is preferably a grinding process, and a polishing process is preferably performed as a finish after the grinding process. Further, in these manufacturing methods, the step of removing the region of the first metal film that does not have the second metal film on the upper surface is a step consisting of an etching process or an ion milling process. It is preferable that the second metal film is etched or ion milled at the same time, and the etching process or ion milling process is terminated when the removal of the first metal film is completed.

  According to the present invention, it is possible to form a pattern wiring by performing the steps of bonding an electronic component to an exposure jig, peeling from the jig, and cleaning required for these operations only once. . Therefore, not only can the effect of simply shortening the lead time be obtained, but also it is possible to prevent the above-described deterioration of the wiring characteristics and the deterioration of the characteristics as an electronic component that may occur due to these operations. Further, since the occurrence of defective products can be reduced, the yield can be improved. Further, since the formed pattern wiring is not bonded to the jig in the subsequent process, there is no damage to the pattern wiring due to the conventional adhesive peeling.

  Furthermore, according to the present invention, the pattern wiring is formed on one side surface and the other side surface of the electronic component while maintaining the positional relationship between each of the plurality of electronic components and the exposure jig constant. Can do. Therefore, the pattern by which the positional relationship between the generated exposure jig and the individual electronic components or the positional relationship between the individual electronic components is different between the pattern wiring formation on one side and the formation on the other side. There is no need to consider the reduction in accuracy. For this reason, it becomes possible to use a fine pattern which has been difficult in the past, and it is possible to obtain an electronic component having a smaller size and higher performance.

  In addition, according to the present invention, the electroless plating for forming the first metal film and the plating for forming the second metal film, which have been performed twice each in the past, can be finished once each. . Since these plating processes are performed by immersing a member in a chemical solution, for example, there is a possibility that the chemical solution may infiltrate inside the electronic component during the processing. If the number of these treatments can be reduced as in the present invention, the possibility of being affected by the chemical solution can be reduced, and it is also possible to suppress the deterioration of the yield due to the deterioration of the performance of the finished product in the production of electronic parts. It becomes possible.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1A shows a perspective view of an adhesive plate as one member constituting an exposure jig in one embodiment of the present invention, and FIG. 1B shows a cut surface when the adhesive plate shown in FIG. 1A is cut along line 1B-1B. The schematic structure of is shown. FIG. 2A shows a perspective view of a support plate as one member constituting the exposure jig, and FIG. 2B shows a schematic configuration of a cut surface when the support plate shown in FIG. 2A is cut along line 2B-2B. 3A shows a perspective view of a base plate as one member constituting the exposure jig, and FIG. 3B shows a schematic configuration of a cut surface when the base plate shown in FIG. 3A is cut along line 3B-3B. The exposure jig in the present embodiment includes the above-described adhesive plate, support plate, base plate, and fixing means for fixing each of them.

  The adhesive plate 10 in this embodiment has a flat plate shape, and has a disk shape in which a so-called orientation flat for positioning is formed in part. The adhesive plate 10 is formed with a through hole 10a that penetrates the upper and lower surfaces and accommodates the bar-shaped electronic component 1 (see FIG. 4A). The electronic component 1 is bonded and fixed to one side surface 10b of the through-hole 10a by a predetermined surface 1b orthogonal to each of the opposing side surfaces 1a and 1a 'that are pattern wiring formation surfaces by an adhesive (not shown). . The electronic component 1 is bonded and fixed to the bonding plate 10 by a so-called robot. Accordingly, the through-hole 10a has a length “l” that allows a robot hand (not shown) holding the electronic component 1 to enter, as well as a length that can accommodate the electronic component. In addition, the through hole 10a allows the robot hand holding the electronic component 1 to enter the through hole 10a, adheres and fixes the electronic component 1 to the through hole side surface 10b, releases the electronic component 1, and faces the side surface 10b. It has a width “w” that allows a series of operations of moving to the side surface and then retracting from the through hole 10. Further, the adhesive plate 10 is formed with a through hole 10c having a countersink for screwing and fixing to the base plate 12, and a screw hole 10d used when fixing the support plate 26 described later to the adhesive plate 10. Has been.

  The support plate 26 in this embodiment has a shape similar to that of the adhesive plate 10 described above, and has a disk shape in which a so-called orientation flat for positioning is formed in part. The support plate 26 has a through hole 26a through which the bar-shaped electronic component 1 (see FIG. 2A) penetrates in the upper and lower surfaces at a position corresponding to the adhesive plate through hole 10a when fixed to the adhesive plate 10. Is formed. As will be described later, the support plate through-hole 26a is set to a length “ls” and a width “ws” which are the size of the end through which the end of the electronic component can pass (see FIG. 4B). Further, the support plate 26 has a through hole 26b having a countersink for fixing with screws to the adhesive plate 10, and a screw used when fixing the screws used when fixing the adhesive plate 10 to the base plate 12. An access hole 26c is formed for fastening and the like.

  As described above, the electronic component 1 is bonded and fixed to the one side surface 10b of the through-hole 10a on the predetermined surface 1b orthogonal to each of the opposing side surfaces 1a and 1a ′ that are the pattern wiring forming surfaces. At that time, both end portions including both side surfaces 1a and 1a ′ are adjusted so as to protrude from the upper and lower surfaces of the adhesive plate 10 by a predetermined equal amount. The support plate 26 is fixed to the upper and lower surfaces of the adhesive plate 10 in this state by screwing. At this time, both end portions of the electronic component 1 described above are protruded from the surface of the support plate 26 by a predetermined amount. That is, when the thickness “t” of the adhesive plate 10 and the thickness “ts” of the support plate 26 are obtained, the value of “t + 2ts” is sometimes smaller than the length between the side surfaces 1a and 1a ′ of the electronic component by a predetermined length. Is set. Here, the adhesive plate 10 and the support plate 26 constitute the holding plate 15 according to the present invention that holds the electronic component 1 and is used for an exposure development process described later (see FIG. 4B).

  The base plate 12 is also a flat plate and has a disk shape corresponding to the adhesive plate 10 and the support plate 26. When the base plate 12 is aligned by the orientation flat and overlapped so as to contact each other, it corresponds to the counterbore 10c described above. A screw hole 12b is formed at the position. The base plate 12 is further formed with a recess 12a so as to correspond to the formation region of the through hole 10 when the adhesive plate 10 is fixed to the base plate 12 with screws (not shown). The recess 12a prevents the electronic component 1 from coming into contact with the base plate 12 in the operation of fixing both plates. Further, the recess 12 has a depth “d” that can accommodate the protruding portion 1c of the electronic component 1 that is bonded and fixed to the bonding plate 10 and protrudes from the upper and lower surfaces of the plate. Note that the depth “d” indicates that the adhesive plate 10 and the support plate are arranged so that the wiring forming surface side is disposed on the base plate side in a state where the pattern wiring is formed on one side surface 1a of the electronic component 1 as described later. Even when fixed to the base plate 12, the side surface including these wirings is large enough not to contact the bottom surface of the recess 12a.

  From the viewpoint of ease of jig fabrication, in the present embodiment, a plurality of the recesses 12a in the base plate 12 are not provided corresponding to each through hole 10a, but all the regions where the plurality of through holes 10a are formed. It is supposed to have a size that includes However, the resist described above in the process according to the invention requires that the surface be subjected to planarization. The processing can be performed by various methods such as grinding, milling, and etching, but is preferably performed by grinding from the viewpoint of ease and processing speed. In this case, a load that is deflected in the direction of the base plate 12 is applied to the adhesive plate 10 or the like by surface grinding of the resist.

  However, the support of the adhesive plate 10 by the base plate 12 cannot be obtained at the central portion of the recess 12a. For this reason, it is preferable to comprise the said adhesive plate 10 from materials with high rigidity, such as a metal and a ceramic. In the present embodiment, the support plate 26 and the adhesive plate 10, and the adhesive plate 10 and the base plate 12 are fixed by screwing. In this case, the counterbore 10c of the adhesive plate 10, the screw hole 12b of the base plate 12, and a screw (not shown) function as a fixing means in the present embodiment. However, the embodiment of the present invention is not limited to this example, and the adhesive plate 10, the support plate 26, and the base plate 12 can be integrated, and the integration operation can be performed easily and reliably. For example, it can be constructed using various configurations such as using a hinge.

  In the present embodiment, the base plate 12 is used as an exposure jig. However, if the support plate 26 is fixed to both surfaces of the adhesive plate 10 to form the holding plate 15 and the pattern wiring is obtained by subjecting both surfaces of the holding plate 15 to exposure development processing or the like, exposure is possible. The jig for use is not limited to this style. Specifically, the base plate only needs to be able to support the holding plate in order to perform exposure processing and the like on both sides of the holding plate easily and reliably. Furthermore, it is more preferable to have a configuration capable of easily performing a planarization process for obtaining the resist surface flat surface 16a.

Next, the process of actually forming the pattern wiring on the electronic component 1 using the above-described exposure jig will be described in detail.
4A to 4O show an embodiment of a method for manufacturing an electronic component according to the present invention, in which the electronic component 1, the adhesive plate 10, the support plate 26, the base plate 12 and the like in each step are partially formed in the same manner as in FIG. 1B. FIG. 5A to 5O show states in which the electronic component 1, the adhesive plate 10, the support plate 26, the base plate 12 and the like in the processes shown in FIGS. 4A to 4O will be observed in individual processes. It is typically shown as a perspective view. 6A to 6H schematically show each step of pattern wiring formation by enlarging only the vicinity of one side surface 1a of the electronic component 1 in the same manner as FIG. 1B and the like.

  In this embodiment, the electronic component 1 is first bonded and fixed to the through-hole side surface 10b of the adhesive plate 10 to which the adhesive is applied by a robot arm (not shown) (FIGS. 4A and 5A). The bonding surface 1b is a surface orthogonal to each of both side surfaces 1a and 1a 'which are pattern wiring formation surfaces in the electronic component. In addition, the bonding process is performed such that both end portions including both side surfaces of the electronic component 1 protrude from the upper and lower surfaces of the bonding plate 10 by a predetermined amount. When the adhesive fixing of the electronic component 1 to all the through holes 10a is completed, the support plate 26 is fixed to the upper and lower surfaces of the adhesive plate 10 by the screws 28, and is configured as the holding plate 15 (FIG. 4B). Subsequently, the adhesive plate 10 and the port plate 26 are fixed to the base plate 12 with screws 14 (FIGS. 4C and 5C). In this embodiment, each plate contacts in a contactable area, and one end portion of the electronic component protruding toward the base plate is accommodated in the base plate 12 recess 12a.

  After the bonding plate 10 and the support plate 26 and the base plate 12 are integrated, the resist 16 is applied to the surface side of the bonding plate 10 (the surface opposite to the surface contacting the base plate 12) (FIGS. 4D and 4D). 5D). The resist 16 is applied until the upper surface of the support plate 26 and the upper end surface of the electronic component 1 bonded and fixed to the adhesive plate 10 (the surface opposite to the surface facing the base plate 12) are completely covered. Here, in this embodiment, the space | interval of the support plate through-hole 26a and the electronic component 1 which penetrates this is 0.1 mm or less. Also, the resist used has a certain degree of viscosity. For this reason, the resist 16 cannot pass through this interval, and does not reach the space formed by the support plate 26, the electronic component 1, and the adhesive plate through hole 10a. Note that the support plate 26 is preferably defined as a configuration having a function of closing the space between the electronic component and the adhesive plate through-hole in the present specification from the viewpoint of preventing the resist from entering the space.

  The space does not particularly contribute to the manufacture of actual electronic components, and the resist that actually enters the space is wasted. In addition, since the space is relatively wide with respect to the opening, it takes extra processing time to remove the resist that has entered the area, and attention must be paid to cleaning unevenness in subsequent cleaning. Necessary. In the present embodiment, resist is prevented from reaching such a space, so that effects such as reduction in processing time and reduction in problems during the process can be obtained.

  In the present embodiment, it is necessary to perform an operation such as removing the support plate 26 and the adhesive plate 10 from the base plate 12 with the resist 16 and the like attached in a further process. Further, as will be described later, these plates are inverted in a later process, and it is necessary to bring the resist adhesion surface side into contact with the surface of the base plate 12. Therefore, the resist 16 on a predetermined region 26c on the surface of the support plate 26 is removed so that the screw 14 can be accessed and the resist adhesion surface and the surface of the base plate 12 can come into contact with each other (FIG. 4E and FIG. 4E). FIG. 5E). Thereafter, the resist 16 is dried to achieve a certain degree of curing. After the resist 16 is cured, as a process for flattening the surface of the resist 16, the resist 16 is ground from the surface side using a grinding device 18 as shown in FIG. 4F. The grinding operation is performed until the surface 16a where the one side surface 1a of the electronic component 1 is exposed. FIG. 5F shows a surface 16a where the surface of the resist 16 is ground to expose the one end surface 1a of the electronic component. FIG. 6A shows the vicinity of one side surface 1a of the electronic component in this state. In addition, after grinding, for example, a metal residue called so-called smear may remain on the surface of the ground surface. For this reason, in order to remove the smear caused by the electrode film, a so-called polishing process may be added after the grinding process is completed.

  After the surface 16a is obtained, the screw 14 is removed, and the support plate 26, the adhesive plate 10 and the like are once separated from the base plate 12. After the separation, the support plate 26, the adhesive plate 10 and the like are reversed and arranged so that the other end surface 1a ′ of the electronic component 1 is the upper surface, and then the support plate 26, the adhesive plate 10 and the like are again attached to the base plate 12 by the screws 14. (FIGS. 4G and 5G). At that time, the predetermined region 26c in the direction of the support plate 26 is in close contact with the flat surface which is the plate support region on the surface of the base plate 12. After the support plate 26, the adhesive plate 10 and the like are fixed to the base plate 12, the resist 16 is applied, the resist on the predetermined region 26c is removed, and the resist 16 is hardened to some extent. Then, the grinding to the surface 16a where the other side surface 1a ′ of the electronic component 1 is exposed is performed again (FIGS. 4H and 5H).

  After the flat surfaces 16a are obtained on the resist surface on the upper and lower surfaces of the holding plate 15 in which the adhesive plate 10, the two support plates 26, etc. are integrated, these holding plates 15 are separated from the base plate 12 (FIGS. 4I and FIG. 4). 5I). Subsequently, the first metal film 20 is formed by electroless plating on the upper and lower flat surfaces 16a, the electronic component one side surface 1a, and the other one side surface 1a 'of the electronic component. The first metal film 20 is formed with a first predetermined thickness. The state in which the first metal film 20 is formed is shown in FIGS. 4J, 5J, and 6B. Subsequently, a dry film 22 is attached to the surface of the first metal film 20 (FIGS. 4K, 5K, and 6C). The dry film 22 functions as a second resist layer. However, various types of photosensitive films can be used as long as exposure and development processes are possible and a uniform thickness can be obtained at a level at which there is no problem with these processes. The layer can be formed using a conductive material. Further, by performing exposure / development processing on the film 22, the pattern space 22a is opposed to the one side surface 1a across the first metal film 20, and the other side surface 1a 'is opposed to the pattern space 22a. A pattern space 22a ′ is formed at the position (FIGS. 4L, 5L, and 6D). In the pattern space 22, a pattern wiring pattern is formed on the bottom surface 20 a constituted by the first metal film 20.

  After the patterning of the dry film 22 is completed, the second metal film 24 is formed to a second predetermined thickness by plating using the pattern and the first metal film 20 on the bottom of the pattern as a seed (FIG. 6E). After forming the second metal film 24, the dry film 22 is removed, and the patterned second metal film 24 is disposed on the surface of the flat first metal film 20, as shown in FIGS. The state shown in 6F is obtained. After the state in which the surface of the resist 16 is covered only with the first metal film 20 and the second metal film 24 is obtained, the metal film is subjected to an etching process on one side surface 1a of the electronic component or another The first metal film 20 other than on the one side surface 1a ′ is removed (FIGS. 4N, 5N, and 6G). Here, the first predetermined thickness of the first electrode film 20 is set to be thinner than the second predetermined thickness of the second electrode film 24. Therefore, as shown in FIG. 6G, even if the first metal film 20 is completely removed by etching, the thickness of the second metal film 24 is reduced by the first predetermined thickness. It is possible to fulfill the function as wiring. In this embodiment, a so-called etching process is performed to remove an excess metal film, but the present invention is not limited to the use of the process. That is, if a predetermined amount of the metal film can be removed, this may be performed by, for example, ion milling instead of etching.

  Next, as shown in FIGS. 4O, 5O and 6H, the layer made of the resist 16 formed on the upper and lower surfaces of the holding plate 15 is removed. Thereafter, the screw 14 is removed, and the adhesive plate 10 is separated from the support plate 26. Thereafter, the electronic component 1 bonded and fixed to the adhesive plate 10 is peeled off with a solvent or the like, and individually cleaned, thereby completing the formation of the secondary wiring pattern for the plurality of electronic components 1. By performing the above steps, the bonding, peeling, and cleaning steps performed on the electronic component need only be performed once. Even when the adhesive plate 10 is inverted, the positional relationship between the exposure center of the exposure apparatus and each of the adhesive plate through-holes 10a is maintained, so that the positional relationship of each electronic component 1 and the bonding thereof are adhered to each other. The exposure process can be performed while maintaining the positional relationship with the plate 10. Therefore, the exposure accuracy can be improved.

  In the present embodiment, when the pattern wiring is formed, first the first metal film 20 is formed as a seed layer by an electroless plating method, and the second metal film 24 is formed thereon by a normal plating method. A metal wiring layer made of a metal laminate is obtained. However, the present invention is not limited to this form. For example, the side surface 1a of the electronic component 1a and the other side surface 1a 'are preliminarily subjected to a roughening process or the like for improving the adhesion of the metal wiring, and a metal wiring layer having a predetermined thickness is formed at a time only by the electroless plating method. It is also good to get. In this case, after the surface of the resist 16 is ground, an adhesion improving process for one side surface and the other side surface of the electronic component is performed, and then a plating film is formed and patterned. Further, the size of the recess 12a of the base plate 12 is set to include the entire region where the adhesive plate through hole 10a is formed. However, if it is possible to guarantee the ease of the reversing operation of the adhesive plate 10 and the avoidance of contact of the electronic component 1 with the base plate 12, the support force of the adhesive plate 10 by the base plate 12 during resist grinding and the amount of resist used are increased. From the viewpoint of reduction, the recess 12a only needs to have a minimum size that can accommodate the end of the electronic component 1.

  Moreover, in embodiment mentioned above, it described in detail regarding the process which fixes the adhesive plate 10 to which the electronic component 1 was adhere | attached to a support plate, and forms a pattern wiring in the one side of the electronic component in the said state. However, the formation process of the pattern wiring describes the formation process of the pattern wiring which is considered to be most appropriate in the practice of the present invention, and various wiring formation methods other than those described above using so-called exposure development processing are applied. It is also possible. In the above-described embodiment, the pattern wiring formation after the surface of the resist 16 is planarized is also described in detail. However, the formation process of the pattern wiring describes the formation process of the pattern wiring which is considered to be most appropriate in the practice of the present invention, and various wiring formation methods other than those described above using so-called exposure development processing are applied. It is also possible.

  The present invention relates to a method of manufacturing an electronic component for forming secondary wiring for a so-called three-dimensional mounting type electronic component incorporating a plurality of lips and the like, and an exposure jig used in the method. However, the implementation of the manufacturing method and the use of the jig according to the present invention are not limited to the electronic component, and various electronic components that need to form a patterned wiring outside a so-called chip capacitor, chip inductor, or the like. It can also be applied to.

It is a schematic perspective view of the adhesion plate which is one member which comprises the exposure jig | tool which concerns on one Embodiment of this invention. It is a figure which shows the cross section which cut | disconnected what added the electronic component to the jig | tool for exposure which consists of a structure shown to FIG. 1A along the line 1B-1B shown to FIG. 1A. It is a schematic perspective view of the support plate which is one member which comprises the exposure jig | tool which concerns on one Embodiment of this invention. It is a figure which shows the cross section which cut | disconnected what added the electronic component to the jig | tool for exposure which consists of a structure shown to FIG. 2A along the line 2B-2B shown to FIG. 1A. It is a schematic perspective view of the base plate which is one member which comprises the exposure jig | tool which concerns on one Embodiment of this invention. It is a figure which shows the cross section which cut | disconnected along what 3B-3B shown to FIG. 1A what added the electronic component to the jig | tool for exposure which consists of a structure shown to FIG. 3A. It is a figure which shows the exposure jig, electronic components, etc. in 1 process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention in the same format as FIG. 1B. It is a figure which shows the exposure jig, electronic components, etc. in 1 process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention in the same format as FIG. 1B. It is a figure which shows the exposure jig, electronic components, etc. in 1 process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention in the same format as FIG. 1B. It is a figure which shows the exposure jig, electronic components, etc. in 1 process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention in the same format as FIG. 1B. It is a figure which shows the exposure jig, electronic components, etc. in 1 process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention in the same format as FIG. 1B. It is a figure which shows the exposure jig, electronic components, etc. in 1 process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention in the same format as FIG. 1B. It is a figure which shows the exposure jig, electronic components, etc. in 1 process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention in the same format as FIG. 1B. It is a figure which shows the exposure jig, electronic components, etc. in 1 process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention in the same format as FIG. 1B. It is a figure which shows the exposure jig, electronic components, etc. in 1 process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention in the same format as FIG. 1B. It is a figure which shows the exposure jig, electronic components, etc. in 1 process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention in the same format as FIG. 1B. It is a figure which shows the exposure jig, electronic components, etc. in 1 process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention in the same format as FIG. 1B. It is a figure which shows the exposure jig, electronic components, etc. in 1 process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention in the same format as FIG. 1B. It is a figure which shows the exposure jig, electronic components, etc. in 1 process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention in the same format as FIG. 1B. It is a figure which shows the exposure jig, electronic components, etc. in 1 process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention in the same format as FIG. 1B. It is a figure which shows the exposure jig, electronic components, etc. in 1 process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention in the same format as FIG. 1B. It is a schematic perspective view which shows the states of an exposure jig, an electronic component, etc. in one process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention. It is a schematic perspective view which shows the states of an exposure jig, an electronic component, etc. in one process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention. It is a schematic perspective view which shows the states of an exposure jig, an electronic component, etc. in one process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention. It is a schematic perspective view which shows the states of an exposure jig, an electronic component, etc. in one process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention. It is a schematic perspective view which shows the states of an exposure jig, an electronic component, etc. in one process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention. It is a schematic perspective view which shows the states of an exposure jig, an electronic component, etc. in one process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention. It is a schematic perspective view which shows the states of an exposure jig, an electronic component, etc. in one process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention. It is a schematic perspective view which shows the states of an exposure jig, an electronic component, etc. in one process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention. It is a schematic perspective view which shows the states of an exposure jig, an electronic component, etc. in one process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention. It is a schematic perspective view which shows the states of an exposure jig, an electronic component, etc. in one process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention. It is a schematic perspective view which shows the states of an exposure jig, an electronic component, etc. in one process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention. It is a schematic perspective view which shows the states of an exposure jig, an electronic component, etc. in one process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention. It is a schematic perspective view which shows the states of an exposure jig, an electronic component, etc. in one process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention. It is a schematic perspective view which shows the states of an exposure jig, an electronic component, etc. in one process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention. It is a schematic perspective view which shows the states of an exposure jig, an electronic component, etc. in one process in the manufacturing method of the electronic component which concerns on one Embodiment of this invention. FIG. 4B is a diagram illustrating the electronic component and the configuration in the vicinity of the end thereof in the same manner as FIG. FIG. 4B is a diagram illustrating the electronic component and the configuration in the vicinity of the end thereof in the same manner as FIG. FIG. 4B is a diagram illustrating the electronic component and the configuration in the vicinity of the end thereof in the same manner as FIG. FIG. 4B is a diagram illustrating the electronic component and the configuration in the vicinity of the end thereof in the same manner as FIG. FIG. 4B is a diagram illustrating the electronic component and the configuration in the vicinity of the end thereof in the same manner as FIG. FIG. 4B is a diagram illustrating the electronic component and the configuration in the vicinity of the end thereof in the same manner as FIG. FIG. 4B is a diagram illustrating the electronic component and the configuration in the vicinity of the end thereof in the same manner as FIG. FIG. 4B is a diagram illustrating the electronic component and the configuration in the vicinity of the end thereof in the same manner as FIG.

Explanation of symbols

1: Electronic component 10: Adhesive plate 12: Base plate 14, 28: Screw 15: Holding plate 16: Resist 18: Grinding device 20: First metal film 22: Dry film 24: Second Metal film, 26: Support plate

Claims (12)

An exposure jig used when pattern wiring is formed using exposure development processing on both opposing side surfaces of an electronic component,
The both sides of the electronic component when having a flat plate shape and having through holes penetrating both sides of the flat plate shape and bonding a plane perpendicular to each of the both side surfaces of the electronic component to the side surface of the through hole An adhesive plate having a thickness in which both end portions including each of the surfaces protrude from the both surfaces of the flat plate shape;
A thickness that can be fixed to each of the both surfaces of the adhesive plate, and that the both end portions of the electronic component can protrude when fixed to the adhesive plate, and a hole corresponding to each of the through holes in the adhesive plate, And a pair of support plates that close a gap between the through holes of the adhesive plate when the electronic component is bonded, and
An exposure jig, wherein the adhesive plate and the pair of support plates constitute a holding plate for holding the electronic component.   The base plate further includes a base plate having a depth that supports the holding plate and has a depth capable of accommodating one end portion of the electronic component protruding from the surface of the support plate when the holding plate is supported. The exposure jig according to claim 1, wherein   The exposure plate according to claim 2, wherein the holding plate is inverted from any one surface side of the holding plate and can be supported by the base plate from the other surface side of the holding plate. jig. A method for manufacturing an electronic component, wherein the pattern wiring is formed on the opposite side surfaces of the electronic component using the exposure jig according to claim 1,
Adhering the electronic component to the side surface of the through-hole, and fixing the support plate on both sides of the adhesive plate after adhering the electronic component, and configuring the holding plate;
Supplying a resist to each surface of the support plate, which is both surfaces of the holding plate, to form a resist layer covering one side surface of the electronic component;
Applying a planarization process from the surface to the resist layer to obtain a resist layer surface in which the one side surface of the electronic component is exposed in the same plane;
Forming the pattern wiring on the one side surface of the electronic component by forming a metal film and a second resist layer on the resist layer surface and exposing and developing the second resist layer. Manufacturing method for electronic parts. An electronic component manufacturing method for forming a pattern wiring on opposite side surfaces of an electronic component,
A surface orthogonal to each of the both side surfaces of the electronic component is bonded to a side surface of the through hole in a flat plate-like adhesive plate having a through hole, and an end portion including each of the both side surfaces of the electronic component is bonded. Projecting from both sides of the plate;
A support plate for projecting an end portion of the electronic component corresponding to the through hole and closing a gap between the through hole and the end portion of the electronic component on both surfaces of the adhesive plate to which the electronic component is bonded and fixed Forming a holding plate by fixing each of them,
A plurality of processes including an exposure development process are performed on one and the other side surfaces of the both side surfaces of the electronic component protruding from the respective surfaces of the support plate constituting the upper and lower surfaces of the holding plate. Forming a pattern wiring; and
Separating the pair of support plates from the adhesive plate that adheres and holds the electronic component on which the pattern wiring is formed on both side surfaces;
And a step of peeling and cleaning the electronic component from the adhesive plate. The plurality of treatments include a step of forming a resist layer that covers a side surface of the electronic component by supplying a resist to the surface side of the support plate on which the end portion of the electronic component projects.
Applying a planarization process to the surface of the resist layer to obtain a resist layer surface in which the one side surface of the electronic component is exposed in the same plane;
6. The method of manufacturing an electronic component according to claim 5, further comprising: a forming process including forming a metal film on the surface of the resist layer, forming a second resist layer, and the exposure and developing process. .   The method of manufacturing an electronic component according to claim 6, wherein the flattening process is performed in a state where the holding plate is supported by a base plate that supports the holding plate from one surface side. The process including the formation process including the formation of the metal film and the formation of the second resist layer on the resist layer surface and the exposure and development process,
Forming a first metal film on the surface of the resist layer; forming a second resist layer on the surface of the first metal film;
A step of subjecting the second resist layer to exposure and development to form a pattern space having the first metal film surface as a bottom surface;
Forming a second metal film on the first metal film and inside the pattern space;
8. The method according to claim 6, further comprising a step of removing the second resist layer and a step of removing a region of the first metal film that does not have the second metal film on an upper surface. The manufacturing method of the electronic component of description.   The method for manufacturing an electronic component according to claim 7, wherein the planarizing process applied to the surface of the resist layer is a grinding process.   The method of manufacturing an electronic component according to claim 9, wherein the planarization process further includes a polishing process.   The step of removing the region of the first metal film that does not have the second metal film on the upper surface is a step of etching treatment, and simultaneously etching the first metal film and the second metal film. 9. The method of manufacturing an electronic component according to claim 8, wherein the etching process is terminated when the removal of the first metal film is completed.   The step of removing the region of the first metal film that does not have the second metal film on the upper surface is a step comprising an ion milling process, wherein the first metal film and the second metal film are simultaneously ionized. 9. The method of manufacturing an electronic component according to claim 8, which is a step of milling and ending the ion milling process when the removal of the first metal film is completed.

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