JP2014212146A - 半導体素子、その製造方法および半導体装置 - Google Patents
半導体素子、その製造方法および半導体装置 Download PDFInfo
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Abstract
Description
本発明の実施の形態について、図面を用いて以下に説明する。図1(a)は、実施の形態に係る半導体素子1a(耐熱性樹脂形成前)の断面図であり、図1(b)は、実施の形態に係る半導体素子1b(耐熱性樹脂形成後)の断面図である。最初に、図1(b)に示す半導体素子1bについて、図1(a)に示す半導体素子1aを用いながら説明する。
Claims (8)
- ダイシング加工により個片化された半導体素子であって、
半導体基体と、
前記半導体基体における前記ダイシング加工が施された部分に生じた形状欠陥を埋め込んで形成された耐熱樹脂層と、
を備えた、半導体素子。 - 前記半導体基体は、ビッカース硬度が1046を超える材料で形成された、請求項1記載の半導体素子。
- 前記耐熱樹脂層と前記半導体基体との密着性は、15MPa以上である、請求項1または請求項2記載の半導体素子。
- 前記耐熱樹脂層は、ポリイミド系樹脂またはポリアミド系樹脂により形成された、請求項1〜3のいずれか1つに記載の半導体素子。
- 前記半導体基体はSiCにより形成された、請求項1記載の半導体素子。
- 前記耐熱樹脂層は、20℃の蒸気圧で800Pa以下の溶媒に耐熱樹脂の溶質を溶解させた溶液を用いて形成された、請求項1記載の半導体素子。
- 請求項1〜6のいずれか1つに記載の半導体素子の製造方法であって、
前記半導体基体におけるダイシング加工が施された部分に耐熱樹脂の溶液を塗布する工程と、
真空処理と過熱処理を施して前記耐熱樹脂層を形成する工程と、
を備えた、半導体素子の製造方法。 - 請求項1〜6のいずれか1つに記載の半導体素子と、
前記半導体素子の電極層に接続されたリード部材と、
前記半導体素子における前記電極層の形成面と対向する面と電気的に接続された通電部材と、
前記通電部材の少なくとも一部、前記半導体素子および前記リード部材を封止する封止樹脂と、
を備えた半導体装置。
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU169376U1 (ru) * | 2016-10-26 | 2017-03-16 | Закрытое акционерное общество "ГРУППА КРЕМНИЙ ЭЛ" | Защитное покрытие полупроводникового прибора на основе карбида кремния |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06216282A (ja) * | 1993-01-19 | 1994-08-05 | Hitachi Ltd | 樹脂封止型半導体装置 |
JP2011165871A (ja) * | 2010-02-09 | 2011-08-25 | Denso Corp | 電子装置およびその製造方法 |
JP2011228336A (ja) * | 2010-04-15 | 2011-11-10 | Mitsubishi Electric Corp | 半導体装置および半導体装置の製造方法 |
-
2013
- 2013-04-17 JP JP2013086237A patent/JP2014212146A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06216282A (ja) * | 1993-01-19 | 1994-08-05 | Hitachi Ltd | 樹脂封止型半導体装置 |
JP2011165871A (ja) * | 2010-02-09 | 2011-08-25 | Denso Corp | 電子装置およびその製造方法 |
JP2011228336A (ja) * | 2010-04-15 | 2011-11-10 | Mitsubishi Electric Corp | 半導体装置および半導体装置の製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU169376U1 (ru) * | 2016-10-26 | 2017-03-16 | Закрытое акционерное общество "ГРУППА КРЕМНИЙ ЭЛ" | Защитное покрытие полупроводникового прибора на основе карбида кремния |
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