JP5413632B2 - Wiring board - Google Patents

Description

  The present invention relates to a wiring board having a circuit, and particularly to a wiring board having a guide hole for circuit processing.

In the circuit processing of wiring boards, those using lasers have been increasing in recent years.
In addition, there is a strong demand for higher density and higher multi-layered wiring boards, and a thin wiring board is often used.

FIG. 1 is a schematic process diagram illustrating a manufacturing process for creating a thin wiring board having a non-through hole.
As shown in FIG. 1 (a), in order to produce a thin wiring board having non-through holes, first, a copper foil 2 on one side of a thin copper clad laminate 1 having copper foils 2 and 3 on both sides is laser processed. In order to use as a mask, the position where the non-through hole is arranged is removed by etching.

  Next, as shown in FIG. 1 (b), the copper of the copper foil 2 is partially removed, and the portion where the resin surface is exposed is irradiated with a carbon dioxide gas laser, so that the base material portion of the copper clad laminate is obtained. The non-through holes 4 and 5 are formed by removing them by combustion decomposition.

  And as shown in FIG.1 (c), the electroconductive copper plating and the electrolytic copper plating process are performed, and the plating conductor 6 is given to the inner wall and copper foil surface of the non-through-holes 4 and 5 which connect the circuit conductor of front and back, Thereafter, the outer layer copper foil (outer layer conductor) is removed by etching to form a circuit, whereby a thin wiring board 7 having non-through holes 4 and 5 as shown in FIG. 1D can be obtained.

  In FIG. 1 (b) and the like before the circuit formation shown in FIG. 1 (d), only the copper foil 2 on one side is etched or drilled. Although it is possible, a reference pattern or hole cannot be formed on the copper foil 3 side.

  As shown in FIG. 1E, the circuit arrangement (product) region 8 and the outer peripheral portion on the copper foil 2 side are also necessary for the copper foil 3 side as shown in FIG. 9, the non-through holes 10 and 11 processed using a laser are image-recognized, and as shown in FIG. 1 (f), concentric through holes 12 and 13 are provided, and the copper foils 2 and 3 are common. This can be solved by using a standard hole.

The guide hole provided here allows the image recognition of the non-through holes 10 and 11 drilled in the same process as the non-through holes 4 and 5 in the circuit formation region on the copper foil 2 side provided in advance, and the circuit formation reference hole Since 12 and 13 are provided, it is possible to obtain circuit alignment on the front and back of the wiring board 7 and high alignment accuracy between the non-through holes 4 and 5 and the outer layer circuit.
JP 2002237768

However, the one shown in FIG. 1 (e) uses a non-penetrating guide hole with low discriminating power because it is not possible to provide a penetrating guide hole with high discriminating power when performing the first circuit processing. Become.
As shown as non-through holes 10 and 11 in FIG. 1 (e), this guide hole is one recess made by laser processing, and has higher discriminating power due to increasing demand for fine wiring. Is desired.

  An object of the present invention is to provide a wiring board having a high positional accuracy, having a guide having a high discrimination power while being non-penetrating.

The present invention relates to the following.
(1) A circuit arrangement area and a non-through hole in the circuit arrangement area are processed at the same time, and a circle is drawn as a whole so that the non-through holes overlap each other. A plurality of non-through holes provided in an outer peripheral portion of the circuit arrangement region so as to have a core circle shape, and the centers of the plurality of non-through holes are processed through the plurality of non-through holes, and the circuit arrangement region A guide hole provided in an outer peripheral portion of the circuit arrangement region, and a guide hole that is formed through the center of the plurality of non-through holes on the basis of the plurality of non-through holes provided in the outer peripheral portion of the circuit arrangement region. A wiring board provided in a collective region connecting outermost points of individual non-through holes provided with non-through holes .
(2) The wiring board according to item (1), wherein the plurality of non-through holes are spaced apart from each other by a constant pitch.

According to the present invention, a non-through hole for interlayer connection of products in a circuit forming region and a through guide hole formed by recognizing a plurality of non-through holes in the outer periphery of the circuit forming region processed at the same time By using this to form a circuit, the recognition accuracy is improved by recognizing a non-through hole of any size and shape, rather than using a through guide hole that has been perforated by recognizing a single non-through hole. The front and back surfaces are well aligned with the non-penetrating interlayer connection holes and a higher density wiring board can be obtained.
In addition, when the guide hole has a smaller area than the collection area of multiple non-through holes, the positional relationship between the non-through holes that are regularly arranged and the guide holes that are drilled through is compared after processing the guide holes. Thus, it is possible to check the drilling accuracy.
Furthermore, when a plurality of non-through holes are spaced at a certain pitch between adjacent non-through holes, the plurality of dents and protrusions close together to improve the contrast, and a large single hole (dent ) Is recognized more accurately, and a guide hole with higher accuracy can be obtained.

The circuit arrangement area described in the present invention means an area in which a circuit is formed. More specifically, the circuit arrangement area includes the outermost circuit and the entire inner area.
The circuit arrangement area may be divided into a plurality of areas in the wiring board. It is desirable that the plurality of circuit arrangement regions are uniformly arranged at a location about 10 mm away from the edge of the substrate.
Further, the non-through hole for image recognition necessary for providing a guide hole to be described later is preferably a hole formed in the same process as the non-through hole for product connection in the circuit formation region.

The outer peripheral portion described in the present invention means all portions outside the circuit arrangement region described above.
The outer peripheral portion is a place where various guide holes or guide holes are arranged, and is affected by distortion of the end portion of the substrate. Therefore, it is preferable that the distance from the end portion is as uniform as possible.

The guide hole described in the present invention is a through hole, and the drilling method is not particularly limited, and can be specifically performed by drilling.
The guide hole is provided in the outer peripheral portion described above and is present in a region different from the circuit arrangement region.
In addition, the guide hole is provided after recognizing a plurality of non-through holes (guide holes) provided in advance, and even if this recognition is performed by image recognition, the hole puncher himself / herself visually recognizes it. You can go. That is, the guide hole may be provided with reference to the non-through hole.

The non-through hole described in the present invention serves as a reference when performing circuit processing on the surface provided with the non-through hole, and may be formed from a plurality of holes.
More specifically, as shown in FIG. 2, the non-through holes 14 are overlapped with each other so as to form an inclined square shape as a whole, as shown in FIG. It is possible to make the holes 14 overlap with each other, draw a circle as a whole, and provide a large circle similar to the circle to form a concentric circle.
The size of the non-through hole is not particularly limited, and it is not always necessary that all of the plurality of non-through holes have the same size.
However, since it is not necessary to change the processing conditions for providing the non-through holes, the sizes of the non-through holes are all the same and the shapes are preferably the same.
Moreover, since the metal layer can be used as a stopper, the non-through hole is preferably performed by laser processing because it is easier to process than drilling.
Furthermore, the size of the non-through hole is desirable because it is possible to save the processing cost, but the recognition accuracy when processing the guide hole varies depending on the thickness of the insulating layer forming the non-through hole. It is good to set.

  As shown in FIG. 4, the non-through hole assembly region described in the present invention is a region (aggregation region 15) connecting the outermost points of the individual non-through holes 14 provided with a plurality of non-through holes 14. Show.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 5 shows a manufacturing process of a wiring board for explaining one embodiment of the present invention.
As shown to Fig.5 (a), in order to obtain the thin wiring board which has a non-through-hole, the copper clad laminated board 21 (Hitachi Chemical Industry Co., Ltd. MCL-E-679FG t0) which bonded the copper foil to the glass epoxy material. .03 mm 12D), the copper foil was removed by etching to produce a conformal mask 22 for laser drilling.

  Next, as shown in FIG. 5B, a carbon dioxide laser (laser processing condition: frequency 1000 Hz, pulse width 10 to 30 μsec, cycle) is applied to the conformal mask 22 where the copper foil is removed and the resin is exposed. (5) to (10), and the resin is burnt and decomposed to remove the resin, and a plurality of non-through holes 25 and 26 each having a diameter of 0.1 mm are densely formed in the circuit arrangement (product) region 24 and the outer peripheral portion 23. Formed.

  And as shown in FIG.5 (c), the inner wall of the non-through-holes 25 and 26 which connect one layer and the other layer different from each other by performing electroless copper plating and electrolytic copper plating processing (plating thickness 15 micrometers) And the plating conductor 27 was given to the copper foil surface.

  After that, as shown in FIG. 5 (d), the non-through holes 26 (see FIG. 5 (c)) on the outer peripheral portion were image-recognized by an X-ray drilling machine (Seiko Precision Co., Ltd.) and densely gathered with a drill. The center of the plurality of non-through holes 26 was drilled with a diameter of 2.0 mm to form a reference hole 28 necessary for forming the outer layer circuit.

  As shown in FIG. 5E, by using the reference hole 28 as a reference, the outer layer copper foil (outer layer conductor) on the front and back sides is etched to provide a predetermined outer layer circuit conductor and a thin wiring board 29 having a non-through hole. Got.

  The thin wiring board 29 obtained above is a double-sided board having a non-through hole. If this double-sided board is used as a core material and build-up is performed in which prepreg and copper foil are alternately laminated, A thin multilayer wiring board can be produced.

It is a schematic manufacturing-process figure of the thin wiring board which has the conventional non-through-hole. It is one Example which shows the some non-through-hole provided in the outer peripheral part of this invention. It is another Example which shows the some non-through-hole provided in the outer peripheral part of this invention. It is one Example which shows the gathering area | region of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is 1 Example which shows the schematic manufacturing-process figure of the wiring board of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Copper clad laminated board, 2 ... Copper foil, 3 ... Copper foil, 4 ... Non-through-hole, 5 ... Non-through-hole, 6 ... Plating conductor, 7 ... Wiring board, 8 ... Circuit arrangement | positioning area | region, 9 ... Outer peripheral part, DESCRIPTION OF SYMBOLS 10 ... Non-through-hole, 11 ... Non-through-hole, 12 ... Through-hole, 13 ... Through-hole, 14 ... Non-through-hole, 15 ... Collection area, 21 ... Copper-clad laminate, 22 ... Conformal mask, 23 ... Outer peripheral part 24 ... Circuit arrangement region, 25 ... Non-through hole, 26 ... Non-through hole, 27 ... Plated conductor, 28 ... Reference hole, 29 ... Thin wiring board.

Claims (2)

A circuit arrangement area and a non-through hole in this circuit arrangement area are processed at the same time, and a circle is drawn as a whole so that the non-through holes overlap each other. A plurality of non-through holes provided in an outer peripheral portion of the circuit arrangement region, and a center of the plurality of non-through holes is processed with reference to the plurality of non-through holes, and the outer peripheral portion of the circuit arrangement region And a guide hole provided in the
Guide holes that are processed through the centers of the plurality of non-through holes on the basis of the plurality of non-through holes provided in the outer peripheral portion of the circuit arrangement region are the individual non-through holes provided with the plurality of non-through holes. A wiring board provided in the gathering area connecting the outermost points . The wiring board according to claim 1, wherein the plurality of non-through holes are spaced apart at a constant pitch from adjacent non-through holes.

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