JP2014169450A5 - - Google Patents
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- Publication number
- JP2014169450A5 JP2014169450A5 JP2014097205A JP2014097205A JP2014169450A5 JP 2014169450 A5 JP2014169450 A5 JP 2014169450A5 JP 2014097205 A JP2014097205 A JP 2014097205A JP 2014097205 A JP2014097205 A JP 2014097205A JP 2014169450 A5 JP2014169450 A5 JP 2014169450A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- acrylate
- group
- resins
- adhesive formulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 0 OC(C=C1)N(*N(C(C=C2)=O)C2=O)C1=O Chemical compound OC(C=C1)N(*N(C(C=C2)=O)C2=O)C1=O 0.000 description 3
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/815,442 US7160946B2 (en) | 2004-04-01 | 2004-04-01 | Method to improve high temperature cohesive strength with adhesive having multi-phase system |
| US10/815442 | 2004-04-01 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005100639A Division JP5654718B2 (ja) | 2004-04-01 | 2005-03-31 | 多相系を有する接着剤を使用する高温結合力を改善する方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014169450A JP2014169450A (ja) | 2014-09-18 |
| JP2014169450A5 true JP2014169450A5 (https=) | 2014-10-30 |
| JP5676801B2 JP5676801B2 (ja) | 2015-02-25 |
Family
ID=34887744
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005100639A Expired - Lifetime JP5654718B2 (ja) | 2004-04-01 | 2005-03-31 | 多相系を有する接着剤を使用する高温結合力を改善する方法 |
| JP2014097205A Expired - Lifetime JP5676801B2 (ja) | 2004-04-01 | 2014-05-08 | 多相系を有する接着剤を使用する高温結合力を改善する方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005100639A Expired - Lifetime JP5654718B2 (ja) | 2004-04-01 | 2005-03-31 | 多相系を有する接着剤を使用する高温結合力を改善する方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7160946B2 (https=) |
| EP (1) | EP1582574B1 (https=) |
| JP (2) | JP5654718B2 (https=) |
| KR (1) | KR101158348B1 (https=) |
| CN (1) | CN1676564A (https=) |
| DE (1) | DE602005000365T2 (https=) |
| SG (1) | SG115812A1 (https=) |
| TW (1) | TWI367926B (https=) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102585760A (zh) | 2004-03-19 | 2012-07-18 | 住友电木株式会社 | 树脂组合物及采用该树脂组合物制作的半导体装置 |
| TW200707468A (en) * | 2005-04-06 | 2007-02-16 | Toagosei Co Ltd | Conductive paste, circuit board, circuit article and method for manufacturing such circuit article |
| US7422707B2 (en) * | 2007-01-10 | 2008-09-09 | National Starch And Chemical Investment Holding Corporation | Highly conductive composition for wafer coating |
| US20080292801A1 (en) * | 2007-05-23 | 2008-11-27 | National Starch And Chemical Investment Holding Corporation | Corrosion-Preventive Adhesive Compositions |
| EP2250227A4 (en) * | 2008-02-25 | 2013-08-21 | Henkel Ag & Co Kgaa | OUT OF THEIR PUNCHING CHIP FIXING PASTE |
| EP2834314A1 (en) | 2012-04-06 | 2015-02-11 | Ips Corporation | Adhesive composition for bonding low surface energy polyolefin substrates |
| WO2016031553A1 (ja) * | 2014-08-29 | 2016-03-03 | 古河電気工業株式会社 | 接着フィルム及び接着フィルムを用いた半導体パッケージ |
| CN104212365B (zh) * | 2014-09-26 | 2015-12-02 | 烟台德邦科技有限公司 | 一种非流动底部填充材料及其制备方法 |
| EP3097593B1 (de) * | 2014-12-01 | 2020-08-26 | PI Ceramic GmbH | Aktuatorvorrichtung |
| DE102014017746B4 (de) * | 2014-12-01 | 2021-10-21 | Pi Ceramic Gmbh | Aktuatorvorrichtung |
| US20180023904A1 (en) * | 2014-12-18 | 2018-01-25 | Kaneka Corporation | Graphite laminates, processes for producing graphite laminates, structural object for heat transport, and rod-shaped heat-transporting object |
| JP6623092B2 (ja) * | 2016-03-22 | 2019-12-18 | 株式会社巴川製紙所 | 熱硬化性接着シートおよびその製造方法 |
| WO2018062164A1 (ja) * | 2016-09-29 | 2018-04-05 | 積水化学工業株式会社 | 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子 |
| WO2018212215A1 (ja) | 2017-05-16 | 2018-11-22 | デクセリアルズ株式会社 | アンダーフィル材、アンダーフィルフィルム、及びこれを用いた半導体装置の製造方法 |
| US20220112373A1 (en) * | 2019-01-24 | 2022-04-14 | Showa Denko K.K. | Thermosetting resin composition |
| TWI783454B (zh) * | 2021-04-21 | 2022-11-11 | 翌驊實業股份有限公司 | 黏著複合物及其使用方法 |
| EP4671291A1 (en) * | 2024-06-26 | 2025-12-31 | Henkel AG & Co. KGaA | ADHESIVE COMPOSITION AND ASSOCIATED HARDENING PRODUCT |
| CN119306648A (zh) * | 2024-12-17 | 2025-01-14 | 杭州之江有机硅化工有限公司 | 一种双马来酰亚胺树脂及其制备方法和应用 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5747615A (en) * | 1988-04-29 | 1998-05-05 | Cytec Technology Corp. | Slurry-mixed heat-curable resin systems having superior tack and drape |
| US5003018A (en) * | 1988-04-29 | 1991-03-26 | Basf Aktiengesellschaft | Slurry mixing of bismaleimide resins |
| JP3290242B2 (ja) * | 1993-05-13 | 2002-06-10 | 住友ベークライト株式会社 | 低誘電率熱硬化性樹脂組成物 |
| US6852814B2 (en) * | 1994-09-02 | 2005-02-08 | Henkel Corporation | Thermosetting resin compositions containing maleimide and/or vinyl compounds |
| DE69621635T2 (de) * | 1995-11-13 | 2003-01-02 | Cytec Technology Corp., Wilmington | Aushärtendes Bismaleinimid Polymer für Kleb- und Verbundwerkstoffe |
| US20030055121A1 (en) * | 1996-09-10 | 2003-03-20 | Dershem Stephen M. | Thermosetting resin compositions containing maleimide and/or vinyl compounds |
| JP3599160B2 (ja) | 1997-05-16 | 2004-12-08 | 大日本インキ化学工業株式会社 | マレイミド誘導体を含有する活性エネルギー線硬化性組成物及び該活性エネルギー線硬化性組成物の硬化方法 |
| AU731141B2 (en) * | 1997-07-03 | 2001-03-22 | Loctite Corporation | High temperature, controlled strength anaerobic adhesive compositions curable under ambient environmental conditions |
| JPH11106455A (ja) * | 1997-10-06 | 1999-04-20 | Hitachi Chem Co Ltd | 樹脂ペースト組成物及びこれを用いた半導体装置 |
| JPH11106454A (ja) * | 1997-10-06 | 1999-04-20 | Hitachi Chem Co Ltd | 樹脂ペースト組成物及びこれを用いた半導体装置 |
| US6265530B1 (en) * | 1998-07-02 | 2001-07-24 | National Starch And Chemical Investment Holding Corporation | Die attach adhesives for use in microelectronic devices |
| US6350840B1 (en) * | 1998-07-02 | 2002-02-26 | National Starch And Chemical Investment Holding Corporation | Underfill encapsulants prepared from allylated amide compounds |
| JP3705530B2 (ja) * | 1998-08-24 | 2005-10-12 | 住友ベークライト株式会社 | 絶縁性ダイアタッチペースト |
| ES2282127T3 (es) * | 1999-07-08 | 2007-10-16 | University Of North Carolina At Chapel Hill | Nuevos profarmacos para amidinas anticrobianas. |
| US6441213B1 (en) * | 2000-05-18 | 2002-08-27 | National Starch And Chemical Investment Holding Corporation | Adhesion promoters containing silane, carbamate or urea, and donor or acceptor functionality |
| BR0111874A (pt) * | 2000-06-23 | 2003-06-24 | Solutia Inc | Processo para formação de microesferas sólida de polìmero adesivo sensìveis à pressão |
| JP3599659B2 (ja) * | 2000-10-26 | 2004-12-08 | 株式会社巴川製紙所 | 半導体装置用接着テープ |
| JP2004534807A (ja) * | 2001-06-22 | 2004-11-18 | ユニリーバー・ナームローゼ・ベンノートシヤープ | ヘアコンディショニング組成物 |
| JP3989299B2 (ja) * | 2002-05-23 | 2007-10-10 | 日本化薬株式会社 | マレイミド化合物、これを含む樹脂組成物及びその硬化物 |
| US6669929B1 (en) | 2002-12-30 | 2003-12-30 | Colgate Palmolive Company | Dentifrice containing functional film flakes |
-
2004
- 2004-04-01 US US10/815,442 patent/US7160946B2/en not_active Expired - Lifetime
-
2005
- 2005-03-28 KR KR1020050025635A patent/KR101158348B1/ko not_active Expired - Lifetime
- 2005-03-29 SG SG200501886A patent/SG115812A1/en unknown
- 2005-03-30 DE DE602005000365T patent/DE602005000365T2/de not_active Expired - Fee Related
- 2005-03-30 EP EP05006864A patent/EP1582574B1/en not_active Expired - Lifetime
- 2005-03-31 TW TW094110162A patent/TWI367926B/zh not_active IP Right Cessation
- 2005-03-31 JP JP2005100639A patent/JP5654718B2/ja not_active Expired - Lifetime
- 2005-04-01 CN CNA2005100655324A patent/CN1676564A/zh active Pending
-
2014
- 2014-05-08 JP JP2014097205A patent/JP5676801B2/ja not_active Expired - Lifetime
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