JP2014211540A5 - - Google Patents

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Publication number
JP2014211540A5
JP2014211540A5 JP2013087826A JP2013087826A JP2014211540A5 JP 2014211540 A5 JP2014211540 A5 JP 2014211540A5 JP 2013087826 A JP2013087826 A JP 2013087826A JP 2013087826 A JP2013087826 A JP 2013087826A JP 2014211540 A5 JP2014211540 A5 JP 2014211540A5
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JP
Japan
Prior art keywords
developable
photosensitive resin
wiring board
printed wiring
flexible printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013087826A
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Japanese (ja)
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JP2014211540A (en
JP5847754B2 (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2013087826A external-priority patent/JP5847754B2/en
Priority to JP2013087826A priority Critical patent/JP5847754B2/en
Priority to PCT/JP2014/060986 priority patent/WO2014171525A1/en
Priority to KR1020157028866A priority patent/KR102229343B1/en
Priority to CN201480021937.5A priority patent/CN105164585B/en
Priority to TW103114237A priority patent/TWI614571B/en
Publication of JP2014211540A publication Critical patent/JP2014211540A/en
Publication of JP2014211540A5 publication Critical patent/JP2014211540A5/ja
Publication of JP5847754B2 publication Critical patent/JP5847754B2/en
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (7)

現像性接着層（Ａ）と、
該現像性接着層（Ａ）を介してフレキシブルプリント配線板に積層される現像性保護層（Ｂ）と、を有する感光性樹脂構造体であって、
少なくとも前記現像性保護層（Ｂ）は、光照射によりパターニングが可能であり、かつ、前記現像性接着層（Ａ）と前記現像性保護層（Ｂ）は、現像によりパターンを一括して形成することが可能であり、
前記現像性接着層（Ａ）が、前記現像性保護層（Ｂ）よりも厚いことを特徴とする感光性樹脂構造体。 A developable adhesive layer (A);
A developable protective layer (B) laminated on the flexible printed wiring board via the developable adhesive layer (A), and a photosensitive resin structure comprising:
At least the developable protective layer (B) can be patterned by light irradiation, and the developable adhesive layer (A) and the developable protective layer (B) collectively form a pattern by development. it is possible der is,
The photosensitive resin structure , wherein the developable adhesive layer (A) is thicker than the developable protective layer (B) . 前記現像性接着層（Ａ）と前記現像性保護層（Ｂ）が共に、光照射によりパターニングが可能である請求項１に記載の感光性樹脂構造体。   The photosensitive resin structure according to claim 1, wherein both the developable adhesive layer (A) and the developable protective layer (B) can be patterned by light irradiation. フレキシブルプリント配線板の屈曲部及び非屈曲部のうちの少なくともいずれか一方に用いられる請求項１又は２に記載の感光性樹脂構造体。 The photosensitive resin structure of Claim 1 or 2 used for at least any one of the bending part and non-bending part of a flexible printed wiring board. フレキシブルプリント配線板のカバーレイ及びソルダーレジストのうちの少なくともいずれか一方を形成するために用いられる請求項１〜３のいずれか１項に記載の感光性樹脂構造体。 The photosensitive resin structure of any one of Claims 1-3 used in order to form at least any one of the coverlay and soldering resist of a flexible printed wiring board. 請求項１〜４のいずれか１項に記載の感光性樹脂構造体の少なくとも片面が、フィルムで支持又は保護されていることを特徴とするドライフィルム。 A dry film, wherein at least one surface of the photosensitive resin structure according to any one of claims 1 to 4 is supported or protected by a film. フレキシブルプリント配線板上に形成された請求項１〜４のうちいずれか１項に記載の感光性樹脂構造体を光照射によりパターニングし、現像によりパターンを一括して形成してなる保護膜を有することを特徴とするフレキシブルプリント配線板。 It has the protective film formed by patterning the photosensitive resin structure of any one of Claims 1-4 formed on the flexible printed wiring board by light irradiation, and forming a pattern collectively by image development A flexible printed wiring board characterized by that. 前記現像性接着層（Ａ）は、フレキシブルプリント配線板上に、感光性又は非感光性の樹脂組成物（Ａ１）を塗布して形成される請求項６に記載のフレキシブルプリント配線板。 The flexible printed wiring board according to claim 6 , wherein the developable adhesive layer (A) is formed by applying a photosensitive or non-photosensitive resin composition (A1) on the flexible printed wiring board.
JP2013087826A 2013-04-18 2013-04-18 Photosensitive resin structure, dry film, and flexible printed wiring board Active JP5847754B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013087826A JP5847754B2 (en) 2013-04-18 2013-04-18 Photosensitive resin structure, dry film, and flexible printed wiring board
PCT/JP2014/060986 WO2014171525A1 (en) 2013-04-18 2014-04-17 Laminate structure, flexible printed wiring board and method for manufacturing same
KR1020157028866A KR102229343B1 (en) 2013-04-18 2014-04-17 Laminate structure, flexible printed wiring board and method for manufacturing same
CN201480021937.5A CN105164585B (en) 2013-04-18 2014-04-17 Laminated structure, flexible printed circuit board, and method for manufacturing same
TW103114237A TWI614571B (en) 2013-04-18 2014-04-18 Laminated structure, flexible printed wiring board and method of manufacturing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013087826A JP5847754B2 (en) 2013-04-18 2013-04-18 Photosensitive resin structure, dry film, and flexible printed wiring board

Publications (3)

Publication Number Publication Date
JP2014211540A JP2014211540A (en) 2014-11-13
JP2014211540A5 true JP2014211540A5 (en) 2015-03-26
JP5847754B2 JP5847754B2 (en) 2016-01-27

Family

ID=51931343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013087826A Active JP5847754B2 (en) 2013-04-18 2013-04-18 Photosensitive resin structure, dry film, and flexible printed wiring board

Country Status (1)

Country Link
JP (1) JP5847754B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107850847B (en) * 2015-08-05 2021-04-13 太阳油墨制造株式会社 Laminated structure, dry film, and flexible printed circuit board
CN105549160A (en) * 2015-11-27 2016-05-04 青岛海信宽带多媒体技术有限公司 Optical module
WO2023188296A1 (en) * 2022-03-31 2023-10-05 株式会社レゾナック Photosensitive multilayer resin film, printed wiring board, semiconductor package and method for producing printed wiring board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3966743B2 (en) * 2002-02-28 2007-08-29 三井化学株式会社 Multilayer photosensitive resin film and insulating film comprising the same
JP2005300857A (en) * 2004-04-09 2005-10-27 Fuji Photo Film Co Ltd Photosensitive transfer sheet, photosensitive laminate, image pattern forming method, and wiring pattern forming method
JP2009025699A (en) * 2007-07-23 2009-02-05 Kaneka Corp Photosensitive dry film resist, printed wiring board using same, and method for producing printed wiring board
JP2009048170A (en) * 2007-07-24 2009-03-05 Kaneka Corp Photosensitive dry film resist, and printed wiring board and method for producing printed wiring board using the same
JP2010204174A (en) * 2009-02-27 2010-09-16 Fujifilm Corp Photosensitive laminate and photosensitive film, and production method of printed board

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