JP2014172169A5 - - Google Patents
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- Publication number
- JP2014172169A5 JP2014172169A5 JP2014043781A JP2014043781A JP2014172169A5 JP 2014172169 A5 JP2014172169 A5 JP 2014172169A5 JP 2014043781 A JP2014043781 A JP 2014043781A JP 2014043781 A JP2014043781 A JP 2014043781A JP 2014172169 A5 JP2014172169 A5 JP 2014172169A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- layer
- porous subpad
- substrate
- chemical mechanical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims 52
- 239000010410 layer Substances 0.000 claims 41
- 239000000758 substrate Substances 0.000 claims 17
- 239000000126 substance Substances 0.000 claims 12
- 238000001514 detection method Methods 0.000 claims 6
- 238000000034 method Methods 0.000 claims 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 4
- 230000003287 optical effect Effects 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 230000013011 mating Effects 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 238000001228 spectrum Methods 0.000 claims 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- 239000006261 foam material Substances 0.000 claims 1
- 239000012939 laminating adhesive Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000035515 penetration Effects 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 229920002635 polyurethane Polymers 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/788,594 | 2013-03-07 | ||
| US13/788,594 US9108290B2 (en) | 2013-03-07 | 2013-03-07 | Multilayer chemical mechanical polishing pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014172169A JP2014172169A (ja) | 2014-09-22 |
| JP2014172169A5 true JP2014172169A5 (enExample) | 2017-03-30 |
Family
ID=51385643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014043781A Pending JP2014172169A (ja) | 2013-03-07 | 2014-03-06 | 多層ケミカルメカニカル研磨パッド |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9108290B2 (enExample) |
| JP (1) | JP2014172169A (enExample) |
| KR (1) | KR20140110785A (enExample) |
| CN (1) | CN104029114B (enExample) |
| DE (1) | DE102014002615A1 (enExample) |
| FR (1) | FR3002873B1 (enExample) |
| TW (1) | TWI610760B (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160354896A1 (en) * | 2014-02-10 | 2016-12-08 | President And Fellows Of Harvard College | 3d-printed polishing pad for chemical-mechanical planarization (cmp) |
| US9216489B2 (en) * | 2014-03-28 | 2015-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
| TW201627658A (zh) * | 2015-01-30 | 2016-08-01 | 陶氏全球科技責任有限公司 | 拋光層分析器及方法 |
| US9446498B1 (en) * | 2015-03-13 | 2016-09-20 | rohm and Hass Electronic Materials CMP Holdings, Inc. | Chemical mechanical polishing pad with window |
| EP3272456B1 (en) * | 2016-07-21 | 2019-03-13 | Delamare Sovra | A method for manufacturing in series optical grade polishing tools |
| EP3272458B1 (en) * | 2016-07-21 | 2019-03-27 | Delamare Sovra | A method for manufacturing in series optical grade polishing tools |
| PT3272457T (pt) * | 2016-07-21 | 2019-06-27 | Delamare Sovra | Um método para fabricação em série de ferramentas de polimento de grau ótico |
| KR101904322B1 (ko) * | 2017-01-23 | 2018-10-04 | 에스케이씨 주식회사 | 연마패드 및 이의 제조방법 |
| US10569383B2 (en) * | 2017-09-15 | 2020-02-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Flanged optical endpoint detection windows and CMP polishing pads containing them |
| CN108818300A (zh) * | 2018-08-03 | 2018-11-16 | 成都时代立夫科技有限公司 | 一种分体式窗口cmp抛光垫的制备方法及cmp抛光垫 |
| US20220023991A1 (en) * | 2018-11-27 | 2022-01-27 | 3M Innovative Properties Company | Polishing pads and systems and methods of making and using the same |
| US11633830B2 (en) * | 2020-06-24 | 2023-04-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP polishing pad with uniform window |
| CN112757153B (zh) * | 2021-03-09 | 2022-07-12 | 万华化学集团电子材料有限公司 | 一种多结构体化学机械抛光垫、制造方法及其应用 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5433651A (en) * | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
| US5893796A (en) | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| EP1176630B1 (en) | 1999-03-31 | 2007-06-27 | Nikon Corporation | Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device |
| US6524164B1 (en) | 1999-09-14 | 2003-02-25 | Applied Materials, Inc. | Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus |
| JP2003133270A (ja) * | 2001-10-26 | 2003-05-09 | Jsr Corp | 化学機械研磨用窓材及び研磨パッド |
| KR20050059123A (ko) * | 2002-08-30 | 2005-06-17 | 도레이 가부시끼가이샤 | 연마 패드, 정반 홀 커버 및 연마장치 및 연마방법 및 반도체 디바이스의 제조방법 |
| KR100532440B1 (ko) * | 2003-06-05 | 2005-11-30 | 삼성전자주식회사 | 윈도로의 유체의 침투를 막는 실링 장벽부를 가지는 화학기계적 연마 장비에 사용되는 연마 패드 |
| CN1926666A (zh) * | 2004-03-11 | 2007-03-07 | 东洋橡胶工业株式会社 | 研磨垫及半导体器件的制造方法 |
| US7204742B2 (en) * | 2004-03-25 | 2007-04-17 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
| US7871309B2 (en) * | 2004-12-10 | 2011-01-18 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US7764377B2 (en) | 2005-08-22 | 2010-07-27 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
| US7210980B2 (en) | 2005-08-26 | 2007-05-01 | Applied Materials, Inc. | Sealed polishing pad, system and methods |
| JP2007260827A (ja) * | 2006-03-28 | 2007-10-11 | Toyo Tire & Rubber Co Ltd | 研磨パッドの製造方法 |
| US8083570B2 (en) * | 2008-10-17 | 2011-12-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having sealed window |
| WO2011008499A2 (en) | 2009-06-30 | 2011-01-20 | Applied Materials, Inc. | Leak proof pad for cmp endpoint detection |
| US9446497B2 (en) * | 2013-03-07 | 2016-09-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Broad spectrum, endpoint detection monophase olefin copolymer window with specific composition in multilayer chemical mechanical polishing pad |
-
2013
- 2013-03-07 US US13/788,594 patent/US9108290B2/en active Active
-
2014
- 2014-02-24 TW TW103106005A patent/TWI610760B/zh active
- 2014-02-25 DE DE102014002615.9A patent/DE102014002615A1/de not_active Withdrawn
- 2014-03-06 JP JP2014043781A patent/JP2014172169A/ja active Pending
- 2014-03-06 CN CN201410080619.8A patent/CN104029114B/zh active Active
- 2014-03-07 FR FR1451889A patent/FR3002873B1/fr not_active Expired - Fee Related
- 2014-03-07 KR KR1020140027123A patent/KR20140110785A/ko not_active Withdrawn
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