JP3967330B2 - Laser processing apparatus and laser processing method - Google Patents

Description

  The present invention relates to a laser processing apparatus and a laser processing method, and more particularly, to a laser processing apparatus and a laser processing method for irradiating a laser beam onto a workpiece while correcting a laser beam incident position on the surface of the workpiece.

  Laser processing apparatuses having a stage that can hold a workpiece and move it in a two-dimensional direction parallel to a predetermined plane are widely used. Such a laser processing apparatus is described in Patent Document 1, for example. Such a stage includes, for example, an X stage that moves in one direction (X direction) and a Y stage that moves in a direction orthogonal to the one direction (Y direction). By moving the X stage and the Y stage, the workpiece can be moved in a two-dimensional direction. By moving the workpiece by moving the stage, the laser beam incident position on the processing surface can be moved.

JP 2003-260579 A

  The stages (X stage and Y stage) are controlled by the control device so as to move to the target position. However, when the stage is moved, a positional deviation with respect to the target position occurs. When a position shift occurs on the stage, a position shift from the target position also occurs on the workpiece. As a result, there is a difference between the position on the processing surface where the laser should be incident and the position where the laser is actually incident.

  Consider that an X stage holding a workpiece is moved in the X direction while irradiating a laser to process a linear region long in the X direction on the surface to be processed. However, when the X stage is moved in the X direction, a movement (yawing) of the trajectory in the Y direction occurs. Due to the yawing, the X stage is displaced in the Y direction. Thereby, the position shift of the Y direction also arises in the processing object held on the stage. The region irradiated with the laser on the surface to be processed does not have a linear shape that is long in the X direction, but has a shape that undulates in the Y direction.

  By the way, when the stage is operated, heat is generated from a linear motor or the like that drives the stage. As this heat propagates to the stage, the temperature of the stage rises. When the object to be processed is held on the stage whose temperature has increased, the temperature of the object to be processed increases.

  In the laser processing technique, generally, a plurality of substrates of the same type are sequentially processed while exchanging the substrates held on the stage. At this time, the temperature of the stage gradually increases. Therefore, the substrate is processed at a higher temperature as the substrate is processed later. In this way, when processing is performed at different temperatures for each substrate, if the processing is performed with a constant length of the region to be processed on any substrate, the following problems occur. The substrate expands thermally as the temperature rises. For this reason, if processing is performed on substrates with different temperatures while the length of the processing region is constant, the length of the processing region in a state where the processing region is returned to room temperature or a certain reference temperature is different for each substrate. Different.

  An object of the present invention is to provide a laser processing apparatus and a laser processing method capable of correcting a shift of a laser beam incident position on a processing surface due to a position shift of a stage at high speed.

According to one aspect of the present invention, a laser light source that emits a laser beam and a stage that holds a workpiece having a workpiece surface and moves the workpiece in at least a one-dimensional direction parallel to the workpiece surface. And a transmission region for transmitting the laser beam is defined in a light shielding region for shielding the incident laser beam, and the transmission region is located at the position where the laser beam emitted from the laser light source is incident. The laser beam that is smaller than the beam cross section of the laser beam and passes through the transmission region is incident on the surface to be processed of the workpiece held on the stage, and the transmission region intersects the traveling direction of the laser beam. is displaceable in the direction, the transparent by excessive area displacement, a beam incident position displacing means for displacing an incident position of the laser beam at the work plane, the scan A position detector for detecting the position of the workpiece or the position of the workpiece held on the stage, and the stage controlled by the stage, and the stage detected by the position detector during the movement of the stage or A control device that obtains a deviation amount of the position of the workpiece held on the stage from a target position and controls the beam incident position displacement means so that the transmission region is displaced based on the deviation amount; Is provided.
According to another aspect of the present invention, (a) a step of moving a stage on which a workpiece having a processing surface on which a laser beam is incident is moved, and (b) during the movement of the stage, The position or the position of the processing object held on the stage is detected, the amount of deviation of the detected position of the stage or processing object held on the stage from the target position is obtained, and And a step of displacing a beam spot on the surface to be processed of the object to be processed based on the amount of the deviation so as to compensate for the deviation of the incident position of the laser beam.

  By moving the beam spot on the processing surface, it is possible to correct the deviation of the beam incident position caused by the deviation of the stage holding the object to be processed from the target position. When changing the relative position between the workpiece and the beam spot on the workpiece surface, it is generally easier to move the beam spot faster than moving the stage holding the workpiece. is there. By moving the beam spot on the processing surface, the deviation of the beam incident position is corrected at high speed.

  FIG. 1A is a schematic diagram of a laser processing apparatus according to an embodiment of the present invention. A laser light source 1 emits a continuous wave laser beam. As the laser light source 1, for example, a semiconductor laser oscillator or a YAG laser oscillator can be used. The laser beam emitted from the laser light source 1 is reflected by the folding mirror 2 and enters the beam incident position displacement means 3. The beam incident position displacing means 3 holds the mask 3A for shaping the cross-sectional shape of the laser beam so that a part of the incident laser beam passes through the transmission region, and the traveling direction of the laser beam. And a mask moving mechanism 3B for displacing in the vertical direction. The beam incident position displacement means 3 will be described later with reference to FIG.

  The laser beam whose cross section is shaped by the beam incident position displacing means 3 is converged by the lens 4 and is incident on the surface of the substrate 5 that is the object to be processed. The substrate 5 is, for example, a glass substrate having a surface formed with an ITO film, a printed wiring board, or the like. The optical path length from the transmission region of the mask 3A to the lens 4 and the optical path length from the lens 4 to the surface of the substrate 5 are, for example, about 1/2 to 1/3 of the transmission region of the mask 3A on the surface of the substrate 5. It is adjusted so as to be reduced to an image.

  The substrate 5 is held on the stage 6, and the stage 6 is held on the base 7. When an XY orthogonal coordinate system fixed to the base 7 is considered, the stage 6 can move in the two-dimensional direction parallel to the XY plane to move the substrate 5. Thereby, the processing position on the substrate surface can be moved. The distance that the stage 6 can move in the one-dimensional direction is, for example, about 1000 mm. As a drive mechanism for the stage 6, for example, a linear motor is used. In general, a drive mechanism using a linear motor has a slower response speed than a drive mechanism using a piezo element. The weight of the movable part of the stage 6 is, for example, about 1000 kg. The holding surface of the stage 6 and the surface of the substrate 5 are parallel to the XY plane. The control device 9 sends a control signal for giving a target position to the stage 6.

  The beam incident position displacing means 3 will be described with reference to FIG. Here, it is assumed that the laser beam is incident on the beam incident position displacement unit 3 along the normal direction of the XY plane fixed to the base 7 in FIG. The upper diagram of FIG. 1B is a plan view of the beam incident position displacing means 3 as seen from a line of sight parallel to the normal direction of the XY plane, and the lower diagram of FIG. It is the front view which looked at the position displacement means 3 with the eyes | visual_axis parallel to a Y-axis.

  The mask 3A has a light shielding region 3Aa that shields the incident laser beam and a transmission region 3Ab that is formed in the light shielding region 3Aa and transmits the laser beam. The transmission region 3Ab has a rectangular shape, for example, and is smaller than the beam cross section of the laser beam incident on the mask 3A. The cross-sectional shape of the laser beam that has passed through the transmission region 3Ab is shaped so as to correspond to the shape of the transmission region 3Ab. The mask moving mechanism 3B includes elastic hinges 3Ba and 3Bd, drive mechanisms 3Bb and 3Be, an inner frame 3Bc, an outer frame 3Bf, and a mask chuck 3Bg. As shown in the lower diagram of FIG. 1B, the mask 3A is held by the mask chuck 3Bg.

  A mask chuck 3Bg is attached to the inner frame 3Bc via a drive mechanism 3Bb including four elastic hinges 3Ba and a piezoelectric element. The elastic hinge 3Ba restrains the position of the mask chuck 3Bg in the Y-axis direction with respect to the inner frame 3Bc, and holds the mask chuck 3Bg so as to be movable in the X-axis direction. By operating the drive mechanism 3Bb, the mask chuck 3Bg can be displaced in the X direction with respect to the inner frame 3Bc.

  The inner frame 3Bc is attached to the outer frame 3Bf via a drive mechanism 3Be including four elastic hinges 3Bd and a piezoelectric element. The elastic hinge 3Bd restrains the position of the inner frame 3Bc in the X-axis direction relative to the outer frame 3Bf, and holds the inner frame 3Bc so as to be movable in the Y-axis direction. The relative position of the outer frame 3Bf is fixed with respect to the base 7 in FIG. By operating the drive mechanism 3Be, the inner frame 3Bc can be displaced in the Y direction with respect to the outer frame 3Bf.

  By appropriately operating the drive mechanisms 3Bb and 3Be, the transmission region 3Ab of the mask 3A is moved in a two-dimensional direction parallel to the XY plane (a two-dimensional direction perpendicular to the traveling direction of the laser beam incident on the beam incident position displacement means 3). Can be displaced. By displacing the transmission region 3Ab, the incident position of the laser beam incident on the substrate 5 can be displaced. The control device 9 controls the mask moving mechanism 3B (the driving mechanisms 3Bb and 3Be).

  By using piezoelectric elements for the drive mechanisms 3Bb and 3Be, the mask 3A can be moved by several tens of μm with a response speed of about 1 ms. The movable portion of the mask moving mechanism 3B that moves when the mask 3A is displaced is light, for example, about 50 kg, so that it can be driven easily.

  It should be noted that the transmission region 3Ab is not displaced in the direction perpendicular to the traveling direction of the laser beam incident on the beam incident position displacing means 3, but in the direction intersecting the traveling direction of the laser beam incident on the beam incident position displacing means 3. If it is displaced, the beam incident position on the processing surface can be displaced.

  Returning to FIG. 1A, the description will be continued. The position detector 8 detects the position of the stage 6 and sends the detection result to the control device 9. By comparing the position of the stage 6 detected by the position detector 8 with the target position given to the stage 6 by the control device 9, the amount of displacement of the stage 6 is obtained. As the position detector 8, for example, a laser interferometer can be used. By disposing the position detector 8 so that the position of the stage 6 in the Y direction can be detected, the amount of misalignment of the stage 6 in the Y direction can be obtained. Furthermore, if another position detector 8 is arranged so that the position of the stage 6 in the X direction can be detected, the amount of displacement of the stage 6 in the X direction can also be obtained.

  Since the substrate 5 is held on the stage 6, the position detector 8 can determine the position of the substrate 5 and the amount of displacement from the target position by detecting the position of the stage 6. Note that the position of the substrate 5 and the amount of displacement may be obtained by installing the position detector 8 so that the position of the substrate 5 can be directly detected.

  If the stage 6 is displaced from the target position, it is assumed that the position on the processing surface where the laser beam should be incident (that is, the amount of displacement of the stage 6 from the target position is zero). There is a difference between the position on the processing surface where the laser beam is supposed to be incident and the position where the laser beam is actually incident. This deviation can be reduced by correcting the beam incident position by a method described later.

  As will be described later with reference to FIG. 3, a reference point and a reference point are defined on the surface of the stage 6. The position detector 10 observes the surface of the stage 6 and detects the positions of the reference point and the reference point, whereby position information of both points is acquired. As the position detector 10, for example, a camera having a solid-state imaging device can be used. The reference point and reference point position information acquired by the position detector 10 is sent to the control device 9.

  Next, a method for correcting the beam incident position using the laser processing apparatus described with reference to FIG. The control device 9 gives a command to the stage 6 to move in the X direction. At this time, the target position in the Y direction given from the control device 9 to the stage 6 is constant from the start point to the end point of the movement. However, when the stage 6 is moved, a movement (yawing) in which the trajectory of the stage 6 undulates occurs in a direction (Y direction) orthogonal to the direction in which the stage 6 is moved (X direction) in the XY plane. For this reason, a position shift of the stage 6 in the Y direction occurs. The positional deviation in the Y direction is, for example, about ± 6 μm with the target position in the Y direction as the center.

  By irradiating the laser while moving the stage 6, the laser is irradiated to a linear region that is long in the X direction on the processing surface. In addition, when the correction of the beam incident position as described below is not performed, the linear region has a shape having a swell of about 12 μm in the width direction (Y direction), for example.

  The position of the stage 6 in the Y direction is detected by the position detector 8. Based on the detected position and the stage target position in the Y direction given by the control device 9, the amount of displacement of the stage 6 is obtained. The control device 9 controls the mask moving mechanism 3B shown in FIG. 1B based on the positional deviation amount of the stage 6, whereby the mask 3A is displaced and the beam spot on the processing surface moves in the Y direction. To do. In a direction that compensates for the deviation of the laser beam incident position caused by the positional deviation of the stage 6 from the target position (on the assumption that the laser beam is incident when the positional deviation amount is assumed to be zero) The direction and distance of the displacement of the mask 3A are determined so that the beam spot on the processing surface moves toward the position). In this way, the beam incident position is corrected. In order to move the beam spot on the processing surface by about 6 μm, for example, if the reduction ratio is 1/3, for example, the movement distance of the mask 3A may be about 18 μm.

  While the stage 6 moves from the start point to the end point, laser irradiation is performed while repeatedly correcting the beam incident position as described above. In this way, the undulation of the region irradiated with the laser beam on the surface to be processed can be reduced.

  A positional deviation may also occur in the X direction, which is the direction in which the stage 6 is to be moved, but this positional deviation is as small as about ± 1 μm centered on the target position, for example. As described below, the deviation of the beam incident position caused by the positional deviation in the X direction may be corrected.

  The position detector 8 detects the position of the stage 6 in the X direction. Based on the detected position and the target position in the X direction given by the control device 9, the positional deviation in the X direction of the stage 6 is obtained. The mask 3A is displaced so that the beam spot on the surface to be processed moves in a direction in which the deviation of the laser beam incident position caused by the positional deviation in the X direction from the target position of the stage 6 is compensated. In this way, the deviation of the beam incident position in the X direction can also be corrected. The correction of the deviation of the beam incident position in the X direction and the correction of the deviation of the beam incident position in the Y direction described above can be performed simultaneously.

  In the above description, the position of the stage 6 is detected, the positional deviation from the target position of the stage 6 is obtained, and the deviation of the beam incident position is corrected. However, the position of the substrate 5 is directly detected, and the target position of the substrate 5 is detected. The deviation of the beam incident position may be corrected by obtaining the deviation of the position from the beam.

  Even if the mask moving mechanism 3B is not driven (even if the position of the mask 3A is fixed), it is possible to correct the beam incident position by correcting the positional deviation of the stage 6. As described in the background art above, the stage 6 is composed of an X stage and a Y stage. While irradiating the laser, the X stage holding the substrate 5 is moved in the X direction to Consider the case of processing a long region in the X direction.

  The position detector 8 detects the position of the X stage in the Y direction, and calculates the amount of displacement of the X stage in the Y direction based on the detected position in the Y direction and the target position in the Y direction given by the control device. To do. Based on the calculated displacement amount in the Y direction, the control device 9 moves the Y stage so that the displacement in the Y direction of the X stage is reduced. In this way, the position shift of the stage 6 (and the position shift of the substrate 5) is reduced, so that the laser beam incident position on the processing surface can be corrected.

  However, since the stage 6 is heavy and a linear motor is used for the drive mechanism, the response speed is slow, and it takes about several tens of ms to move the X stage in the Y direction by about 6 μm, for example. On the other hand, moving the beam spot on the surface to be processed by about 6 μm using the mask moving mechanism 3B can be performed in about 1 ms even if it is necessary to move the mask 3A by about 18 μm. By using the mask moving mechanism 3B, the beam incident position can be corrected at high speed.

  Next, a laser processing method capable of correcting the length of the region to be processed in accordance with the substrate temperature will be described with reference to FIGS. In step ST1 shown in FIG. 2, the substrate 5 is held on the stage 6.

  As shown in FIG. 3, a reference point 20 and a reference point 21 are defined on the surface of the stage 6. The reference point 21 is separated from the reference point 20 by a predetermined distance in the X direction. Two positioning pins 22 are arranged along a straight line passing through the reference point 20 and parallel to the X direction, and two positioning pins 22 are arranged along a straight line passing through the reference point 20 and parallel to the Y direction. Yes. The rectangular substrate 5 is aligned with the positioning pins 22, and the pair of sides of the substrate 5 and the other pair of sides are parallel to the X axis and the Y axis, respectively. The point where one side intersects (one corner of the substrate 5) is arranged so as to coincide with the reference point 20.

  In step ST2 shown in FIG. 2, the position coordinates of the reference point 20 and the reference point 21 are detected using the position detector 10 shown in FIG. The control device 9 calculates the distance D between the reference point 20 and the reference point 21 based on both position coordinates. The distance D changes corresponding to the temperature of the stage 6. The control device 9 determines the current temperature T of the stage 6 based on the distance between the reference point 20 and the reference point 21 measured in advance at the reference temperature, the linear expansion coefficient of the material constituting the stage 6, and the distance D. Ask for.

  In the next step ST3, the length L of the region to be processed on the substrate 5 is obtained. Hereinafter, a method for obtaining the length L will be described. Based on the temperature T of the stage 6 obtained in the above step ST2, the control device 9 estimates the temperature Tw of the substrate 5. The length of the region to be processed when the substrate 5 is at the reference temperature is defined as the reference length. When the temperature of the substrate 5 reaches Tw, the length L to be processed changes from the reference length. The control device 9 obtains the length L to be processed based on the reference length, the linear expansion coefficient of the material constituting the substrate 5, and the temperature Tw of the substrate 5.

  In step ST4, the substrate 5 is irradiated with laser as follows. First, the stage 6 is operated to align the substrate 5 so that the laser beam is irradiated to the starting point P0 shown in FIG. Next, laser beam irradiation is started, and laser irradiation is performed on a linear region connecting the start point P0 and the end point P1 separated from the start point P0 by a distance L in the X direction while moving the stage 6 in the X direction ( The moving distance of the stage is L). In this way, the linear region 23 having a length L on the substrate 5 is processed. A plurality of linear regions (such as the linear regions 23a shown in FIG. 3) can be processed by repeatedly performing such a laser irradiation process by moving the starting point in the Y direction.

  By using the method described above, it is possible to process a region to be processed having an appropriate length according to the temperature of the substrate 5. When processing a plurality of substrates, by performing the above-described steps ST1 to ST4 for each substrate, it is possible to process a processing area of an appropriate length for each substrate.

  In addition, when processing a several process area | region with respect to the one board | substrate 5, said step ST2 and ST3 may be performed for every process area | region, and length correction may be performed. Further, the interval (pitch) between the processed regions may be corrected according to the substrate temperature. The pitch when the substrate temperature is changed to Tw based on the pitch when the substrate temperature is the reference temperature and the linear expansion coefficient of the substrate 5 in the same manner as when the length of the region to be processed is obtained above. Is required.

  The correspondence between the distance D between the reference point 20 and the reference point 21 and the length L of the work area is obtained in advance for various distances D, and a table of the correspondence between the distance D and the length L is created. You may keep it. If the control device 9 obtains the length L of the region to be processed from the distance D between the reference point 20 and the reference point 21 based on such a table, the control device 9 executes when processing the substrate 5. The amount of calculation can be reduced.

  Note that a direction connecting the two points can be obtained from the position coordinates of the reference point 20 and the reference point 21. When a positional deviation occurs in which the direction connecting the reference point 20 and the reference point 21 is inclined with respect to the X axis, the stage 6 moves in a direction parallel to the direction connecting the reference point 20 and the reference point 21. As described above, stage control may be performed.

  If a reference mark for alignment is formed on the substrate 5, the length of the region to be processed can be corrected using the reference mark. As shown in FIG. 3, by arranging one corner of the substrate 5 so as to coincide with the reference point 20, the reference point 20 can be used as a reference point for alignment of the substrate 5. Since the two sides of the substrate 5 that intersect at the reference point 20 are in contact with the positioning pins 22, they do not move even if the substrate 5 is thermally expanded. Thereby, one corner of the substrate 5 arranged at the reference point 20 does not move even if the substrate 5 is thermally expanded.

  The distance Da from the reference point 20 of the stage 6 to the reference mark of the substrate 5 held on the stage 6 is measured in advance at the reference temperature. When processing the substrate 5, the position coordinates of the reference point 20 of the stage 6 and the reference mark of the substrate 5 are detected, and the distance Db between the two points is calculated. It is calculated how many times the distance Db is the distance Da. When this magnification is multiplied by the reference length, the length L of the region to be processed to be processed at the processing temperature can be obtained. The position coordinate of the reference mark on the substrate 5 is detected by the position detector 10. Note that the measurement of the distance Da at the reference temperature may be performed on another substrate on which the reference mark is formed, similarly to the substrate 5.

  Next, a laser processing apparatus according to a modification of the above embodiment will be described with reference to FIG. The laser processing apparatus shown in FIG. 4 has a configuration in which the fine movement stage 11 is added between the substrate 5 and the stage 6 by removing the mask moving mechanism 3B from the laser processing apparatus shown in FIG.

  The continuous wave laser beam emitted from the laser light source 1 is reflected by the folding mirror 2, enters the mask 3A, and the cross section is shaped. The laser beam emitted from the mask 3 </ b> A is converged by the lens 4 and enters the surface of the substrate 5. The mask 3 </ b> A, the lens 4, and the substrate 5 are arranged so that the transmission region of the mask 3 </ b> A forms an image on the surface of the substrate 5.

  The substrate 5 is held on the fine movement stage 11, the fine movement stage 11 is held on the stage 6, and the stage 6 is held on the base 7. The surface of the substrate 5 is parallel to the XY plane. The stage 6 can move in a two-dimensional direction parallel to the XY plane fixed to the base 7 to move the fine movement stage 11 and the substrate 5 held by the fine movement stage 11.

  The fine movement stage 11 can finely displace the substrate 5 from the reference position in a two-dimensional direction parallel to the XY plane. The fine movement stage 11 has a drive mechanism using a piezoelectric element, and moves the substrate 5 by about several tens of μm. The control device 9 controls the fine movement stage 11 by giving a displacement amount from the reference position.

  Using the laser processing apparatus shown in FIG. 4, the deviation of the beam incident position due to the deviation of the position of the stage 6 can be corrected as described below. The amount of displacement of the stage 6 is obtained from the position of the stage 6 detected by the position detector 8 and the target position given to the stage 6 by the control device 9.

  The control device 9 controls the fine movement stage 11 based on the amount of positional deviation of the stage 6 and displaces the substrate 5 so that the substrate 5 approaches the target position. Thereby, the deviation of the beam incident position on the processing surface is corrected. For example, when the stage 6 is moved in the X direction, a position shift in the Y direction of the stage 6 occurs with yawing. By using the fine movement stage 11 and displacing the substrate 5 in the Y direction, it is possible to correct the deviation of the beam incident position on the processing surface due to this deviation.

  Note that the position detector 8 may detect the position of the substrate 5 to obtain a positional deviation amount of the substrate 5 from the target position, and the substrate 5 may be brought closer to the target position based on the positional deviation amount. In this case, when the fine movement stage 11 has displaced the substrate 5 from the reference position in accordance with the beam incident position correction before that, the fine movement stage 11 is controlled based on this displacement amount.

  As described above, the substrate 5 can also be brought close to the target position by correcting the positional deviation of the stage 6, but the response speed of the stage 6 driven by a linear motor or the like is slow. Since the distance that the stage 6 can move is required to be about 1000 mm, a piezo element that responds at high speed cannot be used for the drive mechanism of the stage 6. On the other hand, the fine movement stage 11 can be driven by a piezo element because the substrate 5 has only to be displaced by a distance that is about the magnitude of the positional deviation of the stage 6. Therefore, by using the fine movement stage 11, the movement for compensating the positional deviation of the substrate 5 is accelerated, and the beam incident position can be corrected at a high speed.

  Although the present invention has been described with reference to the embodiments, the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like can be made.

It is the schematic of the laser processing apparatus by the Example of this invention. It is a top view which shows roughly the structure of a beam incident position displacement means. It is the flowchart which showed the laser processing method by the Example. It is a top view of the stage with which the board | substrate was hold | maintained. It is the schematic of the laser processing apparatus by a modification.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Laser light source 2 Folding mirror 3 Beam incident position displacement means 3A Mask 3B Mask moving mechanism 4 Lens 5 Substrate 6 Stage 7 Base 8 10 Position detector 9 Control device 11 Fine movement stage 20 Reference point 21 Reference point

Claims (5)

A laser light source for emitting a laser beam;
A stage for holding a workpiece having a workpiece surface and moving the workpiece in at least a one-dimensional direction parallel to the workpiece surface;
The laser beam emitted from the laser light source is disposed at a position where the laser beam is incident, and a transmission region that transmits the laser beam is defined in a light-shielding region that shields the incident laser beam. A laser beam that is smaller than the beam cross section of the beam and transmitted through the transmission region is incident on the surface to be processed of the object to be processed held by the stage, and the transmission region intersects the traveling direction of the laser beam. A beam incident position displacing means that is displaceable and displaces the incident position of the laser beam in the processing surface by the displacement of the transmission region ;
A position detector for detecting the position of the stage or the position of the workpiece held on the stage;
The stage is controlled and moved, and during the movement of the stage, the amount of deviation from the target position of the position of the stage detected by the position detector or the workpiece held on the stage is obtained, A laser processing apparatus , comprising: a control device that controls the beam incident position displacement means so that the transmission region is displaced based on a deviation amount . The control device compensates for the displacement of the laser beam incident position on the surface to be processed due to the displacement of the stage or the workpiece held on the stage from the target position by the displacement of the transmission region. as is, the laser machining apparatus according to _ claim 1 for controlling the beam incident position displacing unit. Moving direction of the stage is a first direction, the displacement direction of the beam incident position by the beam incident position displacement means, according to claim 1 or 2 which is a second direction perpendicular to the first direction Laser processing equipment. (A) moving a stage on which a workpiece having a workpiece surface on which a laser beam is incident is held;
(B) While moving the stage, the position of the stage or the position of the workpiece held on the stage is detected, and the target of the detected position of the stage or the workpiece held on the stage is detected. A step of obtaining a deviation amount from the position and displacing the beam spot on the surface to be processed of the workpiece based on the deviation amount so as to compensate for the deviation of the laser beam incident position caused by the positional deviation. A laser processing method comprising: In the step (a), the moving direction of the stage is the first direction, and in the step (b), the displacement direction of the beam spot on the processing surface is a second direction orthogonal to the first direction. The laser processing method according to claim 4 , wherein the laser processing method is a direction.

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