JP2014209562A - Wiring board manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a housing hole in a support substrate without generating burrs.SOLUTION: A manufacturing method of a multilayer wiring board 1 comprises: firstly forming a through hole which pierces a metal layer in the metal layer formed on a surface P1 of a support substrate 21; forming a housing hole 24 in the support substrate 21, the housing hole piercing the support substrate 21, by boring the support substrate 21 by inserting a drill into the through hole from the surface P1 side of the support substrate 21 or performing a laser treatment or punching; and subsequently burying an electronic component 5 in the housing hole 24. An opening 241 of the housing hole 24 is formed in a positional relation where a circumference of an opening of the through hole and a circumference of the opening of the housing hole 24 on the surface P1 side have no contact with each other and the entire opening 241 is included in the projection region of the opening of the through hole in orthographic projection on a reference plane parallel with a surface of the support substrate 21.

Description

  The present invention relates to a method for manufacturing a wiring board in which electronic components are embedded.

  There is known a wiring board in which a build-up layer in which insulating layers and conductor layers are alternately laminated is formed on a supporting board. In order to form an accommodation hole for embedding an electronic component inside the support substrate of such a wiring substrate, a technique is known in which a support substrate having a metal layer formed on both sides is punched with a drill (for example, a patent) Reference 1).

JP 2006-339482 A

  However, in the technique described in Patent Document 1, burrs are generated at the peripheral portion of the through-hole formed in the metal layer due to punching out the metal layer with a drill. There is a problem that a separate process is required, which adversely affects the productivity of the wiring board.

  Further, when the through hole is formed by laser processing or punching processing on the metal layer, there is a problem in that burrs are generated at the peripheral portion of the through hole, as in the case of punching with a drill.

  The present invention has been made in view of these problems, and an object of the present invention is to provide a technique capable of forming an accommodation hole in a support substrate without generating burrs.

  A first invention made to achieve the above object includes a buildup layer configured by laminating at least one insulating layer and at least one conductor layer, a support substrate that supports the buildup layer, A method for manufacturing a wiring board including an electronic component embedded in a support substrate, wherein a first through hole penetrating the first metal layer is formed in a first metal layer formed on a surface of the support substrate. The first through hole forming step and inserting the drill into the first through hole from the upper surface side, with the surface of the support substrate on which the first metal layer is formed as the upper surface and the other surface as the lower surface Then, by drilling the support substrate with a drill, a housing hole forming step for forming a housing hole penetrating the support substrate in the support substrate, and an embedding step for embedding an electronic component in the housing hole, In the 1 through hole forming step, in the first through hole The opening of the first through-hole opening and the opening on the upper surface side of the housing hole as the housing-hole opening, the surface of the support substrate without contact between the periphery of the first through-hole opening and the periphery of the housing-hole opening In the orthographic projection onto the reference plane parallel to the substrate, the housing hole opening is formed in a positional relationship that is entirely contained within the projection region of the first through-hole opening. It is.

  In the manufacturing method of the wiring board configured as described above, first, in the first through hole forming step, the first through hole penetrating the first metal layer is formed in the first metal layer formed on the surface of the support substrate. To do. Then, in the accommodation hole forming step, by inserting a drill into the first through hole from the surface (upper surface) side of the support substrate on which the first metal layer is formed, and drilling the support substrate with the drill An accommodation hole penetrating the support substrate is formed in the support substrate. Thereafter, an electronic component is embedded in the accommodation hole.

  And the opening part (accommodating hole opening part) of the upper surface side in the accommodation hole is an orthographic projection onto the reference plane parallel to the surface of the support substrate, and the opening part (first through hole opening part) in the first through hole. The peripheral edge and the peripheral edge of the receiving hole opening are not in contact with each other, and are formed in a positional relationship in which they are entirely included in the projection region of the first through-hole opening.

  For this reason, in order to form the accommodation hole in the support substrate, the drill is inserted into the first through hole from the upper surface side of the support substrate with the axial direction of the drill perpendicular to the upper surface of the support substrate. In addition, it is possible to prevent the drill from coming into contact with the first metal layer. Thereby, the accommodation hole can be formed in the support substrate without generating a burr at the peripheral edge of the accommodation hole opening.

  Furthermore, the first through-hole opening portion without the contact between the peripheral edge of the first through-hole opening portion and the peripheral edge of the storage-hole opening portion in the orthogonal projection onto the reference plane parallel to the surface of the support substrate. In such a projection area, the cracks can be prevented from occurring in the resin material filled between the accommodation hole and the electronic component.

  In the method for manufacturing a wiring board according to the first aspect, when the second metal layer is formed on the lower surface of the support substrate, the second metal layer is formed on the lower surface of the support substrate before the accommodation hole forming step is performed. The second metal layer has a second through-hole forming step for forming a second through-hole penetrating the second metal layer, and the second through-hole forming step includes a second through-hole opening in the second through-hole. In the orthographic projection onto a reference plane parallel to the surface of the support substrate without contacting the periphery of the first through-hole opening and the periphery of the second through-hole opening as the hole opening, the first through-hole opening is It is preferable to form the second through-hole opening in a positional relationship in which the entirety is included in the projection region.

  When drilling the support substrate with the drill with the axial direction of the drill perpendicular to the upper surface of the support substrate in the accommodation hole forming step, the axial direction of the drill may deviate from the direction perpendicular to the upper surface. In this case, the opening area on the lower surface side of the accommodation hole may have an opening area larger than the opening portion (accommodation hole opening portion) on the upper surface side of the accommodation hole.

  In such a case, the second through-hole opening is formed in a positional relationship that completely coincides with the entire first through-hole opening in orthographic projection onto a reference plane parallel to the surface of the support substrate. Then, burrs may occur on the lower surface side of the support substrate. This is because when the drill inserted from the upper surface side of the support substrate passes through the support substrate and reaches the lower surface side, the drill may come into contact with the second metal layer, and the drill may punch the second metal layer.

  In contrast, in the method for manufacturing a wiring board according to the first aspect of the present invention, the first through-hole opening is formed in the orthographic projection onto the reference plane parallel to the surface of the support substrate. The two through-hole openings are formed in a positional relationship that is entirely contained within the projection area of the second through-hole opening without contacting the periphery of the through-hole opening.

  As a result, even when the axial direction of the drill fluctuates when the support substrate is drilled with the drill, the second case when the drill inserted from the upper surface side of the support substrate reaches the lower surface side through the support substrate. Generation | occurrence | production of the situation which contacts a metal layer can be suppressed. Therefore, when the second metal layer is formed on the lower surface of the support substrate, it is possible to suppress the occurrence of burrs at the peripheral edge portion of the opening on the lower surface side in the accommodation hole.

  The method for manufacturing a wiring board according to the first aspect of the present invention may be applied when the accommodation hole forming step forms one accommodation hole by drilling the support substrate a plurality of times with a drill. A specific example of such a housing hole is one in which the housing hole opening has an oval shape.

  In the case of forming a single accommodation hole by drilling the support substrate a plurality of times without forming the first through hole in the first metal layer (that is, by punching out the first metal layer), the first metal There is a possibility that the drill will contact a plurality of times at the same location of the layer, and the burrs are more likely to occur as the number of contacts increases.

  On the other hand, in the method for manufacturing a wiring board according to the first aspect of the present invention, even in the case where one accommodation hole is formed by drilling the support board a plurality of times with a drill, the drill is formed in the first through hole. It is possible to prevent the drill from coming into contact with the first metal layer when inserting the hole, and it is possible to form the accommodation hole in the support substrate without generating burrs. Therefore, in the case where one accommodation hole is formed by drilling the support substrate a plurality of times with a drill, if the method for manufacturing a wiring substrate of the first invention is applied, the burr reduction effect is increased.

In the method for manufacturing a wiring board according to the first aspect of the present invention, in the orthographic projection onto a reference plane parallel to the surface of the support substrate, the accommodation hole opening and the first through hole opening are preferably similar in shape. .
If the accommodation hole opening and the first through-hole opening have a similar shape, the accommodation hole opening is always provided if the opening area of the first through-hole opening is larger than the opening area of the accommodation hole opening. In the orthographic projection onto the reference plane parallel to the surface of the support substrate, the receiving hole opening can be arranged so as to be entirely included in the projection region of the first through hole opening.

  Then, if the shape of the accommodation hole opening is determined, the first through hole opening is then included so that the entire accommodation hole opening is included in the projection region of the first through hole opening. It can be determined under a simple condition such as “similar shape having an opening area larger than that of the opening of the accommodation hole”, and the pattern design of the wiring board can be simplified.

  Furthermore, a method for manufacturing a wiring board according to a second invention made to achieve the above object includes a build-up layer formed by laminating at least one insulating layer and at least one conductor layer, and a build-up layer. A method of manufacturing a wiring board comprising a support substrate for supporting a layer and an electronic component embedded in the support substrate, wherein the first metal layer is formed on the first metal layer formed on the surface of the support substrate. A first through hole forming step for forming a first through hole penetrating the first through hole, and a surface of the support substrate on which the first metal layer is formed is an upper surface and the other surface is a lower surface; A receiving hole forming step for forming a receiving hole penetrating the supporting substrate in the supporting substrate by performing laser processing or punching processing in one through hole and piercing the supporting substrate, and embedding the electronic component in the receiving hole An embedding process, In the 1 through hole forming step, the opening of the first through hole is defined as the first through hole opening, and the opening on the upper surface side of the accommodation hole is defined as the accommodation hole opening. In the orthographic projection onto a reference plane parallel to the surface of the support substrate without contacting the peripheral edge of the portion, the accommodation hole opening is in a positional relationship that is entirely included in the projection region of the first through-hole opening. It is characterized by forming.

  In the manufacturing method of the wiring board configured as described above, first, in the first through hole forming step, the first through hole penetrating the first metal layer is formed in the first metal layer formed on the surface of the support substrate. To do. Then, in the accommodation hole forming step, the support substrate is perforated by applying laser processing or punching into the first through hole from the surface (upper surface) side of the support substrate on which the first metal layer is formed. Thus, an accommodation hole penetrating the support substrate is formed in the support substrate. Thereafter, an electronic component is embedded in the accommodation hole.

  And the opening part (accommodating hole opening part) of the upper surface side in the accommodation hole is an orthographic projection onto the reference plane parallel to the surface of the support substrate, and the opening part (first through hole opening part) in the first through hole. The peripheral edge and the peripheral edge of the receiving hole opening are not in contact with each other, and are formed in a positional relationship in which they are entirely included in the projection region of the first through-hole opening.

  For this reason, in order to form the accommodation hole in the support substrate, when laser processing or punching processing is performed in the first through hole from the upper surface side, the laser beam or the punch die is not in contact with the first metal layer. Can be. Thereby, the accommodation hole can be formed in the support substrate without generating a burr at the peripheral edge of the accommodation hole opening.

1 is a cross-sectional view illustrating a schematic configuration of a multilayer wiring board 1. FIG. 3 is a first cross-sectional view showing a manufacturing process of the multilayer wiring board 1. 6 is a second cross-sectional view showing the manufacturing process of the multilayer wiring board 1; FIG. FIG. 4 is a plan view of through holes 611 and 621 and a cross-sectional view of FIG. 3. FIG. 6 is a third cross-sectional view showing the manufacturing process of the multilayer wiring board 1. It is a top view of the opening part 241 which shows the method of forming an oval-shaped through-hole. FIG. 6 is a plan view of openings 241 and 242 and through holes 611 and 621 and a cross-sectional view of FIG. 5. It is a figure which shows the positional relationship of the opening parts 241 and 242 and the through-holes 611 and 621. FIG. 10 is a fourth cross-sectional view showing the manufacturing process of the multilayer wiring board 1. FIG. 10 is a fifth cross-sectional view showing the manufacturing process of the multilayer wiring board 1. FIG. 10 is a sixth cross-sectional view showing the manufacturing process of the multilayer wiring board 1.

Embodiments of the present invention will be described below with reference to the drawings.
As shown in FIG. 1, the multilayer wiring board 1 according to the embodiment to which the present invention is applied includes a support layer 2 and build-up layers 3 and 4, and includes one surface P1 and the other surface P2 of the support layer 2. Each of them is configured by laminating the buildup layer 3 and the buildup layer 4 along the stacking direction SD.

  First, the support layer 2 includes a support substrate 21 and conductor layers 22 and 23. The support substrate 21 is a plate-like member made of glass fiber impregnated with an epoxy resin, for example, and has high rigidity. The conductor layer 22 and the conductor layer 23 are laminated on one surface (surface P1) and the other surface (surface P2) of the support substrate 21, respectively.

An accommodation hole 24 that penetrates the support substrate 21 is formed in the support substrate 21. An electronic component 5 (in this embodiment, a multilayer capacitor) is embedded in the accommodation hole 24.
Next, the buildup layer 3 includes an insulating layer 31, a conductor layer 32, and a via conductor 33. The build-up layer 3 is configured by laminating an insulating layer 31 and a conductor layer 32 along the laminating direction SD. The via conductor 33 is formed in the insulating layer 31 so as to extend in the stacking direction SD. Thereby, the conductor layer 32 is electrically connected to the conductor layer 22.

  The buildup layer 4 includes an insulating layer 41, a conductor layer 42, and a via conductor 43. The buildup layer 4 is configured by laminating an insulating layer 41 and a conductor layer 42 along the laminating direction SD. The via conductor 43 is formed in the insulating layer 41 so as to extend in the stacking direction SD. Thereby, the conductor layer 42 is electrically connected to the conductor layer 23 and the electronic component 5.

Next, a method for manufacturing the multilayer wiring board 1 to which the present invention is applied will be described.
As shown in FIG. 2, first, a support substrate 21 is prepared in which a metal layer 61 and a metal layer 62 (copper in this embodiment) are laminated on a surface P1 and a surface P2, respectively.

  Then, unnecessary metal layers 61 and 62 are removed by a subtractive method. Thereby, as shown in FIG. 3, the conductor layers 22 and 23 which have a predetermined pattern are formed. Therefore, the metal layers 61 and 62 formed to have a predetermined pattern correspond to the conductor layers 22 and 23, respectively.

  4 shows a plan view of through holes 611 and 621 (described later) in association with the cross-sectional view of FIG. As shown in FIG. 4, in the metal layer 61, the region that contacts the opening 241 on the surface P <b> 1 side in the accommodation hole 24 (shown by a broken line because it will be formed in a later process) has an opening 241 from the surface P <b> 1 side. A through-hole 611 having an opening arranged so as to be visible as a whole is formed.

  Similarly, in the metal layer 62, a through-hole 621 having an opening disposed so that the entire opening 242 can be visually recognized from the surface P2 side is formed in a region of the accommodation hole 24 that is in contact with the opening 242 on the surface P2 side. Is done.

  The opening 241 of the accommodation hole 24 is formed in an oval shape. The through hole 611 is formed in an oval shape similar to the oval shape of the opening 241 and having an opening area larger than that of the opening 241.

  The opening 242 of the accommodation hole 24 is formed in an oval shape. The through hole 621 is formed in an oval shape similar to the oval shape of the opening 242 and having a larger opening area than the opening 242.

  Then, by inserting a drill into the through hole 611 from the surface P1 side, the support substrate 21 is drilled with the drill, and the accommodation hole 24 penetrating the support substrate 21 is formed as shown in FIG. At this time, the drill is inserted so that its axial direction is along the stacking direction SD.

  As shown in FIG. 6, the receiving holes 24 are drills whose cross sections perpendicular to the axial direction are circular, and are positioned at different positions along the major axis direction LA of the oval through-holes 611 (dotted lines in the figure). Circles DR1, DR2, DR3, DR4, and DR5)).

  Further, when the drill is inserted into the support substrate 21 so that the axial direction of the drill is along the stacking direction SD, the axial direction of the drill may deviate from the stacking direction SD. For this reason, as shown in FIG. 7, the opening 242 on the surface P2 side in the accommodation hole 24 may have an opening area larger than the opening 241 on the surface P1 side. For this reason, the through hole 621 is formed in an oval shape having a larger opening area than the through hole 611. FIG. 7 shows a plan view of the openings 241 and 242 and the through holes 611 and 621 in association with the cross-sectional view of FIG.

FIG. 8 shows the positional relationship between the openings 241 and 242 and the through holes 611 and 621 in orthogonal projection onto a reference plane parallel to the surface of the support substrate 21.
As shown in FIG. 8, in the orthogonal projection onto the reference plane parallel to the surface of the support substrate 21, the opening portion 241 penetrates without the contact between the periphery of the opening portion of the through hole 611 and the periphery of the opening portion 241. The whole is included in the projection area of the opening of the hole 611. Further, the opening 242 is entirely included in the projection region of the opening of the through hole 621 without the periphery of the opening of the through hole 621 contacting the periphery of the opening 242. Further, the through hole 611 is entirely included in the projection region of the opening of the through hole 621 without the peripheral edge of the opening of the through hole 611 contacting the peripheral edge of the opening of the through hole 621.

Thereafter, as shown in FIG. 9, the peelable adhesive tape 70 is attached to the surface P <b> 2 side of the support substrate 21, thereby closing the opening 242 of the accommodation hole 24 with the adhesive tape 70.
Then, the electronic component 5 is inserted into the accommodation hole 24 from the opening 241 side, and the electronic component 5 is placed on the adhesive tape 70. The electronic component 5 is fixed on the adhesive tape 70 by the adhesive force of the adhesive tape 70, and the electronic component 5 is accommodated in the accommodation hole 24 as shown in FIG.

  Thereafter, with respect to the surface P1 of the support substrate 21, a film-like resin material (for example, epoxy resin) is disposed on the support substrate 21, and the resin material is cured by applying pressure under vacuum to form the insulating layer 31. . As a result, as shown in FIG. 11, the surface P <b> 1 of the support substrate 21 and the conductor layer 22 are covered with the insulating layer 31. In addition, the insulating layer 31 is filled in the gap between the accommodation hole 24 and the electronic component 5, and the electronic component 5 is embedded in the accommodation hole 24.

Then, the adhesive tape 70 is removed, and the insulating layer 41 is formed on the surface P2 of the support substrate 21 by using the same process as that for forming the insulating layer 31.
A plurality of via holes are formed in the insulating layers 31 and 41 by irradiating a predetermined position on the surfaces of the insulating layers 31 and 41 with a laser. Further, a process (desmear process) for removing smear generated in the via hole due to the formation of the via hole is performed. Then, a thin electroless plating layer (copper in this embodiment) is formed on the insulating layers 31 and 41 by performing electroless plating. Then, a predetermined resist pattern corresponding to the wiring pattern of the conductor layers 32 and 42 is formed on the electroless plating layer. Further, by performing electroplating, a plating layer (copper in this embodiment) is formed in a region not covered with the resist. Thereafter, unnecessary electroless plating layers and resist are removed by etching. As a result, as shown in FIG. 1, via conductors 33 and 43 are formed in the via hole, and conductor layers 32 and 42 having a predetermined wiring pattern are formed.

  In the method of manufacturing the multilayer wiring board 1 configured as described above, first, the through hole 611 that penetrates the metal layer 61 is formed in the metal layer 61 formed on the surface P1 of the support substrate 21. Then, by inserting a drill into the through hole 611 from the surface P1 side of the support substrate 21 and drilling the support substrate 21 with the drill, an accommodation hole 24 penetrating the support substrate 21 is formed in the support substrate 21. . Thereafter, the electronic component 5 is embedded in the accommodation hole 24.

  Then, the opening 241 of the accommodation hole 24 is formed so that the periphery of the opening of the through hole 611 and the periphery of the opening 241 are not in contact with each other in orthographic projection onto a reference plane parallel to the surface of the support substrate 21. Are formed in a positional relationship in which they are entirely included in the projection area of the opening.

  For this reason, in order to form the accommodation hole 24 in the support substrate 21, the drill is inserted into the through hole 611 from the surface P 1 side of the support substrate 21 with the axial direction of the drill perpendicular to the surface P 1 of the support substrate 21. When the drill is inserted, the drill can be prevented from coming into contact with the metal layer 61. Thereby, the accommodation hole 24 can be formed in the support substrate 21 without generating burrs at the peripheral edge of the opening 241.

  Furthermore, in the orthogonal projection onto the reference plane parallel to the surface of the support substrate 21, the opening 241 of the accommodation hole 24 is not in contact with the periphery of the opening of the through-hole 611 and the periphery of the opening 241. By being formed in a positional relationship in which the entirety is included in the projection area of the opening portion of 611, the occurrence of cracks in the resin material filled between the accommodation hole 24 and the electronic component 5 is suppressed. be able to.

  As shown in Table 1, when the distance between the peripheral edge of the opening of the through hole 611 and the peripheral edge of the opening 241 of the accommodation hole 24 (hereinafter referred to as “resin part lowering”) is 0 μm, the accommodation hole 24 and the electron Cracks occur in the resin material filled between the parts 5. On the other hand, when the resin part pull-down is 10 μm to 150 μm, no crack occurs. The resin part pull-down is preferably 10 to 100 μm.

In the method for manufacturing the multilayer wiring board 1, the through hole 621 that penetrates the metal layer 62 is formed in the second metal layer formed on the surface P <b> 2 of the support substrate 21. The through hole 611 is formed in the through hole 621 without the contact between the periphery of the opening of the through hole 611 and the periphery of the opening of the through hole 621 in orthographic projection onto a reference plane parallel to the surface of the support substrate 21. Are formed in a positional relationship in which they are entirely included in the projection area of the opening.

  Thereby, even if the axial direction of the drill fluctuates when drilling the support substrate 21 with a drill, the drill inserted from the surface P1 side of the support substrate 21 passes through the support substrate 21 and reaches the surface P2 side. In this case, it is possible to suppress the occurrence of a situation where the metal layer 62 comes into contact. Therefore, when the metal layer 62 is formed on the surface P <b> 2 of the support substrate 21, it is possible to suppress the occurrence of burrs at the peripheral edge portion of the opening 242 of the accommodation hole 24.

Moreover, in the manufacturing method of the multilayer wiring board 1, the one accommodation hole 24 is formed by drilling the support substrate 21 several times with a drill.
When the support substrate 21 is perforated several times without forming the through hole 611 in the metal layer 61 (that is, by punching the metal layer 61 with a drill), the same metal layer 61 is used. There is a possibility that the drill may come into contact with a part multiple times, and burrs are more likely to occur as the number of contacts increases.

  On the other hand, in the manufacturing method of the multilayer wiring board 1, a drill is formed in the through-hole 611 even when the support board 21 is drilled a plurality of times with a drill to form one accommodation hole 24. When inserted, the drill can be prevented from coming into contact with the metal layer 61, and the accommodation hole 24 can be formed in the support substrate 21 without generating burrs. Therefore, when the single accommodation hole 24 is formed by drilling the support substrate 21 a plurality of times with a drill, applying the method for manufacturing the multilayer wiring board 1 increases the burr reduction effect.

Further, in the method for manufacturing the multilayer wiring board 1, the opening 241 of the accommodation hole 24 and the opening of the through hole 611 are similar in orthographic projection onto a reference plane parallel to the surface of the support substrate 21.
In this way, if the opening area of the opening of the through hole 611 is larger than the opening area of the opening 241, the opening 241 is always orthogonally projected on a reference plane parallel to the surface of the support substrate 21. The opening 241 can be arranged so that the entire periphery is included in the projection region of the opening of the through hole 611 without the periphery of the opening of the through hole 611 and the periphery of the opening 241 being in contact with each other.

  If the shape of the opening 241 is determined, the opening of the through hole 611 is then moved to “open” so that the entire opening 241 is included in the projection region of the opening of the through hole 611. It can be determined under a simple condition such as “similar shape having an opening area larger than that of the portion 241”, and the pattern design of the multilayer wiring board 1 can be simplified.

  In the embodiment described above, the multilayer wiring board 1 is the wiring board in the present invention, the metal layer 61 is the first metal layer in the present invention, the through hole 611 is the first through hole in the present invention, the surface P1 is the upper surface in the present invention, The surface P2 is the lower surface in the present invention, the metal layer 62 is the second metal layer in the present invention, and the through hole 621 is the second through hole in the present invention.

As mentioned above, although one Embodiment of this invention was described, this invention is not limited to the said embodiment, As long as it belongs to the technical scope of this invention, a various form can be taken.
In the above-described embodiment, the support hole 21 is formed in the support substrate 21 without generating burrs by drilling the support substrate 21 with a drill. However, instead of the drill, the receiving hole 24 may be formed in the support substrate 21 by performing laser processing or punching processing.

  Specifically, first, a through hole 611 that penetrates the metal layer 61 is formed in the metal layer 61 formed on the surface P <b> 1 of the support substrate 21. Then, laser processing or punching processing is performed from the surface P1 side of the support substrate 21 to punch the support substrate 21, thereby forming an accommodation hole 24 penetrating the support substrate 21 in the support substrate 21. Thereafter, the electronic component 5 is embedded in the accommodation hole 24.

  Then, the opening 241 of the accommodation hole 24 is formed so that the periphery of the opening of the through hole 611 and the periphery of the opening 241 are not in contact with each other in orthographic projection onto a reference plane parallel to the surface of the support substrate 21. Are formed in a positional relationship in which they are entirely included in the projection area of the opening.

  Therefore, in order to form the accommodation hole 24 in the support substrate 21, when laser processing or punching processing is performed in the through hole 611 from the surface P 1 side of the support substrate 21, the laser beam or the punch mold is a metal layer. The contact with 61 can be prevented. Thereby, the accommodation hole 24 can be formed in the support substrate 21 without generating burrs at the peripheral edge of the opening 241.

  DESCRIPTION OF SYMBOLS 1 ... Multilayer wiring board, 2 ... Support layer, 3, 4 ... Build-up layer, 5 ... Electronic component, 21 ... Support substrate, 22, 23, 32, 42 ... Conductor layer, 24 ... Housing hole, 31, 41 ... Insulation Layer, 33, 43 ... via conductor, 61,62 ... metal layer, 241,242 ... opening, 611,621 ... through hole

Claims (6)

A buildup layer configured by laminating at least one insulating layer and at least one conductor layer; a support substrate supporting the buildup layer; and an electronic component embedded in the support substrate. A method for manufacturing a wiring board comprising:
A first through hole forming step of forming a first through hole penetrating the first metal layer in the first metal layer formed on the surface of the support substrate;
A drill is inserted into the first through hole from the upper surface side, with the surface of the support substrate on which the first metal layer is formed as the upper surface and the other surface as the lower surface. An accommodation hole forming step in which an accommodation hole penetrating the support substrate is formed in the support substrate by drilling the support substrate with
Embedding the electronic component in the accommodation hole,
In the first through-hole forming step, the opening in the first through-hole is defined as a first through-hole opening, and the opening on the upper surface side of the accommodation hole is defined as a housing-hole opening. In the orthographic projection onto a reference plane parallel to the surface of the support substrate without contact between the peripheral edge of the storage hole opening and the peripheral edge of the storage hole opening, the storage hole opening is within the projection region of the first through-hole opening. A method of manufacturing a wiring board, characterized in that the wiring board is formed in a positional relationship in which the whole is included. A second through hole forming step for forming a second through hole penetrating the second metal layer in the second metal layer formed on the lower surface of the support substrate before the accommodation hole forming step is performed; Have
In the second through-hole forming step, the opening in the second through-hole is used as the second through-hole opening, and the periphery of the first through-hole opening and the periphery of the second through-hole opening are not in contact with each other. In orthographic projection onto a reference plane parallel to the surface of the support substrate, the first through-hole opening is formed in a positional relationship that is entirely contained within the projection area of the second through-hole opening. The method for manufacturing a wiring board according to claim 1. In the accommodation hole forming step,
The method for manufacturing a wiring board according to claim 1, wherein one accommodation hole is formed by drilling the support substrate a plurality of times with the drill. The method for manufacturing a wiring board according to claim 3, wherein the accommodation hole opening has an oval shape. 5. The orthographic projection onto a reference plane parallel to the surface of the support substrate, the receiving hole opening and the first through-hole opening are similar in shape. A method for manufacturing a wiring board according to claim 1. A buildup layer configured by laminating at least one insulating layer and at least one conductor layer; a support substrate supporting the buildup layer; and an electronic component embedded in the support substrate. A method for manufacturing a wiring board comprising:
A first through hole forming step of forming a first through hole penetrating the first metal layer in the first metal layer formed on the surface of the support substrate;
Of the both surfaces of the support substrate, the surface on which the first metal layer is formed is the upper surface and the other surface is the lower surface, and laser processing or punching is performed from the upper surface side into the first through hole. An accommodation hole forming step of forming an accommodation hole penetrating the support substrate in the support substrate by drilling the support substrate;
Embedding the electronic component in the accommodation hole,
In the first through-hole forming step, the opening in the first through-hole is defined as a first through-hole opening, and the opening on the upper surface side of the accommodation hole is defined as a housing-hole opening. In the orthographic projection onto a reference plane parallel to the surface of the support substrate without contact between the peripheral edge of the storage hole opening and the peripheral edge of the storage hole opening, the storage hole opening is within the projection region of the first through-hole opening. A method of manufacturing a wiring board, characterized in that the wiring board is formed in a positional relationship in which the whole is included.