JP2014201777A5 - - Google Patents

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Publication number
JP2014201777A5
JP2014201777A5 JP2013077075A JP2013077075A JP2014201777A5 JP 2014201777 A5 JP2014201777 A5 JP 2014201777A5 JP 2013077075 A JP2013077075 A JP 2013077075A JP 2013077075 A JP2013077075 A JP 2013077075A JP 2014201777 A5 JP2014201777 A5 JP 2014201777A5
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JP
Japan
Prior art keywords
layer
carrier
copper foil
copper
ultrathin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013077075A
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English (en)
Japanese (ja)
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JP6353193B2 (ja
JP2014201777A (ja
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Priority to JP2013077075A priority Critical patent/JP6353193B2/ja
Priority claimed from JP2013077075A external-priority patent/JP6353193B2/ja
Publication of JP2014201777A publication Critical patent/JP2014201777A/ja
Publication of JP2014201777A5 publication Critical patent/JP2014201777A5/ja
Application granted granted Critical
Publication of JP6353193B2 publication Critical patent/JP6353193B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013077075A 2013-04-02 2013-04-02 キャリア付き銅箔、当該キャリア付き銅箔を用いて銅張積層板を製造する方法、当該キャリア付き銅箔を用いてプリント配線板を製造する方法、及びプリント配線板の製造方法 Expired - Fee Related JP6353193B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013077075A JP6353193B2 (ja) 2013-04-02 2013-04-02 キャリア付き銅箔、当該キャリア付き銅箔を用いて銅張積層板を製造する方法、当該キャリア付き銅箔を用いてプリント配線板を製造する方法、及びプリント配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013077075A JP6353193B2 (ja) 2013-04-02 2013-04-02 キャリア付き銅箔、当該キャリア付き銅箔を用いて銅張積層板を製造する方法、当該キャリア付き銅箔を用いてプリント配線板を製造する方法、及びプリント配線板の製造方法

Publications (3)

Publication Number Publication Date
JP2014201777A JP2014201777A (ja) 2014-10-27
JP2014201777A5 true JP2014201777A5 (https=) 2016-05-26
JP6353193B2 JP6353193B2 (ja) 2018-07-04

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ID=52352504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013077075A Expired - Fee Related JP6353193B2 (ja) 2013-04-02 2013-04-02 キャリア付き銅箔、当該キャリア付き銅箔を用いて銅張積層板を製造する方法、当該キャリア付き銅箔を用いてプリント配線板を製造する方法、及びプリント配線板の製造方法

Country Status (1)

Country Link
JP (1) JP6353193B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6193534B2 (ja) * 2015-07-03 2017-09-06 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
EP4132235B1 (en) * 2020-03-30 2025-02-19 Mitsubishi Materials Corporation Bonded body and insulating circuit board
KR20240017841A (ko) * 2021-06-03 2024-02-08 미쓰이금속광업주식회사 조화 처리 동박, 동장 적층판 및 프린트 배선판
TWI781818B (zh) 2021-11-05 2022-10-21 長春石油化學股份有限公司 表面處理銅箔及銅箔基板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01194391A (ja) * 1988-01-28 1989-08-04 Hitachi Chem Co Ltd 配線板の製造方法
JP2506574B2 (ja) * 1990-12-19 1996-06-12 日鉱グールド・フォイル株式会社 電解銅箔の製造方法及び装置
JP3466506B2 (ja) * 1999-04-23 2003-11-10 三井金属鉱業株式会社 キャリア箔付電解銅箔及びその電解銅箔の製造方法並びにその電解銅箔を使用した銅張積層板
JP3429290B2 (ja) * 2000-09-18 2003-07-22 日本電解株式会社 微細配線用銅箔の製造方法
JP4178415B2 (ja) * 2002-07-04 2008-11-12 三井金属鉱業株式会社 キャリア箔付電解銅箔
JP4429979B2 (ja) * 2005-06-29 2010-03-10 古河電気工業株式会社 キャリア付き極薄銅箔及びキャリア付き極薄銅箔の製造方法
JP2007194265A (ja) * 2006-01-17 2007-08-02 Dainippon Printing Co Ltd フレキシブルプリント配線板、およびその製造方法
JP4921420B2 (ja) * 2008-06-03 2012-04-25 新日鐵化学株式会社 金属張積層体およびその製造方法
JP5499517B2 (ja) * 2009-05-21 2014-05-21 三菱瓦斯化学株式会社 金属表面処理方法
JP2010006071A (ja) * 2009-08-21 2010-01-14 Furukawa Electric Co Ltd:The 表面処理銅箔、キャリア付き極薄銅箔、フレキシブル銅張積層板及びポリイミド系フレキシブルプリント配線板
CN103154327A (zh) * 2010-10-06 2013-06-12 古河电气工业株式会社 铜箔及其制备方法、带有载体的铜箔及其制备方法、印刷电路板、多层印刷电路板
JP2012107266A (ja) * 2010-11-15 2012-06-07 Jx Nippon Mining & Metals Corp 電解銅箔の製造方法及び製造装置
KR20120053921A (ko) * 2010-11-18 2012-05-29 삼성전기주식회사 인쇄 회로 기판 및 그 제조 방법
JP2013001993A (ja) * 2011-06-21 2013-01-07 Meltex Inc キャリア箔付き極薄銅箔およびその製造方法

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