JP3190099U - Solder pieces and chip solder - Google Patents
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- JP3190099U JP3190099U JP2014000531U JP2014000531U JP3190099U JP 3190099 U JP3190099 U JP 3190099U JP 2014000531 U JP2014000531 U JP 2014000531U JP 2014000531 U JP2014000531 U JP 2014000531U JP 3190099 U JP3190099 U JP 3190099U
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 154
- 238000004080 punching Methods 0.000 claims abstract description 11
- 238000005452 bending Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 abstract description 6
- 238000001179 sorption measurement Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
Abstract
【課題】打ち抜き加工で発生するだれ部と称される屈曲や変形の無い直方体形状の半田小片およびチップソルダを提供する。【解決手段】半田小片１Ａは、ハンドリングの際に吸着される吸着面となり得る第１の面１１、第２の面１２、第３の面１３、第４の面１４と、他に第５の面１５、第６の面１６の面を備え、第２の面１２、第４の面１４、第５の面１５および第６の面１６がせん断面になるように、矢印Ａで示す方向に打ち抜かれて直方体形状に形成される。半田小片１Ａは、吸着面となり得る４面を含めて６面すべての面に、だれ部と称される屈曲や変形が無い。【選択図】図１PROBLEM TO BE SOLVED: To provide a rectangular parallelepiped-shaped solder piece and a chip solder having no bending or deformation called a drooping portion generated in a punching process. SOLUTION: A solder piece 1A has a first surface 11, a second surface 12, a third surface 13, a fourth surface 14, and a fifth surface which can be an adsorption surface to be adsorbed during handling. In the direction indicated by the arrow A, the surface 15 and the sixth surface 16 are provided, and the second surface 12, the fourth surface 14, the fifth surface 15 and the sixth surface 16 are sheared surfaces. It is punched out to form a rectangular parallelepiped shape. The solder small piece 1A has no bending or deformation called a drooping portion on all six surfaces including four surfaces that can be suction surfaces. [Selection diagram] Fig. 1
Description
本考案は、平板状の半田素材から形成された直方形状の半田小片およびチップソルダに関する。 The present invention relates to a rectangular solder piece and a chip solder formed from a flat solder material.
従来、基板に形成されたランドにソルダーペーストを塗布し、ソルダーペーストが塗布された基板のランドに電子部品を実装し、ソルダーペーストを溶解させて半田付を行う技術が用いられている。 Conventionally, a technique is used in which a solder paste is applied to a land formed on a substrate, an electronic component is mounted on the land of the substrate to which the solder paste is applied, and soldering is performed by dissolving the solder paste.
このような工法で電子部品を実装する際に、機械的な固定強度が要求される部品の場合、ランドに塗布されるソルダーペーストのみでは、半田の量が不足する場合がある。 When electronic parts are mounted by such a construction method, in the case of parts that require mechanical fixing strength, the amount of solder may be insufficient with only the solder paste applied to the lands.
そこで、下記特許文献１に示すように、ソルダーペーストに加えて、半田小片と称されるチップ状の半田をランドに搭載して半田を補充する技術が提案されている。 Therefore, as shown in Patent Document 1 below, a technique for replenishing solder by mounting a chip-like solder called a solder piece on a land in addition to a solder paste has been proposed.
ここで、半田小片については、下記特許文献２に示すように、打ち抜き加工で発生するだれ部と称される屈曲や変形を金型内で平滑状態に成形し、だれ部とだれ部のない吸着面とからなる直方体形状の半田小片を形成する製造方法が知られている。 Here, as for the solder piece, as shown in Patent Document 2 below, the bending and deformation generated by punching are formed in a smooth state in the mold, and there is no suction between the drooping portion and the drooping portion. There is known a manufacturing method for forming a rectangular parallelepiped solder piece comprising a surface.
上記特許文献２によれば、半田小片は、長尺状の供給テープに形成された開口凹部に収納され、カバーテープで封止されて供給されるが、供給テープから取り出して基板に搭載する際、だれ部を吸着面とせずに吸着保持できるので、半田小片の供給不良を抑制することができる。 According to Patent Document 2, the solder piece is housed in an opening recess formed in a long supply tape and is supplied after being sealed with a cover tape. Since the dripping portion can be sucked and held without using the sucking surface, it is possible to suppress the supply failure of the solder pieces.
しかしながら、上記特許文献２の半田小片においては、依然としてだれ部が残存することから、だれ部が吸着面となった場合には、半田小片の供給不良発生してしまう。 However, in the solder piece of Patent Document 2, since the drooping portion still remains, when the drooping portion becomes the suction surface, supply failure of the solder small piece occurs.
また、だれ面が残存する場合には、半田小片を供給テープに収納する際に、だれ面を区別する必要があり、供給テープの生産性が著しく低下するという不都合がある。 Further, when the drooping surface remains, it is necessary to distinguish the drooping surface when the solder pieces are stored in the supply tape, which disadvantageously decreases the productivity of the supply tape.
そこで、本考案は、いずれの面にもだれ部の全くない直方形状の半田小片およびチップソルダを実現することを目的とする。 Therefore, the present invention aims to realize a rectangular solder piece and a chip solder having no drooping portion on any surface.
上記課題を解決するために、本考案の半田小片は、平板状の半田素材から形成された直方形状の半田小片であって、いずれの面も屈曲や変形のない吸着面に形成されてなることを特徴とする。 In order to solve the above problems, the solder piece of the present invention is a rectangular solder piece formed of a flat solder material, and any surface is formed on a suction surface that is not bent or deformed. It is characterized by.
これにより、だれ部が吸着面となり半田小片の供給不良発生してしまうことが完全に防止することができる。さらに、半田小片を供給テープに収納する際に、だれ面を区別する必要もない。 As a result, it is possible to completely prevent the drooping portion from becoming the suction surface and causing the supply failure of the solder pieces. Further, when the solder piece is stored in the supply tape, it is not necessary to distinguish the facing surface.
具体的に、本考案の半田小片は、ダイ上に供給された前記半田素材に対して、ダイ孔に向かって第１パンチを該第１パンチの先端が該半田素材の打ち抜き位置の半分まで進行させて半打ち抜き状態とし、半打ち抜き状態とした該半田素材を、該第１パンチと対向する第２パンチと該第１パンチとで押圧して該半田素材を平滑化し、平滑化させた該半田素材に対して、該第１パンチで打ち抜いて得られることを特徴とする。 Specifically, the solder piece according to the present invention advances the first punch toward the die hole with respect to the solder material supplied onto the die, and the tip of the first punch advances to half of the punching position of the solder material. The solder material which is made into a half-punched state by pressing the solder material in the half-punched state with the second punch and the first punch facing the first punch, and smoothes the solder material, and the smoothed solder It is characterized by being obtained by punching a material with the first punch.
これにより、いずれの面にもだれ部の全くない直方形状の半田小片を具体的に実現することができる。 Thereby, it is possible to specifically realize a rectangular solder piece having no drooping portion on any surface.
ここで、本考案のチップソルダは、上記半田小片が収納される開口凹部が複数形成された供給テープであって、各開口凹部に該半田小片が収納されたことを特徴とする。 Here, the chip solder of the present invention is a supply tape in which a plurality of opening recesses in which the solder pieces are stored is formed, wherein the solder pieces are stored in the respective opening recesses.
かかるチップソルダでは、半田小片を供給テープに収納する際に、だれ面を区別する必要がなく、供給テープの生産性を著しく向上させることができる。 In such a chip solder, it is not necessary to distinguish the face when the solder piece is stored in the supply tape, and the productivity of the supply tape can be remarkably improved.
以下、図面を参照して、本考案の半田小片、チップソルダおよび半田小片の製造方法の実施の形態について説明する。なお、上記特許文献２との相違点を明確とするため、上記特許文献２を一部引用して以下説明する。 Hereinafter, embodiments of a solder piece, a chip solder, and a method of manufacturing a solder piece according to the present invention will be described with reference to the drawings. In addition, in order to clarify the difference from the above-mentioned patent document 2, a part of the above-mentioned patent document 2 will be cited and described below.
＜本実施の形態の半田小片の構成例＞
図１は、本実施の形態の半田小片の一例を示す斜視図、図２は、本実施の形態の半田小片の一例を示す側面図である。
<Configuration example of solder piece of this embodiment>
FIG. 1 is a perspective view illustrating an example of a solder piece according to the present embodiment, and FIG. 2 is a side view illustrating an example of the solder piece according to the present embodiment.
本実施の形態の半田小片１Ａは、６面から構成される直方体形状で、テープ状の板材を打ち抜く打ち抜き加工で製造される。半田小片１Ａは、ハンドリングの際に吸着される吸着面となり得る、第１の面１１、第２の面１２、第３の面１３および第４の面１４の４面と第５の面１５、第６の面１６の２面を備える。 The solder piece 1A of the present embodiment has a rectangular parallelepiped shape composed of six surfaces, and is manufactured by a punching process that punches a tape-shaped plate material. The solder piece 1A has four surfaces, a first surface 11, a second surface 12, a third surface 13, and a fourth surface 14, and a fifth surface 15, which can be suction surfaces that are attracted during handling. Two surfaces of the sixth surface 16 are provided.
半田小片１Ａは、第３の面１３、第４の面１４、第５の面１５および第６の面１６がせん断面となるように、矢印Ａで示す方向に打ち抜かれる。従来の工法であれば、半田小片１Ａは、第３の面１３にだれ部１３ａが形成されるが、本考案により、だれ部の発生を抑えているため６面すべてが所定の寸法精度で形成し得る面となる。 The solder piece 1A is punched in the direction indicated by the arrow A so that the third surface 13, the fourth surface 14, the fifth surface 15 and the sixth surface 16 become shear surfaces. If the conventional method is used, the solder piece 1A has a drooping portion 13a formed on the third surface 13. However, according to the present invention, the generation of the dripping portion is suppressed, so that all six surfaces are formed with a predetermined dimensional accuracy. It becomes a possible surface.
従って、半田小片１Ａは、第１の面１１、第２の面１２、第３の面１３および第４の面１４のいずれの面でも吸着面として使用できる。 Therefore, the solder piece 1 </ b> A can be used as an adsorption surface on any of the first surface 11, the second surface 12, the third surface 13, and the fourth surface 14.
半田小片１Ａは、本例では第５の面１５および第６の面１６が略正方形で構成され、第５の面１５と第１の面１１で共用される辺２０ａと、第５の面１５と第２の面１２で共用される辺２０ｂと、第５の面１５と第３の面１３で共用される辺２０ｃと、第５の面１５と第４の面１４で共用される辺２０ｄは、打ち抜き加工による抜き方向に起因して同じ長さに構成される。 In this example, the solder piece 1A is configured such that the fifth surface 15 and the sixth surface 16 are substantially square, the side 20a shared by the fifth surface 15 and the first surface 11, and the fifth surface 15 And the side 20b shared by the second surface 12, the side 20c shared by the fifth surface 15 and the third surface 13, and the side 20d shared by the fifth surface 15 and the fourth surface 14. Are configured to have the same length due to the punching direction by punching.
また、半田小片１Ａは、第６の面１６と第１の面１１で共用される辺２１ａと、第６の面１６と第２の面１２で共用される辺２１ｂと、第６の面１６と第３の面１３で共用される辺２１ｃと、第６の面１６と第４の面１４で共用される辺２１ｄは、略同じ長さに構成される。そして、第５の面１５の各辺と第６の面１６の各辺は、同じ長さに構成される。 Further, the solder piece 1A includes a side 21a shared by the sixth surface 16 and the first surface 11, a side 21b shared by the sixth surface 16 and the second surface 12, and a sixth surface 16 The side 21c shared by the third surface 13 and the side 21d shared by the sixth surface 16 and the fourth surface 14 have substantially the same length. Each side of the fifth surface 15 and each side of the sixth surface 16 are configured to have the same length.
半田小片１Ａは、第１の面１１、第２の面１２、第３の面１３および第４の面１４が長方形で構成される。半田小片１Ａでは、第１の面１１と第２の面１２で共用される辺２２ａと、第２の面１２と第３の面１３で共用される辺２２ｂと、第３の面１３と第４の面１４で共用される辺２２ｃと、第４の面１４と第１の面１１で共用される辺２２ｄは、工具の精度に依存する範囲で略同じ長さに構成される。そして、半田小片１Ａは、第１の面１１、第２の面１２、第３の面１３および第４の面１４で共用される各辺が、第５の面１５および第６の面１６の各辺より長く構成される。 In the solder piece 1A, the first surface 11, the second surface 12, the third surface 13, and the fourth surface 14 are rectangular. In the solder piece 1A, the side 22a shared by the first surface 11 and the second surface 12, the side 22b shared by the second surface 12 and the third surface 13, the third surface 13 and the second surface 13a. The side 22c shared by the fourth surface 14 and the side 22d shared by the fourth surface 14 and the first surface 11 are configured to have substantially the same length within a range depending on the accuracy of the tool. The solder piece 1 </ b> A has sides shared by the first surface 11, the second surface 12, the third surface 13, and the fourth surface 14 of the fifth surface 15 and the sixth surface 16. Composed longer than each side.
このように、半田小片１Ａは、第５の面１５および第６の面１６が略正方形で構成され、第１の面１１、第２の面１２、第３の面１３および第４の面１４が長方形で構成されることで、第５の面１５と第６の面１６を通る軸を回転軸として、第１の面１１、第２の面１２、第３の面１３および第４の面１４の４面が面対称となる。 As described above, the solder piece 1A is configured such that the fifth surface 15 and the sixth surface 16 are substantially square, and the first surface 11, the second surface 12, the third surface 13, and the fourth surface 14 are formed. Is formed in a rectangular shape, the first surface 11, the second surface 12, the third surface 13, and the fourth surface with the axis passing through the fifth surface 15 and the sixth surface 16 as the rotation axis. Four planes 14 are plane-symmetric.
これにより、半田小片１Ａは、第１の面１１、第２の面１２、第３の面１３および第４の面１４のいずれか１面が吸着面となり、吸着面となり得る第１の面１１、第２の面１２、第３の面１３および第４の面１４は、半田小片１Ａを真空吸着で吸着し得る所定の平面で構成される。 As a result, in the solder piece 1A, any one of the first surface 11, the second surface 12, the third surface 13, and the fourth surface 14 becomes the suction surface, and the first surface 11 that can be the suction surface. The second surface 12, the third surface 13, and the fourth surface 14 are configured as predetermined planes that can adsorb the solder pieces 1A by vacuum suction.
＜本実施の形態のチップソルダの構成例＞
図３は、本実施の形態のチップソルダの一例を示す斜視図である。本実施の形態のチップソルダ１０Ａは、上述した半田小片１Ａと、半田小片１Ａが収納される供給テープ３を備える。供給テープ３は樹脂材料あるいは紙等で長尺状に構成され、半田小片１Ａを収納し得る複数の開口凹部３０が、延在方向に沿って形成される。また、チップソルダ１０Ａは、供給テープ３を走行させるための送り穴３１が、延在方向に沿って形成される。チップソルダ１０Ａは、開口凹部３０に半田小片１Ａが収納された後、図示しないカバーテープによって封止される。
<Configuration example of chip solder of this embodiment>
FIG. 3 is a perspective view showing an example of the chip solder of the present embodiment. The chip solder 10A of the present embodiment includes the above-described solder piece 1A and the supply tape 3 in which the solder piece 1A is accommodated. The supply tape 3 is formed in a long shape with a resin material, paper, or the like, and a plurality of opening recesses 30 that can accommodate the solder pieces 1A are formed along the extending direction. Further, in the chip solder 10A, a feed hole 31 for running the supply tape 3 is formed along the extending direction. The chip solder 10 </ b> A is sealed with a cover tape (not shown) after the solder piece 1 </ b> A is accommodated in the opening recess 30.
開口凹部３０は、長手方向の辺３０ａが、半田小片１Ａの第１の面１１、第２の面１２、第３の面１３および第４の面１４で共用する各辺より若干長い程度の長さを有し、短手方向の辺３０ｂが、第５の面１５および第６の面１６の各辺より若干長い程度の長さを有した開口である。また、開口凹部３０は、深さ方向の辺３０ｃが、第５の面１５および第６の面１６の各辺より若干長い程度の長さを有して開口である。 The opening recess 30 has a length such that the side 30a in the longitudinal direction is slightly longer than each side shared by the first surface 11, the second surface 12, the third surface 13, and the fourth surface 14 of the solder piece 1A. The opening 30 has a length that is slightly longer than the sides of the fifth surface 15 and the sixth surface 16. In addition, the opening recess 30 is an opening having a length in which the side 30 c in the depth direction is slightly longer than the sides of the fifth surface 15 and the sixth surface 16.
これにより、チップソルダ１０Ａは、供給テープ３の各開口凹部３０にそれぞれ１個の半田小片１Ａが収納される。半田小片１Ａは、第５の面１５と第６の面１６を通る軸を回転軸として、第１の面１１、第２の面１２、第３の面１３および第４の面１４のいずれか１面を、開口凹部３０から露出させる任意の向きで収納される。一方、半田小片１Ａは、第５の面１５および第６の面１６を開口凹部から露出させる向きで供給テープ３に収納されることはない。 Thereby, in the chip solder 10 </ b> A, one piece of solder 1 </ b> A is accommodated in each opening recess 30 of the supply tape 3. The solder piece 1A is one of the first surface 11, the second surface 12, the third surface 13, and the fourth surface 14, with an axis passing through the fifth surface 15 and the sixth surface 16 as a rotation axis. One surface is stored in an arbitrary direction that is exposed from the opening recess 30. On the other hand, the solder piece 1A is not stored in the supply tape 3 in a direction in which the fifth surface 15 and the sixth surface 16 are exposed from the opening recess.
＜本実施の形態の半田小片の使用形態例＞
図４Ａおよび図４Ｂは、本実施の形態の半田小片の使用形態の一例を示す説明図である。半田小片１Ａは、図４Ａに示すように、ソルダーペースト５０が塗布された基板５１上のランド５２に、電子部品５３とともに搭載される。半田小片１Ａを基板５１に搭載する工程では、チップソルダ１０Ａの形態で供給される半田小片１Ａが真空吸着で吸着され、所定のランド上に搭載される。
<Usage example of solder piece of this embodiment>
4A and 4B are explanatory views showing an example of a usage pattern of the solder piece of the present embodiment. As shown in FIG. 4A, the solder piece 1 </ b> A is mounted together with the electronic component 53 on the land 52 on the substrate 51 to which the solder paste 50 is applied. In the step of mounting the solder piece 1A on the substrate 51, the solder piece 1A supplied in the form of the chip solder 10A is sucked by vacuum suction and mounted on a predetermined land.
そして、基板５１を図示しないリフロー炉に投入して加熱することで、図４Ｂに示すように、ソルダーペースト５０と半田小片１Ａを溶解させて、電子部品５３の半田付が行われる。 Then, the substrate 51 is put into a reflow furnace (not shown) and heated, so that the solder paste 50 and the solder piece 1A are melted and the electronic component 53 is soldered as shown in FIG. 4B.
半田小片１Ａを利用した半田付では、ソルダーペーストのみを利用した半田付に比較して、半田の量を増やすことができるので、機械的な強度が要求される半田付箇所において、強度を向上させることができる。 Soldering using the solder piece 1A can increase the amount of solder compared to soldering using only the solder paste, so that the strength is improved at the soldering point where mechanical strength is required. be able to.
＜本実施の形態の半田小片の製造方法例＞
図５Ａ、図５Ｂ、図５Ｃおよび図５Ｄは、本実施の形態の半田小片の製造方法の一例を示す動作説明図であり、次に、各図を参照して、本実施の形態の半田小片の製造方法について説明する。本実施の形態の半田小片１Ａは、図５Ａに示すように、所定の厚さに構成されるテープ状の板材である半田圧延テープ４がダイ４０に供給され、図５Ｂに示すように、半田圧延テープ４を第１パンチ４１で圧延テープ板厚の約半分まで半田小片１Ａを押し出す。この状態では、半田小片１Ａの押し出された第３の面１３にだれ部１３ａと称される屈曲や変形が生じる（図２）。
<Example of manufacturing method of solder piece of this embodiment>
FIG. 5A, FIG. 5B, FIG. 5C, and FIG. 5D are operation explanatory views showing an example of a method for manufacturing a solder piece of the present embodiment. Next, referring to each drawing, the solder piece of the present embodiment The manufacturing method will be described. As shown in FIG. 5A, the solder piece 1A of the present embodiment is supplied with a solder rolling tape 4 which is a tape-like plate material having a predetermined thickness, and is supplied with a solder as shown in FIG. 5B. The small piece 1A of the rolled tape 4 is extruded by the first punch 41 to about half the thickness of the rolled tape plate. In this state, bending or deformation called a drooping portion 13a occurs on the extruded third surface 13 of the solder piece 1A (FIG. 2).
次に、図５Ｃに示すように、第１パンチ４１と第２パンチ４２で半田小片１Ａを上下から押圧してだれ部を平滑な面に成形する。 Next, as shown in FIG. 5C, the solder piece 1 </ b> A is pressed from above and below with the first punch 41 and the second punch 42 to form a drooping portion on a smooth surface.
かかる押圧工程では、第１パンチ４１と第２パンチ４２とで相互に半田小片１Ａを押圧した後、第１パンチ４１と第２パンチ４２とで半田小片１Ａを挟持した状態で押圧して平滑化させることが望ましい。 In this pressing step, the first punch 41 and the second punch 42 press the solder pieces 1A with each other, and then press and smooth the solder pieces 1A sandwiched between the first punch 41 and the second punch 42. It is desirable to make it.
図５Ｃでだれ部を無くした半田小片１Ａは、図５Ｄで示すように第１パンチ４１で金型外へ押し出され直方体形状に構成される。 The solder piece 1A from which the drooping portion has been removed in FIG. 5C is pushed out of the mold by the first punch 41 as shown in FIG. 5D and is formed in a rectangular parallelepiped shape.
半田小片１Ａでは、第２の面１２、第４の面１４、第５の面１５および第６の面１６がせん断面になるように打ち抜き加工による抜き方向が設定される。半田圧延テープ４は、第２の面１２、第４の面１４、第５の面１５と第６の面１６で共有する各辺２０ｂ、２０ｄ、２１ｂ、２１ｄの長さと同じ厚みを有する。 In the solder piece 1A, the punching direction is set so that the second surface 12, the fourth surface 14, the fifth surface 15, and the sixth surface 16 become shear surfaces. The solder rolling tape 4 has the same thickness as the length of each side 20b, 20d, 21b, 21d shared by the second surface 12, the fourth surface 14, the fifth surface 15, and the sixth surface 16.
半田圧延テープ４を打ち抜く第１パンチ４１は、本例では長方形の断面を有し、第１の面１１および第３の面１３の各辺とほぼ同じ長さに構成される。 The first punch 41 for punching the solder rolling tape 4 has a rectangular cross section in this example, and is configured to have substantially the same length as each side of the first surface 11 and the third surface 13.
第１パンチ４１を受けるダイ４０は、第１パンチ４１で打ち抜かれた半田小片１Ａが通る抜き穴４０ａが形成される。抜き穴４０ａは、本例では長方形の断面を有し、４つの辺の長さが、半田小片１Ａの第１の面１１および第２の面１２の各辺より若干長く構成される。 The die 40 that receives the first punch 41 is formed with a hole 40a through which the solder piece 1A punched by the first punch 41 passes. In this example, the through hole 40a has a rectangular cross section, and the lengths of the four sides are slightly longer than the sides of the first surface 11 and the second surface 12 of the solder piece 1A.
打ち抜き加工で製造される半田小片１Ａでは、せん断面となる第２の面１２、第４の面１４、第５の面１５および第６の面１６の精度は、第１パンチ４１とダイ４０の抜き穴４０ａとのクリアランスで決められる。このため吸着面となり得る第１の面１１、第２の面１２、第３の面１３および第４の面１４が、半田小片１Ａを真空吸着で吸着し得る所定の平面となるように、各工具の寸法が設定される。 In the solder piece 1A manufactured by punching, the accuracy of the second surface 12, the fourth surface 14, the fifth surface 15 and the sixth surface 16 serving as the shearing surface is the same as that of the first punch 41 and the die 40. It is determined by the clearance with the hole 40a. For this reason, each of the first surface 11, the second surface 12, the third surface 13, and the fourth surface 14 that can serve as suction surfaces is a predetermined plane that can suck the solder pieces 1A by vacuum suction. The tool dimensions are set.
＜本実施の形態のチップソルダの製造方法例＞
次に、各図を参照して、本実施の形態のチップソルダの製造方法の一例について説明する。本実施の形態のチップソルダ１０Ａは、供給テープ３の開口凹部３０に半田小片１Ａを収納して構成される。
<Example of manufacturing method of chip solder of this embodiment>
Next, an example of a manufacturing method of the chip solder according to the present embodiment will be described with reference to each drawing. The chip solder 10 </ b> A according to the present embodiment is configured by housing the solder piece 1 </ b> A in the opening recess 30 of the supply tape 3.
半田小片１Ａの形状と、供給テープ３の開口凹部３０の形状から、半田小片１Ａは、向きを揃えて整列させることなく、第１の面１１、第２の面１２、第３の面１３および第４の面１４のいずれか１面を、開口凹部３０から露出させる向きで収納することができる。 Due to the shape of the solder piece 1A and the shape of the opening recess 30 of the supply tape 3, the solder piece 1A has the first surface 11, the second surface 12, the third surface 13 and the like without being aligned and aligned. Any one of the fourth surfaces 14 can be stored in a direction to be exposed from the opening recess 30.
一方、半田小片１Ａは、第５の面１５および第５の面１５と対向する第６の面１６が、開口凹部から露出させる向きで供給テープ３に収納されることはない。 On the other hand, the solder piece 1A is not accommodated in the supply tape 3 with the fifth surface 15 and the sixth surface 16 facing the fifth surface 15 being exposed from the opening recess.
これにより、チップソルダ１０Ａは、半田小片１Ａにおいて、真空吸着で吸着し得る所定の平面で構成される第１の面１１、第２の面１２、第３の面１３および第４の面１４のいずれかを吸着面とすることができ、半田小片１Ａを確実に吸着させることができる。また、チップソルダ１０Ａは、吸着に不向きな形状のだれ部が吸着面にないことから、吸着不良の発生が抑えられ、吸着不良に伴う半田小片１Ａの供給不良を防ぐことができる。 As a result, the chip solder 10 </ b> A has any one of the first surface 11, the second surface 12, the third surface 13, and the fourth surface 14 configured by a predetermined plane that can be attracted by vacuum suction in the solder piece 1 </ b> A. This can be used as an adsorption surface, and the solder piece 1A can be reliably adsorbed. In addition, since the chip solder 10A does not have a drooping portion with a shape unsuitable for suction on the suction surface, the occurrence of suction failure can be suppressed, and supply failure of the solder piece 1A due to suction failure can be prevented.
＜本実施の形態の半田小片の変形例＞
図６は、本実施の形態の半田小片の変形例を示す斜視図である。変形例の半田小片１Ｂは第５の面１５と、第５の面１５と対向する第６の面１６を長方形で構成したものである。半田小片の寸法は、必要とする半田補充量に応じて、例えば表１に示す３タイプの寸法から選択して使用することができる。
<Modification of Solder Piece of this Embodiment>
FIG. 6 is a perspective view showing a modification of the solder piece of the present embodiment. The solder piece 1B of the modified example is configured such that the fifth surface 15 and the sixth surface 16 facing the fifth surface 15 are formed in a rectangular shape. The size of the solder piece can be selected from, for example, three types shown in Table 1 according to the required amount of solder replenishment.
本考案は、ソルダーペーストに加えて、半田小片をランドに搭載して半田を補充する工法に適用される。 The present invention is applied to a method of replenishing solder by mounting solder pieces on lands in addition to solder paste.
１Ａ・・・半田小片、１１・・・第１の面、１２・・・第２の面、１３・・・第３の面、１４・・・第４の面、１５・・・第５の面、１６・・・第６の面、１０Ａ・・・チップソルダ、３・・・供給テープ、３０・・・開口凹部、４１・・・第１パンチ、４２・・・第２パンチ。 DESCRIPTION OF SYMBOLS 1A ... Solder piece, 11 ... 1st surface, 12 ... 2nd surface, 13 ... 3rd surface, 14 ... 4th surface, 15 ... 5th Surface, 16 ... sixth surface, 10A ... chip solder, 3 ... supply tape, 30 ... opening recess, 41 ... first punch, 42 ... second punch.
Claims (3)
いずれの面も屈曲や変形のない吸着面に形成されてなることを特徴とする半田小片。 A rectangular solder piece formed from a flat solder material,
A small solder piece characterized in that any surface is formed on a suction surface without bending or deformation.
ダイ上に供給された前記半田素材に対して、ダイ孔に向かって第１パンチを該第１パンチの先端が該半田素材の打ち抜き位置の半分まで進行させて半打ち抜き状態とし、半打ち抜き状態とした該半田素材を、該第１パンチと対向する第２パンチと該第１パンチとで押圧して該半田素材を平滑化し、平滑化させた該半田素材に対して、該第１パンチで打ち抜いて得られることを特徴とする半田小片。 A rectangular solder piece formed from a flat solder material,
With respect to the solder material supplied on the die, the first punch is moved toward the die hole so that the tip of the first punch advances to half of the punching position of the solder material to form a half-punched state. The solder material is pressed by the second punch opposite to the first punch and the first punch to smooth the solder material, and the smoothed solder material is punched by the first punch. Solder piece characterized by being obtained by
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2015145015A (en) * | 2014-02-03 | 2015-08-13 | ウツミ電気株式会社 | Small solder piece, chip solder, and method of manufacturing small solder piece |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2015145015A (en) * | 2014-02-03 | 2015-08-13 | ウツミ電気株式会社 | Small solder piece, chip solder, and method of manufacturing small solder piece |
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