JP2016027435A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2016027435A5 JP2016027435A5 JP2015221229A JP2015221229A JP2016027435A5 JP 2016027435 A5 JP2016027435 A5 JP 2016027435A5 JP 2015221229 A JP2015221229 A JP 2015221229A JP 2015221229 A JP2015221229 A JP 2015221229A JP 2016027435 A5 JP2016027435 A5 JP 2016027435A5
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive
- resin layer
- film
- dry film
- photosensitive dry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims 13
- 239000011347 resin Substances 0.000 claims 13
- -1 isocyanate compound Chemical class 0.000 claims 4
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive Effects 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 230000001681 protective Effects 0.000 claims 2
- 239000011342 resin composition Substances 0.000 claims 2
- 230000003746 surface roughness Effects 0.000 claims 2
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2H-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims 1
- 229920003180 amino resin Polymers 0.000 claims 1
- 150000001718 carbodiimides Chemical class 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 235000013533 rum Nutrition 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 150000003553 thiiranes Chemical class 0.000 claims 1
Claims (5)
前記支持フィルムが、熱可塑性樹脂とフィラーとを含む樹脂組成物からなり、
前記支持フィルムの、感光性樹脂層を設ける面側の算術平均表面粗さＲａが５０〜３９０ｎｍであり、
前記感光性樹脂層を形成する際に用いられる感光性樹脂組成物が、イソシアネート化合物、ブロックイソシアネート化合物、アミノ樹脂、マレイミド化合物、ベンゾオキサジン樹脂、カルボジイミド樹脂、シクロカーボネート化合物、多官能エポキシ化合物、多官能オキセタン化合物、およびエピスルフィド樹脂からなる群より選択される熱硬化性成分を少なくとも１種以上含んでなることを特徴とする、ソルダーレジスト層形成用感光性ドライフィルム。 A photosensitive dry film comprising a support film and a photosensitive resin layer provided on one surface of the support film,
The support film is made of a resin composition containing a thermoplastic resin and a filler,
Wherein the support film, the arithmetic average surface roughness Ra of the surface side provided with a photosensitive resin layer is Ri 50~390nm der,
The photosensitive resin composition used for forming the photosensitive resin layer is an isocyanate compound, a blocked isocyanate compound, an amino resin, a maleimide compound, a benzoxazine resin, a carbodiimide resin, a cyclocarbonate compound, a polyfunctional epoxy compound, a polyfunctional compound. A photosensitive dry film for forming a solder resist layer , comprising at least one thermosetting component selected from the group consisting of an oxetane compound and an episulfide resin .
製造する方法であって、A method of manufacturing comprising:
基板上に、前記感光性ドライフィルムの感光性樹脂層を貼合し、前記感光性ドライフィA photosensitive resin layer of the photosensitive dry film is bonded onto a substrate, and the photosensitive dry film is bonded.
ルムの支持フィルム上から露光を行い、Perform exposure from the support film of Rum,
前記感光性ドライフィルムから支持フィルムを剥離して現像を行うことにより、前記基By removing the support film from the photosensitive dry film and developing, the base
上にパターニングされた樹脂層を形成し、 Form a patterned resin layer on top,
前記パターニングされた樹脂層を光照射ないし熱により硬化させて、硬化被膜を形成すThe patterned resin layer is cured by light irradiation or heat to form a cured film.
る、ことを含んでなり、 Comprising
前記硬化被膜表面の算術平均表面粗さＲａが５０〜３９０ｎｍである、プリント配線板A printed wiring board having an arithmetic average surface roughness Ra of 50 to 390 nm on the surface of the cured coating
の製造方法。Manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015221229A JP6227617B2 (en) | 2014-06-30 | 2015-11-11 | Photosensitive dry film and method for producing printed wiring board using the same |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014135225 | 2014-06-30 | ||
| JP2014135225 | 2014-06-30 | ||
| JP2015221229A JP6227617B2 (en) | 2014-06-30 | 2015-11-11 | Photosensitive dry film and method for producing printed wiring board using the same |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015025558A Division JP5882510B2 (en) | 2014-06-30 | 2015-02-12 | Photosensitive dry film and method for producing printed wiring board using the same |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017130666A Division JP2017191336A (en) | 2014-06-30 | 2017-07-03 | Photosensitive dry film and process for producing printed wiring board using the same |
| JP2017130660A Division JP6258547B2 (en) | 2014-06-30 | 2017-07-03 | Photosensitive dry film and method for producing printed wiring board using the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016027435A JP2016027435A (en) | 2016-02-18 |
| JP2016027435A5 true JP2016027435A5 (en) | 2016-09-23 |
| JP6227617B2 JP6227617B2 (en) | 2017-11-08 |
Family
ID=55352798
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015221229A Active JP6227617B2 (en) | 2014-06-30 | 2015-11-11 | Photosensitive dry film and method for producing printed wiring board using the same |
| JP2017130660A Active JP6258547B2 (en) | 2014-06-30 | 2017-07-03 | Photosensitive dry film and method for producing printed wiring board using the same |
| JP2017130666A Pending JP2017191336A (en) | 2014-06-30 | 2017-07-03 | Photosensitive dry film and process for producing printed wiring board using the same |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017130660A Active JP6258547B2 (en) | 2014-06-30 | 2017-07-03 | Photosensitive dry film and method for producing printed wiring board using the same |
| JP2017130666A Pending JP2017191336A (en) | 2014-06-30 | 2017-07-03 | Photosensitive dry film and process for producing printed wiring board using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (3) | JP6227617B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6690367B2 (en) * | 2016-03-31 | 2020-04-28 | 日立化成株式会社 | Photosensitive resin composition, photosensitive resin film, method for producing cured product, laminate, and electronic component |
| JP6409106B1 (en) * | 2017-08-30 | 2018-10-17 | 太陽インキ製造株式会社 | Curable resin composition, dry film, cured product and printed wiring board |
| JP2019178305A (en) * | 2018-03-30 | 2019-10-17 | 太陽インキ製造株式会社 | Curable resin composition, dry film composed of the composition, cured product and printed wiring board having the cured product |
| JP7225553B2 (en) * | 2018-03-30 | 2023-02-21 | 住友ベークライト株式会社 | Resin sheet for forming solder resist |
| JP7345457B2 (en) * | 2018-05-16 | 2023-09-15 | 株式会社レゾナック | Method for forming photosensitive film and permanent mask resist |
| JP7001866B1 (en) | 2020-08-26 | 2022-01-20 | 株式会社タムラ製作所 | A method for manufacturing a photosensitive dry film and a printed wiring board using a photosensitive dry film. |
| CN116635789A (en) * | 2020-12-25 | 2023-08-22 | 富士胶片株式会社 | Transfer material and method for producing laminate |
| WO2022202661A1 (en) * | 2021-03-25 | 2022-09-29 | 太陽インキ製造株式会社 | Laminate structure, cured product of resin layer in said laminate structure, electronic component, and cured product formation method |
| CN113835298B (en) * | 2021-09-30 | 2023-11-28 | 明冠新材料股份有限公司 | Photosensitive dry film and preparation method thereof |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006154622A (en) * | 2004-12-01 | 2006-06-15 | Fuji Photo Film Co Ltd | Pattern forming material and pattern forming method |
| JP2007178500A (en) * | 2005-12-27 | 2007-07-12 | Fujifilm Corp | Photosensitive film, permanent pattern and method for forming the same |
| JP2008166313A (en) * | 2006-12-26 | 2008-07-17 | Nichigo Morton Co Ltd | Method for forming resist pattern |
| JP2008250246A (en) * | 2007-03-30 | 2008-10-16 | Fujifilm Corp | Method for manufacturing photosensitive laminate, and printed wiring board and method for manufacturing the same |
| JP2009223142A (en) * | 2008-03-18 | 2009-10-01 | Fujifilm Corp | Surface roughening and treating method for photosensitive film, and photosensitive film |
| JP2010072340A (en) * | 2008-09-18 | 2010-04-02 | Fujifilm Corp | Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern forming method, and printed circuit board |
| JP2010085513A (en) * | 2008-09-30 | 2010-04-15 | Toyo Ink Mfg Co Ltd | Photosensitive dry film |
| JP2011043854A (en) * | 2010-11-15 | 2011-03-03 | Asahi Kasei E-Materials Corp | Photosensitive resin laminate |
| CN103299242B (en) * | 2010-12-28 | 2016-08-10 | 太阳油墨制造株式会社 | Photocurable resin composition, its dry film and solidfied material and use their printed circuit board (PCB) |
| JP5829035B2 (en) * | 2011-03-31 | 2015-12-09 | 太陽インキ製造株式会社 | Photocurable resin composition, dry film, cured product, and printed wiring board |
| JP5514356B2 (en) * | 2012-09-28 | 2014-06-04 | 太陽インキ製造株式会社 | Photocurable resin composition, printed wiring board, and method for producing photocurable resin composition |
| KR101734425B1 (en) * | 2013-09-24 | 2017-05-11 | 주식회사 엘지화학 | Preparation method for dry film solder resist and film laminate used therein |
| JP5864524B2 (en) * | 2013-12-26 | 2016-02-17 | 太陽ホールディングス株式会社 | Photocurable resin composition |
| JP6841585B2 (en) * | 2014-03-27 | 2021-03-10 | 積水化学工業株式会社 | Manufacturing method of laminated structure and laminated film |
| JP6683125B2 (en) * | 2014-04-25 | 2020-04-15 | 日立化成株式会社 | Photosensitive element, laminated body, permanent mask resist, manufacturing method thereof, and manufacturing method of semiconductor package |
-
2015
- 2015-11-11 JP JP2015221229A patent/JP6227617B2/en active Active
-
2017
- 2017-07-03 JP JP2017130660A patent/JP6258547B2/en active Active
- 2017-07-03 JP JP2017130666A patent/JP2017191336A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2016027435A5 (en) | ||
| ATE496977T1 (en) | TOPCOAT COMPOSITION, ALKALINE DEVELOPER SOLUBLE TOPCOAT FILM COMPRISING THE COMPOSITION AND PATTERN FORMING METHOD USING THERETO | |
| JP2008516121A5 (en) | ||
| JP2013529724A5 (en) | ||
| JP2010199541A5 (en) | ||
| JP2007103924A5 (en) | ||
| JP2007176169A5 (en) | ||
| JP2016510169A5 (en) | ||
| JP2009099649A5 (en) | ||
| JP2010219210A5 (en) | Semiconductor device | |
| JP2013533605A5 (en) | ||
| JP2019507206A5 (en) | ||
| JP2013532222A5 (en) | ||
| SG11201907482YA (en) | Pellicle, exposure original plate, exposure device, and semiconductor device manufacturing method | |
| JP2016064641A5 (en) | ||
| JP2020062878A5 (en) | ||
| JP2016096246A5 (en) | Method for forming solder resist on flexible printed wiring board and printed wiring board | |
| JP2003156667A5 (en) | ||
| JP2018125378A5 (en) | ||
| KR20220035927A (en) | A thermosetting resin composition, a thermosetting resin film, a thermosetting film, a laminated body, and a printed wiring board, and its manufacturing method | |
| JP2018149803A5 (en) | ||
| JP2014211540A5 (en) | ||
| TW200641524A (en) | Photosensitive solder resist composition, photosensitive solder resist film, permanent pattern and method for forming the same | |
| JP2008122844A5 (en) | ||
| JP2018136522A5 (en) |