JP2013230594A5 - - Google Patents
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- JP2013230594A5 JP2013230594A5 JP2012103357A JP2012103357A JP2013230594A5 JP 2013230594 A5 JP2013230594 A5 JP 2013230594A5 JP 2012103357 A JP2012103357 A JP 2012103357A JP 2012103357 A JP2012103357 A JP 2012103357A JP 2013230594 A5 JP2013230594 A5 JP 2013230594A5
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- Prior art keywords
- liquid
- resin layer
- photosensitive resin
- manufacturing
- discharge head
- Prior art date
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- 239000007788 liquid Substances 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 9
- 238000007599 discharging Methods 0.000 claims description 4
- 230000000149 penetrating Effects 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 5
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003211 photoinitiator Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
Description
そこで、本発明の一形態は、
液体を吐出する吐出口と、該吐出口に連通する液体流路と、前記液体を吐出するためのエネルギーを発生する吐出エネルギー発生素子と、前記液体流路に前記液体を供給する液体供給口と、を有する液体吐出ヘッドの製造方法であって、
(1)第一の面側に、前記吐出エネルギー発生素子と、前記第一の面から突出する部材とを有し、かつ前記第一の面から前記第一の面と反対側の第二の面まで貫通する前記液体供給口としての貫通口を有する基板を用意する工程と、
(2)前記基板及び前記部材の上に第一のネガ型感光性ドライフィルムを用いて第一のネガ型感光性樹脂層を形成する工程と、
(3)前記第一のネガ型感光性樹脂層に第一の露光によって第一の潜像を形成する工程と、
(4)前記第一の潜像が形成された第一のネガ型感光性樹脂層の上に第二のネガ型感光性ドライフィルムを用いて第二のネガ型感光性樹脂層を形成する工程と、
(5)前記第二のネガ型感光性樹脂層に第二の露光によって第二の潜像を形成する工程と、
(6)前記第一の潜像及び前記第二の潜像を現像処理によって除去することにより、前記液体流路及び前記吐出口を形成する工程と、
を有する液体吐出ヘッドの製造方法である。
なお本明細書中で、前記工程(1)に記載される部材を「高さ調整部材」と呼ぶことがある。
Therefore, one aspect of the present invention is
A discharge port for discharging a liquid, a liquid flow path communicating with the discharge port, a discharge energy generating element for generating energy for discharging the liquid, and a liquid supply port for supplying the liquid to the liquid flow path A method of manufacturing a liquid discharge head comprising:
(1) to the first surface side, and the discharge energy generating element, said first possess a member protruding from the surface, and from the first surface opposite to the second and the first surface Preparing a substrate having a through-hole as the liquid supply port penetrating to a surface ;
(2) forming a first negative photosensitive resin layer by using the first negative type photosensitive dry film on the substrate and the front SL member,
(3) forming a first latent image on the first negative photosensitive resin layer by first exposure;
(4) A step of forming a second negative photosensitive resin layer using a second negative photosensitive dry film on the first negative photosensitive resin layer on which the first latent image is formed. When,
(5) forming a second latent image on the second negative photosensitive resin layer by second exposure;
(6) forming the liquid flow path and the ejection port by removing the first latent image and the second latent image by development processing;
A method of manufacturing a liquid discharge head having
In the present specification, the member described in the step (1) may be referred to as a “height adjusting member”.
また、第一のネガ型感光性樹脂層9の表面は、高さ調整用部材5の表面にならうように形成することが好ましい。つまり、高さ調整用部材の高さに表面を合わせて第一のネガ型感光性樹脂層を形成することが好ましい。さらに換言すると、第一のネガ型感光性樹脂層の厚さと高さ調整用部材5の厚さ(高さ)が等しくなるように第一のネガ型感光性樹脂層を形成することが好ましい。このように第一のネガ型感光性樹脂層を形成するために、第一のネガ型感光性ドライフィルムの未露光時のTg(ガラス転移温度)以上で第一のネガ型感光性樹脂層を形成することが好ましい。また、第一のネガ型感光性ドライフィルムにローラ等で圧力をかけて第一のネガ型感光性樹脂層を形成することが好ましい。 The surface of the first negative photosensitive resin layer 9 is preferably formed so as to follow the surface of the height adjusting member 5. That is, it is preferable to form the first negative photosensitive resin layer by matching the surface with the height of the height adjusting member. In other words, the first negative photosensitive resin layer is preferably formed so that the thickness of the first negative photosensitive resin layer is equal to the thickness (height) of the height adjusting member 5. Thus, in order to form the first negative photosensitive resin layer, the first negative photosensitive resin layer has a T g (glass transition temperature) or higher at the time of unexposed of the first negative photosensitive dry film. Is preferably formed. Moreover, it is preferable to apply pressure to the first negative photosensitive dry film with a roller or the like to form the first negative photosensitive resin layer.
なお、Tg以上の温度で圧力をかけて転写した第一のネガ型感光性樹脂層は、その一部が供給口3に流れ込む場合があるが、この流れ込んだ部分は後工程で除去される。 Note that the first negative type photosensitive resin layer transferred under pressure at T g above temperature, there is a case where a part flows into the supply port 3, the flowed part is removed in a later step .
第一のネガ型感光性ドライフィルムの材料としては、エポキシ樹脂を用いた。また、第一のネガ型感光性ドライフィルムの材料には、感光性を持たすためにトリアリールスルホニウム塩を光開始剤として含ませている。また、この感光性ドライフィルムは、i線ステッパーキヤノン製FPA3000i5+(商品名)を使用して5000Jで露光すると残膜100%となるようなネガ型レジストであるように調整した。本材料を用いて平均膜厚が15μmとなるようにドライフィルムを作製した。本材料の未硬化でのTgが約60℃なので、70℃で0.5MPaの圧力で、真空中で、前記シリコン基板に前記ドライフィルムを貼りつけ、14μmの共通配線高さに表面を合わせて表面が平坦となるように基板上に第一のネガ型感光性樹脂層を形成した。この時、高さ調整用部材に対して垂直方向(基板面と平行な方向)にローラーを動かして転写した。 Epoxy resin was used as the material for the first negative photosensitive dry film. Further, the material of the first negative photosensitive dry film contains a triarylsulfonium salt as a photoinitiator in order to provide photosensitivity. In addition, this photosensitive dry film was adjusted to be a negative resist that would result in 100% remaining film when exposed at 5000 J using FPA3000i5 + (trade name) manufactured by i-line Stepper Canon. Using this material, a dry film was produced so that the average film thickness was 15 μm. Since T g of about 60 ° C. in uncured this material, at 0.5MPa pressure at 70 ° C., in vacuum, it attached the dry film on the silicon substrate, aligning the surface to the common wiring height of 14μm Then, a first negative photosensitive resin layer was formed on the substrate so that the surface was flat. At this time, transfer was performed by moving a roller in a direction perpendicular to the height adjusting member (a direction parallel to the substrate surface).
第一のネガ型感光性樹脂層は、実施例1と同じドライフィルムを用いて形成した。具体的には、本材料の未硬化でのTgが約60℃なので、70℃で、0.5MPaの圧力で、真空中で、ドライフィルムを貼りつけ、14μmの端子高さに表面を合わせて表面が平坦となるように基板上に第一のネガ型感光性樹脂層を形成した。この時、高さ調整用部材に対して垂直方向(基板面と平行な方向)にローラーを動かして転写した。なお、端子は分離しているが、間隔(中心同士の距離)は30μmから60μmであり、転写ローラー径が60mmであるため、端子が分離していることの影響はない。 The first negative photosensitive resin layer was formed using the same dry film as in Example 1. Specifically, since T g of about 60 ° C. in uncured this material, at 70 ° C., at a pressure of 0.5 MPa, in a vacuum, pasting a dry film, combined surface 14μm terminal height Then, a first negative photosensitive resin layer was formed on the substrate so that the surface was flat. At this time, transfer was performed by moving a roller in a direction perpendicular to the height adjusting member (a direction parallel to the substrate surface). Although the terminals are separated, the distance (distance between the centers) is 30 to 60 μm and the transfer roller diameter is 60 mm, so there is no influence of the separation of the terminals.
Claims (10)
(1)第一の面側に、前記吐出エネルギー発生素子と、前記第一の面から突出する部材とを有し、かつ前記第一の面から前記第一の面と反対側の第二の面まで貫通する前記液体供給口としての貫通口を有する基板を用意する工程と、
(2)前記基板及び前記部材の上に第一のネガ型感光性ドライフィルムを用いて第一のネガ型感光性樹脂層を形成する工程と、
(3)前記第一のネガ型感光性樹脂層に第一の露光によって第一の潜像を形成する工程と、
(4)前記第一の潜像が形成された第一のネガ型感光性樹脂層の上に第二のネガ型感光性ドライフィルムを用いて第二のネガ型感光性樹脂層を形成する工程と、
(5)前記第二のネガ型感光性樹脂層に第二の露光によって第二の潜像を形成する工程と、
(6)前記第一の潜像及び前記第二の潜像を現像処理によって除去することにより、前記液体流路及び前記吐出口を形成する工程と、
を有する液体吐出ヘッドの製造方法。 A discharge port for discharging a liquid, a liquid flow path communicating with the discharge port, a discharge energy generating element for generating energy for discharging the liquid, and a liquid supply port for supplying the liquid to the liquid flow path A method of manufacturing a liquid discharge head comprising:
(1) to the first surface side, and the discharge energy generating element, said first possess a member protruding from the surface, and from the first surface opposite to the second and the first surface Preparing a substrate having a through-hole as the liquid supply port penetrating to a surface ;
(2) forming a first negative photosensitive resin layer by using the first negative type photosensitive dry film on the substrate and the front SL member,
(3) forming a first latent image on the first negative photosensitive resin layer by first exposure;
(4) A step of forming a second negative photosensitive resin layer using a second negative photosensitive dry film on the first negative photosensitive resin layer on which the first latent image is formed. When,
(5) forming a second latent image on the second negative photosensitive resin layer by second exposure;
(6) forming the liquid flow path and the ejection port by removing the first latent image and the second latent image by development processing;
A method of manufacturing a liquid discharge head having
Priority Applications (1)
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JP2012103357A JP6029316B2 (en) | 2012-04-27 | 2012-04-27 | Method for manufacturing liquid discharge head |
Applications Claiming Priority (1)
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JP2012103357A JP6029316B2 (en) | 2012-04-27 | 2012-04-27 | Method for manufacturing liquid discharge head |
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JP2013230594A JP2013230594A (en) | 2013-11-14 |
JP2013230594A5 true JP2013230594A5 (en) | 2015-05-28 |
JP6029316B2 JP6029316B2 (en) | 2016-11-24 |
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JP6238760B2 (en) * | 2014-01-16 | 2017-11-29 | キヤノン株式会社 | Structure manufacturing method and liquid discharge head manufacturing method |
JP6525698B2 (en) * | 2015-04-14 | 2019-06-05 | キヤノン株式会社 | Method of manufacturing liquid discharge head |
JP6566709B2 (en) * | 2015-05-07 | 2019-08-28 | キヤノン株式会社 | Inkjet recording head substrate |
JP2018024211A (en) * | 2016-08-12 | 2018-02-15 | キヤノン株式会社 | Method for manufacturing liquid discharge head |
EP3877184A4 (en) * | 2019-04-29 | 2022-06-15 | Hewlett-Packard Development Company, L.P. | Manufacturing a corrosion tolerant micro-electromechanical fluid ejection device |
US11787180B2 (en) | 2019-04-29 | 2023-10-17 | Hewlett-Packard Development Company, L.P. | Corrosion tolerant micro-electromechanical fluid ejection device |
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JP2694054B2 (en) * | 1990-12-19 | 1997-12-24 | キヤノン株式会社 | Liquid jet recording head, method of manufacturing the same, and recording apparatus having liquid jet recording head |
JPH11245425A (en) * | 1998-02-27 | 1999-09-14 | Casio Comput Co Ltd | Manufacture for thermal ink-jet head |
JP2007083711A (en) * | 2005-08-23 | 2007-04-05 | Canon Inc | Manufacturing method of ink jet recording head |
US8268539B2 (en) * | 2010-07-23 | 2012-09-18 | Caron Kabushiki Kaisha | Method of manufacturing liquid ejection head |
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