JP2014175340A - Imprint method, mold for imprint and imprint device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imprint method which allows for stabilized fabrication of a high accuracy pattern structure by preventing damage, and the like, of a mold, and to provide a mold for imprint and an imprint device.SOLUTION: An imprint method includes a resin supply step for supplying a molded resin to a transfer substrate at a supply position, a contact step for forming a molded resin layer by transferring the transfer substrate from the supply position to a transfer position, approaching a mold having an uneven structure and the transfer substrate, and forming the molded resin layer by developing the molded resin between the mold and the transfer substrate, a curing step for curing the molded resin layer into a transfer resin layer where the uneven structure is transferred, and a release step for separating the transfer resin layer and the mold to bring about a state where a pattern structure, i.e., the transfer resin layer, is located on the transfer substrate. At least during transfer of the transfer substrate to the transfer position, removal operation of a foreign matter existing in the atmosphere and/or the transfer substrate is performed.

Description

  The present invention provides an imprint method in which a resin is supplied to produce a thin film having a desired pattern (a figure composed of a concavo-convex structure such as a line or a pattern) and / or a structure having a smooth thin film having no pattern; The present invention relates to a mold and an imprint apparatus used for the imprint method.

In recent years, a pattern forming technique using an imprint method has attracted attention as a fine pattern forming technique that replaces the photolithography technique. The imprint method is a pattern forming technique in which a fine structure is transferred at an equal magnification by using a mold member (mold) having a fine concavo-convex structure and transferring the concavo-convex structure to a molding resin. For example, in an imprint method using a photocurable resin as a molding resin, droplets of the photocurable resin are supplied to the surface of the transfer substrate, and the mold having the desired concavo-convex structure and the transfer substrate are brought to a predetermined distance. The concavo-convex structure is filled with a photocurable resin, and in this state, light is irradiated from the mold side to cure the photocurable resin. A pattern structure having an inverted uneven structure (uneven pattern) is formed.
Such an imprint method has a problem that static electricity is generated when the mold is pulled away from the resin layer, the mold is charged, and foreign matters in the atmosphere are easily attached to the mold. When imprinting is performed in a state where foreign matter or the like is attached to the mold, there is a possibility that a defect of the pattern structure occurs, and further, the mold is damaged. In order to cope with this, for example, when removing the mold from the resin layer, the mold is discharged (Patent Documents 1 and 2), or when the mold potential exceeds a predetermined value. (Patent Document 3) has been proposed.
In addition, the foreign matter is a solid material that is dried by floating droplets supplied by an ink jet method as a mist, a solid material that is sprayed by a droplet of resin supplied by a spin coat method, and an imprint apparatus such as an ink jet head. It is a substance that is not intended to be involved in imprinting, such as fine particles generated from constituent members, and dust present in the imprinting apparatus.

JP 2007-98779 A JP 2008-260273 A JP 2009-286085 A

However, even if the mold is discharged using the above-described static eliminating means, if foreign matter is present on the transfer substrate when filling the mold concavo-convex structure with the photocurable resin, photocuring into the concavo-convex structure is performed. There was also a possibility that the filling failure of the functional resin may occur, and the mold may be damaged.
In general, in an imprint apparatus, in order to improve the efficiency in imprinting, a stage for holding a transfer substrate is supplied with a photocurable resin droplet on the surface of the transfer substrate where the transfer substrate is supplied. The position and the proximity between the mold and the transfer substrate are configured to be movable at a desired speed between transfer positions where imprinting is performed. In particular, when there is a risk of a shortage of the amount of resin supplied due to volatilization of droplets of the photocurable resin, a change in the resin component ratio, etc., it is necessary to shorten the time from the position where the droplets are supplied to the transfer position. The transfer substrate held on the stage is conveyed at high speed to the transfer position. However, an air flow toward the mold is generated due to the effect of high-speed conveyance of such a transfer substrate, and there is a risk that foreign matter will be drawn into the air flow and adhere to the mold. There has been a problem that even if the charge is eliminated, such adhesion of foreign matter cannot be prevented.
The present invention has been made in view of the above-described circumstances. An imprint method, an imprint mold, and an imprint mold that can prevent damage to the mold and stably produce a highly accurate pattern structure. An object is to provide a printing apparatus.

  In order to achieve such an object, the imprint method of the present invention includes a resin supply step of supplying a molding resin to a transfer substrate at a supply position, and transporting the transfer substrate from the supply position to the transfer position, thereby forming irregularities. A contact step in which a mold having a structure and the transfer substrate are brought close to each other, a molding resin layer is formed by spreading the molding resin between the mold and the transfer substrate, and the molding resin layer is cured. A curing step for transferring the concavo-convex structure to the transfer resin layer, and separating the transfer resin layer from the mold so that the pattern structure as the transfer resin layer is positioned on the transfer substrate. And a step of removing foreign substances present in the atmosphere and / or on the transfer substrate at least when the transfer substrate is transported to the transfer position.

As another aspect of the present invention, the foreign matter is captured and removed by electrostatic force on the upstream side in the transport direction of the transfer substrate to the transfer position from the region having the concavo-convex structure of the mold. The configuration.
As another aspect of the present invention, a foreign matter catching region is set upstream of the region having the concavo-convex structure in the mold in the transport direction, and the electrostatic force is expressed by charging the foreign matter catching region. The configuration.
As another aspect of the present invention, the foreign matter is obtained by bringing a material located on the opposite side of the charging column away from the position of the constituent material of the mold in the charging row in contact with or away from the foreign matter capturing region of the mold. The capture region was charged.
As another aspect of the present invention, the foreign matter capturing area is charged by separating the transfer resin layer and the mold in the peeling step.
As another aspect of the present invention, a configuration is adopted in which a dust collection mechanism is disposed upstream of the region having the uneven structure of the mold in the transport direction.
As another aspect of the present invention, the foreign matter is removed by suction of the atmosphere upstream of the region having the concavo-convex structure of the mold in the transport direction of the transfer substrate to the transfer position. did.

  Further, the imprint method of the present invention includes a resin supply step of supplying a molding resin to a transfer substrate at a supply position, a mold having a concave-convex structure at a position different from the supply position, and the transfer substrate at the supply position The mold or both of the mold and the transfer substrate are conveyed so as to face each other at the transfer position, and the mold and the transfer substrate are brought close to each other at the transfer position. A contact step in which the molding resin is spread to form a molding resin layer, a curing step in which the molding resin layer is cured to transfer the concavo-convex structure, and the transfer resin. A mold release step for separating the layer and the mold so that the pattern structure, which is the transfer resin layer, is positioned on the transfer substrate, and at least the transfer position The mold or during transportation of both of the transfer substrate and the mold was configured as for removing operation of the foreign matter present in the atmosphere and / or the transfer substrate of.

The mold for imprinting of the present invention includes a base, a concavo-convex structure region set on one surface of the base, a foreign matter capturing region, a main convex structure portion located in the concavo-convex structure region and having a concavo-convex structure on a surface thereof. And a sub-convex structure portion located in the foreign substance capturing region.
As another aspect of the present invention, the foreign substance capturing region and the concavo-convex structure region are directed from the end side of the base located on the opposite side of the concavo-convex structure region to the concavo-convex structure region via the foreign matter capturing region. When projected onto a plane perpendicular to the surface, the width of the foreign substance capturing region is larger than the width of the concavo-convex structure region.

As another aspect of the present invention, the surface of the sub-convex structure portion has a concavo-convex structure, and the density of the concavo-convex structure is higher than the density of the concavo-convex structure located on the surface of the main convex structure portion. It was.
As another aspect of the present invention, a plurality of convex structure portions positioned on the surface of the sub-convex structure portion are present in a state of being separated from each other in the foreign substance capturing region.
As another aspect of the present invention, the sub-convex structure portions are separated from each other in a direction from the end portion side of the base located on the opposite side of the concavo-convex structure region to the concavo-convex structure region via the foreign substance capturing region. The configuration is such that there are multiple in the state.
As another aspect of the present invention, in the direction orthogonal to the direction from the end side of the base located on the side opposite to the concavo-convex structure region through the foreign substance capturing region to the concavo-convex structure region, the sub-convex The structure portion is configured to exist in a plurality in a state of being separated from each other.

  The imprint apparatus of the present invention includes at least a mold holding unit for holding a mold, a substrate holding unit for holding a transfer substrate, and a resin supply unit for supplying a molding resin to the transfer substrate, The substrate holding part is movable with respect to the mold holding part and the resin supply part, and the mold holding part is upstream of a mold holding position in a direction in which the substrate holding part moves toward the mold holding part. The structure has a suction mechanism on the side.

  The imprint apparatus according to the present invention includes at least a mold holding unit for holding a mold, a substrate holding unit for holding a transfer substrate, and a resin supply unit for supplying a molding resin to the transfer substrate. The substrate holding part is movable relative to the mold holding part and the resin supply part, and the mold holding part is moved from a mold holding position in a direction in which the substrate holding part moves toward the mold holding part. In addition, the configuration has a dust collecting mechanism on the upstream side.

  The imprint apparatus of the present invention includes a mold holding unit for holding a mold, a substrate holding unit for holding a transfer substrate, a resin supply unit that supplies a molding resin to the transfer substrate, and the mold A charge generating member that generates charge on at least a part of the mold held by the holding unit, and the substrate holding unit is movable with respect to the mold holding unit and the resin supply unit, and the charge generation The member has an abutting member capable of approaching and separating from a desired part on the upstream side of the mold held by the mold holding unit in a direction in which the substrate holding unit moves toward the mold holding unit. The configuration.

  According to the present invention, there is an effect that a mold can be prevented from being damaged and a highly accurate pattern structure can be stably produced.

FIG. 1 is a plan view for explaining an embodiment of an imprint mold of the present invention. FIG. 2 is a longitudinal sectional view taken along the line II of the imprint mold shown in FIG. FIG. 3 is a plan view for explaining an embodiment of the imprint mold of the present invention. FIG. 4 is a longitudinal sectional view corresponding to FIG. 2 showing another embodiment of the imprint mold of the present invention. FIG. 5 is a plan view corresponding to FIG. 1, showing another embodiment of the imprint mold of the present invention. FIG. 6 is a plan view corresponding to FIG. 1, showing another embodiment of the imprint mold of the present invention. FIG. 7 is a schematic configuration diagram showing an embodiment of the imprint apparatus according to the present invention. FIG. 8 is an enlarged plan view showing a mold holding part of the imprint apparatus shown in FIG. FIG. 9 is a schematic configuration diagram showing another embodiment of the imprint apparatus of the present invention. FIG. 10 is an enlarged plan view showing a mold holding part of the imprint apparatus shown in FIG. FIG. 11 is a schematic configuration diagram showing another embodiment of the imprint apparatus according to the present invention. 12 is an enlarged plan view 3 showing a mold holding part of the imprint apparatus shown in FIG. FIG. 13 is a process diagram for explaining an embodiment of the imprint method of the present invention. FIG. 14 is a flowchart showing a flow of steps of the imprint method shown in FIG. FIG. 15 is a diagram illustrating an example in which another mold is used in the imprint method illustrated in FIG. 13. FIG. 16 is a diagram for explaining another embodiment of the imprint method of the present invention. FIG. 17 is a flowchart showing a flow of steps of the imprint method shown in FIG. FIG. 18 is a diagram for explaining another embodiment of the imprint method of the present invention. FIG. 19 is a process diagram for explaining another embodiment of the imprint method of the present invention. FIG. 20 is a flowchart showing a flow of steps of the imprint method shown in FIG. FIG. 21 is a diagram for explaining another example of the imprint method shown in FIG. FIG. 22 is a diagram for explaining another example of the imprint method shown in FIG. FIG. 23 is a diagram for explaining another embodiment of the imprint method of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Note that the drawings are schematic or conceptual, and the dimensions of each member, the ratio of sizes between the members, etc. are not necessarily the same as the actual ones, and represent the same members. However, in some cases, the dimensions and ratios may be different depending on the drawing.

[Imprint mold]
FIG. 1 is a plan view for explaining an embodiment of an imprint mold according to the present invention, and FIG. 2 is a longitudinal sectional view taken along line II of the imprint mold shown in FIG. is there. 1 and 2, the imprint mold 1 is set on the base 2, the main convex structure portion 4 located in the concavo-convex structure region A set on one surface 2 a of the base 2, and the surface 2 a. The secondary convex structure part 7 located in the foreign material capture area B is provided. The main convex structure portion 4 has a concavo-convex structure 5 on its surface 4a. In the illustrated example, the concavo-convex structure 5 has a concave portion 5a. Moreover, in the example of illustration, the surface 7a of the sub convex structure part 7 is a flat surface. The concavo-convex structure 5 in FIG. 2 is shown for convenience, and is not limited to this. In FIG. 1, the concavo-convex structure 5 is not shown.

  In the illustrated example, the concavo-convex structure region A is substantially square, and the main convex structure portion 4 is located over the entire concavo-convex structure region A. Further, the foreign matter catching area B is rectangular, and the sub-convex structure portion 7 is located in the entire foreign matter catching area B. Then, the concavo-convex structure region A and the foreign matter catching region B are directed from the end 2A side of the base 2 located on the opposite side of the concavo-convex structure region A via the foreign matter catching region B (indicated by arrows in FIG. 1). When projected onto a plane (for example, a plane whose end face is indicated by a two-dot chain line in FIG. 1) in a direction (direction indicated by an arrow Y in FIG. 1) orthogonal to the direction indicated by X) The width W2 of the region B is preferably larger than the width W1 of the uneven structure region A. Further, in the example shown in FIG. 1, the foreign matter catching area B is parallel to the end 2 </ b> A of the base 2, but the longitudinal direction of the foreign matter catching area B intersects with the end 2 </ b> A of the base 2. Is the same. For example, as shown in FIG. 3A, even if the longitudinal direction of the foreign substance capturing region B is oblique to the end 2A of the base 2, the end 2A side of the base 2 is directed to the concavo-convex structure region A. When projected onto a plane orthogonal to the direction (for example, a plane whose end face is indicated by a two-dot chain line in FIG. 3A), the width W2 of the foreign substance capturing region B is equal to the width W1 of the concavo-convex structure region A. Is preferably larger. Further, in the example shown in FIG. 1, the direction from the end 2 </ b> A side of the base 2 toward the concavo-convex structure region A (the direction indicated by the arrow X in FIG. 1) is a direction orthogonal to the end 2 </ b> A of the base 2. However, for example, as shown in FIG. 3B, even when the direction of the arrow X is oblique to the end 2A of the base 2, the plane orthogonal to this (for example, two in FIG. It is preferable that the width W2 of the foreign substance capturing region B is larger than the width W1 of the concavo-convex structure region A when projected onto a flat surface whose end face is indicated by a dotted line. More preferably, in any part of the concavo-convex structure region A, it is preferable that the foreign matter capturing region B exists on the upstream side in the arrow X direction. As a result, it is more certain that foreign matter approaching the mold from the direction from the foreign matter catching region B to the concavo-convex structure region A (the direction indicated by the arrow X in FIGS. 1 and 3) is caught by the foreign matter catching region B. It becomes.

  As the material of the mold 1 for imprinting, when the molding resin used for imprinting is photocurable, a material that can transmit irradiation light for curing them can be used. In addition to glass such as glass, silicate glass, calcium fluoride, magnesium fluoride, and acrylic glass, sapphire and gallium nitride, resin such as polycarbonate, polystyrene, acrylic, and polypropylene, or any laminate of these materials Can be used. Further, when the molding resin to be used is not photocurable, or when it is possible to irradiate light for curing the molding resin from the transfer substrate side, the mold 1 does not have to be light transmissive. In addition to the above materials, for example, metals such as silicon, nickel, titanium, and aluminum, alloys thereof, oxides, nitrides, or any laminated material thereof can be used.

Further, in order to facilitate peeling between the resin to be molded and the mold, a release agent layer may be provided on the surface 4 a of the main convex structure portion 4 and the surface 7 a of the sub convex structure portion 7 of the mold 1. However, as will be described later, the sub-convex structure portion 7 located in the foreign-matter capturing region B is a part that expresses the action of capturing foreign matters by charging, and when a release agent layer is provided, the sub-convex structure It is preferable to consider the ease of charging the portion 7.
The thickness of the base portion 2 of the mold 1 can be set in consideration of the shape of the main convex structure portion 4 and the sub convex structure portion 7 provided on the one surface 2a, the strength of the material, the suitability for handling, and the like. It can be appropriately set within a range of about 10 mm. In addition, the main convex structure part 4 and the sub convex structure part 7 may have a convex structure with two or more steps on the surface 4a and the surface 7a with respect to the surrounding area.

  As shown in FIG. 4, the imprint mold of the present invention may be a mold 1 ′ having a concavo-convex structure 8 on the surface 7 a of the sub-convex structure portion 7 located in the foreign matter capturing region B. In the example of illustration, the uneven structure 8 has the recessed part 8a. When the uneven structure 8 is present on the surface 7a of the sub-convex structure portion 7 in this way, as will be described later, in order to facilitate charging of the sub-convex structure portion 7, the density at which the recessed portion 8a exists in the uneven structure 8 Is preferably set so as to be higher than the density at which the concave portions 5 a exist in the concave-convex structure 5.

  Further, the imprint mold of the present invention may have a plurality of sub-convex structure portions separated from each other in the foreign matter capturing region B. For example, the mold 1 ″ shown in FIG. 5 moves from the end portion side of the base portion 2 located on the opposite side to the concavo-convex structure region A via the foreign substance capturing region B (region surrounded by a two-dot chain line) to the concavo-convex structure region A. A plurality (two in the illustrated example) of the sub-convex structure portions 7A are present in the foreign matter capturing area B in the direction (indicated by the arrow X in FIG. 4) in the direction in which they are directed. The mold 1 ″ shown in FIG. 2 is directed from the end side of the base 2 located on the side opposite to the concavo-convex structure region A via the foreign substance capturing region B (region surrounded by a two-dot chain line) to the concavo-convex structure region A (see FIG. 6 in the direction indicated by the arrow X), a plurality of sub-convex structure portions 7B are separated from each other in the foreign matter capturing region B, and further, a direction intersecting the direction indicated by the arrow X (see FIG. 6). In the direction indicated by the arrow Y) Part 7B there are a plurality in a state separated from each other.

Such an imprint mold of the present invention charges the sub-convex structure portions 7, 7 </ b> A, 7 </ b> B located in the foreign matter capturing region B, thereby moving the foreign matter capturing region B toward the concavo-convex structure region A (see FIG. The foreign matter approaching the mold (from the direction indicated by the arrow X in FIGS. 1, 3, 5, and 6) can be captured by the sub-convex structure portions 7, 7 </ b> A, 7 </ b> B in the foreign matter capturing region B. Thereby, it can prevent that a foreign material adheres to the main convex structure part 4 of the uneven structure area | region A. FIG.
The above-described embodiment of the mold for imprinting is an exemplification, and the present invention is not limited to the embodiment.

[Imprint device]
<First Embodiment>
FIG. 7 is a schematic configuration diagram showing an embodiment of the imprint apparatus of the present invention, and FIG. 8 is an enlarged plan view showing a mold holding part of the imprint apparatus shown in FIG. 7 and 8, the imprint apparatus 21 of the present invention includes a mold holding unit 22 for holding the mold 101, a suction mechanism 23, a substrate holding unit 25 for holding the transfer substrate 111, and a transfer substrate. 111 is provided with a resin supply unit 27 for supplying a resin to be molded.

(Mold holding part 22)
The mold holding unit 22 constituting the imprint apparatus 21 holds the mold 101 having the concavo-convex structure region 102 (region surrounded by a chain line in FIG. 8) for pattern formation at the mold holding position 22A. A holding mechanism for the mold 101 in the mold holding unit 22 may be, for example, a holding mechanism by suction, a holding mechanism by mechanical clamping, and the holding mechanism is not particularly limited. Moreover, the mold holding part 22 may be movable up and down in the direction of arrow Z shown in FIG. A light source and an optical system (not shown) for resin curing when a photocurable resin is used as the resin to be molded may be disposed above the mold holding unit 22.

The mold holding unit 22 has the suction mechanism 23 upstream of the mold holding position 22A in the direction in which the substrate holding unit 25 moves toward the mold holding unit 22 (the direction indicated by the arrow X in FIGS. 7 and 8). Have. The suction mechanism 23 includes a suction port 24 provided in the mold holding unit 22 and an exhaust pipe, a filter, an exhaust pump, etc. (not shown) for exhausting air from the suction port 24 in the direction of arrow a shown in FIG. ing. In the illustrated example, in the direction (direction indicated by arrow Y in FIG. 8) perpendicular to the direction (direction indicated by arrow X in FIG. 8) in which the substrate holding portion 25 moves toward the mold holding portion 22, this suction port. The length L2 of 24 is larger than the length L1 of the concavo-convex structure region 102 of the mold 101 held at the mold holding position 22A. This makes it more reliable that the foreign matter approaching the mold 101 from the direction indicated by the arrow X in FIG. Note that the suction port 24 may not be a single rectangular opening as in the illustrated example, but may be a plurality of adjacent openings.
In the illustrated example, the mold holding unit 22 is integrally provided with the suction port 24 of the suction mechanism 23, but the present invention can be applied to the substrate holding unit while the suction port 24 of the suction mechanism 23 is separated from the mold holding unit 22. A mode in which the suction port 24 is located upstream of the mold holding position 22A in the movement direction 25 is also included.

(Substrate holder 25)
The substrate holding unit 25 constituting the imprint apparatus 21 holds the transfer substrate 111 for imprinting, and the holding mechanism of the transfer substrate 111 is, for example, a holding mechanism by suction, a holding mechanism by mechanical clamping, or the like. The holding mechanism is not particularly limited. The substrate holding unit 111 is movable on the XY stage in a horizontal plane by a drive mechanism unit (not shown), and a resin supply position for receiving the supply of the resin to be molded on the transfer substrate 111 by the resin supply unit 27, mold holding It can move to a transfer position or the like that faces the portion 22 and performs transfer. The imprint apparatus of the present invention is not limited to the illustrated example, and can move arbitrary members of the mold holding unit 22, the substrate holding unit 25, and the resin supply unit 27, and the relative positions thereof can be set. It may be an aspect that can be changed. In the illustrated example, the transfer substrate 111 is a substrate having a so-called mesa structure having the convex structure portion 112, but the transfer substrate to be held by the substrate holding portion 25 may not have a mesa structure. Good.

(Resin supply unit 27)
The resin supply unit 27 constituting the imprint apparatus 21 supplies droplets of the molding resin onto the convex structure portion 112 of the transfer substrate 111 held by the substrate holding unit 25. For example, the resin supply unit 27 Includes an ink jet device (only the ink jet head 28 is shown in the illustrated example). The ink jet device provided in the resin supply unit 27 is a desired operation of the ink jet head 28 for supplying droplets of the molding resin onto the convex structure portion 112 of the transfer substrate 111 held by the substrate holding unit 25, for example, the substrate A drive unit that enables a reciprocating operation in a horizontal plane along the surface of the holding unit 25, an ink supply unit to the inkjet head 28, a control unit that controls the inkjet head 28, the drive unit, and the ink supply unit, and the like. It has.
The resin supply unit 27 may supply a resin to be molded onto the convex structure portion 112 of the transfer substrate 111 by a spin coating method. In this case, the driving mechanism for rotating the transfer substrate 111 may be built in the substrate holding unit 25, or provided separately from the substrate holding unit 25 and after the molding resin is supplied onto the transfer substrate 111. The transfer substrate 111 may be configured to be held by the substrate holding unit 25.

  In such an imprint apparatus 21 of the present invention, in order to transport the transfer substrate 111 that has been supplied with the molding resin to a predetermined position below the mold 101 (a position indicated by a two-dot chain line in FIG. 7), 7 and FIG. 8, the substrate holding unit 25 moves at a high speed below the mold holding unit 22 from the direction indicated by the arrow X, thereby generating an air flow toward the mold 101, and being drawn into the air flow, foreign matter approaches the mold 101. Even if foreign matters exist on the transferred transfer substrate 111, these foreign matters are sucked and removed together with the atmosphere from the suction port 24 of the suction mechanism 23 and are prevented from reaching the mold 101.

<Second Embodiment>
FIG. 9 is a schematic configuration diagram showing another embodiment of the imprint apparatus of the present invention, and FIG. 10 is an enlarged plan view showing a mold holding part of the imprint apparatus shown in FIG. 9 and 10, the imprint apparatus 31 of the present invention includes a mold holding unit 32 for holding the mold 101, a dust collecting mechanism 33, a substrate holding unit 35 for holding the transfer substrate 111, and a transfer substrate. 111 is provided with a resin supply unit 37 for supplying a resin to be molded.

(Mold holding part 32)
The mold holding unit 32 constituting the imprint apparatus 31 holds the mold 101 having the concavo-convex structure region 102 (region surrounded by a chain line in FIG. 10) for pattern formation at the mold holding position 32A. The holding mechanism of the mold 101 in the mold holding part 32 may be the same as that of the mold holding part 22 described above, and may be raised and lowered in the direction of arrow Z shown in FIG. In addition, a light source and an optical system (not shown) for resin curing when a photo-curing resin is used as the resin to be molded may be disposed above the mold holding unit 32.
The mold holding unit 32 has the dust collecting mechanism 33 upstream of the mold holding position 32A in the direction in which the substrate holding unit 35 moves toward the mold holding unit 32 (the direction indicated by the arrow X in FIGS. 9 and 10). Have. The dust collection mechanism 33 includes a dust collection unit 34 including a discharge electrode and a dust collection plate (not shown), a power source, wiring, a control device, and the like (not shown).

In the illustrated example, this dust collecting mechanism is in a direction (direction indicated by arrow Y in FIG. 10) perpendicular to the direction (direction indicated by arrow X in FIG. 10) in which the substrate holding portion 35 moves toward the mold holding portion 32. The length L2 of 33 is larger than the length L1 of the concavo-convex structure region 102 of the mold 101 held at the mold holding position 32A. Thereby, it becomes more certain that the foreign matter approaching the mold 101 from the direction indicated by the arrow X in FIG. In addition, the dust collection part 34 is not limited to rectangular shape like the example of illustration, Moreover, multiple dust collection parts 34 may be arrange | positioned.
In the illustrated example, the mold holding part 32 is integrally provided with a dust collecting part 34. However, in the present invention, although the dust collecting part 34 is separated from the mold holding part 32, the mold holding part 32 is molded in the moving direction of the substrate holding part 35. The aspect located upstream from the holding position 32A is also included.

(Substrate holder 35)
The substrate holding part 35 constituting the imprint apparatus 31 can be the same as the substrate holding part 25 constituting the imprint apparatus 21 described above.
(Resin supply unit 37)
The resin supply part 37 constituting the imprint apparatus 31 can be the same as the resin supply part 27 constituting the imprint apparatus 21. In the illustrated example, the resin supply part 37 is an ink jet apparatus (in the illustrated example, an ink jet apparatus). Only the head 38 is shown).
In such an imprint apparatus 31 of the present invention, the transfer substrate 111 that has been supplied with the molding resin is transported to a predetermined position below the mold 101 (a position indicated by a two-dot chain line in FIG. 9). 9 and FIG. 10, the substrate holding portion 35 moves at a high speed below the mold holding portion 32 from the direction indicated by the arrow X, thereby generating an air flow toward the mold 101, and being drawn into this air flow, foreign matter approaches the mold 101. Even if foreign matters exist on the transferred transfer substrate 111, these foreign matters are captured and removed by the dust collecting mechanism 33 and are prevented from reaching the mold 101.

<Third Embodiment>
FIG. 11 is a schematic configuration diagram showing another embodiment of the imprint apparatus of the present invention, and FIG. 12 is an enlarged plan view showing a mold holding part of the imprint apparatus shown in FIG. 11 and 12, the imprint apparatus 41 of the present invention includes a mold holding unit 42 for holding the mold 101, a substrate holding unit 45 for holding the transfer substrate 111, and molding on the transfer substrate 111. A resin supply unit 47 that supplies resin and a charge generation member 49 that generates charge on at least a part of the mold 101 held by the mold holding unit 42 are provided.
(Mold holding part 42)
The mold holding unit 42 constituting the imprint apparatus 41 holds the mold 101 having the concavo-convex structure region 102 (region surrounded by a chain line in FIG. 12) for forming a pattern at the mold holding position 42A. The mold holding unit 42 holding mechanism of the mold 101 may be the same as the mold holding unit 22 described above, and may be moved up and down in the direction of arrow Z shown in FIG. In addition, a light source and an optical system (not shown) for resin curing when a photocurable resin is used as the molding resin may be disposed above the mold holding unit 42.

(Substrate holder 45)
The substrate holding part 45 constituting the imprint apparatus 41 can be the same as the substrate holding part 25 constituting the imprint apparatus 21 described above.
(Resin supply unit 47)
The resin supply part 47 constituting the imprint apparatus 41 can be the same as the resin supply part 27 constituting the imprint apparatus 21. In the illustrated example, the resin supply part 47 is an ink jet apparatus (in the illustrated example, an ink jet apparatus). Only the head 48 is shown).

(Charging generating member 49)
The charge generation member 49 that constitutes the imprint apparatus 41 is more than the uneven structure region 102 of the mold 101 in the direction in which the substrate holder 45 moves toward the mold holder 42 (the direction indicated by the arrow X in FIGS. 11 and 12). Is also disposed on the upstream side. The charge generating member 49 includes a contact member 49a for placing a desired charging material M, a support member 49b for supporting the contact member 49a, a lifting device (not shown), and the like. Lifting device, together with a vertically movable by an arrow Z ₁ direction in FIG 11 the support member 49b, in a state where the supporting member 49b is positioned in the vicinity of the mold 101, the contact member 49a is spaced a closer to the mold 101 as performed, a device for vertically moving the contact member 49a as shown by arrow Z ₂ in FIG. 11. Thereby, the charging material M placed on the contact member 49a can be brought into contact with and separated from the mold 101. The charging material M is a material that is located farther away from the position of the constituent material of the mold 101 in the charging row on the opposite side of the charging row, and a region in which the charging material M is in contact with or separated from the mold 101. Can be charged.

  In the illustrated example, the contact member in the direction (direction indicated by arrow Y in FIG. 12) perpendicular to the direction (direction indicated by arrow X in FIG. 12) in which the substrate holding portion 45 moves toward the mold holding portion 42. The length L2 of 49a is larger than the length L1 of the concavo-convex structure region 102 of the mold 101 held at the mold holding position 42A. Accordingly, it is more reliable to capture and remove the foreign matter approaching the mold 101 from the direction indicated by the arrow X in FIG. 12 in the region where the mold 101 is charged by the charging material 49 using the charging material M. Become. In addition, the contact member 49a is not limited to a rectangular shape as illustrated, and a plurality of contact members 49a may be provided.

  In such an imprint apparatus 41 of the present invention, in order to transport the transfer substrate 111 that has been supplied with the molding resin to a predetermined position below the mold 101 (a position indicated by a two-dot chain line in FIG. 11), 11 and FIG. 12, the substrate holding part 45 moves at a high speed downward from the mold holding part 42 from the direction indicated by the arrow X. As a result, an air flow toward the mold 101 is generated. Even if foreign matters exist on the transferred transfer substrate 111, these foreign matters are captured and removed by the charge generating member 49 in the region charged in the mold 101 using the charging material M, and the unevenness of the mold 101 is removed. Reaching the structure region 102 is prevented.

[Imprint method]
The imprint method of the present invention includes a resin supply process, a contact process, a curing process, and a mold release process. Then, at least when the transfer substrate is transported to the transfer position, a foreign matter existing in the atmosphere and / or on the transfer substrate is removed.
<First Embodiment>
One embodiment of such an imprint method of the present invention uses the above-described imprint mold 1 of the present invention (see FIGS. 1 and 2) and the imprint apparatus 41 (see FIGS. 11 and 12). An example will be described with reference to FIGS. 13 and 14. In FIG. 13, only a mold holding part and a board | substrate holding part are shown, and the other member which comprises the imprint apparatus 41 is not illustrated. FIG. 14 is a flowchart showing a flow of steps of the imprint method shown in FIG.

  In the present embodiment, in step S1, the sub-convex structure portion 7 in the foreign matter capturing area B of the mold 1 held by the mold holding portion 42 of the imprint apparatus 41 is charged (FIG. 13A). In the illustrated example, the sub-convex structure portion 7 of the mold 1 is positively charged. Such charging of the sub-convex structure portion 7 can be performed by bringing the charging material M into contact with and separating from the surface 7 a of the sub-convex structure portion 7 by the charge generating member 49 of the imprint apparatus 41. For example, when the material of the mold 1 is quartz glass, the charging material M is a material located farther away from the opposite side of the charging column, for example, minus, with respect to the position of the quartz glass that is easily positively charged in the charging column. Can be appropriately selected from materials such as fluorine, silicon, vinyl, acrylic, polyethylene, urethane, celluloid, and polyester that are easily charged. The number of times that the charging material M is brought into contact with or separated from the surface 7a of the sub-convex structure portion 7 of the mold 1 is not particularly limited. For example, the charging amount is used in a range of 0.1 kV to 20 kV. The number of times can be set in consideration of the material of the charging material M and the like.

Next, in the resin supply step, droplets R of the resin to be molded are applied from the inkjet head 48 of the resin supply unit 47 (not shown) to a desired region on the imprint transfer substrate 111 held by the substrate holding unit 45. Discharge and supply (step S2).
The transfer substrate 111 used in the imprint method of the present invention can be appropriately selected. For example, glass such as quartz, soda lime glass, borosilicate glass, semiconductor such as silicon, gallium arsenide, gallium nitride, polycarbonate, polypropylene, It may be a resin substrate such as polyethylene, a metal substrate, or a composite material substrate made of any combination of these materials. Further, for example, a desired pattern structure such as a fine wiring used in a semiconductor or a display, a photonic crystal structure, an optical waveguide, or an optical structure such as holography may be formed.

Next, in step S3, the transfer substrate 111 supplied with the droplet R of the molding resin is transported from the supply position to the transfer position, and foreign matters are removed during the transport (FIG. 13B). That is, when the transfer substrate 111 is transported by the substrate holding member 45 in the direction indicated by the arrow X in FIG. 13B, an air flow toward the mold 1 is generated, and the foreign matter P is drawn into the air flow and the foreign matter P is drawn into the mold 1. When the foreign matter P approaches or is transferred, the foreign matter P is captured and removed by the electrostatic force developed by the sub-convex structure portion 7 of the foreign matter catching region B of the mold 1.
Next, in the contacting step, the mold holding unit 42 and the substrate holding unit 45 are brought close to each other, the mold 1 having the concavo-convex structure 5 and the transfer substrate 111 are brought close to each other, and the mold 1 and the transfer substrate 111 are placed between them. The resin droplet R is developed to form a molded resin layer (step S4).

Next, in the curing process, light irradiation is performed from the mold 1 side to cure the resin layer to be molded, thereby forming a transfer resin layer to which the uneven structure 5 of the mold 1 has been transferred (step S5). In this curing step, when the transfer substrate 111 is made of a light-transmitting material, light irradiation may be performed from the transfer substrate 111 side, or light irradiation may be performed from both sides of the transfer substrate 111 and the mold 1. Further, when the molding resin is a thermosetting resin or a thermoplastic resin, the molding resin layer can be cured by heating or cooling (cooling). .
Next, in the mold release process, the transfer resin layer and the mold 1 are separated from each other, and the pattern structure as the transfer resin layer is positioned on the transfer substrate 111 (step S6).
Next, in step S7, it is determined whether or not the imprint has reached the required number of times, and if so, the imprint is terminated.

If the required number of imprints has not been reached, it is determined in step S8 whether or not the electrostatic force due to charging of the sub-convex structure portion 7 of the mold 1 is sufficient. If the sub-convex structure portion 7 is sufficiently charged, the process from the resin supply process of step S2 to the release process of step S6 is repeated, and whether or not the imprint has reached the required number of times in step S7. Judging. On the other hand, if the sub-convex structure portion 7 is insufficiently charged or not charged, the operation returns to the operation of charging the sub-convex structure portion 7 of the mold 1 in step S1, and then the resin supply process in step S2 to step S6. The process until the mold release process is repeated, and in step S7, it is determined whether or not the required number of imprints has been reached.
In this embodiment, instead of the above-described mold 1 of the present invention, the imprint mold 1 ′ of the present invention is provided with the concavo-convex structure 8 on the surface 7 a of the sub-convex structure portion 7 located in the foreign matter capturing region B. (See FIG. 4) can be used.

Also, the mold used may be a mold that does not have a so-called mesa structure that does not include the main convex structure portion 4 and the sub-convex structure portion 7, unlike the mold 1 of the present invention. FIG. 15 is a diagram showing a state in which the foreign matter capturing area 103 located on the upstream side in the transport direction of the transfer substrate 111 with respect to the uneven structure area 102 of the mold 101 is charged in step S1. Also in this case, the charging material M of the imprint apparatus 41 can be charged by bringing the charging material M into contact with or away from the foreign matter capturing area 103 of the mold 101.
Further, in this embodiment, the operation is not limited to using the imprint apparatus 41 of the present invention, and the operation of charging the charging material M with the surface 7a of the sub-convex structure portion 7 by contacting, separating, This can be done using any desired means.

<Second Embodiment>
Next, another embodiment of the imprint method of the present invention will be described with reference to FIGS. 16 and 17 by taking the case of using the above-described imprint apparatus 21 of the present invention (see FIGS. 7 and 8) as an example. To do. In FIG. 16, only a mold holding part and a board | substrate holding part are shown, and the other member which comprises the imprint apparatus 21 is not illustrated. FIG. 17 is a flowchart showing the flow of steps of the imprint method shown in FIG.
In the present embodiment, in the resin supply process, a target region on the convex structure portion 112 of the imprint transfer substrate 111 held by the substrate holding portion 25 is covered by an inkjet head 28 of the resin supply portion 27 (not shown). The molding resin droplet R is discharged and supplied (step S11).
Next, in step S12, the transfer substrate 111 to which the droplet R of the molding resin has been supplied is conveyed from the supply position to the transfer position in the direction of arrow X. In this conveyance, foreign matter is removed (FIG. 16). . That is, when the transfer substrate 111 is conveyed by the substrate holding member 25, an air flow toward the mold 1 is generated, and the foreign material P approaches the mold 101 by being drawn into the air flow, or the foreign material P exists on the transferred transfer substrate 111. In this case, the foreign matter P is sucked and removed together with the atmosphere from the suction port 24 by the suction mechanism 23 provided in the mold holding unit 22 of the imprint apparatus 21 and is prevented from reaching the mold 101.

Next, in the contacting step, the mold holding unit 22 and the substrate holding unit 25 are brought close to each other, the mold 101 and the transfer substrate 111 are brought close to each other, and a resin droplet R is placed between the mold 101 and the transfer substrate 111. The molded resin layer is formed by expanding (step S13). In the illustrated example, the uneven structure of the mold 101 is omitted.
Next, in the curing process, light irradiation is performed from the mold 101 side to cure the molding resin layer, thereby obtaining a transfer resin layer to which the uneven structure of the mold 101 is transferred (step S14). In this curing step, when the transfer substrate 111 is made of a light-transmitting material, light irradiation may be performed from the transfer substrate 111 side, or light irradiation may be performed from both sides of the transfer substrate 111 and the mold 101. Further, when the molding resin is a thermosetting resin or a thermoplastic resin, the molding resin layer can be cured by heating or cooling (cooling). .

Next, in the mold release step, the transfer resin layer and the mold 101 are separated from each other, and the pattern structure that is the transfer resin layer is positioned on the transfer substrate 111 (step S15).
Next, in step S16, it is determined whether or not the required number of imprints has been reached. If so, the imprint is terminated.
If the required number of imprints has not been reached, the process from the resin supply process in step S11 to the release process in step S15 is repeated, and it is determined in step S16 whether the required number of imprints has been reached. To do.
In this embodiment, the mold to be used may be a so-called mesa mold having a convex structure portion, unlike the mold 101 of the present invention.
In this embodiment, the imprint apparatus 21 according to the present invention is not limited to use, and a desired suction mechanism is provided on the upstream side in the transfer substrate transport direction with respect to the uneven structure region of the mold. It may be arranged.

<Third Embodiment>
Next, another embodiment of the imprint method of the present invention will be described with reference to FIG. 18 and FIG. 17 described above, taking the case of using the above-described imprint apparatus 31 of the present invention as an example. In FIG. 18, only the mold holding unit and the substrate holding unit are shown, and other members constituting the imprint apparatus 31 are not shown. FIG. 17 is a flowchart showing a flow of steps of the imprint method shown in FIG.
In the present embodiment, in the resin supplying step, the resin to be molded is transferred from the inkjet head 38 of the resin 37 (not shown) to a desired region on the convex structure portion 112 of the imprint transfer substrate 111 held by the substrate holding portion 35. The droplet R is discharged and supplied (step S11).
Next, in step S12, when the transfer substrate 111 supplied with the resin droplet R to be molded is transported from the supply position to the transfer position in the direction of the arrow X, foreign matter is removed (FIG. 18). That is, an air flow toward the mold 101 is generated by the transfer of the transfer substrate 111 by the substrate holding member 35, and the foreign matter P approaches the mold 1 by being drawn into the air flow, or the foreign matter P exists on the transferred transfer substrate 111. In this case, the foreign matter P is captured and removed by the dust collection unit 34 of the dust collection mechanism 33 provided in the mold holding unit 32 of the imprint apparatus 31 and is prevented from reaching the mold 101.

Next, in the contacting step, the mold holding unit 32 and the substrate holding unit 35 are brought close to each other, the mold 101 and the transfer substrate 111 are brought close to each other, and a resin droplet R is placed between the mold 101 and the transfer substrate 111. The molded resin layer is formed by expanding (step S13). In the illustrated example, the uneven structure of the mold 101 is omitted.
Next, in the curing process, light irradiation is performed from the mold 101 side to cure the molding resin layer, thereby forming a transfer resin layer to which the uneven structure of the mold 101 has been transferred (step S14). In this curing step, when the transfer substrate 111 is made of a light-transmitting material, light irradiation may be performed from the transfer substrate 111 side, or light irradiation may be performed from both sides of the transfer substrate 111 and the mold 101. Further, when the molding resin is a thermosetting resin or a thermoplastic resin, the molding resin layer can be cured by heating or cooling (cooling). .
Next, in the mold release step, the transfer resin layer and the mold 101 are separated from each other, and the pattern structure that is the transfer resin layer is positioned on the transfer substrate 111 (step S15).
Next, in step S16, it is determined whether or not the required number of imprints has been reached. If so, the imprint is terminated.

If the required number of imprints has not been reached, the process from the resin supply process in step S11 to the release process in step S15 is repeated, and it is determined in step S16 whether the required number of imprints has been reached. To do.
Also in the present embodiment, the mold to be used may be a so-called mesa mold having a convex structure portion, unlike the mold 101 of the present invention.
Further, in this embodiment, the imprint apparatus 31 of the present invention is not limited to the use, and a desired dust collecting mechanism is provided on the upstream side in the transfer direction of the transfer substrate from the uneven structure region of the mold. It may be arranged.

<Fourth Embodiment>
Next, another embodiment of the imprint method of the present invention will be described with reference to FIG. 19 and FIG. 20 by using the above-described imprint mold 1 ′ of the present invention (see FIG. 4) as an example. While explaining. FIG. 20 is a flowchart showing the flow of steps of the imprint method shown in FIG.
In the present embodiment, in the resin supply process, the droplet R of the molding resin is supplied to a desired region on the imprint transfer substrate 111 held by the substrate holder 11 (step S21). In this resin supply step, the amount of droplets is reduced in the main convex structure portion 4 located in the concave / convex structure region A of the mold 1 ′ to be used and the sub convex structure portion 7 located in the foreign matter capturing region B in the subsequent contact step. The droplet R is supplied onto the transfer substrate 111 so that the droplet R contacts. In the illustrated example, the pattern density of the concavo-convex structure 8 located in the sub-convex structure portion 7 of the mold 1 ′ is larger than the pattern density of the concavo-convex structure 5 located in the main convex structure portion 4.
Next, in the contacting step, the transfer substrate 111 supplied with the droplet R of the molding resin is conveyed from the supply position to the transfer position (FIG. 19A), and then the mold 1 ′ and the transfer substrate 111 are moved. In close proximity, a resin droplet R is developed between the mold 1 'and the transfer substrate 111 to form a molded resin layer (step S22).

Next, in the curing process, light is irradiated from the mold 1 'side to cure the resin layer to be molded (FIG. 19B), and a transfer resin layer to which the uneven structure 5 of the mold 1' is transferred ( Step S23). In this curing step, when the transfer substrate 111 is made of a light-transmitting material, light irradiation may be performed from the transfer substrate 111 side, or light irradiation may be performed from both sides of the transfer substrate 111 and the mold 1 ′. . Further, when the molding resin is a thermosetting resin or a thermoplastic resin, the molding resin layer can be cured by heating or cooling (cooling). .
Next, in the mold release step, the transfer resin layer and the mold 1 ′ are separated from each other, so that the pattern structure as the transfer resin layer is positioned on the transfer substrate 111 (step S24). By separating the transfer resin layer from the mold 1 ′, the main convex structure portion 4 located in the concave / convex structure region A of the mold 1 ′ and the sub convex structure portion 7 located in the foreign matter capturing region B are charged (FIG. 19 (C)). In the illustrated example, both the main convex structure portion 4 and the sub convex structure portion 7 of the mold 1 ′ are positively charged. However, the pattern density of the concave and convex structure 8 located in the sub convex structure portion 7 is the main convex structure portion 4. Is higher than the pattern density of the concavo-convex structure 5 located in the sub-convex structure portion 7 located in the foreign matter capturing region B rather than the charge amount in the main convex structure portion 4 located in the concavo-convex structure region A of the mold 1 ′. The charge amount at is high.

Next, in step S25, it is determined whether or not the required number of imprints has been reached. If so, the imprint is terminated.
If the required number of imprints has not been reached, the next imprint is started from the resin supply step of step S21. In this case, in step S21, the foreign substance is removed when the transfer substrate 11 supplied with the droplet R of the molding resin is transported from the supply position to the transfer position in the direction of the arrow X (FIG. 19D). . That is, when the transfer substrate 11 is transported, an air flow toward the mold 1 ′ is generated, and the foreign matter P approaches the mold 1 ′ by being drawn into the air flow, or when the foreign matter P exists on the transferred transfer substrate 11. These foreign matters P are captured and removed by the electrostatic force generated by the sub-convex structure portion 7 located in the foreign matter catching region B of the mold 1 ′, and the main convex structure portion 4 located in the concavo-convex structure region A of the mold 1 ′. Reaching is prevented. Thereafter, the process from the contact process in step S22 to the release process in step S24 is repeated, and in step S25, it is determined whether or not the required number of imprints has been reached.

  In the present embodiment, instead of the above-described imprint mold 1 ′ (see FIG. 4) of the present invention, the sub-convex structure portion 7 located in the foreign matter capturing region B of the mold 1 includes the concavo-convex structure 8. A non-imprint mold 1 (see FIGS. 1 and 2) may be used. In this case, as shown in FIG. 21, the molding resin to be supplied as the droplet R1 to the transfer substrate 111 so as to contact the main convex structure portion 4 located in the concave-convex structure region A of the mold 1 and the foreign matter capturing region B The resin supplied as the droplet R2 to the transfer substrate 111 so as to be in contact with the sub-convex structure portion 7 that is positioned may be different. That is, as compared with the resin supplied as the droplet R1, the resin supplied as the droplet R2 can be a resin that is located farther away from the material of the mold 1 on the opposite side of the charging column. As a result, the sub-convex structure portion 7 that does not include the concavo-convex structure 8 can exhibit a sufficient electrostatic force.

In this embodiment, instead of the above-described imprint mold 1 ′ of the present invention (see FIG. 4), a mold that does not include the main convex structure portion 4 and the sub convex structure portion 7 may be used. . FIG. 22 shows the use of such a mold 101 as a transfer substrate 111 with a convex structure portion 112 corresponding to the concave / convex structure region 102 of the mold 101 and a convex structure portion 113 corresponding to the foreign matter capturing region 103 of the mold 101. An example of using a transfer substrate provided is shown. Also in this case, the foreign matter capturing area 103 of the mold 101 can be charged in the peeling in step S24.
Furthermore, in this embodiment, at the time of the first imprint or the first imprint after cleaning the mold, it is located in the foreign matter capturing area B of the mold 1 ′ before the resin supply step of step S21. The sub-convex structure portion 7 may be charged. Such charging of the sub-convex structure portion 7 of the mold 1 ′ can be performed using, for example, the imprint apparatus 41 of the present invention, as in the first embodiment described above.
In such an imprinting method of the present invention, an air flow toward the mold is generated by the transfer substrate being transferred, and the foreign matter is drawn into the air flow to approach the mold, or there is a foreign matter on the transferred transfer substrate. However, these foreign substances are removed before reaching the uneven structure region of the mold, and it is possible to prevent occurrence of defects in the pattern structure, damage to the mold, and the like.

The above-described embodiment of the imprint method is an exemplification, and the present invention is not limited to this. For example, in the above-described embodiment, the mold is at the transfer position and the transfer substrate is transported to the transfer position. However, when only the mold is transported to the transfer position, or the mold and the transfer substrate are at the transfer position. It may be a case where it is conveyed. In the following, as in the first embodiment described above, an example in which the imprint mold 1 (see FIGS. 1 and 2) and the imprint apparatus 41 (see FIGS. 11 and 12) of the present invention are used is taken as an example. The case where only the mold is conveyed to the transfer position will be described with reference to FIG. The mold 1 indicated by a solid line in FIG. 23 is in a state where the charging of the sub-convex structure portion 7 (see FIG. 13A) has been completed, and the transfer substrate 111 is supplied with droplets R of resin to be molded. At the transfer position. In the present invention, the mold 1 is transported in the direction of the arrow X ′ shown in the drawing toward the transfer position, and foreign matters are removed during the transport. That is, as described above, when the mold 1 is conveyed in the direction of the arrow X ′ shown in the figure toward the transfer position, the transfer substrate 111 is relatively conveyed in the direction of the arrow X shown in the figure relative to the mold 1. Become. Therefore, the foreign matter capturing area B of the mold 1 is located upstream of the concavo-convex structure area A in the transfer direction of the transfer substrate 111 (the arrow X direction in the drawing). When the mold 1 is transported in the direction of the arrow X ′ and transported to the position indicated by the chain line, even if the foreign matter P ₁ is present in the nearby atmosphere, the substructure of the foreign matter capturing area B of the mold 1 7 is captured and removed by the electrostatic force developed. Further, when the mold 1 is further transported in the direction of the arrow X ′ and transported to a position close to the transfer substrate 111 (a position indicated by a two-dot chain line), the foreign matter P ₂ exists on the transfer substrate 111. The substructure 7 in the foreign matter capturing area B of the mold 1 is captured and removed by the electrostatic force that is developed. Therefore, even if foreign matter approaches the mold or foreign matter is present on the transfer substrate, these foreign matter is removed before reaching the concavo-convex structure region of the mold, resulting in pattern structure defects and mold damage. Etc. can be prevented. Thus, the effect in the case where a mold is conveyed to a transfer position is similarly show | played also in the above-mentioned 2nd-4th embodiment.

  The present invention can be applied to the manufacture of various pattern structures using an imprint method and the fine processing of workpieces such as substrates.

DESCRIPTION OF SYMBOLS 1,1 ', 1 "... Imprint mold 2 ... Base part 4 ... Main convex structure part 5 ... Uneven structure 7, 7A, 7B ... Sub-convex structure part 8 ... Uneven structure A ... Uneven structure area B ... Foreign substance capture area DESCRIPTION OF SYMBOLS 21, 31, 41 ... Imprint apparatus 22, 32, 42 ... Mold holding part 23 ... Suction mechanism 33 ... Dust collection mechanism 25, 35, 45 ... Substrate holding part 27, 37, 47 ... Resin supply part 49 ... Charge generating member

Claims (17)

A resin supply step of supplying the molding resin to the transfer substrate at the supply position;
The transfer substrate is transported from the supply position to the transfer position, the mold having a concavo-convex structure and the transfer substrate are brought close to each other, and the resin to be molded is developed between the mold and the transfer substrate. Forming a contact step;
A curing step of curing the molding resin layer and transferring the concavo-convex structure to the transfer resin layer;
A mold release step of separating the transfer resin layer and the mold to place the pattern structure, which is the transfer resin layer, on the transfer substrate;
An imprinting method comprising performing an operation of removing foreign matter existing in the atmosphere and / or on the transfer substrate at least when the transfer substrate is transported to the transfer position.   2. The foreign matter is captured and removed by electrostatic force on the upstream side in the transport direction of the transfer substrate to the transfer position from the region having the concavo-convex structure of the mold. Imprint method.   3. The electrostatic force is expressed by setting a foreign matter catching region upstream of the region having the concavo-convex structure in the mold in the transport direction, and charging the foreign matter catching region. Imprint method.   The foreign matter catching region is charged by contacting and separating the material located on the opposite side of the charge train to the foreign matter capturing region of the mold with respect to the position of the constituent material of the mold in the electrifying train. The imprint method according to claim 3.   The imprint method according to claim 3, wherein the foreign matter capturing region is charged by separating the transfer resin layer and the mold in the peeling step.   The imprint method according to claim 2, wherein a dust collection mechanism is disposed upstream of the region having the concavo-convex structure of the mold in the transport direction.   2. The in-hole according to claim 1, wherein the foreign matter is removed by suction of an atmosphere upstream of the region having the concavo-convex structure of the mold in the transfer direction of the transfer substrate to the transfer position. How to print. A resin supply step of supplying the molding resin to the transfer substrate at the supply position;
Transporting the mold or both the mold and the transfer substrate so that the mold having a concavo-convex structure at a position different from the supply position and the transfer substrate at the supply position are opposed to each other at the transfer position, A contact step in which the mold and the transfer substrate are brought close to each other at the transfer position, and the molding resin is developed between the mold and the transfer substrate to form a molding resin layer;
A curing step of curing the molding resin layer and transferring the concavo-convex structure to the transfer resin layer;
A mold release step of separating the transfer resin layer and the mold to place the pattern structure, which is the transfer resin layer, on the transfer substrate;
An imprinting method comprising performing an operation of removing foreign matter existing in the atmosphere and / or on the transfer substrate at least when the mold or the mold and the transfer substrate are transported to the transfer position.   A base, a concavo-convex structure region set on one surface of the base, a foreign matter catching region, a main convex structure portion that is located in the concavo-convex structure region and has a concavo-convex structure on the surface, and a sub-convex located in the foreign matter catching region A mold for imprinting, comprising: a structural part.   The foreign substance capturing area and the concavo-convex structure area are projected onto a plane orthogonal to the direction from the end of the base located on the opposite side of the concavo-convex structure area to the concavo-convex structure area via the foreign substance capturing area. The imprint mold according to claim 9, wherein a width of the foreign substance capturing region is larger than a width of the uneven structure region.   The surface of the sub-convex structure portion has a concavo-convex structure, and the density of the concavo-convex structure is higher than the density of the concavo-convex structure located on the surface of the main convex structure portion. 10. A mold for imprinting according to 10.   The imprint according to any one of claims 9 to 11, wherein a plurality of convex structure portions located on a surface of the sub-convex structure portion are present in a state of being separated from each other in the foreign matter capturing region. Mold.   In the direction from the end of the base located on the opposite side of the concavo-convex structure region to the concavo-convex structure region via the foreign substance capturing region, a plurality of sub-convex structure portions exist in a state of being separated from each other. The mold for imprinting according to claim 12, characterized in that:   The sub-convex structure portions are spaced apart from each other in a direction orthogonal to the direction from the end portion side of the base located on the opposite side of the concavo-convex structure region to the concavo-convex structure region via the foreign substance capturing region. The imprint mold according to claim 12, wherein a plurality of the molds are present. A mold holding unit for holding the mold, a substrate holding unit for holding the transfer substrate, and a resin supply unit for supplying a molding resin to the transfer substrate,
The substrate holding part is movable with respect to the mold holding part and the resin supply part,
The imprint apparatus, wherein the mold holding unit has a suction mechanism upstream of a mold holding position in a direction in which the substrate holding unit moves toward the mold holding unit. A mold holding unit for holding the mold, a substrate holding unit for holding the transfer substrate, and a resin supply unit for supplying a molding resin to the transfer substrate,
The substrate holding part is movable with respect to the mold holding part and the resin supply part,
The imprint apparatus, wherein the mold holding unit has a dust collection mechanism upstream of a mold holding position in a direction in which the substrate holding unit moves toward the mold holding unit. At least one of a mold holding unit for holding a mold, a substrate holding unit for holding a transfer substrate, a resin supply unit for supplying a molding resin to the transfer substrate, and a mold held by the mold holding unit A charge generating member that causes charging in the part,
The substrate holding part is movable with respect to the mold holding part and the resin supply part,
The charge generating member is a contact member capable of approaching and separating from a desired portion upstream of the mold held by the mold holding unit in a direction in which the substrate holding unit moves toward the mold holding unit. An imprint apparatus comprising:

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