TWI610760B - 多層化學機械硏磨墊 - Google Patents

多層化學機械硏磨墊 Download PDF

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Publication number
TWI610760B
TWI610760B TW103106005A TW103106005A TWI610760B TW I610760 B TWI610760 B TW I610760B TW 103106005 A TW103106005 A TW 103106005A TW 103106005 A TW103106005 A TW 103106005A TW I610760 B TWI610760 B TW I610760B
Authority
TW
Taiwan
Prior art keywords
layer
polishing
pad
avg
porous
Prior art date
Application number
TW103106005A
Other languages
English (en)
Chinese (zh)
Other versions
TW201505771A (zh
Inventor
安格斯 瑞普
馬提 狄羅特
Original Assignee
羅門哈斯電子材料Ｃｍｐ控股公司
陶氏全球科技責任有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 羅門哈斯電子材料Ｃｍｐ控股公司, 陶氏全球科技責任有限公司 filed Critical 羅門哈斯電子材料Ｃｍｐ控股公司
Publication of TW201505771A publication Critical patent/TW201505771A/zh
Application granted granted Critical
Publication of TWI610760B publication Critical patent/TWI610760B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW103106005A 2013-03-07 2014-02-24 多層化學機械硏磨墊 TWI610760B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/788,594 2013-03-07
US13/788,594 US9108290B2 (en) 2013-03-07 2013-03-07 Multilayer chemical mechanical polishing pad

Publications (2)

Publication Number Publication Date
TW201505771A TW201505771A (zh) 2015-02-16
TWI610760B true TWI610760B (zh) 2018-01-11

Family

ID=51385643

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103106005A TWI610760B (zh) 2013-03-07 2014-02-24 多層化學機械硏磨墊

Country Status (7)

Country Link
US (1) US9108290B2 (enExample)
JP (1) JP2014172169A (enExample)
KR (1) KR20140110785A (enExample)
CN (1) CN104029114B (enExample)
DE (1) DE102014002615A1 (enExample)
FR (1) FR3002873B1 (enExample)
TW (1) TWI610760B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160354896A1 (en) * 2014-02-10 2016-12-08 President And Fellows Of Harvard College 3d-printed polishing pad for chemical-mechanical planarization (cmp)
US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
TW201627658A (zh) * 2015-01-30 2016-08-01 陶氏全球科技責任有限公司 拋光層分析器及方法
US9446498B1 (en) * 2015-03-13 2016-09-20 rohm and Hass Electronic Materials CMP Holdings, Inc. Chemical mechanical polishing pad with window
EP3272456B1 (en) * 2016-07-21 2019-03-13 Delamare Sovra A method for manufacturing in series optical grade polishing tools
EP3272458B1 (en) * 2016-07-21 2019-03-27 Delamare Sovra A method for manufacturing in series optical grade polishing tools
PT3272457T (pt) * 2016-07-21 2019-06-27 Delamare Sovra Um método para fabricação em série de ferramentas de polimento de grau ótico
KR101904322B1 (ko) * 2017-01-23 2018-10-04 에스케이씨 주식회사 연마패드 및 이의 제조방법
US10569383B2 (en) * 2017-09-15 2020-02-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Flanged optical endpoint detection windows and CMP polishing pads containing them
CN108818300A (zh) * 2018-08-03 2018-11-16 成都时代立夫科技有限公司 一种分体式窗口cmp抛光垫的制备方法及cmp抛光垫
US20220023991A1 (en) * 2018-11-27 2022-01-27 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
US11633830B2 (en) * 2020-06-24 2023-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with uniform window
CN112757153B (zh) * 2021-03-09 2022-07-12 万华化学集团电子材料有限公司 一种多结构体化学机械抛光垫、制造方法及其应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1322374A (zh) * 1999-03-31 2001-11-14 株式会社尼康 抛光体、抛光设备、抛光设备调节方法、抛光膜厚度或抛光终点测量方法及半导体器件的制造方法
US20040248501A1 (en) * 2003-06-05 2004-12-09 Jin-Kook Kim Polishing pad for chemical mechanical polishing apparatus
TW201020068A (en) * 2008-10-17 2010-06-01 Rohm & Haas Elect Mat Chemical mechanical polishing pad having sealed window

Family Cites Families (13)

* Cited by examiner, † Cited by third party
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US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6524164B1 (en) 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
JP2003133270A (ja) * 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
KR20050059123A (ko) * 2002-08-30 2005-06-17 도레이 가부시끼가이샤 연마 패드, 정반 홀 커버 및 연마장치 및 연마방법 및 반도체 디바이스의 제조방법
CN1926666A (zh) * 2004-03-11 2007-03-07 东洋橡胶工业株式会社 研磨垫及半导体器件的制造方法
US7204742B2 (en) * 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
US7871309B2 (en) * 2004-12-10 2011-01-18 Toyo Tire & Rubber Co., Ltd. Polishing pad
US7764377B2 (en) 2005-08-22 2010-07-27 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
US7210980B2 (en) 2005-08-26 2007-05-01 Applied Materials, Inc. Sealed polishing pad, system and methods
JP2007260827A (ja) * 2006-03-28 2007-10-11 Toyo Tire & Rubber Co Ltd 研磨パッドの製造方法
WO2011008499A2 (en) 2009-06-30 2011-01-20 Applied Materials, Inc. Leak proof pad for cmp endpoint detection
US9446497B2 (en) * 2013-03-07 2016-09-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Broad spectrum, endpoint detection monophase olefin copolymer window with specific composition in multilayer chemical mechanical polishing pad

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1322374A (zh) * 1999-03-31 2001-11-14 株式会社尼康 抛光体、抛光设备、抛光设备调节方法、抛光膜厚度或抛光终点测量方法及半导体器件的制造方法
US20040248501A1 (en) * 2003-06-05 2004-12-09 Jin-Kook Kim Polishing pad for chemical mechanical polishing apparatus
TW201020068A (en) * 2008-10-17 2010-06-01 Rohm & Haas Elect Mat Chemical mechanical polishing pad having sealed window

Also Published As

Publication number Publication date
FR3002873A1 (fr) 2014-09-12
KR20140110785A (ko) 2014-09-17
JP2014172169A (ja) 2014-09-22
US20140256230A1 (en) 2014-09-11
TW201505771A (zh) 2015-02-16
US9108290B2 (en) 2015-08-18
CN104029114B (zh) 2017-04-26
CN104029114A (zh) 2014-09-10
DE102014002615A1 (de) 2014-09-11
FR3002873B1 (fr) 2017-05-12

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