JP2014160745A - Substrate manufacturing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate manufacturing apparatus which can detect a substrate having a height of over an acceptable value with high efficiency even when a width of a movement route of a stage increases.SOLUTION: A substrate manufacturing apparatus comprises: a first stage for holding a substrate on a top face; a first movement mechanism for moving the first stage; a control device for controlling the first movement mechanism; a nozzle head arranged above a route where the first stage moves, for discharging droplets of a thin film material toward the substrate held on the first stage; and a contact detection device arranged above the route, for transmitting a contact detection signal to the control device when detecting contact with the substrate. A lower end of a contact member is lower than a lower end of the nozzle head based on a height of a top face of the first stage. The control device controls the first movement mechanism to avoid approach of the first stage to under the nozzle head when the contact detection device receives the contact detection signal.

Description

  The present invention relates to a substrate manufacturing apparatus for forming a thin film by discharging droplets of a thin film material onto a substrate held on a stage.

  A technique for forming a thin film pattern on the surface of a substrate by discharging a droplet containing a thin film material from a nozzle head is known (for example, Patent Document 1). The object on which the thin film is to be formed is, for example, a printed circuit board, and the thin film forming material is a solder resist.

  When applying the droplets, the printed circuit board is fixed on the movable stage by a vacuum chuck or the like. In order to increase the position accuracy of the landing point of the droplet, it is preferable to narrow the interval between the printed circuit board and the nozzle head. For example, the distance between the two is set to about 0.5 mm to 1 mm. If the edge of the substrate is warped and floats from the upper surface of the movable stage, there is a concern that the substrate contacts the nozzle head.

  A processing apparatus for detecting the height of a wafer held on a stage using a laser beam is known (for example, Patent Document 2). In this apparatus, a plurality of laser beams are propagated along paths having different heights in parallel with the upper surface of the wafer, and the light beams are detected by the light receiving device. When the wafer blocks the laser beam, the laser beam does not reach the light receiving device. The height of the wafer can be detected by determining whether or not the laser beam is detected by the light receiving device.

JP 2004-104104 A Japanese Patent Laid-Open No. 2001-230239

  Consider a case where a conventional method using a laser beam is applied to detect the warpage of a substrate placed on a movable stage. When the laser diode and the light receiving element are arranged so that the laser beam propagates in parallel with the holding surface of the stage, the lower ends of the housings of the laser diode and the light receiving element are arranged at a position lower than the optical axis of the laser beam. As an example, in order to detect a substrate warpage of about 0.5 mm to 1 mm, the height from the upper surface of the stage to the optical axis of the laser beam is a value obtained by adding about 0.5 mm to 1 mm to the thickness of the substrate. Must be. Generally, the height from the lower end of the housing of the laser diode and the light receiving device to the optical axis of the laser beam is higher than the height obtained by adding 0.5 mm to 1 mm to the thickness of the substrate. For this reason, when the laser diode and the light receiving device are arranged on the moving path of the stage, the lower ends of the housings of the laser diode and the light receiving device come into contact with the stage. It is difficult to arrange the laser diode and the light receiving device on the moving path of the stage.

  Since it is difficult to arrange the laser diode and the light receiving device on the moving path of the stage, the laser diode and the light receiving element must be arranged on both sides of the moving path, respectively. When this arrangement is adopted, the optical path length from the laser diode to the light receiving device becomes longer as the width of the stage movement path becomes wider. When the optical path length of the laser beam becomes long, it becomes difficult to detect a slight difference in the height of the substrate to be detected. If the detection accuracy of the warpage of the substrate is lowered and the warpage exceeding the allowable value cannot be detected, the warped edge of the substrate comes into contact with the nozzle head when the stage is moved.

  An object of the present invention is to provide a substrate manufacturing apparatus capable of accurately detecting a substrate having a height exceeding an allowable value and avoiding the substrate from contacting the nozzle head even when the width of the stage moving path is widened. Is to provide.

According to one aspect of the invention,
A first stage holding a substrate on the top surface;
A first moving mechanism for moving the first stage;
A control device for controlling the first moving mechanism;
A nozzle head that is disposed above a path along which the first stage moves, and that discharges droplets of a thin film material toward a substrate held on the first stage;
A contact detection device that includes a contact member disposed above the path, and that detects that the contact member has contacted the substrate held on the first stage, and transmits a contact detection signal to the control device; Have
With the upper surface of the first stage as a reference for height, the lower end of the contact member is lower than the lower end of the nozzle head,
When the control device receives the contact detection signal from the contact detection device, the control device controls the first moving mechanism to prevent the first stage from entering below the nozzle head. Is provided.

  When the contact member comes into contact with the substrate, the contact detection device detects the substrate exceeding the allowable height. Even if the width of the movement path of the first stage becomes wider, the contact member can be arranged above the first stage, and a substrate having a height exceeding the allowable value can be detected with high accuracy. By adjusting the height from the first stage to the lower end of the contact member according to the height from the first stage to the lower end of the nozzle head, the height from the first stage to the nozzle head is small. Even in some cases, it is possible to detect a substrate with a height exceeding the allowable value.

FIG. 1 is a plan view of the substrate manufacturing apparatus according to the first embodiment. FIG. 2 is a plan view of the substrate manufacturing apparatus according to the first embodiment. FIG. 3 is a plan view of the substrate manufacturing apparatus according to the first embodiment. FIG. 4 is a plan view of the substrate manufacturing apparatus according to the first embodiment. FIG. 5 is a plan view of the substrate manufacturing apparatus according to the first embodiment. FIG. 6 is a front view of the substrate manufacturing apparatus according to the first embodiment. FIG. 7 is a side view of the substrate manufacturing apparatus according to the first embodiment. FIG. 8 is a side view of the contact detection device, the nozzle head, and the first stage of the substrate manufacturing apparatus according to the first embodiment. FIG. 9 is a side view of the contact detection device, the nozzle head, and the first stage of the substrate manufacturing apparatus according to the first embodiment. FIG. 10 is a side view of the contact detection device, the nozzle head, and the first stage of the substrate manufacturing apparatus according to the first embodiment. FIG. 11 is a side view of the contact detection device, the nozzle head, and the first stage of the substrate manufacturing apparatus according to the second embodiment.

A substrate manufacturing apparatus according to an embodiment described below is applied to a substrate manufacturing apparatus having a nozzle head and a moving device that moves a processing object relative to the nozzle head. In particular,
The present invention is applied to a substrate manufacturing apparatus that uses a substrate (for example, a printed circuit board) that may be deformed in a manufacturing process as a processing target. The substrate manufacturing apparatus causes droplets to land on the surface of the substrate by discharging the droplets from the nozzle head.

  In order to keep the position accuracy of the landing point of the droplet within an allowable range, the interval between the nozzle head and the processing object is set to an appropriate value. In order to increase the positional accuracy, it is preferable to narrow the interval between the nozzle head and the processing object. On the other hand, if the interval is too narrow, the risk of contact with the processing target of the nozzle head increases.

  When the holding surface on which the object to be processed is held is used as a reference for height, a contact member is prepared at a position lower than the lower end of the nozzle head, and the contact member is arranged on the movement path of the object to be processed. Before the object contacts the nozzle head, it contacts the contact member. In the following embodiments, it is possible to avoid the processing object from coming into contact with the nozzle head when triggered by the contact between the processing object and the contact member.

[Example 1]
FIG. 1 is a plan view of a substrate manufacturing apparatus according to the first embodiment. An xyz orthogonal coordinate system is defined in which the horizontal plane is the xy plane and the upper vertical direction is the positive direction of the z axis. The substrate manufacturing apparatus according to the first embodiment includes a first processing system 20A and a second processing system 20B.

  Hereinafter, the structure of the first processing system 20A will be described. Guided by the first y-direction linear guide 21A, the first intermediate table 22A moves in the y-direction. A first x-direction linear guide 23A is attached to the first intermediate table 22A. The first stage 25A is guided by the first x-direction linear guide 23A and moves in the x direction. The first stage 25A moves in the y direction within the stroke range of the first y-direction linear guide 21A, and moves in the x direction within the stroke range of the first x-direction linear guide 23A. The substrate 35 is held on the upper surface of the first stage 25A. The substrate 35 is fixed to the upper surface of the first stage 25A by, for example, a vacuum chuck. The first moving mechanism 26A moves the first intermediate table 22A and the first stage 25A in the y direction and the x direction, respectively. The control device 30 controls the first moving mechanism 26A.

  The second processing system 20B has a symmetrical structure with the first processing system 20A with respect to a virtual plane perpendicular to the x-axis. That is, the second processing system 20B includes a second y-direction linear guide 21B, a second intermediate table 22B, a second x-direction linear guide 23B, a second stage 25B, and a second moving mechanism 26B. . The second moving mechanism 26B is controlled by the control device 30.

  The first intermediate table 22A and the second intermediate table 22B move along parallel paths that are separated from each other in the x direction. When the first stage 25A is arranged at a fixed position with respect to the x direction, the first stage 25A and the first intermediate table 22A may pass in the y direction without contacting the second intermediate table 22B. it can. Similarly, when the second stage 25B is disposed at a fixed position, the second stage 25B and the second intermediate table 22B may pass in the y direction without coming into contact with the first intermediate table 22A. it can. FIG. 1 shows a state in which the first stage 25A and the second stage 25B are both arranged at fixed positions.

When the first stage 25A is disposed at the transfer position with respect to the y direction and is disposed at the fixed position with respect to the x direction (the state in FIG. 1), between the first stage 25A and the substrate transport apparatus (not shown). Then, the substrate 35 is transferred. Similarly, when the second stage 25B is disposed at the transfer position with respect to the y direction and is disposed at the fixed position with respect to the x direction (the state of FIG. 1), the second stage 25B and the substrate transfer device (not shown). The substrate 35 is transferred between the two.

  The first imaging device 31A is disposed above the path of the first stage 25A when the first stage 25A is disposed at the fixed position. Similarly, the second imaging device 31B is disposed above the path of the second stage 25B when the second stage 25B is disposed at the fixed position.

  FIG. 2 shows a state in which the first stage 25A is disposed below the first imaging device 31A. The first imaging device 31A images the alignment mark formed on the substrate 35 disposed below the first imaging device 31A. The second imaging device 31B images the alignment mark formed on the substrate 35 held by the second stage 25B.

  FIG. 3 is a plan view showing a state in which the first stage 25A is disposed at the processing position in the x direction. The processing position is located in the middle between the fixed position of the first stage 25A and the fixed position of the second stage 25B in the x direction. The first stage 25A is movable in the x direction between a fixed position and a processing position. Similarly, the second stage 25B is also movable in the x direction between the fixed position of the second stage 25B and the processing position. The processing position of the first stage 25A and the processing position of the second stage 25B are defined at the same position in the x direction.

  The contact detection device 40 and the nozzle head 50 are disposed above the path of the first stage 25A when the first stage 25A is disposed at the processing position. The first stage 25A passes from below the first imaging device 31A in a state where the first stage 25A is disposed at a fixed position with respect to the x direction, and is then disposed at the processing position with respect to the x direction. Passes below 40 and enters below the nozzle head 50.

  FIG. 4 shows a state in which the first stage 25 </ b> A is disposed below the nozzle head 50. The nozzle head 50 discharges droplets of a thin film material toward the substrate 35 disposed below the nozzle head 50. A thin film pattern is formed on the substrate 35 by discharging droplets of a thin film material from the nozzle head 50 while moving the first stage 25A in the y direction.

  FIG. 5 shows a state in which the second stage 25B is disposed at the processing position in the x direction and is disposed below the contact detection device 40.

  The contact detection device 40 is commonly used for the substrate 35 held on the first stage 25A and the substrate 35 held on the second stage 25B. The nozzle head 50 is also commonly used for forming a thin film pattern on the substrate 35 held on the first stage 25A and forming a thin film pattern on the substrate 35 held on the second stage 25B.

  FIG. 6 shows a front view of the contact detection device 40 and the first stage 25A. On the surface plate 37, the first y-direction linear guide 21A and the second y-direction linear guide 21B are fixed. The first intermediate table 22A is supported by the first y-direction linear guide 21A so as to be movable in the y-direction. A first x-direction linear guide 23A is fixed on the first intermediate table 22A. The first stage 25A is supported by the first x-direction linear guide 23A so as to be movable in the x-direction. The substrate 35 is held on the upper surface of the first stage 25A. FIG. 6 shows a state in which the first stage 25A is arranged at the processing position.

The contact detection device 40 is supported by a portal frame 38 (support member) above the first stage 25A arranged at the processing position. The portal frame 38 straddles the path of the first stage 25A defined by the first y-direction linear guide 21A and the path of the second stage 25B defined by the second y-direction linear guide 21B. Is arranged.

  FIG. 7 shows a side view of the first stage 25 </ b> A, the contact detection device 40, and the nozzle head 50. A first y-direction linear guide 21A is fixed on the surface plate 37. The first intermediate table 22A moves in the y direction while being guided by the first y direction linear guide 21A. A first x-direction linear guide 23A is fixed to the first intermediate table 22A. The first stage 25A is guided by the first x-direction linear guide 23A and moves in the x direction. The contact detection device 40 and the nozzle head 50 are arranged above the path of the first stage 25A.

  The lifting mechanism 45 moves the contact detection device 40 up and down. Another raising / lowering mechanism 55 raises / lowers the nozzle head 50. In addition, it is good also as a structure which raises / lowers both the contact detection apparatus 40 and the nozzle head 50 with one raising / lowering mechanism.

  A contact detection signal is sent from the contact detection device 40 to the control device 30. In response to an instruction from the control device 30, the first moving mechanism 26A moves the first intermediate table 22A and the first stage 25A.

  FIG. 8 shows a more detailed side view of the first stage 25 </ b> A, the contact detection device 40, and the nozzle head 50. A contact member 41 is suspended above the path of the first stage 25A. The contact member 41 has, for example, a plate-like outer shape, and is stationary in a posture perpendicular to the y direction. The contact member 41 is supported at its upper end by a lifting mechanism 45 (FIG. 7) so as to be swingable via a rotating shaft 42 parallel to the x direction.

  The temporary fixing mechanism 44 temporarily fixes the contact member 41 in a posture perpendicular to the y direction, that is, in a posture in which the lower end of the contact member 41 is disposed at the lowest position. When a force in the direction from the contact detection device 40 toward the nozzle head 50 is applied to the lower end of the contact member 41, the contact member 41 is released from the temporarily fixed state by the temporary fixing mechanism 44, and the lower end is directed toward the nozzle head 50. Swings so as to be displaced (changes the posture). As an example, the contact member 41 is made of a magnetic material, and the temporary fixing mechanism 44 is made of a permanent magnet. The posture of the contact member 41 is temporarily fixed by the magnetic force acting between the temporary fixing mechanism 44 and the contact member 41.

  The sensor 43 detects a change in the posture of the contact member 41 and transmits the detection result to the control device 30. As the sensor 43, for example, a contact type displacement sensor can be used.

  With respect to the moving direction (y direction) of the first stage 25 </ b> A, the defense plates 51 are arranged in front and rear of the nozzle head 50, respectively. The defense plate 51 is fixed at a relative position with respect to the nozzle head 50. When the upper surface of the first stage 25A is used as a height reference, the height to the lower end of the contact member 41 in the temporarily fixed state is H1, the height to the lower end of the protection plate 51 is H2, and the nozzle head 50 The height to the bottom is H3. The magnitude relationship of these heights is H1 ≦ H2 ≦ H3.

  The height H1 is higher than the height to the upper surface of the substrate 35 when the substrate 35 to be processed is held on the first stage 25A. For this reason, the normal substrate 35 having no warp or the like passes under the contact member 41 and the protection plate 51 and enters under the nozzle head 50.

FIG. 9 shows a side view of the first stage 25A, the contact detection device 40, and the nozzle head 50 when the edge of the substrate 35 warps upward and is lifted from the upper surface of the first stage 25A. A case where the height from the upper surface of the first stage 25A to the upper end of the part where the substrate 35 is lifted is higher than the height H1 of the lower end of the contact member 41 will be described. First stage 25A
Is moved toward the nozzle head 50, the edge of the substrate 35 contacts the lower end of the contact member 41. When the first stage 25A is further moved toward the nozzle head 50, the lower end of the contact member 41 is pushed in the direction of the nozzle head 50, and the contact member 41 tilts. When the sensor 43 detects a change in the posture of the contact member 41, a contact detection signal is transmitted from the sensor 43 to the control device 30.

  When receiving the contact detection signal from the sensor 43, the control device 30 controls the first moving mechanism 26A so that the first stage 25A does not enter below the nozzle head 50. For example, the control device 30 stops the first stage 25A. As described above, when the substrate 35 includes a portion that is higher than the allowable height (height H1 in the first embodiment), the first stage 25A does not enter below the nozzle head 50. Since the substrate 35 does not reach the lower side of the nozzle head 50, it is possible to prevent the nozzle head 50 from being damaged due to the raised portion of the substrate 35 coming into contact with the nozzle head 50.

  The temporary fixing mechanism 44 temporarily fixes the contact member 41 with a weak force that does not damage the substrate 35. For this reason, even if the board | substrate 35 contacts the contact member 41, the board | substrate 35 is not damaged. When the first stage 25A stops, the operator closes the raised portion of the substrate 35 to the upper surface of the first stage 25A with an adhesive tape or the like to eliminate the lifting. Thereafter, the thin film forming process can be continued.

  With reference to FIG. 10, a case where a contact detection signal is not transmitted to the control device 30 even when the substrate 35 contacts the lower end of the contact member 41 due to a defect of the contact detection device 40 will be described. When the height from the upper surface of the first stage 25 </ b> A to the upper end of the raised portion of the substrate 35 is higher than the height H <b> 2 of the lower end of the defense plate 51, the raised portion of the substrate 35 contacts the lower end of the defense plate 51. The rigidity of the protection plate 51 is sufficiently larger than the rigidity of the substrate 35. For this reason, when the first stage 25 </ b> A moves toward the nozzle head 50, the substrate 35 is plastically deformed by the force received from the protection plate 51. The defense plate 51 prevents the substrate 35 including a portion exceeding the height H <b> 3 of the bottom surface of the nozzle head 50 from entering below the nozzle head 50.

  Although the plastically deformed substrate 35 is discarded, damage to the nozzle head 50 that is more expensive than the substrate 35 can be prevented. In order to avoid damage to the nozzle head 50 even when the first stage 25A moves in the reverse direction in the y direction after passing below the nozzle head 50, both sides of the nozzle head 50 are protected with respect to the y direction. It is preferable to attach the plate 51. Further, the contact detection device 40 (FIG. 7) may also be attached to both sides of the nozzle head 50.

  In order to reduce the disposal of the substrate 35 whose edge is warped, it is preferable that the height H1 of the lower end of the contact member 41 is lower than the height H2 (FIG. 8) of the lower end of the protection plate 51. In order to prevent damage to the nozzle head 50, the height H1 and the height H2 are preferably set lower than the height H3 (FIG. 8) of the bottom surface of the nozzle head 50. The height H2 of the lower end of the defense plate 51 and the height H3 of the bottom surface of the nozzle head 50 are adjusted when the relative positions of the two are fixed. The height H1 of the lower end of the contact member 41 and the height H2 of the lower end of the defense plate 51 are adjusted by operating the elevating mechanisms 45 and 55 (FIG. 7). In addition, when it is set as the structure which raises / lowers the contact detection apparatus 40 and the nozzle head 50 with one raising / lowering apparatus, both the height H1 of the lower end of the contact member 41 and the height H2 of the lower end of the defense board 51 are both Is adjusted when attaching to the lifting device.

  The height H3 of the bottom surface of the nozzle head 50 is set according to the target position accuracy of the droplet landing point. When high positional accuracy is required, the height H3 must be lowered. When the height H3 is lowered, the height H2 of the defense plate 51 and the height H1 of the contact member 41 are also lowered according to the height H3.

  8 to 10, the processing procedure of the substrate 35 held on the first stage 25A has been described. However, the processing procedure of the substrate 35 held on the second stage 25B (FIG. 1) is also the first stage. This is the same as the processing procedure for the substrate 35 held at 25A.

  In the first embodiment, the substrate manufacturing apparatus including two processing systems of the first processing system 20A and the second processing system 20B is taken as an example, but the contact detection device 40 (FIG. 7) according to the first embodiment is The present invention can also be applied to a substrate manufacturing apparatus having one processing system. For example, in a substrate manufacturing apparatus having only the first processing system 20A (FIG. 1), the first stage 25A is directly guided by the first y-direction linear guide 21A and moves in the y-direction. Good.

[Example 2]
With reference to FIG. 11, the board | substrate manufacturing apparatus by Example 2 is demonstrated. Hereinafter, differences from the first embodiment will be described, and description of the same configuration will be omitted.

  FIG. 11 is a side view of the contact detection device 40, the nozzle head 50, and the first stage 25A of the substrate manufacturing apparatus according to the second embodiment. In the second embodiment, the contact member 41 is formed of an elastic material such as rubber. When the raised portion of the substrate 35 contacts the lower end of the contact member 41, the contact member 41 is elastically deformed. When the sensor 43 detects that the contact member 41 is elastically deformed, a contact detection signal is transmitted to the control device 30.

  When no external force is applied to the contact member 41, the contact member 41 is stationary at the neutral position by the restoring force. For this reason, the temporary fixing mechanism 44 (FIG. 8) of Example 1 is unnecessary.

  In the second embodiment, similarly to the first embodiment, damage to the nozzle head 50 can be avoided. Further, it is possible to prevent the substrate 35 from being warped from being damaged.

  As shown in FIGS. 1 and 6, in the substrate manufacturing apparatus according to the first and second embodiments, the path of the first stage 25A and the path of the second stage 25B are separated from each other in the x direction. Arranged. The nozzle head 50 (FIG. 1) is shared by the first processing system 20A including the first stage 25A and the second processing system 20B including the second stage 25B. For this reason, when forming a thin film pattern using the nozzle head 50 in one processing system, the other processing system can perform delivery of a substrate, imaging of an alignment mark, and the like.

  When adopting a configuration in which the height of the substrate on the stage is detected using a laser beam, it is difficult to arrange the laser light source and the light receiving element on the path of the stage. Since the laser light source and the light receiving element protrude upward and downward from the height of the optical axis of the laser beam, when the laser light source and the light receiving element are arranged on the stage path, the laser light source and the light receiving element themselves come into contact with the stage. It is because it ends up.

  In the case of detecting the height of a substrate on a stage using a laser beam in a substrate manufacturing apparatus having two processing systems as in the first and second embodiments, the first shown in FIG. The laser light source and the light receiving element must be disposed outside the path of the processing system 20A and the path of the second processing system 20B. For this reason, the optical path length of the laser beam becomes long. As the optical path length increases, the detection accuracy of the height of the substrate decreases.

In the first and second embodiments, the portal frame 38 (FIG. 6) is disposed so as to straddle both the path of the first processing system 20A and the path of the second processing system 20B. Other parts of the contact detection device 40 are not arranged at a position lower than the lower end of the contact member 41 (FIGS. 8 and 11). For this reason, even if the contact detection device 40 is disposed at a position that overlaps the path of the first stage 25A and the second stage 25B, the contact detection device 40 does not change the first stage 25A and the second stage 25B.
There is no contact with the stage 25B. The contact detection device 40 can detect the substrate 35 having a height exceeding the allowable value with high accuracy without hindering the movement of the first stage 25A and the second stage 25B.

  Although the present invention has been described with reference to the embodiments, the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like can be made.

20A 1st processing system 20B 2nd processing system 21A 1st y-direction linear guide 21B 2nd y-direction linear guide 22A 1st intermediate table 22B 2nd intermediate table 23A 1st x-direction linear guide 23B 2nd 2 x-direction linear guide 25A 1st stage 25B 2nd stage 26A 1st moving mechanism 26B 2nd moving mechanism 30 Controller 31A 1st imaging device 31B 2nd imaging device 35 Substrate 37 Surface plate 38 Gate Shape frame (support member)
40 Contact Detection Device 41 Contact Member 42 Swing Center 43 Sensor 44 Temporary Fixing Mechanism 45 Lifting Mechanism 50 Nozzle Head 51 Defense Plate 55 Lifting Mechanism

Claims (7)

A first stage holding a substrate on the top surface;
A first moving mechanism for moving the first stage;
A control device for controlling the first moving mechanism;
A nozzle head that is disposed above a path along which the first stage moves, and that discharges droplets of a thin film material toward a substrate held on the first stage;
A contact detection device that includes a contact member disposed above the path, and that detects that the contact member has contacted the substrate held on the first stage, and transmits a contact detection signal to the control device; Have
With the upper surface of the first stage as a reference for height, the lower end of the contact member is lower than the lower end of the nozzle head,
When the control device receives the contact detection signal from the contact detection device, the control device controls the first moving mechanism to prevent the first stage from entering below the nozzle head. . Furthermore, it has a defense plate disposed above the path between the nozzle head and the contact member,
With the upper surface of the first stage as a reference for height, the lower end of the defense plate is lower than the lower end of the contact member or the same height as the lower end of the contact member, The substrate manufacturing apparatus according to claim 1, wherein a relative position is fixed with respect to the nozzle head. When the contact member comes into contact with the substrate held on the first stage, the posture changes,
The substrate manufacturing apparatus according to claim 1, wherein the contact detection device further includes a sensor that detects a change in posture of the contact member.   The substrate manufacturing apparatus according to claim 3, wherein the contact member is suspended above the path, and swings in a moving direction of the first stage when a lower end contacts the substrate. When the contact member comes into contact with the substrate held on the first stage, the contact member is elastically deformed,
The substrate manufacturing apparatus according to claim 1, wherein the contact detection device further includes a sensor that detects deformation of the contact member.   The substrate manufacturing method according to claim 5, wherein the contact member is suspended above the path, and when the lower end contacts the substrate, the lower end is elastically deformed so as to be displaced in the moving direction of the first stage. apparatus. further,
A second stage for holding the substrate;
A second moving mechanism for moving the second stage;
A support member for supporting the contact detection device above the path of the first stage and the path of the second stage;
The first moving mechanism and the second moving mechanism move the first stage and the second stage along parallel paths that are separated from each other, and below the nozzle head. , Moving the first stage and the second stage along the same path,
The said support member is arrange | positioned so that two parallel paths mutually separated of the said 1st stage and the said 2nd stage may be straddle | crossed. Board manufacturing equipment.

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