JP2016064641A5 - - Google Patents
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- JP2016064641A5 JP2016064641A5 JP2015130967A JP2015130967A JP2016064641A5 JP 2016064641 A5 JP2016064641 A5 JP 2016064641A5 JP 2015130967 A JP2015130967 A JP 2015130967A JP 2015130967 A JP2015130967 A JP 2015130967A JP 2016064641 A5 JP2016064641 A5 JP 2016064641A5
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- JP
- Japan
- Prior art keywords
- resin composition
- epoxy resin
- photosensitive resin
- manufacturing
- trifunctional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003822 epoxy resin Substances 0.000 claims description 35
- 229920000647 polyepoxide Polymers 0.000 claims description 35
- 239000011342 resin composition Substances 0.000 claims description 24
- 230000001588 bifunctional Effects 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 239000007788 liquid Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- FAYMLNNRGCYLSR-UHFFFAOYSA-M Triphenylsulfonium triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 FAYMLNNRGCYLSR-UHFFFAOYSA-M 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 3
- 230000003287 optical Effects 0.000 claims 4
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
Description
本発明の光造形物の製造方法は、表面に開口する穴が形成された基板上に、穴を塞ぐように感光性樹脂組成物をドライフィルム形態で貼り、パターニングすることで光造形物を製造する光造形物の製造方法において、感光性樹脂組成物が、三官能以上のエポキシ樹脂と、二官能エポキシ樹脂と、を含む樹脂と、光酸発生剤とを含有し、二官能エポキシ樹脂の重量平均分子量（Ｍw）が５５００〜６００００であり、樹脂の重量平均分子量（Ｍw）が４５００〜１１０００となる範囲であり、三官能以上のエポキシ樹脂と二官能エポキシ樹脂の質量混合比が、三官能以上のエポキシ樹脂の質量を（ａ）とし、二官能エポキシ樹脂の質量を（ｂ）として、（ｂ）／（ａ）≦１．５であることを特徴とする。 The method for producing an optically shaped article of the present invention produces an optically shaped article by pasting and patterning a photosensitive resin composition in the form of a dry film so as to close the hole on a substrate having holes formed on the surface. In the method for producing an optically shaped article, the photosensitive resin composition contains a resin containing a trifunctional or higher functional epoxy resin and a bifunctional epoxy resin, and a photoacid generator, and the weight of the bifunctional epoxy resin The average molecular weight ( Mw ) is 5500 to 60000, the weight average molecular weight ( Mw ) of the resin is 4500 to 11000, and the mass mixing ratio of the trifunctional or higher functional epoxy resin to the bifunctional epoxy resin is 3 It is characterized in that (b) / (a) ≦ 1.5, where (a) is the mass of a functional or higher epoxy resin and (b) is the mass of a bifunctional epoxy resin.
本発明の液体吐出ヘッドの製造方法は、吐出エネルギー発生素子と液体の供給路とが形成された基板上に、感光性樹脂組成物をドライフィルム形態で貼る液体吐出ヘッドの製造方法において、感光性樹脂組成物が、三官能以上のエポキシ樹脂と、二官能エポキシ樹脂と、を含む樹脂と、光酸発生剤とを含有し、二官能エポキシ樹脂の重量平均分子量（Ｍw）が５５００〜６００００であり、樹脂の重量平均分子量（Ｍw）が４５００〜１１０００となる範囲であり、三官能以上のエポキシ樹脂と二官能エポキシ樹脂の質量混合比が、三官能以上のエポキシ樹脂の質量を（ａ）とし、二官能エポキシ樹脂の質量を（ｂ）として、（ｂ）／（ａ）≦１．５であることを特徴とする。 The method for producing a liquid ejection head of the present invention is a method for producing a liquid ejection head in which a photosensitive resin composition is pasted in a dry film form on a substrate on which an ejection energy generating element and a liquid supply path are formed. The resin composition contains a resin containing a trifunctional or higher functional epoxy resin and a bifunctional epoxy resin, and a photoacid generator, and the weight average molecular weight (M w ) of the bifunctional epoxy resin is 5500 to 60000. Yes, the weight average molecular weight (M w ) of the resin is in the range of 4500 to 11000, and the mass mixing ratio of the trifunctional or higher functional epoxy resin and the bifunctional epoxy resin is the mass of the trifunctional or higher functional epoxy resin (a) The mass of the bifunctional epoxy resin is (b), and (b) / (a) ≦ 1.5.
Claims (14)
前記感光性樹脂組成物が、三官能以上のエポキシ樹脂と、二官能エポキシ樹脂と、を含む樹脂と、光酸発生剤とを含有し、前記二官能エポキシ樹脂の重量平均分子量（Ｍw）が５５００〜６００００であり、前記樹脂の重量平均分子量（Ｍw）が４５００〜１１０００であり、前記三官能以上のエポキシ樹脂と前記二官能エポキシ樹脂の質量混合比が、前記三官能以上のエポキシ樹脂の質量を（ａ）とし、前記二官能エポキシ樹脂の質量を（ｂ）として、（ｂ）／（ａ）≦１．５であることを特徴とする、光造形物の製造方法。 In the manufacturing method of the optical modeling object which manufactures the optical modeling object by pasting and patterning the photosensitive resin composition in the form of a dry film so as to block the hole on the substrate in which the hole opening on the surface is formed,
The photosensitive resin composition contains a trifunctional or higher functional epoxy resin and a bifunctional epoxy resin, and a photoacid generator, and the bifunctional epoxy resin has a weight average molecular weight (M w ). 5500 to 60000, the weight average molecular weight (M w ) of the resin is 4500 to 11000, and the mass mixing ratio of the trifunctional or higher functional epoxy resin to the bifunctional epoxy resin is that of the trifunctional or higher functional epoxy resin. A method for producing an optically shaped article, wherein (b) / (a) ≦ 1.5, wherein (a) is the mass, and (b) is the mass of the bifunctional epoxy resin.
前記感光性樹脂組成物が、三官能以上のエポキシ樹脂と、二官能エポキシ樹脂と、を含む樹脂と、光酸発生剤とを含有し、前記二官能エポキシ樹脂の重量平均分子量（Ｍw）が５５００〜６００００であり、かつ、前記樹脂の重量平均分子量（Ｍw）が４５００〜１１０００であり、前記三官能以上のエポキシ樹脂と前記二官能エポキシ樹脂の質量混合比が、前記三官能以上のエポキシ樹脂の質量を（ａ）とし、前記二官能エポキシ樹脂の質量を（ｂ）として、（ｂ）／（ａ）≦１．５であることを特徴とする、液体吐出ヘッドの製造方法。 In a method for manufacturing a liquid discharge head, in which a photosensitive resin composition is pasted in a dry film form on a substrate on which a discharge energy generating element and a liquid supply path are formed.
The photosensitive resin composition contains a trifunctional or higher functional epoxy resin and a bifunctional epoxy resin, and a photoacid generator, and the bifunctional epoxy resin has a weight average molecular weight (M w ). 5500 to 60000, the weight average molecular weight (M w ) of the resin is 4500 to 11000, and the mixing ratio of the trifunctional or higher epoxy resin to the bifunctional epoxy resin is the trifunctional or higher epoxy. A method of manufacturing a liquid discharge head, wherein (b) / (a) ≦ 1.5, wherein (b) is the mass of the resin and (b) is the mass of the bifunctional epoxy resin.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/828,736 US9599893B2 (en) | 2014-09-25 | 2015-08-18 | Production process for optically shaped product and production process for liquid discharge head |
| EP15002614.4A EP3001248B1 (en) | 2014-09-25 | 2015-09-07 | Production process for liquid discharge head |
| CN201510623132.4A CN105467757B (en) | 2014-09-25 | 2015-09-25 | The production method of light molding and the production method of liquid discharging head |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014194701 | 2014-09-25 | ||
| JP2014194701 | 2014-09-25 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016064641A JP2016064641A (en) | 2016-04-28 |
| JP2016064641A5 true JP2016064641A5 (en) | 2018-07-05 |
| JP6635692B2 JP6635692B2 (en) | 2020-01-29 |
Family
ID=55804785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015130967A Active JP6635692B2 (en) | 2014-09-25 | 2015-06-30 | Method for manufacturing stereolithography and method for manufacturing liquid ejection head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6635692B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6961470B2 (en) * | 2017-01-17 | 2021-11-05 | キヤノン株式会社 | Liquid discharge head and its manufacturing method |
| US10031415B1 (en) * | 2017-08-21 | 2018-07-24 | Funai Electric Co., Ltd. | Method to taylor mechanical properties on MEMS devices and nano-devices with multiple layer photoimageable dry film |
| US20190056659A1 (en) * | 2017-08-21 | 2019-02-21 | Funai Electric Co., Ltd. | Method for manufacturing mems devices using multiple photoacid generators in a composite photoimageable dry film |
| JP2019107874A (en) * | 2017-12-18 | 2019-07-04 | 株式会社エンプラス | Lamination molding method |
| WO2019124150A1 (en) * | 2017-12-18 | 2019-06-27 | 株式会社エンプラス | Additive layer manufacturing method |
| JP7134825B2 (en) * | 2018-10-05 | 2022-09-12 | キヤノン株式会社 | Microstructure manufacturing method and liquid ejection head manufacturing method |
| JP7473996B2 (en) * | 2020-08-07 | 2024-04-24 | 株式会社トクヤマデンタル | Dental hardenable composition |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4593309B2 (en) * | 2005-01-21 | 2010-12-08 | 東京応化工業株式会社 | Method for forming a top plate in a precise fine space |
| JP4789733B2 (en) * | 2006-07-21 | 2011-10-12 | 日本化薬株式会社 | Photosensitive resin composition, laminate thereof, cured product thereof, and pattern forming method using the composition |
| JP2008180879A (en) * | 2007-01-24 | 2008-08-07 | Tokyo Ohka Kogyo Co Ltd | Photosensitive resin composition and resist pattern forming method using the same |
| JP5020645B2 (en) * | 2007-01-24 | 2012-09-05 | 東京応化工業株式会社 | Photosensitive resin composition and pattern forming method using the same |
| JP2009119725A (en) * | 2007-11-15 | 2009-06-04 | Canon Inc | Inkjet recording head and method for manufacturing inkjet recording head |
| JP5814691B2 (en) * | 2011-08-11 | 2015-11-17 | 互応化学工業株式会社 | Resin resin composition |
| JP5959941B2 (en) * | 2012-05-31 | 2016-08-02 | キヤノン株式会社 | Method for manufacturing liquid discharge head |
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2015
- 2015-06-30 JP JP2015130967A patent/JP6635692B2/en active Active
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