JP2014166939A5 - - Google Patents

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Publication number
JP2014166939A5
JP2014166939A5 JP2013225296A JP2013225296A JP2014166939A5 JP 2014166939 A5 JP2014166939 A5 JP 2014166939A5 JP 2013225296 A JP2013225296 A JP 2013225296A JP 2013225296 A JP2013225296 A JP 2013225296A JP 2014166939 A5 JP2014166939 A5 JP 2014166939A5
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JP
Japan
Prior art keywords
copper
fine particles
nitride fine
copper nitride
particles according
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JP2013225296A
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English (en)
Japanese (ja)
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JP6057379B2 (ja
JP2014166939A (ja
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Priority to JP2013225296A priority Critical patent/JP6057379B2/ja
Priority claimed from JP2013225296A external-priority patent/JP6057379B2/ja
Priority to CN201480006826.7A priority patent/CN104981427A/zh
Priority to KR1020157020804A priority patent/KR20150112984A/ko
Priority to PCT/JP2014/052321 priority patent/WO2014119748A1/ja
Publication of JP2014166939A publication Critical patent/JP2014166939A/ja
Publication of JP2014166939A5 publication Critical patent/JP2014166939A5/ja
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Publication of JP6057379B2 publication Critical patent/JP6057379B2/ja
Expired - Fee Related legal-status Critical Current
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JP2013225296A 2013-01-31 2013-10-30 窒化銅微粒子およびその製造方法 Expired - Fee Related JP6057379B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013225296A JP6057379B2 (ja) 2013-01-31 2013-10-30 窒化銅微粒子およびその製造方法
CN201480006826.7A CN104981427A (zh) 2013-01-31 2014-01-31 氮化铜微粒及其制造方法
KR1020157020804A KR20150112984A (ko) 2013-01-31 2014-01-31 질화구리 미립자 및 그 제조 방법
PCT/JP2014/052321 WO2014119748A1 (ja) 2013-01-31 2014-01-31 窒化銅微粒子およびその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013017510 2013-01-31
JP2013017510 2013-01-31
JP2013225296A JP6057379B2 (ja) 2013-01-31 2013-10-30 窒化銅微粒子およびその製造方法

Publications (3)

Publication Number Publication Date
JP2014166939A JP2014166939A (ja) 2014-09-11
JP2014166939A5 true JP2014166939A5 (https=) 2016-06-23
JP6057379B2 JP6057379B2 (ja) 2017-01-11

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JP2013225296A Expired - Fee Related JP6057379B2 (ja) 2013-01-31 2013-10-30 窒化銅微粒子およびその製造方法

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JP (1) JP6057379B2 (https=)
KR (1) KR20150112984A (https=)
CN (1) CN104981427A (https=)
WO (1) WO2014119748A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015147561A1 (ko) * 2014-03-26 2015-10-01 전자부품연구원 전도체 패턴의 형성이 용이한 복합소재와 그 복합소재를 제조하는 방법 및 상기 복합소재에서 시드 소재인 구리질화물 및 그 구리질화물을 합성하는 방법
JP6574553B2 (ja) * 2014-06-26 2019-09-11 昭和電工株式会社 導電パターン形成用組成物および導電パターン形成方法
KR102303767B1 (ko) * 2017-11-01 2021-09-23 한국전자기술연구원 전도체 패턴용 구리질화물 분말의 제조 방법
CN110642304B (zh) * 2019-10-09 2021-12-31 上海师范大学 一种超级电容器用三金属氮化物材料及其制备方法
CN111450867A (zh) * 2020-05-09 2020-07-28 青岛科技大学 用于电催化二氧化碳还原的Cu3N纳米催化剂的制备方法
CN115057417B (zh) * 2022-06-08 2023-09-12 安徽大学 一种氮化铜纳米片的制备及其在甲酸盐电合成中的应用
CN116516280A (zh) * 2023-04-27 2023-08-01 常州大学 一种高效节能的工件氮化方法
CN116924697B (zh) * 2023-07-31 2025-08-29 上海耀皮工程玻璃有限公司 一种Low-E镀膜玻璃调色层及其制备方法和用途
CN119282131B (zh) * 2024-11-18 2025-12-30 济源星翰新材料科技有限公司 一种微米铜粉的制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005122230A1 (ja) * 2004-06-07 2005-12-22 Kyushu Institute Of Technology 銅表面の処理方法及び銅パターン配線形成方法、並びに該方法を用いて作成された半導体装置
JP3870273B2 (ja) * 2004-12-28 2007-01-17 国立大学法人九州工業大学 銅パターン配線形成方法及び該方法を用いて作成された半導体装置、並びにナノ銅金属粒子
JP5778382B2 (ja) * 2008-10-22 2015-09-16 東ソー株式会社 金属膜製造用組成物、金属膜の製造方法及び金属粉末の製造方法
JP5243510B2 (ja) * 2010-10-01 2013-07-24 富士フイルム株式会社 配線材料、配線の製造方法、及びナノ粒子分散液

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