JP2022080723A - Imprint device, imprint method and manufacturing method of uneven structure - Google Patents

Abstract

To suppress contamination of a transfer portion by components of a mold-releasing agent contained in different resin materials when the different resin materials are supplied in the same imprinting device.SOLUTION: An imprint device 10 includes a base material transport unit 13 for horizontally transporting a base material 40, a mold holding unit 18 for holding a mold 50, a first dispenser head 17A for discharging a first resin material to the base material 40, and a second dispenser head 17B for discharging a second resin material to the base material 40, an airflow forming portion 19 for forming an airflow from one side to the other. The first dispenser head 17A and the second dispenser head 17B can move between standby positions P1b and P2b and discharge positions P1a and P2a, respectively. The first resin material has higher mold-release performance than the second resin material, and the discharge position P1a of the first dispenser head 17A is not located on the upstream side of the airflow with respect to the discharge position P2a of the second dispenser head 17B.SELECTED DRAWING: Figure 2

Description

The present disclosure relates to an imprint apparatus, an imprint method, and a method for manufacturing an uneven structure.

In recent years, as a fine pattern forming technique that replaces the photolithography technique, a pattern forming technique using an imprint method has attracted attention. The imprint method is a pattern forming technique in which a mold member (mold) having a fine concavo-convex structure is used and the concavo-convex structure is transferred to an object to be molded to transfer the fine structure to the same size. For example, in the imprint method using a photocurable resin, droplets of the photocurable resin are supplied to the surface of the workpiece as an object to be molded, and a predetermined distance between the mold having a desired uneven structure and the workpiece. The uneven structure is filled with the photocurable resin, and in this state, light is irradiated from the mold side to cure the photocurable resin, and then the mold is separated from the resin layer, so that the unevenness of the mold is provided. Form a pattern structure having an inverted concave-convex structure (concave-convex pattern) (Patent Document 1).

Japanese Unexamined Patent Publication No. 2014-41861

The conventional imprint device is not supposed to use a plurality of types of resin materials in the same imprint device, and generally has only one dispenser head. On the other hand, in recent years, it has been required to apply different resin materials in the same imprint device.

In this embodiment, when different resin materials are supplied in the same imprint device, it is possible to prevent the transfer portion from being contaminated by the components of the release agent contained in the resin material. , An imprint method and a method for manufacturing an uneven structure.

The imprint device according to the present embodiment is an imprint device, which is held by a base material transport portion that holds and horizontally conveys a base material, a mold holding portion that holds a mold, and the base material transport portion. A first dispenser head that discharges the first resin material to the base material, and a second dispenser head that discharges the second resin material to the base material held by the base material transport portion. The first dispenser head and the second dispenser head are movable between a standby position and a discharge position, respectively, and the first resin is provided with an air flow forming portion for forming an air flow from one side to the other. The material has higher releasability than the second resin material, and the discharge position of the first dispenser head is not located on the upstream side of the air flow with respect to the discharge position of the second dispenser head.

In the imprinting apparatus according to the present embodiment, the first resin material contains a mold release agent, and the second resin material does not contain the mold release agent, or the mold release agent is more than the first resin material. The content of the agent may be low.

In the imprint device according to the present embodiment, the standby position of the first dispenser head and the standby position of the second dispenser head are located on opposite sides of the flow line of the base material transport portion. You may.

In the imprinting apparatus according to the present embodiment, the base material may be in the form of a sheet.

The imprint method according to the present embodiment is an imprint method, which is a step of holding the base material by the base material transport portion and transporting the base material in the horizontal direction, and a first resin from the first dispenser head to the base material. A step of ejecting a droplet of the material, a step of deploying the droplet of the first resin material between the mold and the base material to form a first resin layer of the first resin material, and the first step. The step of obtaining the first resin layer to which the surface shape of the mold is transferred by curing the resin layer, the step of discharging the second resin material from the second dispenser head to the base material, and the mold and the above. The surface shape of the mold is formed by developing a droplet of the second resin material between the substrate and the second resin material to form a second resin layer of the second resin material and by curing the second resin layer. The first dispenser head and the second dispenser head are movable between a standby position and a discharge position, respectively, and are provided with a step of obtaining the second resin layer to which the second resin layer is transferred. The first resin material has a higher releasability than the second resin material, and the discharge position of the first dispenser head is relative to the discharge position of the second dispenser head. It is not located on the upstream side of the airflow.

In the imprint method according to the present embodiment, the first resin material contains a mold release agent, and the second resin material does not contain the mold release agent, or the mold release agent is more than the first resin material. The content of the agent may be low.

In the imprint method according to the present embodiment, the base material on which the first resin layer is formed and the base material on which the second resin layer is formed may be different from each other.

In the imprint method according to the present embodiment, the standby position of the first dispenser head and the standby position of the second dispenser head are located on opposite sides of the flow line of the base material transport portion. You may.

In the imprint method according to the present embodiment, the base material may be in the form of a sheet.

The method for manufacturing the concave-convex structure according to the present embodiment includes a step of preparing a first base material and a droplet of a first resin material containing a mold release agent to be ejected from the first dispenser head onto the first base material. A step of forming a first resin layer of the first resin material by developing droplets of the first resin material between the mold and the first base material, and a step of curing the first resin layer. By doing so, the first resin layer to which the surface shape of the mold is transferred is obtained, and the step of adhering the mold release agent in the first resin material to the mold, the base material main body, and the base material. A step of preparing a second base material having a mask layer formed on the main body, a step of discharging a second resin material from the second dispenser head to the second base material, and a step of adhering the mold release agent. A step of developing a droplet of the second resin material between the mold and the second base material to form a second resin layer of the second resin material, and curing the second resin layer. The step of obtaining the second resin layer to which the surface shape of the mold is transferred, the step of dry-etching the second resin layer until the mask layer is exposed, and the step of not being covered with the second resin layer. The first step comprises a step of removing the mask layer, a step of dry etching the base material main body using the remaining mask layer as a mask, and a step of removing the mask layer remaining on the base material main body. The 1 dispenser head and the 2nd dispenser head are movable between the standby position and the discharge position, respectively, and an air flow from one side to the other side is formed, and the first resin material is the second resin material. The releasability is higher than that, and the discharge position of the first dispenser head is not located on the upstream side of the air flow with respect to the discharge position of the second dispenser head.

According to the present embodiment, when different resin materials are supplied in the same imprinting apparatus, it is possible to prevent the transfer portion from being contaminated by the components of the release agent contained in the resin material.

FIG. 1 is a side view showing an imprint device according to an embodiment. FIG. 2 is a plan view showing an imprint device according to an embodiment. 3 (a)-(d) are side views showing a part of the imprint method according to the embodiment. 4 (a)-(d) are side views showing a part of the imprint method according to the embodiment. 5 (a)-(h) are schematic cross-sectional views showing a method of manufacturing an uneven structure according to an embodiment. 6 (a)-(d) are side views showing a part of the imprint method according to the modified example. 7 (a)-(d) are side views showing a part of the imprint method according to the modified example. FIG. 8 is a plan view showing an imprint device according to the first modification. FIG. 9 is a side view showing the imprint device according to the second modification. FIG. 10 is a plan view showing an imprint device according to the second modification. FIG. 11 is a plan view showing an imprint device according to a third modification.

Hereinafter, each embodiment will be described with reference to the drawings. The drawings are illustrations and may be exaggerated for illustration purposes and may differ from the actual product. In addition, it is possible to change and implement as appropriate within the range that does not deviate from the technical idea. In each of the following figures, the same parts are designated by the same reference numerals, and some detailed description may be omitted.

Also, as used herein, terms such as "parallel", "orthogonal", "identical", lengths, angles and physical properties that specify the shape, geometrical conditions and physical properties and their degree. The value of, etc. shall be interpreted including the range in which the same function can be expected without being bound by the strict meaning. Furthermore, in the drawings, for the sake of clarity, the shapes of a plurality of parts that can be expected to have the same function are regularly described, but the function is expected without being bound by a strict meaning. The shapes of the portions may be different from each other as long as they can be formed. Further, in the drawings, the boundary line indicating the joint surface between the members is simply shown as a straight line for convenience, but it is not limited to a strict straight line, and the desired joining performance can be expected. To the extent possible, the shape of the boundary line is arbitrary.

[Imprint device]
An imprint device according to an embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a side view showing an imprint device according to the present embodiment, and FIG. 2 is a plan view of the imprint device shown in FIG.

As shown in FIG. 1, the imprint device 10 according to the present embodiment holds a stage unit (base material transporting portion) 13 that holds and horizontally conveys a base material 40 for imprinting, and a mold 50. A mold holding portion 18, a first dispenser head 17A, and a second dispenser head 17B are provided. The first dispenser head 17A is movable between the standby position P1b and the discharge position P1a, and the second dispenser head 17B is movable between the standby position P2b and the discharge position P2a. Further, the first dispenser head 17A and the second dispenser head 17B are arranged apart from each other in the horizontal direction (XY plane direction), and can move independently of each other.

The stage unit 13 has a base material holding portion 23 for holding the base material 40, and conveys the base material 40 in the horizontal direction. Further, the first dispenser head 17A discharges the first resin material to the base material 40 held by the base material holding portion 23. The second dispenser head 17B discharges the second resin material to the base material 40 held by the base material holding portion 23.

Further, the stage unit 13, the mold holding portion 18, the first dispenser head 17A and the second dispenser head 17B are housed in the chamber 11. A stage surface plate 12 is fixed in the chamber 11. Further, the stage unit 13 is arranged on the stage surface plate 12 in the chamber 11. The support portion 14 is arranged in the chamber 11, and the support portion 14 is arranged above the stage unit 13.

A leveling portion 15, an alignment camera 16, a second dispenser head 17B, a first dispenser head 17A, and a mold holding portion 18 are attached and fixed to the support portion 14, respectively. The mold 50 is held in the mold holding portion 18. Further, an airflow forming portion 19 for forming an airflow F from one side to the other side (in the present embodiment, from the minus side in the X-axis direction to the plus side in the X-axis direction) is arranged in the chamber 11. Further, above the mold holding portion 18, an irradiation unit 21 that irradiates light (for example, ultraviolet light) toward the first resin material or the second resin material supplied on the base material 40 is provided. There is. A transfer portion 25 is provided below the mold holding portion 18. The transfer unit 25 is a region where the mold 50 and the base material 40 are located when the shape of the mold 50 is transferred to the first resin material or the second resin material on the base material 40.

As shown in FIG. 2, a mold holding portion 18, a leveling portion 15, an alignment camera 16, a second dispenser head 17B, and a first dispenser head 17A are arranged in the chamber 11. Further, in the chamber 11, the base material 40 is carried in, and a load region 20 which is a region for holding the base material 40 on the stage unit 13 is provided. A stock portion 24 for storing the base material 40 may be provided in the chamber 11 on the upstream side of the air flow F with respect to the mold holding portion 18. In FIG. 2, some elements such as the stage surface plate 12, the support portion 14, and the irradiation portion 21 are not shown.

In the present embodiment, the discharge position P1a of the first dispenser head 17A is located on the downstream side of the air flow F with respect to the discharge position P2a of the second dispenser head 17B. The discharge position P1a of the first dispenser head 17A refers to a position where the first resin material is discharged to the base material 40 while the first dispenser head 17A is stopped on the base material 40. Similarly, the discharge position P2a of the second dispenser head 17B refers to a position where the second resin material is discharged to the base material 40 while the second dispenser head 17B is stopped on the base material 40. As a result, as will be described later, the first resin material discharged from the first dispenser head 17A has higher mold release property than the second resin material discharged from the second dispenser head 17B, and the content of the mold release agent is high. When the amount is large, the components contained in the release agent are difficult to be carried to the transfer unit 25 side. As a result, it is possible to suppress contamination of various members existing in the transfer unit 25 by the components contained in the release agent.

Further, the alignment camera 16, the leveling portion 15, the second dispenser head 17B, the first dispenser head 17A, and the load region 20 are all downstream of the airflow F with respect to the mold holding portion 18 (plus in the X-axis direction). Located on the side). As a result, foreign matter such as particles generated in the leveling portion 15, the alignment camera 16, the second dispenser head 17B, the first dispenser head 17A, or the load region 20 is prevented from being carried to the mold 50 side by the air flow F, and the foreign matter is prevented. Is prevented from adhering to the mold 50.

In the present specification, "the member A is located on the lower (upper) flow side of the airflow with respect to the member B" means that "the portion of the member A located on the upper (lower) flow side of the airflow is the member". It means that it is located on the lower (upper) flow side of the airflow F than the portion of B that is located on the lower (upper) flow side of the airflow. "

In FIG. 2, the discharge position P1a of the first dispenser head 17A is located on the downstream side of the air flow F with respect to the discharge position P2a of the second dispenser head 17B, but the present invention is not limited to this. The discharge position P1a of the first dispenser head 17A may not be located on the upstream side of the air flow F with respect to the discharge position P2a of the second dispenser head 17B. That is, the discharge position P1a of the first dispenser head 17A and the discharge position P2a of the second dispenser head 17B may exist at the same position with respect to the flow direction of the air flow F. For example, in the example shown in FIG. 2, the X coordinate of the discharge position P1a of the first dispenser head 17A and the X coordinate of the discharge position P2a of the second dispenser head 17B may be the same as each other.

As shown in FIG. 2, the mold holding portion 18, the discharge position P2a of the second dispenser head 17B, the discharge position P1a of the first dispenser head 17A, and the load region 20 are arranged in this order when viewed from a plane. There is. In this case, the mold holding portion 18, the discharge position P2a of the second dispenser head 17B, the discharge position P1a of the first dispenser head 17A, and the load region 20 are arranged in a straight line in this order. As a result, the stage unit 13 moves in the direction upstream toward the upstream of the airflow F during each step prior to the contact step described later, and does not pass under the mold 50. As a result, foreign matter such as particles is prevented from adhering to the mold 50 due to the influence of the stage unit 13.

Hereinafter, each element constituting the imprint device 10 will be further described.

(Stage unit 13)
As shown in FIG. 1, the stage unit (base material transporting unit) 13 is provided on a moving stage 22 for moving the stage unit 13 in the horizontal direction on the stage surface plate 12 and on the moving stage 22 for imprinting. It has a base material holding portion (chuck) 23 for holding the base material 40. Of these, the moving stage 22 conveys the base material holding portion 23 along the flow line TL (see FIG. 2) extending in the horizontal direction (in this case, the X direction) to position the base material 40 at a predetermined position. Is. In addition, the moving stage 22 adjusts the position of the base material 40 in the XY direction, has a function of adjusting (correcting) the position in the θ (rotation around the Z axis) direction, and adjusts the position of the base material 40 in the Z axis direction. It may have a function of adjusting the inclination of the base material 40 and a function of adjusting the inclination of the base material 40. The moving stage 22 and the base material holding portion 23 are driven by the moving stage 22 and can move together in the horizontal direction. In the present embodiment, the base material holding portion 23 holds the base material 40 by using a holding mechanism by suction, but is not limited to this, and is based on, for example, a holding mechanism by mechanical pinching, a holding mechanism by static electricity, or the like. The material 40 may be held. The stage unit 13 may be provided with a reference mark (not shown), a mold-side leveling sensor, a stage position measuring unit, and the like.

(Base material 40)
The base material 40 for imprinting may consist of a flat substrate having a flat front surface and a flat back surface. Alternatively, the base material 40 may have a mesa shape having a convex step higher than the surroundings on a part of the front surface, or a concave shape cut on a part of the back surface by, for example, counterbore processing. May be there. The base material 40 is made of, for example, quartz glass, silicate-based glass, calcium fluoride, magnesium fluoride, acrylic glass or the like, resins such as polycarbonate, polypropylene, polyethylene, polyethylene or the like, or any laminated material thereof. It may be a transparent substrate or the like. Further, as the base material 40, a metal substrate such as nickel, titanium or aluminum, a semiconductor substrate such as silicon or gallium nitride can also be used. Such a base material 40 may be, for example, a replica blank for making a replica of the mold 50 which is a master template. Alternatively, the base material 40 may be an optical element, a magnetic recording medium, or the like.

(Leveling part 15)
The leveling unit 15 is composed of, for example, a leveling sensor such as a laser displacement sensor. The leveling portion 15 has a function of measuring the height (flatness) of the base material 40 held by the base material holding portion 23.

(Alignment camera 16)
The alignment camera 16 positions the base material 40 on the stage unit 13 in the horizontal direction by detecting an alignment mark (not shown) provided on the base material 40. Specifically, the alignment mark formed on the base material 40 is measured by the alignment camera 16 to obtain the horizontal positional deviation of the base material 40 with respect to the imprint device 10. Then, the position of the base material 40 is adjusted by, for example, the moving stage 22 based on the position shift of the base material 40 with respect to the imprint device 10. The alignment camera 16 is provided at substantially the same position as the leveling portion 15, but the alignment camera 16 may be provided at a position away from the leveling portion 15.

(1st dispenser head 17A)
The first dispenser head 17A ejects droplets 41 of a first resin material such as a photocurable resin onto a base material 40 held by a base material holding portion 23 by an inkjet method. The first dispenser head 17A is made of, for example, an inkjet head. Further, the first dispenser head 17A includes a drive unit that enables a desired operation of the first dispenser head 17A, for example, a horizontal operation, an ink supply unit to the first dispenser head 17A, and a first dispenser head. A control unit or the like that controls the 17A, the drive unit, the ink supply unit, or the like may be provided. In this case, the first dispenser head 17A has a discharge position P1a (two-dot chain line in FIG. 2) for discharging the first resin material and a standby position (solid line in FIG. 2) for waiting until the first resin material is discharged. ) P1b can be taken. In this case, the first dispenser head 17A can move in the Y direction between the discharge position P1a and the standby position P1b.

(2nd dispenser head 17B)
The second dispenser head 17B ejects droplets 41 of a second resin material such as a photocurable resin onto the base material 40 held by the base material holding portion 23 by an inkjet method. The second dispenser head 17B is made of, for example, an inkjet head. Further, the second dispenser head 17B has a drive unit that enables a desired operation of the second dispenser head 17B, for example, a horizontal operation, an ink supply unit to the second dispenser head 17B, and a second dispenser head. A control unit or the like that controls the 17B, the drive unit, and the ink supply unit may be provided. In this case, the second dispenser head 17B has a discharge position P2a (two-dot chain line in FIG. 2) for discharging the second resin material and a standby position (solid line in FIG. 2) for waiting until the second resin material is discharged. ) P2b can be taken. In this case, the second dispenser head 17B can move in the Y direction between the discharge position P2a and the standby position P2b.

(1st resin material and 2nd resin material)
The first resin material and the second resin material are each made of, for example, a photocurable resin. The photocurable resin is generally composed of a main agent, an initiator, and a cross-linking agent, and if necessary, a mold release agent for suppressing adhesion to the mold 50 and an adhesion to the base material 40 are improved. Contains an initiator for the purpose. The photocurable resin used in the present embodiment is not particularly limited, and is appropriately selected from known photocurable resins according to the intended use, required properties, physical properties, etc. of the pattern structure produced by imprinting. be able to. For example, if the application of the pattern structure is a lithography application, it is required that the etching resistance and viscosity are low and the residual film thickness is small, and if the application of the pattern structure is an optical member, a specific refractive index and light transmittance are required. Is required. A photocurable resin can be appropriately selected according to these requirements. However, in any application, it is required to have characteristics (viscosity, surface tension, etc.) that satisfy the compatibility with the inkjet head to be used. The viscosity, surface tension, etc. of the compatible liquid of the inkjet head differ depending on the structure, material, and the like. Therefore, it is possible to appropriately adjust the viscosity, surface tension, etc. of the photocurable resin, or to appropriately select an inkjet head suitable for the photocurable resin to be used.

The first resin material and the second resin material may contain different kinds of components from each other, may contain different amounts of components from each other, or may have different properties from each other. In the present embodiment, as the first resin material, a material having higher releasability with respect to the base material 40 than the second resin material is used. Specifically, the first resin material contains a mold release agent, and the second resin material does not contain a mold release agent, or the content of the mold release agent per unit weight is smaller than that of the first resin material. Such a release agent may contain, for example, a surfactant such as a fluorine-based surfactant, a silicone-based surfactant, or a hydrocarbon-based surfactant, and among them, the release agent is easily surface segregated. Since it is easy to reduce the force, those containing a fluorosurfactant and a silicone-based surfactant can be preferably used. Examples of the fluorine-based surfactant include a polyalkylene oxide (polyethylene oxide, polypropylene oxide, etc.) adduct of an alcohol having a perfluoroalkyl group, a polyalkylene oxide (polyethylene oxide, polypropylene oxide, etc.) adduct of a perfluoropolyether, and the like. Can be mentioned. The fluorosurfactant may have a hydroxyl group, an alkoxy group, an alkyl group, an amino group, a thiol group or the like in a part of the molecular structure (for example, a terminal group). Examples of the silicone-based surfactant include polydimethylsiloxane derivatives having a polymerizable group such as an acryloyl group, a metaacryloyl group, an epoxy group, an oxetane group, and a vinyl ether group. The silicone-based surfactant may have a hydroxyl group, an alkoxy group, an alkyl group, an amino group, a thiol group, or the like in a part of the molecular structure (for example, a terminal group). The mold release force (force required for peeling) of the first resin material after curing with respect to the base material 40 is smaller than the mold release force of the second resin material after curing with respect to the base material 40. That is, the cured first resin material has a property of being more easily peeled off from the base material 40 than the cured second resin material. Further, the surface energy of the cured resin after imprinting may be smaller in the first resin material than in the second resin material. Further, when the mold release agent contains a fluorine compound, the amount of the fluorine component on the surface of the cured resin after imprinting may be larger in the first resin material than in the second resin material. The charge amount of the cured resin after imprinting may be smaller in the first resin material than in the second resin material.

(Ink receiving member 26)
As shown in FIG. 2, ink receiving members 26 may be provided below the standby position of the first dispenser head 17A and below the standby position of the second dispenser head 17B, respectively. The ink receiving member 26 receives droplets that are periodically pre-discharged (also referred to as throwing away or flushing) at a standby position for the purpose of maintaining the ejection performance of the first dispenser head 17A and the second dispenser head 17B. For example, a bottomed container having an opening having a desired shape may be provided. Further, the bottom of such a bottomed container may be provided with a porous body, which improves the acceptability of droplets. The porous body is not particularly limited as long as it is made of a known inorganic or organic porous body, cloth, or other material that does not dissolve or deteriorate due to the components of the droplets.

(Mold holding portion 18)
The mold holding portion 18 holds the mold 50 in a state where the surface of the mold 50 having the uneven pattern 51 is directed toward the stage unit 13. The mold holding portion 18 holds the mold 50 by, for example, a holding mechanism by suction, a holding mechanism by mechanical pinching, a holding mechanism by static electricity, and the like, and the specific configuration of the holding mechanism is not particularly limited.

A height control mechanism 31 is attached to the mold holding portion 18, whereby the height direction (Z-axis direction) position of the mold 50 can be controlled or adjusted. The height control mechanism 31 presses the mold 50 against the photocurable resin on the base material 40 by driving the mold 50 downward. Further, the height control mechanism 31 peels (releases) the mold 50 from the photocurable resin on the base material 40 by driving the mold 50 upward.

(Mold 50)
The mold 50 has a fine uneven pattern 51 formed in the central region of the lower surface thereof. The uneven pattern 51 is formed by, for example, an electron beam lithography method. The mold 50 is made of a material that transmits light from the irradiation unit 21, and for example, quartz glass, silicic acid-based glass, calcium fluoride, magnesium fluoride, acrylic glass, etc., or any laminated material thereof may be used. Can be done. Further, the mold 50 has a pattern surface on which the uneven pattern 51 to be transferred is formed on the base material 40. In this mold 50, an electron beam resist is applied to the surface of a mold substrate, an electron beam is drawn on the electron beam resist to form a resist pattern, and the mold substrate is etched using this resist pattern as an etching mask to form an uneven pattern. It is manufactured by forming 51. Although the uneven pattern 51 is shown schematically in the figure, the height (depth of the concave portion) of the convex portion of the uneven pattern 51, the pitch, the number, and the arrangement area (the uneven pattern 51 with respect to the main surface of the mold 50). The occupied area) and the shape (line shape, dot shape (moth-eye shape), etc.) are not particularly limited and may be appropriately set according to the base material to be manufactured. The size of the uneven pattern 51 is not particularly limited, but for example, the width of the convex portion is 40 nm or less, preferably 10 nm or more and 30 nm or less, and the distance between adjacent convex portions is preferably 40 nm or less. It is 10 nm or more and 30 nm or less. The surface of the mold 50 on the stage unit 13 side may be a flat surface having no uneven pattern 51. When the base material 40 is a replica blank for making a replica template, the mold 50 may be a master template for making a replica template.

(Irradiation unit 21)
The irradiation unit 21 irradiates the photocurable resin supplied (coated) on the base material 40 with light. As will be described later, in the present embodiment, since the first resin material and the second resin material supplied on the base material 40 are photocurable resins, the photocurable resin is light from the irradiation unit 21. It is cured by irradiation with. The mold holding portion 18 is provided with an opening through which the light from the irradiation portion 21 passes.

(Airflow forming part 19)
As described above, the airflow forming portion 19 forms an airflow F from one side to the other side (from the minus side in the X-axis direction to the plus side in the X-axis direction) in the chamber 11. This airflow is blown laterally with respect to the mold holding portion 18. Further, the airflow forming portion 19 is arranged in the chamber 11 on the opposite side of the first dispenser head 17A and the second dispenser head 17B with respect to the mold holding portion 18 when viewed from a plane. The air flow forming unit 19 creates a good transfer environment in the chamber 11 excluding the influence of foreign substances such as particles, and may be, for example, sending an air flow F made of clean air (clean air). The clean air may be one that takes in outside air, and for example, it is preferable to use outside air that has passed through a filter.

(Static elimination device 32)
Further, as shown in FIGS. 1 and 2, a static elimination device 32 for statically eliminating the mold 50 and the base material 40 is provided in the chamber 11. The static elimination device 32 is for preventing foreign matter from adhering to the mold 50 and the base material 40 due to charging of the mold 50 and the base material 40. Such a static elimination device 32 is, for example, a soft X-ray type ionizer, and specifically, a gas molecule in the chamber 11 is ionized and statically eliminated by irradiating with soft X-rays (low-energy X-rays). May be there. When a soft X-ray type ionizer is used, stable static elimination performance can be obtained without generating dust.

The static eliminator 32 is arranged at a position not on the downstream side of the air flow F with respect to the mold holding portion 18. As a result, the ions generated by the static eliminator 32 are flown to the downstream side of the airflow F by the airflow F, so that the mold 50 and the base material 40 can be effectively statically eliminated. Specifically, when the airflow F is directed from the minus side in the X-axis direction to the plus side in the X-axis direction, the static elimination device 32 is located on the minus side in the X-axis direction with respect to the mold holding portion 18, or is on the plus side in the Y-axis direction. Alternatively, it is preferably located on the minus side in the Y-axis direction. In FIG. 2, the static elimination device 32 is located on the minus side in the X-axis direction with respect to the mold holding portion 18.

[Imprint method]
Next, an imprint method for performing an imprint process using the above-mentioned imprint device 10 will be described with reference to FIGS. 3 (a)-(d) and 4 (a)-(d). 3 (a)-(d) and 4 (a)-(d) are side views showing one step of the imprint method according to the present embodiment, respectively. In FIGS. 3 (a)-(d) and 4 (a)-(d), the same parts as those of the embodiments shown in FIGS. 1 and 2 are designated by the same reference numerals. Further, in FIGS. 3 (a)-(d) and 4 (a)-(d), some components such as the chamber 11, the leveling portion 15, the alignment camera 16 and the load area 20 are not shown for convenience. ing.

Here, a first photocurable resin layer (first resin layer) 42A made of a first resin material is formed on the base material 40 (first base material), and then another base material 40B (second base material) is formed. A case where a second photocurable resin layer (second resin layer) 42B made of a second resin material is formed on the material) will be described.

First, the stage unit 13 is moved to the load region 20 (see FIGS. 1 and 2) in a state where the base material 40 is not mounted on the base material holding portion 23 (load region moving step). The stage unit 13 horizontally moves on the stage surface plate 12 by driving the moving stage 22 (the same applies to each of the following steps). Next, in this load region 20, the base material 40 is held on the base material holding portion 23 of the stage unit 13 (base material holding step). In this case, the base material 40 may be sucked and held by being vacuum-sucked by the base material holding portion 23.

Subsequently, by moving the stage unit 13 to the minus side in the X-axis direction, the base material 40 is moved below the leveling portion 15 (see FIGS. 1 and 2), and the base material 40 is moved in the height direction of the base material 40 in the leveling portion 15. The position is measured (leveling process). Subsequently, by moving the stage unit 13 to the minus side in the X-axis direction, the base material 40 is moved below the alignment camera 16, and the horizontal position of the base material 40 is adjusted using the alignment camera 16 (alignment step). ).

Next, the first dispenser head 17A is moved from the standby position P1b to the minus side in the Y-axis direction and stopped at the discharge position P1a (first dispenser head position moving step). Further, by moving the stage unit 13 to the minus side in the X-axis direction, the base material 40 is moved below the first dispenser head 17A (dispenser position moving step).

Subsequently, as shown in FIG. 3A, droplets 41 of the first resin material such as a photocurable resin are ejected from the first dispenser head 17A onto the base material 40 held by the base material holding portion 23. (Droplet supply process). In this droplet supply step, droplets 41 of the first resin material are ejected and supplied from the first dispenser head 17A to a desired region on the base material 40 located below the first dispenser head 17A. After that, the first dispenser head 17A moves from the discharge position P1a to the plus side in the Y-axis direction and returns to the standby position P1b.

In FIGS. 3 (a)-(d) and 4 (a)-(d), the first dispenser head 17A at the discharge position P1a and the second dispenser head 17B at the discharge position P2a are shown by solid lines, respectively. There is. Further, the first dispenser head 17A at the standby position P1b and the second dispenser head 17B at the standby position P2b are shown by a two-dot chain line, respectively.

In the present embodiment, the airflow forming portion 19 forms an airflow F from one side (minus side in the X direction) to the other side (plus side in the X direction). As a result, the components and mist contained in the mold release agent in the droplet 41 of the first resin material discharged from the first dispenser head 17A onto the base material 40 diffuse to the transfer portion 25 side and become the mold 50 or the like. Adhesion is suppressed.

Next, as shown in FIG. 3B, by moving the stage unit 13 to the minus side in the X-axis direction, the base material 40 is moved below the mold 50 held by the mold holding portion 18 (mold position). Moving process).

Subsequently, as shown in FIG. 3C, by bringing the mold 50 and the base material 40 close to each other, a first resin material droplet 41 is developed between the mold 50 and the base material 40. The first photocurable resin layer 42A of the resin material is formed (contact step). In this contact step, the mold holding portion 18 is lowered by the height control mechanism 31, and the mold holding portion 18 and the base material holding portion 23 are in close proximity to each other. As a result, the droplet 41 of the first resin material is developed between the mold 50 and the base material 40, and the first photocurable resin layer 42A is formed.

Next, light irradiation is performed with the light from the irradiation unit 21, and the first photocurable resin layer 42A is cured. As a result, the uneven pattern 51 of the mold 50 is transferred to the first photocurable resin layer 42A (curing step). In this curing step, light is irradiated from the irradiation unit 21 located above the mold holding unit 18 in a state where the mold holding unit 18 is lowered. As a result, the first photocurable resin layer 42A is photocured to obtain the first photocurable resin layer 42A to which the surface shape of the uneven pattern 51 of the mold 50 is transferred.

After that, as shown in FIG. 3D, the first photocurable resin layer 42A and the mold 50 are separated from each other (mold release step). In this mold release step, the height control mechanism 31 raises the mold holding portion 18 to separate the first photocurable resin layer 42A and the mold 50. As a result, the first photocurable resin layer 42A having an uneven pattern structure is formed on the base material 40.

At this time, a part of the mold release agent contained in the first resin material adheres to the mold 50 side. As a result, in the step of forming the second photocurable resin layer 42B on the other base material 40B described later, the releasability between the mold 50 and the second photocurable resin layer 42B is enhanced. Therefore, when the second photocurable resin layer 42B is peeled from the mold 50, it is possible to prevent a part of the second photocurable resin layer 42B from adhering to the mold 50. As a result, when the imprinting process is repeatedly performed using the mold 50, it is possible to prevent the deposits from repeatedly causing defects in the resin layer. As described above, each step shown in FIGS. 3 (a) to 3 (d) may be a step mainly for adhering the mold release agent to the mold 50, and the first photocurability on the base material 40 may be obtained. A dummy imprint process may be performed in which the resin layer 42A is not directly used.

Subsequently, the base material 40 held by the base material holding portion 23 is replaced with another base material 40B (hereinafter, also simply referred to as a base material 40B). That is, the base material 40 on the base material holding portion 23 is removed, and then another base material 40B is held on the base material holding portion 23. In this case, the other base material 40B may have the same structure as the base material 40 or may have a different structure from the base material 40.

Next, the second dispenser head 17B is moved from the standby position P2b to the minus side in the Y-axis direction and stopped at the discharge position P2a (second dispenser head position moving step). Further, by moving the stage unit 13 to the minus side in the X-axis direction, the base material 40B is moved below the second dispenser head 17B (dispenser position moving step).

Subsequently, as shown in FIG. 4A, a droplet 41 of a second resin material such as a photocurable resin is ejected from the second dispenser head 17B onto the base material 40B held by the base material holding portion 23. (Droplet supply process). In this droplet supply step, droplets 41 of the second resin material are ejected and supplied from the second dispenser head 17B to a desired region on the base material 40B located below the second dispenser head 17B. After that, the second dispenser head 17B moves from the discharge position P2a to the plus side in the Y-axis direction and returns to the standby position P2b.

Next, as shown in FIG. 4B, by moving the stage unit 13 to the minus side in the X-axis direction, the base material 40B is moved below the mold 50 held by the mold holding portion 18 (mold position). Moving process).

Subsequently, as shown in FIG. 4C, by bringing the mold 50 and the base material 40B close to each other, a second resin material droplet 41 is developed between the mold 50 and the base material 40B. A second photocurable resin layer 42B of the resin material is formed (contact step). In this contact step, the mold holding portion 18 is lowered by the height control mechanism 31, and the mold holding portion 18 and the base material holding portion 23 are in close proximity to each other. As a result, the droplet 41 of the second resin material is developed between the mold 50 and the base material 40B, and the second photocurable resin layer 42B is formed.

Next, light irradiation is performed with the light from the irradiation unit 21, and the second photocurable resin layer 42B is cured. As a result, the shape of the uneven pattern 51 of the mold 50 is transferred to the second photocurable resin layer 42B (curing step). In this curing step, light is irradiated from the irradiation unit 21 located above the mold holding unit 18 in a state where the mold holding unit 18 is lowered. As a result, the second photocurable resin layer 42B is photocured to obtain a second photocurable resin layer 42B to which the surface shape of the uneven pattern 51 of the mold 50 is transferred.

After that, as shown in FIG. 4D, the second photocurable resin layer 42B and the mold 50 are separated from each other (mold release step). In this mold release step, the height control mechanism 31 raises the mold holding portion 18 to separate the second photocurable resin layer 42B from the mold 50. As a result, the second photocurable resin layer 42B having an uneven pattern structure is formed on the base material 40B. As described above, a part of the mold release agent contained in the first resin material is previously attached to the mold 50. As a result, in the step of separating the mold 50 and the second photocurable resin layer 42B, the mold 50 and the second photocurable resin layer 42B can be smoothly released from the mold.

As described above, in the present embodiment, the imprint device 10 includes a first dispenser head 17A and a second dispenser head 17B, and the first dispenser head 17A and the second dispenser head 17B are independent of each other. It is possible to move. As a result, different resin materials (first resin material and second resin material) can be supplied to one base material 40 in the same imprint device 10. As a result, a plurality of resin layers (first photocurable resin layer 42A, second photocurable resin layer 42B) made of different resin materials (first resin material and second resin material) are formed on the base material 40. It becomes possible to do.

Further, in the present embodiment, an airflow F from one side to the other side (from the minus side in the X-axis direction to the plus side in the X-axis direction) is formed in the chamber 11 by the airflow forming portion 19. In this case, the first resin material has higher releasability than the second resin material, and the first dispenser head 17A is located on the downstream side of the airflow F with respect to the second dispenser head 17B. As a result, the above-mentioned component of the first resin material having high releasability is less likely to be carried to the transfer portion 25 side. As a result, it is possible to suppress contamination of various members existing in the transfer unit 25 by the demolded component.

That is, the first resin material and the second resin material are supplied from the first dispenser head 17A and the second dispenser head 17B, respectively, as droplets having a liquid amount of several pL to several tens of pL by, for example, an inkjet method. Such a small amount of droplets are highly volatile, and volatile components are easily carried to the transfer unit 25 side. In the present embodiment, as described above, the first dispenser head 17A for discharging the first resin material having higher releasability and the second dispenser head 17B for discharging the second resin material having lower releasability It is arranged on the downstream side of the airflow F. As a result, it is possible to prevent the component of the first resin material having high releasability from moving to the transfer portion 25 side, diffusing, and adhering to the mold 50 or the like.

Further, in the present embodiment, the first resin material contains a mold release agent, and the second resin material does not contain a mold release agent or contains a smaller release agent than the first resin material. .. In this case, the first dispenser head 17A for discharging the first resin material is arranged on the downstream side of the airflow F with respect to the second dispenser head 17B for discharging the second resin material. As a result, it is possible to prevent the component of the mold release agent contained in the first resin material from moving to the transfer portion 25 side, diffusing, and adhering to the mold 50 or the like.

In the present embodiment, a first photocurable resin layer (first resin layer) 42A made of a first resin material and a second photocurable resin made of a second resin material are placed on one base material 40. It may be formed by superimposing the layer (second resin layer) 42B.

[Manufacturing method of uneven structure]
Next, a method for manufacturing the concavo-convex structure, which manufactures the concavo-convex structure by using the above-mentioned imprint method, will be described.

First, as shown in FIG. 5A, a base material 40 (first base material) made of quartz glass or the like is prepared.

Next, as shown in FIG. 5B, the first photocuring made of the first resin material having a predetermined uneven pattern on the base material 40 using the mold 50 of the imprinting apparatus 10 according to the present embodiment. The sex resin layer (first resin layer) 42A is formed. The method for forming the first photocurable resin layer 42A can be carried out in substantially the same manner as the steps shown in FIGS. 3A to 3D described above. At this time, a part of the mold release agent contained in the first resin material adheres to the mold 50 side. In FIGS. 5 (b) and 5 (d), the mold release agent adhering to the mold 50 side is shown by a thick line.

Subsequently, as shown in FIG. 5 (c), another base material 40B (second base material) is prepared. The base material 40B has a base material main body 61 such as quartz glass and a mask layer 62 formed on the base material main body 61, which is a metal layer such as chromium.

Next, as shown in FIG. 5D, a second photocuring made of a second resin material having a predetermined uneven pattern on the base material 40B using the mold 50 of the imprinting apparatus 10 according to the present embodiment. The sex resin layer (second resin layer) 42B is formed. The method for forming the second photocurable resin layer 42B can be carried out in substantially the same manner as the steps shown in FIGS. 4 (a) to 4 (d) described above. At this time, since the mold release agent is attached to the mold 50 in advance, the mold release property between the mold 50 and the second photocurable resin layer 42B is enhanced.

Next, as shown in FIG. 5 (e), the second photocurable resin layer 42B is removed by etching until the mask layer 62 is exposed on the surface by performing dry etching using the first etching gas.

Next, as shown in FIG. 5 (f), a part of the mask layer 62 is removed by etching by wet etching until the base material body 61 is exposed on the surface. In this way, the mask layer 62 not covered by the second photocurable resin layer 42B is removed. When the base material main body 61 is exposed on the surface, a convex portion in which the mask layer 62 and the second photocurable resin layer 42B are laminated is formed on the base material main body 61.

Next, as shown in FIG. 5 (g), the base material body 61 is etched using the remaining mask layer 62 as a mask by performing dry etching using a second etching gas such as CHF3 gas. In this case, the portion of the base material body 61 that is not covered by the mask layer 62 is scraped into a concave shape by etching. Further, the second photocurable resin layer 42B is also etched and removed by the second etching gas, and the mask layer 62 is exposed on the surface. As a result, an uneven pattern is formed on the base material main body 61.

Then, as shown in FIG. 5 (h), the mask layer 62 remaining on the base material body 61 is removed by etching by wet etching. In this way, the concavo-convex structure 60 made of the base material body 61 having the concavo-convex pattern is produced. Such an uneven structure 60 may be used, for example, as a replica mold, a device component, or the like.

[Modification example of imprint method]
Next, a modified example of the imprint method in which the imprint process is performed using the above-mentioned imprint device 10 will be described with reference to FIGS. 6 (a)-(d) and 7 (a)-(d). .. 6 (a)-(d) and 7 (a)-(d) are side views showing one step of the imprint method according to the present embodiment, respectively. In FIGS. 6 (a)-(d) and 7 (a)-(d), the same parts as those of the embodiments shown in FIGS. 1 to 5 are designated by the same reference numerals.

In this modification, a first photocurable resin layer (first resin layer) 42A made of a first resin material and a second photocurable resin layer made of a second resin material (on a single base material 40). A case where the second resin layer) 42B is formed side by side will be described.

First, in the same manner as in the above-described embodiment, the load region moving step, the base material holding step, the leveling step, the alignment step, the first dispenser head position moving step, and the dispenser position moving step are performed.

Subsequently, as shown in FIG. 6A, droplets 41 of the first resin material such as a photocurable resin are ejected from the first dispenser head 17A onto the base material 40 held by the base material holding portion 23. (Droplet supply process). In this droplet supply step, droplets 41 of the first resin material are ejected and supplied from the first dispenser head 17A to the first region A1 on the base material 40 located below the first dispenser head 17A. After that, the first dispenser head 17A moves from the discharge position P1a to the plus side in the Y-axis direction and returns to the standby position P1b.

Next, as shown in FIG. 6B, by moving the stage unit 13 to the minus side in the X-axis direction, the base material 40 is moved below the mold 50 held by the mold holding portion 18 (mold position). Moving process).

Subsequently, as shown in FIG. 6C, by bringing the mold 50 and the base material 40 close to each other, the droplet 41 of the first resin material is placed between the mold 50 and the first region A1 of the base material 40. To form the first photocurable resin layer 42A of the first resin material (contact step).

Next, light irradiation is performed with the light from the irradiation unit 21, and the first photocurable resin layer 42A is cured. As a result, the uneven pattern 51 of the mold 50 is transferred to the first photocurable resin layer 42A (curing step).

After that, as shown in FIG. 6D, the first photocurable resin layer 42A and the mold 50 are separated from each other (mold release step). As a result, the first photocurable resin layer 42A having a concavo-convex pattern structure is formed in the first region A1 on the base material 40.

Subsequently, the mold 50 held by the mold holding portion 18 is replaced with another mold 50A having a shape different from that of the mold 50 (hereinafter, also simply referred to as a mold 50A). In this case, the other mold 50A has an uneven pattern having a shape different from that of the mold 50.

Next, the second dispenser head 17B is moved from the standby position P2b to the minus side in the Y-axis direction and stopped at the discharge position P2a (second dispenser head position moving step). Further, by moving the stage unit 13 to the minus side in the X-axis direction, the base material 40 is moved below the second dispenser head 17B (dispenser position moving step).

Subsequently, as shown in FIG. 7A, a second resin material such as a photocurable resin is formed from the second dispenser head 17B in the second region A2 on the base material 40 held by the base material holding portion 23. Droplet 41 is discharged and supplied (droplet supply step). The second region A2 is a region on the base material 40 that is located at a position different from that of the first region A1 in the plane direction (XY plane direction). After that, the second dispenser head 17B moves from the discharge position P2a to the plus side in the Y-axis direction and returns to the standby position P2b.

Next, as shown in FIG. 7B, by moving the stage unit 13 to the minus side in the X-axis direction, the base material 40 is moved below the mold 50A held by the mold holding portion 18 (mold position). Moving process).

Subsequently, as shown in FIG. 7 (c), by bringing the mold 50A and the base material 40 close to each other, the droplet 41 of the second resin material is placed between the mold 50A and the second region A2 of the base material 40. To form the second photocurable resin layer 42B of the second resin material (contact step).

Next, light irradiation is performed with the light from the irradiation unit 21, and the second photocurable resin layer 42B is cured. As a result, the surface shape of the uneven pattern of the mold 50A is transferred to the second photocurable resin layer 42B (curing step).

After that, as shown in FIG. 7D, the second photocurable resin layer 42B and the mold 50A are separated from each other (mold release step). As a result, a second photocurable resin layer 42B having an uneven pattern structure is formed on the second region A2 of the base material 40.

In this modification, the first resin material discharged from the first dispenser head 17A has higher releasability than the second resin material discharged from the second dispenser head 17B. Therefore, even when the mold 50 has a structure that is harder to release than the mold 50A, for example, when the mold 50 has a higher aspect ratio than the mold 50A, the mold 50 and the first photocurable resin layer 42A Can be released smoothly.

Further, in this modification, the imprint device 10 includes a first dispenser head 17A and a second dispenser head 17B, and the first dispenser head 17A and the second dispenser head 17B can move independently of each other. ing. As a result, different resin materials (first resin material and second resin material) can be supplied to one base material 40 in the same imprint device 10. As a result, a plurality of resin layers (first photocurable resin layer 42A, second photocurable resin layer) composed of different resin materials (first resin material and second resin material) are located at different positions on the base material 40. 42B) can be formed side by side.

[First modification of the imprint device]
Next, a first modification of the imprint device will be described with reference to FIG. FIG. 8 is a plan view showing a first modification of the imprint device. In the modified example shown in FIG. 8, the positional relationship between the first dispenser head 17A and the second dispenser head 17B is different, and other configurations are substantially the same as those of the above-described embodiment. In FIG. 8, the same parts as those shown in FIGS. 1 to 7 are designated by the same reference numerals, and detailed description thereof will be omitted.

In FIG. 8, the standby position P1b of the first dispenser head 17A and the standby position P2b of the second dispenser head 17B are located on opposite sides of the flow line TL of the stage unit 13. Specifically, the standby position P1b of the first dispenser head 17A is located on the minus side in the Y direction with respect to the flow line TL of the stage unit 13. The standby position P2b of the second dispenser head 17B is located on the positive side in the Y direction with respect to the flow line TL of the stage unit 13.

In this case, the standby position P1b of the first dispenser head 17A is separated from the standby position P2b of the second dispenser head 17B in a direction (Y direction) intersecting the flow line TL. Therefore, the component volatilized from the second resin material discharged from the second dispenser head 17B is difficult to be carried to the first dispenser head 17A side located on the downstream side of the air flow F. This makes it possible to suppress contamination of the first dispenser head 17A by the volatile components. For example, even when the second resin material contains a mold release agent, contamination of the first dispenser head 17A by the components of the mold release agent can be suppressed.

[Second variant of the imprint device]
Next, a second modification of the imprint device will be described with reference to FIGS. 9 and 10. 9 and 10 are plan views showing a second modification of the imprint device. The modified examples shown in FIGS. 9 and 10 differ in that the sheet-shaped base material 40A is mainly used, and other configurations are substantially the same as those of the above-described embodiment. In FIGS. 9 and 10, the same parts as those shown in FIGS. 1 to 8 are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIGS. 9 and 10, the imprint device 10 according to the present modification includes a conveyor (base material transporting portion) 13A, a mold holding portion 18A, a first dispenser head 17A, and a second dispenser head 17B. It is equipped with. The conveyor 13A holds the sheet-shaped base material 40A for imprinting and conveys it in the horizontal direction. The mold holding portion 18A holds the roll-shaped mold 55. The first dispenser head 17A and the second dispenser head 17B are arranged apart from each other in the horizontal direction (XY plane direction) and can move independently of each other.

The conveyor 13A conveys the sheet-shaped base material 40A in the horizontal direction (in this case, the minus side in the X direction). Further, the first dispenser head 17A discharges the first resin material to the base material 40A held on the conveyor 13A. The second dispenser head 17B discharges the second resin material to the base material 40A held on the conveyor 13A. The base material 40A may be a resin such as polycarbonate, polypropylene, polyethylene, polyethylene, or a transparent substrate made of any laminated material thereof. The base material 40A is preferably in the form of a sheet and has flexibility. Such a base material 40A may be used for producing, for example, an optical component.

Further, the conveyor 13A, the mold holding portion 18A, the first dispenser head 17A and the second dispenser head 17B are housed in the chamber 11. The support portion 14 is arranged in the chamber 11, and the support portion 14 is arranged above the conveyor 13A.

A leveling portion 15, an alignment camera 16, a second dispenser head 17B, a first dispenser head 17A, and a mold holding portion 18A are attached and fixed to the support portion 14, respectively. The mold 55 is held in the mold holding portion 18A. The mold 55 is cylindrical and may have a fine uneven pattern on its surface. The mold 55 transfers the unevenness pattern to the first resin material or the second resin material on the base material 40A by rotating with respect to the mold holding portion 18A.

In the chamber 11, an airflow forming portion 19 for forming an airflow F from one side to the other side (in this modification, from the minus side in the X-axis direction to the plus side in the X-axis direction) is arranged. Further, an irradiation unit 21 is provided between the mold holding portion 18A and the air flow forming portion 19. A transfer portion 25 is provided below the mold holding portion 18A. The transfer unit 25 is a region where the mold 55 and the base material 40A are located when the shape of the mold 55 is transferred to the first resin material or the second resin material on the base material 40A.

In this modification, the discharge position P1a of the first dispenser head 17A is located on the downstream side of the air flow F with respect to the discharge position P2a of the second dispenser head 17B. As a result, when the first resin material discharged from the first dispenser head 17A has higher mold release property than the second resin material discharged from the second dispenser head 17B and the content of the mold release agent is large, It is difficult for the components contained in the release agent to be carried to the transfer unit 25 side. As a result, it is possible to suppress contamination of various members existing in the transfer unit 25 by the components contained in the release agent.

An imprint method for performing an imprint process using the imprint device 10 shown in FIGS. 9 and 10 will be described.

First, the first dispenser head 17A is moved from the standby position P1b to the minus side in the Y-axis direction and stopped at the discharge position P1a (first dispenser head position moving step). Subsequently, a droplet 46A of the first resin material such as a photocurable resin is ejected from the first dispenser head 17A and supplied to the base material 40A held on the conveyor 13A (droplet supply step). After that, the first dispenser head 17A returns from the discharge position P1a to the standby position P1b.

Next, the base material 40A is moved below the mold 55 held by the mold holding portion 18A by the conveyor 13A (mold position moving step). Subsequently, the droplet 46A of the first resin material passes through the gap between the mold 55 and the base material 40A to develop the droplet 46A between the mold 55 and the base material 40A and develop the first resin material. 1st photocurable resin layer 42A is formed (contact step).

Next, light irradiation is performed with the light from the irradiation unit 21, and the first photocurable resin layer 42A is cured. As a result, the uneven pattern of the mold 55 is transferred to the first photocurable resin layer 42A (curing step).

Next, the second dispenser head 17B is moved from the standby position P2b to the minus side in the Y-axis direction and stopped at the discharge position P2a (second dispenser head position moving step). Further, the base material 40A is moved below the second dispenser head 17B by the conveyor 13A (dispenser position moving step).

Subsequently, a droplet 46B of a second resin material such as a photocurable resin is ejected and supplied from the second dispenser head 17B onto the base material 40A held on the conveyor 13A (droplet supply step). The region to which the droplet 46B is supplied is a region on the base material 40A that is located at a position different from the region to which the droplet 46A is supplied in the plane direction (XY plane direction). After that, the second dispenser head 17B returns from the discharge position P2a to the standby position P2b.

Next, the base material 40A is moved below the mold 55 held by the mold holding portion 18A by the conveyor 13A (mold position moving step). Subsequently, the droplet 46B of the second resin material passes through the gap between the mold 55 and the base material 40A to develop the droplet 46B of the second resin material between the mold 55 and the base material 40A. The second photocurable resin layer 42B of the second resin material is formed (contact step).

Next, light irradiation is performed with the light from the irradiation unit 21, and the second photocurable resin layer 42B is cured. As a result, the uneven pattern of the mold 55 is transferred to the second photocurable resin layer 42B (curing step).

As described above, in the present modification, the imprint device 10 includes the first dispenser head 17A and the second dispenser head 17B, and the first dispenser head 17A and the second dispenser head 17B are independent of each other. It is movable. Thereby, different resin materials (first resin material and second resin material) can be supplied to one sheet-shaped base material 40A in the same imprint device 10. As a result, a plurality of resin layers (first photocurable resin layer 42A, second photocurable) composed of different resin materials (first resin material and second resin material) are located at different positions on the sheet-shaped base material 40A. It is possible to form the sex resin layers 42B) side by side.

In this modification, the first resin material discharged from the first dispenser head 17A has higher releasability than the second resin material discharged from the second dispenser head 17B. Therefore, for example, even when the first photocurable resin layer 42A has a property that it is more difficult to release from the mold 55 than the second photocurable resin layer 42B, the mold 55 and the first photocurable resin layer 42A It is possible to enhance the releasability of.

In this modification, a first photocurable resin layer (first resin layer) 42A made of a first resin material and a second photocurable material made of a second resin material are placed on one sheet-shaped base material 40A. It may be formed by superimposing the sex resin layer (second resin layer) 42B. Further, in this modification, the mold 55 forming the first photocurable resin layer 42A and the mold 55 forming the second photocurable resin layer 42B may be the same as each other, or may be different from each other. Is also good.

[Third variant of the imprint device]
Next, a third modification of the imprint device will be described with reference to FIG. FIG. 11 is a plan view showing a third modification of the imprint device. The modified example shown in FIG. 11 has a different positional relationship between the first dispenser head 17A and the second dispenser head 17B, and other configurations are substantially the same as the imprint device 10 according to the above-mentioned modified example 2. In FIG. 11, the same parts as those shown in FIGS. 9 and 10 are designated by the same reference numerals, and detailed description thereof will be omitted.

In FIG. 11, the standby position P1b of the first dispenser head 17A and the standby position P2b of the second dispenser head 17B are located on opposite sides of the flow line TL of the stage unit 13. Specifically, the standby position P1b of the first dispenser head 17A is located on the minus side in the Y direction with respect to the flow line TL of the stage unit 13, and the standby position P2b of the second dispenser head 17B is the stage unit 13. It is located on the plus side in the Y direction with respect to the flow line TL of.

In this case, the standby position P1b of the first dispenser head 17A is separated from the standby position P2b of the second dispenser head 17B in a direction (Y direction) orthogonal to the flow line TL. Therefore, the component volatilized from the second resin material discharged from the second dispenser head 17B is difficult to be carried to the first dispenser head 17A side located on the downstream side of the air flow F. This makes it possible to suppress contamination of the first dispenser head 17A by the volatile components. For example, even when the second resin material contains a mold release agent, contamination of the first dispenser head 17A by the components of the mold release agent can be suppressed.

The present disclosure is not limited to each of the above-described embodiments and modifications as they are, and at the implementation stage, the components can be modified and embodied within a range that does not deviate from the gist thereof. In addition, various inventions can be formed by an appropriate combination of the plurality of components disclosed in each of the above-described embodiments and modifications. Some components may be removed from all the components shown in each embodiment and each modification.

10 Imprint device 11 Chamber 12 Stage surface plate 13 Stage unit 14 Support part 15 Leveling part 16 Alignment camera 17A 1st dispenser head 17B 2nd dispenser head 18 Mold holding part 19 Airflow forming part 20 Load area 21 Irradiation part 23 Base material holding Part 24 Stock part 25 Transfer part 26 Ink receiving member 40 Base material 41 Droplet 50 Mold 51 Concavo-convex pattern 60 Concavo-convex structure

Claims (10)

It ’s an imprint device,
A base material transport section that holds the base material and transports it in the horizontal direction,
The mold holding part that holds the mold and
A first dispenser head that discharges a first resin material to the base material held by the base material transport portion, and a first dispenser head.
A second dispenser head that discharges a second resin material to the base material held by the base material transport portion, and a second dispenser head.
It is equipped with an airflow forming part that forms an airflow from one side to the other.
The first dispenser head and the second dispenser head can be moved between the standby position and the discharge position, respectively.
The first resin material has higher releasability than the second resin material.
An imprint device in which the discharge position of the first dispenser head is not located on the upstream side of the air flow with respect to the discharge position of the second dispenser head. The first resin material contains a mold release agent, and the second resin material does not contain the mold release agent or has a smaller content of the mold release agent than the first resin material, claim 1. The imprint device described in. The first or second aspect of the present invention, wherein the standby position of the first dispenser head and the standby position of the second dispenser head are located on opposite sides of the flow line of the substrate transport portion. Imprint device. The imprint device according to any one of claims 1 to 3, wherein the substrate is in the form of a sheet. It ’s an imprint method.
The process of holding the base material by the base material transport unit and transporting it in the horizontal direction,
A step of ejecting a droplet of the first resin material from the first dispenser head onto the base material,
A step of deploying droplets of the first resin material between the mold and the base material to form a first resin layer of the first resin material.
A step of obtaining the first resin layer to which the surface shape of the mold is transferred by curing the first resin layer, and a step of obtaining the first resin layer.
The process of discharging the second resin material from the second dispenser head to the base material, and
A step of deploying droplets of the second resin material between the mold and the base material to form a second resin layer of the second resin material.
A step of obtaining the second resin layer to which the surface shape of the mold is transferred by curing the second resin layer is provided.
The first dispenser head and the second dispenser head can be moved between the standby position and the discharge position, respectively.
An airflow from one side to the other is formed,
The first resin material has higher releasability than the second resin material.
An imprint method in which the discharge position of the first dispenser head is not located on the upstream side of the air flow with respect to the discharge position of the second dispenser head. 5. The first resin material contains a mold release agent, and the second resin material does not contain the mold release agent or has a smaller content of the mold release agent than the first resin material, claim 5. The imprint method described in. The imprint method according to claim 5 or 6, wherein the base material on which the first resin layer is formed and the base material on which the second resin layer is formed are different from each other. Any of claims 5 to 7, wherein the standby position of the first dispenser head and the standby position of the second dispenser head are located on opposite sides of the flow line of the substrate transport portion. The imprint method described in paragraph 1. The imprint method according to any one of claims 5 to 8, wherein the substrate is in the form of a sheet. The process of preparing the first base material and
A step of ejecting droplets of a first resin material containing a mold release agent from a first dispenser head onto the first base material,
A step of forming a first resin layer of the first resin material by developing droplets of the first resin material between the mold and the first base material.
By curing the first resin layer, the first resin layer to which the surface shape of the mold is transferred is obtained, and the release agent in the first resin material is adhered to the mold.
A step of preparing a second base material having a base material main body and a mask layer formed on the base material main body, and
A step of discharging the second resin material from the second dispenser head to the second base material,
A step of developing droplets of the second resin material between the mold to which the mold release agent is attached and the second base material to form a second resin layer of the second resin material.
A step of obtaining the second resin layer to which the surface shape of the mold is transferred by curing the second resin layer, and a step of obtaining the second resin layer.
A step of dry etching the second resin layer until the mask layer is exposed, and
The step of removing the mask layer not covered with the second resin layer, and
A step of dry etching the base material body using the remaining mask layer as a mask,
A step of removing the mask layer remaining on the base material main body is provided.
The first dispenser head and the second dispenser head can be moved between the standby position and the discharge position, respectively.
An airflow from one side to the other is formed,
The first resin material has higher releasability than the second resin material.
A method for manufacturing an uneven structure, wherein the discharge position of the first dispenser head is not located on the upstream side of the air flow with respect to the discharge position of the second dispenser head.

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