JP2014209580A5 - - Google Patents
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- Publication number
- JP2014209580A5 JP2014209580A5 JP2014045009A JP2014045009A JP2014209580A5 JP 2014209580 A5 JP2014209580 A5 JP 2014209580A5 JP 2014045009 A JP2014045009 A JP 2014045009A JP 2014045009 A JP2014045009 A JP 2014045009A JP 2014209580 A5 JP2014209580 A5 JP 2014209580A5
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- mold
- pad portion
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 11
- 230000003014 reinforcing effect Effects 0.000 claims 10
- 238000004519 manufacturing process Methods 0.000 claims 8
- 239000002184 metal Substances 0.000 claims 7
- 238000000429 assembly Methods 0.000 claims 4
- 230000000712 assembly Effects 0.000 claims 4
- 238000005530 etching Methods 0.000 claims 2
- 239000011159 matrix material Substances 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000005229 chemical vapour deposition Methods 0.000 claims 1
- 238000005240 physical vapour deposition Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014045009A JP6104832B2 (ja) | 2013-03-25 | 2014-03-07 | 発光素子組立体及びその製造方法、並びに、表示装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013061433 | 2013-03-25 | ||
| JP2013061433 | 2013-03-25 | ||
| JP2014045009A JP6104832B2 (ja) | 2013-03-25 | 2014-03-07 | 発光素子組立体及びその製造方法、並びに、表示装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014209580A JP2014209580A (ja) | 2014-11-06 |
| JP2014209580A5 true JP2014209580A5 (OSRAM) | 2016-03-31 |
| JP6104832B2 JP6104832B2 (ja) | 2017-03-29 |
Family
ID=51568493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014045009A Expired - Fee Related JP6104832B2 (ja) | 2013-03-25 | 2014-03-07 | 発光素子組立体及びその製造方法、並びに、表示装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9312461B2 (OSRAM) |
| JP (1) | JP6104832B2 (OSRAM) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016101652A1 (de) * | 2016-01-29 | 2017-08-03 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit Seitenkontakten |
| JP7328560B2 (ja) | 2019-12-24 | 2023-08-17 | 日亜化学工業株式会社 | 発光装置の製造方法および発光装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4066620B2 (ja) * | 2000-07-21 | 2008-03-26 | 日亜化学工業株式会社 | 発光素子、および発光素子を配置した表示装置ならびに表示装置の製造方法 |
| JP4082242B2 (ja) | 2003-03-06 | 2008-04-30 | ソニー株式会社 | 素子転写方法 |
| JP4673610B2 (ja) * | 2004-11-25 | 2011-04-20 | シチズン電子株式会社 | 表面実装型発光ダイオード |
| JP5692952B2 (ja) * | 2007-12-11 | 2015-04-01 | シチズン電子株式会社 | 発光ダイオード |
| US20090284932A1 (en) * | 2008-03-25 | 2009-11-19 | Bridge Semiconductor Corporation | Thermally Enhanced Package with Embedded Metal Slug and Patterned Circuitry |
| JP2010087224A (ja) * | 2008-09-30 | 2010-04-15 | Toyoda Gosei Co Ltd | Ｌｅｄ表示装置およびｌｅｄ表示装置用隔壁の製造方法 |
| JP5482293B2 (ja) * | 2009-03-05 | 2014-05-07 | 日亜化学工業株式会社 | 光半導体装置及びその製造方法 |
| JP5691681B2 (ja) * | 2010-03-15 | 2015-04-01 | 日亜化学工業株式会社 | 発光装置 |
| JP2011253970A (ja) * | 2010-06-03 | 2011-12-15 | Panasonic Corp | 光半導体装置用パッケージおよびその製造方法 |
| US8652860B2 (en) * | 2011-01-09 | 2014-02-18 | Bridgelux, Inc. | Packaging photon building blocks having only top side connections in a molded interconnect structure |
-
2014
- 2014-03-07 JP JP2014045009A patent/JP6104832B2/ja not_active Expired - Fee Related
- 2014-03-24 US US14/223,263 patent/US9312461B2/en not_active Expired - Fee Related
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