SG115812A1 - Method to improve high temperature cohesive strength with adhesive having multi-phase system - Google Patents

Method to improve high temperature cohesive strength with adhesive having multi-phase system

Info

Publication number
SG115812A1
SG115812A1 SG200501886A SG200501886A SG115812A1 SG 115812 A1 SG115812 A1 SG 115812A1 SG 200501886 A SG200501886 A SG 200501886A SG 200501886 A SG200501886 A SG 200501886A SG 115812 A1 SG115812 A1 SG 115812A1
Authority
SG
Singapore
Prior art keywords
adhesive
high temperature
phase system
cohesive strength
improve high
Prior art date
Application number
SG200501886A
Other languages
English (en)
Inventor
Takano Tadashi
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Publication of SG115812A1 publication Critical patent/SG115812A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/34—Introducing sulfur atoms or sulfur-containing groups
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L1/00—Arrangements for detecting or preventing errors in the information received
    • H04L1/22—Arrangements for detecting or preventing errors in the information received using redundant apparatus to increase reliability
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/30—Introducing nitrogen atoms or nitrogen-containing groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
SG200501886A 2004-04-01 2005-03-29 Method to improve high temperature cohesive strength with adhesive having multi-phase system SG115812A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/815,442 US7160946B2 (en) 2004-04-01 2004-04-01 Method to improve high temperature cohesive strength with adhesive having multi-phase system

Publications (1)

Publication Number Publication Date
SG115812A1 true SG115812A1 (en) 2005-10-28

Family

ID=34887744

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200501886A SG115812A1 (en) 2004-04-01 2005-03-29 Method to improve high temperature cohesive strength with adhesive having multi-phase system

Country Status (8)

Country Link
US (1) US7160946B2 (https=)
EP (1) EP1582574B1 (https=)
JP (2) JP5654718B2 (https=)
KR (1) KR101158348B1 (https=)
CN (1) CN1676564A (https=)
DE (1) DE602005000365T2 (https=)
SG (1) SG115812A1 (https=)
TW (1) TWI367926B (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102585760A (zh) 2004-03-19 2012-07-18 住友电木株式会社 树脂组合物及采用该树脂组合物制作的半导体装置
TW200707468A (en) * 2005-04-06 2007-02-16 Toagosei Co Ltd Conductive paste, circuit board, circuit article and method for manufacturing such circuit article
US7422707B2 (en) * 2007-01-10 2008-09-09 National Starch And Chemical Investment Holding Corporation Highly conductive composition for wafer coating
US20080292801A1 (en) * 2007-05-23 2008-11-27 National Starch And Chemical Investment Holding Corporation Corrosion-Preventive Adhesive Compositions
EP2250227A4 (en) * 2008-02-25 2013-08-21 Henkel Ag & Co Kgaa OUT OF THEIR PUNCHING CHIP FIXING PASTE
EP2834314A1 (en) 2012-04-06 2015-02-11 Ips Corporation Adhesive composition for bonding low surface energy polyolefin substrates
WO2016031553A1 (ja) * 2014-08-29 2016-03-03 古河電気工業株式会社 接着フィルム及び接着フィルムを用いた半導体パッケージ
CN104212365B (zh) * 2014-09-26 2015-12-02 烟台德邦科技有限公司 一种非流动底部填充材料及其制备方法
EP3097593B1 (de) * 2014-12-01 2020-08-26 PI Ceramic GmbH Aktuatorvorrichtung
DE102014017746B4 (de) * 2014-12-01 2021-10-21 Pi Ceramic Gmbh Aktuatorvorrichtung
US20180023904A1 (en) * 2014-12-18 2018-01-25 Kaneka Corporation Graphite laminates, processes for producing graphite laminates, structural object for heat transport, and rod-shaped heat-transporting object
JP6623092B2 (ja) * 2016-03-22 2019-12-18 株式会社巴川製紙所 熱硬化性接着シートおよびその製造方法
WO2018062164A1 (ja) * 2016-09-29 2018-04-05 積水化学工業株式会社 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子
WO2018212215A1 (ja) 2017-05-16 2018-11-22 デクセリアルズ株式会社 アンダーフィル材、アンダーフィルフィルム、及びこれを用いた半導体装置の製造方法
US20220112373A1 (en) * 2019-01-24 2022-04-14 Showa Denko K.K. Thermosetting resin composition
TWI783454B (zh) * 2021-04-21 2022-11-11 翌驊實業股份有限公司 黏著複合物及其使用方法
EP4671291A1 (en) * 2024-06-26 2025-12-31 Henkel AG & Co. KGaA ADHESIVE COMPOSITION AND ASSOCIATED HARDENING PRODUCT
CN119306648A (zh) * 2024-12-17 2025-01-14 杭州之江有机硅化工有限公司 一种双马来酰亚胺树脂及其制备方法和应用

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US5747615A (en) * 1988-04-29 1998-05-05 Cytec Technology Corp. Slurry-mixed heat-curable resin systems having superior tack and drape
US5003018A (en) * 1988-04-29 1991-03-26 Basf Aktiengesellschaft Slurry mixing of bismaleimide resins
JP3290242B2 (ja) * 1993-05-13 2002-06-10 住友ベークライト株式会社 低誘電率熱硬化性樹脂組成物
US6852814B2 (en) * 1994-09-02 2005-02-08 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
DE69621635T2 (de) * 1995-11-13 2003-01-02 Cytec Technology Corp., Wilmington Aushärtendes Bismaleinimid Polymer für Kleb- und Verbundwerkstoffe
US20030055121A1 (en) * 1996-09-10 2003-03-20 Dershem Stephen M. Thermosetting resin compositions containing maleimide and/or vinyl compounds
JP3599160B2 (ja) 1997-05-16 2004-12-08 大日本インキ化学工業株式会社 マレイミド誘導体を含有する活性エネルギー線硬化性組成物及び該活性エネルギー線硬化性組成物の硬化方法
AU731141B2 (en) * 1997-07-03 2001-03-22 Loctite Corporation High temperature, controlled strength anaerobic adhesive compositions curable under ambient environmental conditions
JPH11106455A (ja) * 1997-10-06 1999-04-20 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JPH11106454A (ja) * 1997-10-06 1999-04-20 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
US6265530B1 (en) * 1998-07-02 2001-07-24 National Starch And Chemical Investment Holding Corporation Die attach adhesives for use in microelectronic devices
US6350840B1 (en) * 1998-07-02 2002-02-26 National Starch And Chemical Investment Holding Corporation Underfill encapsulants prepared from allylated amide compounds
JP3705530B2 (ja) * 1998-08-24 2005-10-12 住友ベークライト株式会社 絶縁性ダイアタッチペースト
ES2282127T3 (es) * 1999-07-08 2007-10-16 University Of North Carolina At Chapel Hill Nuevos profarmacos para amidinas anticrobianas.
US6441213B1 (en) * 2000-05-18 2002-08-27 National Starch And Chemical Investment Holding Corporation Adhesion promoters containing silane, carbamate or urea, and donor or acceptor functionality
BR0111874A (pt) * 2000-06-23 2003-06-24 Solutia Inc Processo para formação de microesferas sólida de polìmero adesivo sensìveis à pressão
JP3599659B2 (ja) * 2000-10-26 2004-12-08 株式会社巴川製紙所 半導体装置用接着テープ
JP2004534807A (ja) * 2001-06-22 2004-11-18 ユニリーバー・ナームローゼ・ベンノートシヤープ ヘアコンディショニング組成物
JP3989299B2 (ja) * 2002-05-23 2007-10-10 日本化薬株式会社 マレイミド化合物、これを含む樹脂組成物及びその硬化物
US6669929B1 (en) 2002-12-30 2003-12-30 Colgate Palmolive Company Dentifrice containing functional film flakes

Also Published As

Publication number Publication date
JP5654718B2 (ja) 2015-01-14
EP1582574B1 (en) 2006-12-27
TWI367926B (en) 2012-07-11
US20050222330A1 (en) 2005-10-06
JP5676801B2 (ja) 2015-02-25
CN1676564A (zh) 2005-10-05
KR20060044868A (ko) 2006-05-16
DE602005000365T2 (de) 2007-05-16
DE602005000365D1 (de) 2007-02-08
US7160946B2 (en) 2007-01-09
JP2014169450A (ja) 2014-09-18
KR101158348B1 (ko) 2012-06-22
JP2005290380A (ja) 2005-10-20
TW200613501A (en) 2006-05-01
EP1582574A1 (en) 2005-10-05

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