JP2014157999A - Electronic component feeding device, electronic component mounting apparatus and electronic component supply method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To supply electronic components to their holding positions with higher accuracy.SOLUTION: An electronic component feeding device comprises: housing means which holds a plurality of electronic components in a row and has an opening formed at the end of an arrangement direction in which the plurality of electronic components are juxtaposed; support means which is arranged at the end of the housing means and supports the electronic components that have passed through the opening; vibrating means which vibrates at least the housing means and moves the plurality of electronic components housed in the housing means toward the end; locking means which is arranged on the opposite side in the arrangement direction to the housing means side of the support means and restricts the movement of the electronic components to the tip side in the arrangement direction so as to hold the electronic components in their holding positions; and sucking means which has a suction port formed on at least one of the locking means, the support means and the housing means, and sucks air from the suction port so as to suck the electronic components in a position facing the suction port.

Description

  The present invention relates to an electronic component supply device, an electronic component mounting device, and an electronic component supply method.

  An electronic component mounting apparatus (mounter) has a head provided with a nozzle, holds an electronic component with the nozzle, and mounts it on a substrate. The electronic component mounting apparatus holds the electronic component at the holding position (suction position, holding position) by moving the nozzle of the head in a direction orthogonal to the surface of the substrate. After that, the electronic component mounting apparatus moves the head relative to the direction parallel to the surface of the substrate, and moves the nozzle of the head in a direction perpendicular to the surface of the substrate when it reaches the mounting position of the held electronic component. After the electronic component is mounted on the substrate close to the substrate, the electronic component is mounted on the substrate by releasing the holding by the nozzle.

  Here, the electronic component mounting apparatus includes an electronic component supply device (feeder) as a mechanism for supplying the electronic component to the holding position. Examples of the electronic component supply device include a tape feeder, a bulk feeder, a stacking stick feeder, and a stick feeder.

  For example, in Patent Document 1, a plurality of electronic components are housed, and a stick case having an opening end in the length direction is stacked on the stacking unit, and the stacking unit is stacked with the opening end inclined downward. A contact portion having a flat surface with which the opening end of the stick case contacts, a through port through which the electronic components in the stick case pass from the one opening end in contact with the flat surface of the contact portion to the transport portion side, and stacking Elevating means for moving the stick cases stacked in the ascending order or descending order and sequentially matching the opening ends of the stick cases to the through-holes, and switching means for switching the ascending order and descending order for moving the stick cases by the elevating means, A stick component supply device is described. In addition, it is described that a component detection sensor that detects the passage of an electronic component is installed in the vicinity of the through hole, and the supply operation of the electronic component is controlled based on the result of the component detection sensor. Japanese Patent Application Laid-Open No. H10-228561 describes that the lowering operation of the nozzle is controlled by the suction state in the mechanism that holds the electronic component by performing suction with the nozzle.

JP 2008-270547 A JP 2009-176859 A

  The stick component supply device (stick feeder) shown in Patent Document 1 moves electronic components in a line along a rail or the like, and sequentially conveys the electronic components to a holding position. Here, the stick feeder (electronic component supply device) may adversely affect the holding operation by the nozzle when the electronic component moved to the holding position is displaced. The electronic component supply device (stick feeder) has room for improvement in the mechanism for supplying the electronic component to the holding position.

  The present invention has been made in view of the above, and an object thereof is to provide an electronic component supply device, an electronic component mounting device, and an electronic component supply method capable of supplying an electronic component to a holding position with higher accuracy. And

  The present invention is an electronic component supply apparatus, comprising: a storage unit that holds a plurality of electronic components in a row and has an opening formed at an end in an arrangement direction, which is a direction in which the plurality of electronic components are arranged; A support means for supporting the electronic component disposed adjacent to the end of the accommodation means and passing through the opening; and a plurality of the electrons contained in the accommodation means by vibrating at least the accommodation means. A vibration means for moving a component toward the end portion, and an arrangement direction in which the electronic component is moved to the tip side in the arrangement direction. A suction port is formed in at least one of the locking means that regulates and holds the electronic component in a holding position, the locking means, the support means, and the storage means, and sucks air from the suction port, Before the position facing the suction port And having a suction means for sucking the electronic component, a.

  The vibration control unit further includes a vibration control unit that controls the vibration unit, and a detection unit that detects the presence / absence of the electronic component at the holding position, and the vibration control unit corresponds to a detection result of the detection unit. It is preferable to control stop and operation of the vibration means.

  Further, it is preferable that a plurality of units including the housing means, the support means, and the suction means are provided, and the vibration means vibrates the two units integrally.

  In the suction unit, it is preferable that one of the suction ports is formed in the locking unit and sucks the electronic component in the holding position.

  In the suction unit, it is preferable that one of the suction ports is formed in the housing unit and sucks an electronic component at a position adjacent to the holding position.

  Further, the present invention is an electronic component mounting apparatus, comprising: the electronic component supply apparatus according to any one of the above; and at least one nozzle that holds the electronic component at a predetermined position of the support means, A head capable of moving in the vertical and horizontal directions for conveying the electronic component held by the nozzle, and a control means for controlling movement of the nozzle in the vertical and horizontal directions, the control means comprising: The suction means is stopped or operated in conjunction with the vertical movement of the nozzle.

  Further, it is preferable that the control unit stops sucking the electronic component at the holding position a predetermined time before the time when the electronic component at the holding position is sucked by the nozzle.

  The present invention includes a storage unit that holds a plurality of electronic components in a row and has an opening formed at an end in an arrangement direction, which is a direction in which the plurality of electronic components are arranged, and the end of the storage unit A support means for supporting the electronic component disposed adjacent to the opening and passing through the opening, a vibration means for vibrating at least the storage means, and the storage means side of the support means in the arrangement direction. An electronic component supply method using an electronic component supply apparatus, which is disposed on the opposite side, restricts movement of the electronic components to the tip side in the arrangement direction, and holds the electronic components in a holding position. The conveying means that vibrates at least the accommodating means by the vibration means, moves the plurality of electronic components accommodated in the accommodating means toward the end, and moves the electronic components to the holding position. Steps, A suction step in which a suction port is formed in at least one of the locking means, the support unit, and the storage unit, sucks air from the suction port, and sucks the electronic component at a position facing the suction port; It is characterized by having.

  In the suction step, it is preferable to suck the electronic component at the holding position.

  Further, it is preferable that the suction step sucks an electronic component at a position adjacent to the holding position.

  According to the present invention, the electronic component can be supplied to the holding position with higher accuracy.

FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus. FIG. 2 is a schematic diagram illustrating a schematic configuration of an example of a component supply unit. FIG. 3 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 4 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 5 is an explanatory diagram illustrating an example of a nozzle. FIG. 6 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 7 is a flowchart showing an example of the operation of the electronic component mounting apparatus. FIG. 8 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 9 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 10 is a plan view illustrating an example of an electronic component supply apparatus. FIG. 11 is a side view of the electronic component supply apparatus shown in FIG. FIG. 12 is a partial cross-sectional view showing a schematic configuration of the electronic component supply apparatus. FIG. 13 is a schematic diagram illustrating an example of a stick case and an electronic component of the electronic component supply apparatus. FIG. 14 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 15 is a flowchart illustrating an example of the operation of the electronic component supply apparatus. FIG. 16 is a timing chart showing an example of the operation of the electronic component mounting apparatus. FIG. 17 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 18 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 19 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 20 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 21 is a schematic diagram illustrating a schematic configuration of another example of the electronic component supply apparatus. FIG. 22 is an enlarged view of the electronic component supply apparatus shown in FIG. FIG. 23 is a timing chart showing an example of the operation of the electronic component mounting apparatus. FIG. 24 is an explanatory diagram for explaining the function of the electronic component supply apparatus shown in FIG.

  Hereinafter, the present invention will be described in detail with reference to the drawings. The present invention is not limited by the following modes for carrying out the invention (hereinafter referred to as embodiments). In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. Furthermore, the constituent elements disclosed in the following embodiments can be appropriately combined.

  Hereinafter, an electronic component supply device and an electronic component mounting device according to the present embodiment will be described with reference to the drawings. In addition, this invention is not limited by this embodiment. An electronic component mounting apparatus commonly used in the following embodiments has a lead, and the lead is inserted into a substrate hole (insertion hole, hole) of the substrate, whereby the electronic component mounted on the substrate An electronic component mounting apparatus for mounting a so-called insertion type electronic component. The electronic component mounting apparatus has a function of mounting an insertion type electronic component (lead type electronic component). Here, the insertion type electronic component is mounted by inserting a lead into a hole formed in the substrate. Further, electronic components mounted on the substrate without being inserted into the insertion hole (substrate hole), for example, SOP, QFP, etc., are mounted electronic components. The electronic component mounting apparatus may have a function of mounting a mountable electronic component mounted on the substrate. The electronic component mounting apparatus 10 of the following embodiment has a function of mounting both a mountable electronic component and an insertable electronic component.

  Next, the electronic component mounting apparatus 10 of this embodiment will be described. The electronic component mounting apparatus 10 can mount both a mountable electronic component and an insertable electronic component. That is, it is an apparatus that can mount both a mountable electronic component that is mounted by being placed on a substrate and a lead-type electronic component that is mounted by inserting a lead into an insertion hole of the substrate (insertion-type electronic component). The electronic component mounting apparatus 10 can mount both the mounted electronic component and the lead electronic component, or can mount only one of them. The electronic component mounting apparatus 10 can mount both the mountable electronic component and the lead-type electronic component in this way, and can be used in various applications depending on the board to be manufactured and the layout of the other electronic component mounting apparatus. Can be used.

  FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus. An electronic component mounting apparatus 10 shown in FIG. 1 is an apparatus for mounting electronic components on a substrate 8. The electronic component mounting apparatus 10 includes a housing 11, a board transport unit 12, component supply units 14 f and 14 r, a head 15, an XY movement mechanism 16, a VCS unit 17, a replacement nozzle holding mechanism 18, and a component storage. The unit 19, the control device 20, the operation unit 26, and the display unit 27 are included. The XY movement mechanism 16 includes an X-axis drive unit 22 and a Y-axis drive unit 24. Here, as shown in FIG. 1, the electronic component mounting apparatus 10 according to the present embodiment includes component supply units 14 f and 14 r on the front side and the rear side with the board conveyance unit 12 as the center. In the electronic component mounting apparatus 10, the component supply unit 14 f is disposed on the front side of the electronic component mounting apparatus 10, and the component supply unit 14 r is disposed on the rear side of the electronic component mounting apparatus 10. In the following description, the two component supply units 14f and 14r are referred to as a component supply unit 14 unless particularly distinguished.

  The board | substrate 8 should just be a member which mounts an electronic component, and the structure is not specifically limited. The substrate 8 of the present embodiment is a plate-like member, and a wiring pattern is provided on the surface. Solder which is a bonding member for bonding the wiring pattern of the plate-like member and the electronic component is attached to the surface of the wiring pattern provided on the substrate 8 by reflow. The substrate 8 is also formed with through holes (insertion holes, substrate holes) into which electronic components are inserted.

  The substrate transport unit 12 is a transport mechanism that transports the substrate 8 in the X-axis direction in the drawing. The substrate transport unit 12 includes a rail that extends in the X-axis direction, and a transport mechanism that supports the substrate 8 and moves the substrate 8 along the rail. The substrate transport unit 12 transports the substrate 8 in the X-axis direction by moving the substrate 8 along the rail by the transport mechanism in a direction in which the mounting target surface of the substrate 8 faces the head 15. The board transport unit 12 transports the board 8 supplied from the equipment supplied to the electronic component mounting apparatus 10 to a predetermined position on the rail. The head 15 mounts an electronic component on the surface of the substrate 8 at a predetermined position. When the electronic component is mounted on the substrate 8 that has been transported to the predetermined position, the substrate transport unit 12 transports the substrate 8 to an apparatus that performs the next step. Various structures can be used as the transport mechanism of the substrate transport unit 12. For example, a belt system in which a transport mechanism is integrated, in which a rail disposed along the transport direction of the substrate 8 and an endless belt rotating along the rail are combined and transported in a state where the substrate 8 is mounted on the endless belt. Can be used.

  In the electronic component mounting apparatus 10, a component supply unit 14f is disposed on the front side, and a component supply unit 14r is disposed on the rear side. The front-side component supply unit 14f and the rear-side component supply unit 14r each hold a large number of electronic components mounted on the substrate 8, and can supply them to the head 15, that is, they can be held (sucked or gripped) by the head 15. The electronic component supply apparatus which supplies to a holding position in a state is provided. The electronic component supply device will be described later in detail. Note that the electronic components supplied by the component supply units 14f and 14r of the present embodiment may be of the same type or different.

  FIG. 2 is a schematic diagram illustrating a schematic configuration of an example of a component supply unit. As shown in FIG. 2, the component supply unit 14 includes a plurality of electronic component supply devices (hereinafter also simply referred to as “component supply devices”) 90 and 90 a.

  Specifically, the component supply unit 14 supplies a plurality of lead-type electronic components (insertion-type electronic components) to a holding position, and can be held by the suction nozzle or gripping nozzle provided in the head at the holding position. In addition to mounting a plurality of supply devices 90, an electronic component holding tape (chip component tape) in which a plurality of mounted electronic components are fixed to the tape body is mounted, and the mounted electronic components held by the electronic component holding tape are held. An electronic component supply device 90a is provided that is peeled off from the tape main body at the position (first holding position) and can hold the mounted electronic component at the holding position with a suction nozzle or a gripping nozzle provided in the head. The component supply unit 14 may install a stick feeder or a tray feeder as the other electronic component supply device 90a. A plurality of component supply apparatuses 90 and 90 a shown in FIG. 2 are held by a support base (bank) 96. Further, the support table 96 can be mounted with other devices (for example, a measuring device, a camera, etc.) of the component supply devices 90 and 90a.

  The component supply unit 14 includes a plurality of types of electronic component supply devices that are different in the types of electronic components to be mounted, the mechanisms for holding the electronic components, or the supply mechanisms. 90, 90a. Further, the component supply unit 14 may include a plurality of electronic component supply devices 90 and 90a of the same type. The component supply unit 14 is preferably configured to be detachable from the apparatus main body.

  The component supply device 90 supplies lead type electronic components to the head 15. The component supply device 90 moves the lead-type electronic components accommodated in a single row in the stick case in a predetermined direction, so that the electronic components can be held by the nozzles of the head 15 (suction position, gripping position). , Holding area). The component supply device 90 can hold (suck or grip) the lead type electronic component by the nozzle of the head 15 by moving the lead type electronic component to the holding position. The component supply device 90 will be described later. The plurality of component supply apparatuses 90 may supply different types of electronic components or separate electronic components. In addition to the stick feeder, the component supply device 90 supplies the radial lead type electronic component to the head 15 using an electronic component holding tape configured by attaching a plurality of radial lead type electronic component leads to the tape. A tape feeder, a bowl feeder, an axial feeder, a tray feeder, or the like can also be used.

  The electronic component supply device 90a supplies an electronic component to the head 15 using an electronic component holding tape configured by attaching a chip-type electronic component mounted on a substrate to a tape. In the electronic component holding tape, a plurality of storage chambers are formed in the tape, and the electronic components are stored in the storage chamber. The electronic component supply device 90a holds an electronic component holding tape, feeds the held electronic component holding tape, and sends out the chip-type electronic components housed in a row in a stick case in a stick case by vibration. It is a stick tape feeder that moves to a holding area where electronic components can be sucked by 15 nozzles. By moving the storage chamber to the holding area, the electronic component accommodated in the storage chamber can be exposed to a predetermined position, and the electronic component is sucked and held by the nozzle of the head 15. Can do. The electronic component supply device 90a is not limited to a tape feeder, and can be various chip component feeders that supply chip-type electronic components. As the chip component feeder, for example, a stick feeder, a tape feeder, or a bulk feeder can be used.

  The head 15 holds (sucks or holds) the electronic component held by the component supply unit 14f or the electronic component held by the component supply unit 14r with a nozzle, and moves the held electronic component to a predetermined position by the substrate transport unit 12. And a mechanism for mounting on the substrate 8. Further, when the component supply unit 14r includes the electronic component supply device 90a, the head 15 mounts (mounts) a chip-type electronic component (mounted electronic component) held by the electronic component supply device 90a on the substrate 8. It is a mechanism to do. The configuration of the head 15 will be described later. The chip-type electronic component (mounted electronic component) is a leadless electronic component that does not include a lead that is inserted into an insertion hole (through hole) formed in the substrate 8. Examples of the on-board electronic component include SOP and QFP as described above. The chip-type electronic component is mounted on the substrate 8 without inserting the lead into the insertion hole.

  The XY moving mechanism 16 is a moving mechanism that moves the head 15 in the X-axis direction and the Y-axis direction in FIG. 1, that is, on a plane parallel to the surface of the substrate 8, and the X-axis driving unit 22 and the Y-axis driving unit 24. Have The X-axis drive unit 22 is connected to the head 15 and moves the head 15 in the X-axis direction. The Y-axis drive unit 24 is connected to the head 15 via the X-axis drive unit 22 and moves the head 15 in the Y-axis direction by moving the X-axis drive unit 22 in the Y-axis direction. The XY moving mechanism 16 can move the head 15 to the position facing the substrate 8 or the position facing the component supply units 14f and 14r by moving the head 15 in the XY axis direction. The XY moving mechanism 16 adjusts the relative position of the head 15 and the substrate 8 by moving the head 15. Thus, the electronic component held by the head 15 can be moved to an arbitrary position on the surface of the substrate 8, and the electronic component can be mounted at an arbitrary position on the surface of the substrate 8. That is, the XY movement mechanism 16 moves the head 15 on the horizontal plane (XY plane), and moves the electronic components in the electronic component supply devices 90 and 90a of the component supply units 14f and 14r to a predetermined position (mounting position, It becomes a transfer means for transferring to the mounting position. As the X-axis drive unit 22, various mechanisms that move the head 15 in a predetermined direction can be used. As the Y-axis drive unit 24, various mechanisms that move the X-axis drive unit 22 in a predetermined direction can be used. As a mechanism for moving the object in a predetermined direction, for example, a linear motor, a rack and pinion, a transport mechanism using a ball screw, a transport mechanism using a belt, or the like can be used.

  The VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are positions that overlap the movable region of the head 15 in the XY plane, and the position in the Z direction is lower than the head 15 in the vertical direction. Placed in position. In the present embodiment, the VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are disposed adjacent to each other between the substrate transport unit 12 and the component supply unit 14r.

  The VCS unit (component state detection unit, state detection unit) 17 is an image recognition device, and includes a camera for photographing the vicinity of the nozzles of the head 15 and an illumination unit for illuminating the photographing region. The VCS unit 17 recognizes the shape of the electronic component sucked by the nozzle of the head 15 and the holding state of the electronic component by the nozzle. More specifically, when the head 15 is moved to the facing position, the VCS unit 17 captures the nozzle of the head 15 from the lower side in the vertical direction, and analyzes the captured image so that it is adsorbed by the nozzle. Recognizes the shape of the electronic component and the electronic component holding state by the nozzle The VCS unit 17 sends the acquired information to the control device 20.

  The replacement nozzle holding mechanism 18 is a mechanism that holds a plurality of types of nozzles. The replacement nozzle holding mechanism 18 holds a plurality of types of nozzles in a state where the head 15 can be attached and detached. Here, the replacement nozzle holding mechanism 18 of the present embodiment holds a suction nozzle that holds the electronic component by suction and a gripping nozzle that holds the electronic component by gripping the electronic component. The head 15 changes the nozzle to be mounted by the replacement nozzle holding mechanism 18, and supplies air pressure to the mounted nozzle to drive it, thereby holding the electronic component to be held under appropriate conditions (suction or gripping). be able to.

  The component storage unit 19 is a box that stores electronic components that the head 15 holds with nozzles and is not mounted on the substrate 8. That is, the electronic component mounting apparatus 10 is a disposal box for discarding electronic components that are not mounted on the substrate 8. When there is an electronic component that is not mounted on the substrate 8 among the electronic components held by the head 15, the electronic component mounting apparatus 10 moves the head 15 to a position facing the component storage unit 19 and holds the held electronic component. By releasing the part, the electronic part is put into the part storage unit 19.

  The control device 20 controls each part of the electronic component mounting apparatus 10. The control device 20 is an aggregate of various control units. The operation unit 26 is an input device through which an operator inputs an operation. Examples of the operation unit 26 include a keyboard, a mouse, and a touch panel. The operation unit 26 sends the detected various inputs to the control device 20. The display unit 27 is a screen that displays various types of information to the worker. Examples of the display unit 27 include a touch panel and a vision monitor. The display unit 27 displays various images based on the image signal input from the control device 20.

  Although the electronic component mounting apparatus 10 of the present embodiment has one head, two heads may be provided corresponding to each of the component supply units 14f and 14r. In this case, two X-axis drive units are provided, and the two heads can be moved independently by moving the two heads in the XY directions, respectively. Furthermore, the electronic component mounting apparatus 10 is also preferably arranged with two board transfer parts 12 in parallel. The electronic component mounting apparatus 10 can move the two substrates 8 alternately to the electronic component mounting positions by the two substrate transfer units 12 and alternately mount the components by the two heads 15. Can be installed.

  Next, the configuration of the head 15 will be described with reference to FIGS. 3 and 4. FIG. 3 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 4 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 3 also shows various control units that control the electronic component mounting apparatus 10 and one component supply device 90 of the component supply unit 14r. As shown in FIGS. 3 and 4, the head 15 includes a head main body 30, an imaging device (substrate state detection unit) 36, a height sensor (substrate state detection unit) 37, and a laser recognition device (component state detection unit, state detection). Part) 38.

  As shown in FIG. 3, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, and a component supply control unit 64. The control unit 60, the head control unit 62, and the component supply control unit 64 are part of the control device 20 described above. In addition, the electronic component mounting apparatus 10 is connected to a power source and supplies power supplied from the power source to each unit using the control unit 60, the head control unit 62, the component supply control unit 64, and various circuits. The control unit 60, the head control unit 62, and the component supply control unit 64 will be described later.

  The electronic component supply device (feeder) 90 is a mechanism for supplying the electronic component 80. In the present embodiment, the electronic component 80 includes an electronic component main body (hereinafter simply referred to as “main body”) 82 and a plurality of leads 84 connected to the main body 82. As such an electronic component 80, an integrated circuit can be illustrated. The supply of components by the electronic component supply device 90 will be described later.

  The head body 30 includes a head support 31 that supports each part, a plurality of nozzles 32, and a nozzle drive unit 34. As shown in FIG. 4, six nozzles 32 are arranged in a row in the head main body 30 of the present embodiment. The six nozzles 32 are arranged in a direction parallel to the X axis. In addition, as for the nozzle 32 shown in FIG. 4, the suction nozzle which adsorbs and hold | maintains the electronic component 80 is arrange | positioned.

  The head support 31 is connected to the X-axis drive unit 22 and supports the nozzle 32 and the nozzle drive unit 34. The head support 31 also supports the laser recognition device 38.

  The nozzle 32 is a suction mechanism that sucks and holds the electronic component 80. The nozzle 32 has an opening 32a at the tip. The opening 32 a is connected to the nozzle driving unit 34 through an internal cavity and a cavity of the nozzle holding unit 33. The nozzle 32 sucks air from the opening 32a to suck and hold the electronic component 80 at the tip. The nozzle 32 can be attached to and detached from the nozzle holding portion 33, and is stored (stored) in the replacement nozzle mechanism 18 when it is not attached to the nozzle holding portion 33. The nozzle 32 has various shapes and sizes of the opening 32a. In the present embodiment, an adsorption type nozzle having an opening for adsorbing an electronic component is shown. However, an arm that operates by air pressure is used, and a holding type nozzle is used to hold the electronic component by sandwiching it. Can do.

  The nozzle holding unit 33 is a mechanism that holds the nozzle 32 at the end (tip) on the lower side in the vertical direction. For example, the nozzle driving unit 34 is coupled to the nozzle 32 and a shaft that moves relative to the nozzle support 31. And a socket. The shaft is a rod-shaped member, and is arranged extending in the Z-axis direction. The shaft supports a socket disposed at an end portion on the lower side in the vertical direction. The shaft is supported with respect to the head support 31 in a state where a portion connected to the socket is movable in the Z-axis direction and is rotatable in the θ direction. Here, the Z axis is an axis orthogonal to the XY plane and is a direction orthogonal to the surface of the substrate 8. That is, the θ direction is a direction parallel to the circumferential direction of a circle around the Z axis, which is an axis parallel to the direction in which the nozzle driving unit 34 moves the nozzle 32. The θ direction is the rotation direction of the nozzle 32. A portion of the shaft connected to the socket is moved and rotated in the Z-axis direction and the θ direction by the nozzle driving unit 34.

  The nozzle driving unit 34 moves the nozzle holding unit 33 in the Z-axis direction to move the nozzle 32 in the Z-axis direction, and sucks the electronic component 80 through the opening 32 a of the nozzle 32. Further, the nozzle drive unit 34 rotates the nozzle 32 in the θ direction by rotating the nozzle holding unit 33 in the θ direction when the electronic component 80 is mounted.

  The nozzle driving unit 34 includes a mechanism having a Z-axis motor 34a, specifically, a linear motion linear motor whose driving direction is the Z-axis direction as a mechanism for moving the nozzle 32 in the Z-axis direction. The nozzle drive unit 34 moves the shaft of the opening 32a at the tip of the nozzle 32 in the Z-axis direction by moving the nozzle 32 in the Z-axis direction together with the nozzle holding unit 33 by the Z-axis motor 34a. In addition, the nozzle drive unit 34 includes a mechanism configured by, for example, a motor and a transmission element connected to the shaft of the nozzle holding unit 33 as a mechanism for rotating the nozzle 32 in the θ direction. The nozzle driving unit 34 transmits the driving force output from the motor to the shaft of the nozzle holding unit 33 by a transmission element, and rotates the shaft in the θ direction, thereby rotating the tip of the nozzle 32 in the θ direction.

  The nozzle drive unit 34 has a mechanism for sucking the electronic component 80 through the opening 32a of the nozzle 32, that is, as a suction mechanism, for example, an air pipe connected to the opening 32a of the nozzle 32, and a pump connected to the air pipe. And a solenoid valve that switches between opening and closing the pipe of the air pipe. The nozzle drive unit 34 sucks air from the air pipe with a pump, and switches whether to suck air from the opening 32a by switching between opening and closing of the electromagnetic valve. The nozzle drive unit 34 opens the electromagnetic valve and sucks (holds) the electronic component 80 in the opening 32a by sucking air from the opening 32a, and closes the electromagnetic valve and sucks air in the opening 32a by not sucking air from the opening 32a. The electronic component 80 that has been released is released, that is, the electronic component 80 is not sucked (not held) by the opening 32a.

  The imaging device 36 is fixed to the head support 31 of the head body 30 and images an area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The imaging device 36 has a camera and an illumination device, and acquires an image with the camera while illuminating the visual field with the illumination device. Thereby, an image of a position facing the head body 30, for example, various images of the substrate 8 and the component supply unit 14 can be taken. For example, the imaging device 36 captures an image of a BOC mark (hereinafter also simply referred to as a BOC) or a through hole (insertion hole) as a reference mark formed on the surface of the substrate 8. Here, when a reference mark other than the BOC mark is used, an image of the reference mark is taken.

  The height sensor 37 is fixed to the head support 31 of the head body 30 and measures the distance from the area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The height sensor 37 includes a light emitting element that emits laser light and a light receiving element that receives the laser light reflected and returned at the facing position, and the time from when the laser light is emitted until it is received. It is possible to use a laser sensor that measures the distance from the facing part. In addition, the height sensor 37 processes the distance from the facing portion using the position of the sensor itself and the position of the substrate 8 to measure the height of the facing portion, specifically, the electronic component 80. To detect. The process of detecting the height of the electronic component 80 based on the measurement result of the distance from the electronic component 80 may be performed by the control unit 60.

  The laser recognition device 38 includes a light source 38a and a light receiving element 38b. The laser recognition device 38 is built in the bracket 50. As shown in FIG. 3, the bracket 50 is connected to the lower side of the head support 31, the substrate 8, and the component supply device 90 side. The laser recognition device 38 is a device that detects the state of the electronic component 80 by irradiating the electronic component 80 sucked by the nozzle 32 of the head body 30 with laser light. Here, the state of the electronic component 80 includes the shape of the electronic component 80, whether the electronic component 80 is sucked in the correct posture by the nozzle 32, and the like. The light source 38a is a light emitting element that outputs laser light. The light receiving element 38b has a position in the Z-axis direction, that is, a position having the same height, and is disposed at a position facing the light source 38a.

  Next, the control function of the device configuration of the electronic component mounting apparatus 10 will be described. As illustrated in FIG. 3, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, and a component supply control unit 64 as the control device 20. Each of the various control units is configured by a member having an arithmetic processing function and a storage function such as a CPU, a ROM, and a RAM. In this embodiment, a plurality of control units are used for convenience of explanation, but a single control unit may be used. Further, when the control function of the electronic component mounting apparatus 10 is a single control unit, it may be realized by one arithmetic device or a plurality of arithmetic devices.

  The control unit 60 is connected to each unit of the electronic component mounting apparatus 10 and executes a stored program based on the input operation signal and information detected by each unit of the electronic component mounting apparatus 10. Control the operation of each part. The control unit 60 controls, for example, the transport operation of the substrate 8, the drive operation of the head 15 by the XY movement mechanism 16, the shape detection operation by the laser recognition device 38, and the like. Further, the control unit 60 sends various instructions to the head control unit 62 as described above, and also controls the control operation by the head control unit 62. The control unit 60 also controls the control operation by the component supply control unit 64.

  The head control unit 62 is connected to the nozzle driving unit 34 and various sensors and the control unit 60 disposed on the head support 31, and controls the nozzle driving unit 34 to control the operation of the nozzle 32. The head control unit 62 performs the suction (holding) / release operation of the electronic component 80 of the nozzle 32 and the operation of each nozzle 32 based on the operation instruction supplied from the control unit 60 and the detection results of various sensors (for example, a distance sensor). Controls the rotation operation and the movement operation in the Z-axis direction. Control of the head controller 62 will be described later.

  The component supply control unit 64 controls the operation of supplying the electronic component 80 by the component supply units 14f and 14r. The component supply control unit 64 may be provided for each electronic component supply device 90 or may control all of the plurality of electronic component supply devices 90 by one.

  Here, in the above embodiment, the case where the suction nozzle is used as the nozzle mounted on the head has been described, but the present invention is not limited to this. FIG. 5 is an explanatory diagram illustrating an example of a nozzle. FIG. 5 is a diagram illustrating an example of a gripping nozzle (gripper nozzle). A nozzle 201 illustrated in FIG. 5 includes a fixed arm 202 and a movable arm 204. The nozzle 201 is fixed in a state in which the fulcrum 205 of the movable arm 204 is rotatable on the main body of the nozzle 201, and the movable arm 204 has a portion facing the fixed arm 202 with the fulcrum 205 as an axis close to the fixed arm 202. It can move in a direction away from the direction. The movable arm 204 is connected to a drive unit 206 on a side opposite to a portion of the main body of the nozzle 201 and a portion approaching or moving away from the fixed arm 202 via a fulcrum 205. The drive unit 206 is moved by a drive source (air pressure) that drives the gripping nozzle. The movable arm 204 moves in a direction away from the direction in which the portion facing the fixed arm 202 approaches the fixed arm 202 when the driving unit 206 moves.

  The nozzle 201 can grip the electronic component 80 by reducing the distance between the fixed arm 202 and the movable arm 204 in a state where the electronic component 80 is between the fixed arm 202 and the movable arm 204.

  The gripping nozzle is not limited to the nozzle 201 and can have various shapes. The gripping nozzle can have various values for the distance between the fixed arm and the movable arm and the movable range. As described above, the gripping nozzle has different shapes of electronic components that can be gripped for each shape of the nozzle.

  The electronic component mounting apparatus 10 can appropriately hold the electronic component by selecting the type of nozzle that holds the electronic component according to the type of electronic component to be held. Specifically, one electronic component can be mounted by selecting whether to use a suction nozzle or a gripping nozzle according to the electronic component to be held, and switching which nozzle to use among each type of nozzle. More kinds of electronic components can be mounted on the device.

  Next, the operation of each part of the electronic component mounting apparatus 10 will be described. Note that the operation of each part of the electronic component mounting apparatus 10 described below can be executed by controlling the operation of each part based on the control device 20.

  FIG. 6 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. The overall processing operation of the electronic component mounting apparatus 10 will be described with reference to FIG. Note that the processing shown in FIG. 6 is executed by the control device 20 controlling each unit. The electronic component mounting apparatus 10 reads a production program as step S52. The production program is created by a dedicated production program creation device, or created by the control device 20 based on various input data.

  After reading the production program in step S52, the electronic component mounting apparatus 10 detects the state of the apparatus in step S54. Specifically, the configuration of the component supply units 14f and 14r, the type of electronic component being filled, the type of nozzle prepared, and the like are detected. The electronic component mounting apparatus 10 detects the state of the apparatus in step S54, and when preparation is completed, the board 8 is carried in as step S56. The electronic component mounting apparatus 10 carries in a board | substrate at step S56, and if a board | substrate is arrange | positioned in the position which mounts an electronic component, it will mount an electronic component on a board | substrate as step S58. The electronic component mounting apparatus 10 will carry out a board | substrate as step S60, if mounting of an electronic component is completed by step S58. When the electronic component mounting apparatus 10 carries out the board in step S60, it is determined in step S62 whether production is finished. If the electronic component mounting apparatus 10 determines that the production is not finished in step S62 (No in step S62), the electronic component mounting apparatus 10 proceeds to step S56 and executes the processing from step S56 to step S60. That is, processing for mounting electronic components on the board is executed based on the production program. If the electronic component mounting apparatus 10 determines that the production is finished in step S62 (Yes in step S62), the electronic component mounting apparatus 10 finishes this process.

  The electronic component mounting apparatus 10 can manufacture a board on which the electronic component is mounted by reading the production program and performing various settings as described above, and then mounting the electronic component on the board. In addition, the electronic component mounting apparatus 10 mounts a lead-type electronic component having a main body and leads connected to the main body on the substrate as an electronic component, specifically, a hole (insertion hole) formed on the substrate. ) Can be mounted on the substrate.

  FIG. 7 is a flowchart showing an example of the operation of the electronic component mounting apparatus. Note that the processing operation shown in FIG. 7 is an operation from the loading of the substrate 8 to the completion of the mounting of the electronic component 80 on the substrate 8. Further, the processing operation shown in FIG. 7 is executed by the control unit 60 controlling the operation of each unit.

  The control part 60 carries in the board | substrate 8 as step S102. Specifically, the control unit 60 transports the substrate 8 to be mounted with the electronic component to a predetermined position by the substrate transport unit 12. If the board | substrate 8 is carried in by step S102, the control part 60 will carry out holding movement as step S104. Here, the holding movement (suction movement) is a processing operation for moving the head main body 30 to a position where the nozzle 32 faces the electronic component 80 in the holding area of the component supply unit 14.

  After performing the holding movement in step S104, the control unit 60 lowers the nozzle 32 as step S106. That is, the control unit 60 moves the nozzle 32 downward to a position where the electronic component 80 can be held (sucked and gripped). After lowering the nozzle 32 in step S106, the controller 60 holds the electronic component 80 with the nozzle 32 as step S108, and raises the nozzle 32 as step S110. When the control unit 60 raises the nozzle to a predetermined position in step S110, specifically, moves the electronic component 80 to the measurement position of the laser recognition device 38, the electronic component sucked by the nozzle 32 is step S112. 80 shapes are detected. When the shape of the electronic component 80 is detected in step S112, the control unit 60 raises the nozzle 32 in step S114. As described above, the control unit 60 detects the component shape in step S112, and when it is determined that the held electronic component 80 cannot be mounted, the electronic component 80 is discarded and the electronic component 80 is adsorbed again. When the control unit 60 raises the nozzle to a predetermined position, in step S116, the controller 60 moves the electronic component 80 sucked by the nozzle 32 to a position facing the mounting position (mounting position) of the substrate 8. In step S118, the nozzle 32 is lowered. In step S120, component mounting (component mounting), that is, a processing operation for releasing the electronic component 80 from the nozzle 32 is performed. In step S122, the nozzle 32 is raised. That is, the control unit 60 performs the mounting process described above in the processing operation from step S112 to step S120.

  When the nozzle is raised in step S122, the control unit 60 determines in step S124 whether the mounting of all the components is complete, that is, whether the mounting process of the electronic component 80 scheduled to be mounted on the board 8 is completed. If the control unit 60 determines in step S124 that the mounting of all components has not been completed (No in step S124), that is, the electronic component 80 to be mounted remains, the control unit 60 proceeds to step S104 and proceeds to the next electronic component. A processing operation for mounting 80 on the substrate 8 is executed. In this way, the control unit 60 repeats the above processing operation until the mounting of all components (all electronic components) on the substrate 8 is completed. If the control unit 60 determines in step S124 that the mounting of all components has been completed (Yes in step S124), the control unit 60 ends this process.

  Next, the process shown in FIG. 8 is a process before mounting the electronic component 80, specifically, a measurement process of the shape of the electronic component 80 and a determination process based on the measurement result. Note that the control unit 60 executes the processing of FIG. 8 for all the electronic components 80 that hold the processing. The control unit 60 acquires data of the electronic component 80 to be held as step S150. Here, the data of the electronic component 80 to be held (sucking target, gripping target) is various pieces of information necessary for mounting the electronic component 80 on the substrate 8. The data of the electronic component 80 to be held includes the position of the electronic component supply device 90 where the electronic component 80 is held, the shape data of the electronic component 80, the suction height (holding height) of the electronic component 80, and the electronic component 80. Is information of a measurement position measured by the laser recognition device 38.

  After acquiring data in step S150, the control unit 60 determines a measurement position in step S152. That is, the control unit 60 determines the position for detecting the shape of the electronic component 80 based on the data acquired in step S150, that is, the position of the electronic component 80 in the Z-axis direction. Note that the control unit 60 may perform the processing of step S150 and step S152 before the electronic component 80 is sucked.

  When the measurement position is determined in step S152 and the electronic component 80 is sucked by the nozzle 32, the control unit 60 adjusts the Z-axis position of the electronic component 80 in step S154. That is, the control unit 60 moves the measurement position determined in step S152 of the electronic component 80 to the measurement region of the laser recognition device 38 by moving the nozzle 32 in the Z-axis direction. After adjusting the Z-axis position of the electronic component 80 in step S154, the control unit 60 measures the shape of the electronic component 80 in step S156. That is, the control unit 60 detects the shape of the electronic component 80 at the measurement position using the laser recognition device 38.

  When detecting the shape of the electronic component 80 at the measurement position in step S156, the control unit 60 determines whether the measurement is completed in step S158. That is, the control unit 60 determines whether or not the measurement of the shape at the measurement position determined in step S152 is completed. If it is determined in step S158 that the measurement is not completed (No in step S158), the control unit 60 proceeds to step S154, performs the processes in steps S154 and S156 again, and determines the shape of the measurement position where the measurement has not ended. measure. The controller 60 detects the shape of the set measurement position by repeating the adjustment of the position of the electronic component 80 and the measurement of the shape in this way.

  When it is determined in step S158 that the measurement is finished (Yes in step S158), the control unit 60 compares the measurement result with the reference data in step S160. Here, the reference data is data on the shape of the electronic component 80 to be attracted (held) acquired in step S150. The control unit 60 compares the measurement result with the reference data to determine whether the sucked electronic component 80 has a shape that matches the reference data, whether the direction of the electronic component 80 matches the direction of the reference data, etc. Determine.

  After performing the comparison in step S160, the control unit 60 determines whether the component is appropriate in step S162. Specifically, the control unit 60 determines whether or not the electronic component 80 is attracted in a state where it can be mounted in step S162. When it is determined in step S162 that the component is not appropriate (No in step S162), the control unit 60 discards the electronic component 80 attracted by the nozzle 32 in step S164, and ends this process. The control unit 60 moves the head 15 and the nozzle 32 to a position facing the component storage unit 19 and throws the electronic component 80 held by the nozzle 32 into the component storage unit 19, thereby discarding the electronic component 80. To do. The control unit 60 executes again the process of mounting the same type of electronic component 80 on the same mounting position (mounting position) of the substrate 8.

  When it is determined in step S162 that the component is appropriate (Yes in step S162), the control unit 60 determines whether the component direction (direction in the rotation direction of the nozzle) is appropriate in step S166. That is, it is determined whether the sucked electronic component 80 is the same as the reference direction. In addition, the control part 60 of this embodiment determines whether the electronic component 80 is reversed as step S166. If the controller 60 determines that the direction is not appropriate in step S166 (No in step S166), that is, the electronic component 80 is in an inverted state, the controller 60 inverts the electronic component 80 in step S168 and then proceeds to step S170. .

  When it is determined Yes in step S166 or when the process of step S168 is executed, the control unit 60 finely adjusts the mounting position (mounting position) of the electronic component 80 based on the holding position as step S170. For example, based on the detection result of the shape of the electronic component 80, the position where the nozzle 32 sucks the electronic component 80 is detected, and based on the deviation of the holding position from the reference position, the nozzle 32 and the substrate 8 at the time of mounting are detected. Adjust the relative position. The control unit 60 ends the process after executing the process of step S170. In addition, after performing the process of step S170 of FIG. 8, the control unit 60 mounts the determined electronic component 80 on the substrate 8 taking into account the result of step S170.

  The electronic component mounting apparatus 10 detects the shape of the electronic component 80 using the laser recognition device 38 as described above, and performs various processing based on the result, thereby mounting the electronic component 80 appropriately on the substrate 8. Can do.

  The electronic component mounting apparatus 10 discards the electronic component 80 in step S164 of the flowchart shown in FIG. 8, but when it is determined that the lead shape of the electronic component 80 is inappropriate, the electronic component mounting apparatus 10 executes a process of correcting the lead shape. It may be. That is, in step S164, the electronic component 80 may be corrected (processed) into a shape that allows insertion of the lead of the electronic component 80 without being discarded, and may be mounted at the mounting position (mounting position). Even if the electronic component mounting apparatus 10 corrects the lead of the electronic component 80 by a mechanism that clamps the electronic component 80 of the cut unit of the electronic component supply apparatus 90, the electronic component mounting apparatus 10 corrects the lead of the electronic component 80 by a separately provided correction mechanism. You may make it do. As processing means for processing the shape of the lead in this way, various means such as a mechanism for clamping the main body 82 or the lead 84 of the electronic component 80 or a separately provided correction mechanism can be used.

  Next, an example of a processing operation when the electronic component 80 is mounted will be described with reference to FIG. FIG. 9 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. The electronic component mounting apparatus 10 executes the process of FIG. 9 every time the electronic component 80 is held by the nozzle 32 of the head 15. The process of FIG. 9 is basically a process when both the lead type electronic component and the mounted type electronic component are mounted on the substrate 8 as the electronic component 80. The electronic component mounting apparatus 10 specifies the electronic component 80 to be held in step S180, and determines whether the component to be held is a lead type electronic component in step S182.

  If the electronic component mounting apparatus 10 determines in step S182 that the electronic component mounting apparatus 10 is a lead type electronic component (Yes in step S182), the electronic component mounting apparatus 10 holds the lead type electronic component of the electronic component supply apparatus 90 with the nozzle 32 in step S184. That is, the electronic component mounting apparatus 10 holds the lead type electronic component supplied to the holding position (second holding position) of the electronic component supply apparatus 90 with the nozzle 32. When the electronic component mounting apparatus 10 holds the lead type electronic component with the nozzle 32 in step S184, the lead of the lead type electronic component is inserted into the insertion hole and mounted on the substrate 8 in step S186.

  If the electronic component mounting apparatus 10 determines in step S182 that the electronic component mounting apparatus 10 is not a lead type electronic component (No in step S182), the electronic component mounting apparatus 10 holds the mounted electronic component of the electronic component supply apparatus 90a with the nozzle 32 in step S187. That is, the electronic component mounting apparatus 10 holds the mounted electronic component supplied to the holding position (first holding position) of the electronic component supply apparatus 90a by the nozzle 32. When the electronic component mounting apparatus 10 holds the mountable electronic component with the nozzle 32 in step S187, the mountable electronic component is mounted on the substrate 8 in step S188. That is, the electronic component mounting apparatus 10 mounts the mountable electronic component on the substrate 8 without inserting it into the insertion hole.

  When the electronic component mounting apparatus 10 executes the process of step S186 or step S188, that is, when the electronic component is mounted, the electronic component mounting apparatus 10 determines in step S189 whether mounting of all the electronic components is completed. If the electronic component mounting apparatus 10 determines that the mounting is not completed in step S189 (No in step S189), the electronic component mounting apparatus 10 proceeds to step S180, specifies the electronic component to be mounted next, and applies the specified electronic component to the specified electronic component. The above process is executed. If the electronic component mounting apparatus 10 determines that the mounting is completed in step S189 (Yes in step S189), the electronic component mounting apparatus 10 ends the process.

  As shown in FIG. 9, the electronic component mounting apparatus 10 can mount the mounted electronic component and the lead electronic component on the substrate 8 with one head. Furthermore, the electronic component mounting apparatus 10 can mount both the mounting type electronic component and the lead type electronic component with the same nozzle 32. Here, the electronic component mounting apparatus 10 can be transported and mounted by the same nozzle 32 as the mounted electronic component by holding (sucking or gripping) the main body of the lead type electronic component. In addition, the electronic component mounting apparatus 10 performs mounting with the same head or the same nozzle by determining whether the electronic component mounting device or the lead electronic component is inserted and switching between inserting and not inserting the lead into the insertion hole in accordance with each. Even in this case, it can be mounted on the substrate 8 under conditions suitable for each electronic component. Thereby, it is possible to mount the mounting type electronic component and the lead type electronic component without replacing the nozzle 32. Further, the mounting type electronic component and the lead type electronic component can be mixed and mounted without being separated, so that the mounting order is less restricted and the mounting efficiency can be further improved.

  Next, the electronic component supply apparatus 90 will be described with reference to FIGS. FIG. 10 is a plan view illustrating an example of an electronic component supply apparatus. FIG. 11 is a side view of the electronic component supply apparatus shown in FIG. FIG. 12 is a partial cross-sectional view showing a schematic configuration of the electronic component supply apparatus. FIG. 13 is a schematic diagram illustrating an example of a stick case and an electronic component of the electronic component supply apparatus.

  The electronic component supply device 90 is a vibration type stick feeder, and includes a base 401, a stick chute 402, two accommodation means 404 (404L, 404R), two support means 406 (406L, 406R), and a locking means. 408 (408L, 408R), vibration means (vibrating body) 418, vibration control means (vibrating body controller) 419, and two component detection sensors (detection means) 421 (421L, 421R). In the electronic component supply apparatus 90, the housing unit 404L, the support unit 406L, the locking unit 408L, and the component detection sensor 421L form one unit, and the housing unit 404R, the support unit 406R, and the locking unit. 408R and the component detection sensor 421R form one unit. The electronic component supply device 90 supplies the electronic component 80 from each of the two units. That is, the electronic component supply device 90 is provided with holding positions 450 (450L, 450R) for supplying the electronic component 80 to the nozzle 32 in each of the two units, and can supply the electronic component 80 at two locations. Since the two units have the same configuration except for the arrangement position, when describing the function of each part, the description will be made as the accommodation means 404, the support means 406, the locking means 408, the component detection sensor 421, and the holding position 450. To do. In addition, the electronic component supply device 90 sandwiches a bunker and clamps the electronic component supply device 90 with respect to the bunker, a counter weight for appropriately vibrating the target portion, and stabilizing the weight balance, etc. It has.

  The base 401 is a base that supports each unit included in the electronic component supply apparatus 90 directly or via another member. Specifically, the vibration means 418 is placed on the base 401, and the vibration control means 419 is also fixed.

  The stick chute 402 is supported by vibration means 418 fixed to the base 401. The stick chute 402 is a plate-like member, and each part of the two units is installed on the upper surface.

  The accommodating means 404 is supported on the stick chute 402. The accommodating means 404 is a so-called stick case having a hollow inside and having both ends in the longitudinal direction opened. The accommodation means 404 has an opening 426 at the end on the support means 406 side. Specifically, the end of the accommodating unit 404L on the support unit 406L side becomes an opening 426L, and the end of the accommodating unit 404R on the support unit 406R side becomes an opening 426R. The storage means 404 has a plurality of electronic components 80 arranged in a row in the longitudinal direction in a space inside the cylindrical shape. Further, the accommodating means 404 is formed with irregularities along the shape of the electronic component 80 disposed therein on the lower surface in the vertical direction, and the irregularities extend in the longitudinal direction. The electronic component 80 accommodated in the accommodating means 404 of this embodiment is a lead-type electronic component in which a lead 84 is connected to a main body 82. The accommodating means 404 has a convex position facing the main body 82 and a concave area where the lead 84 is disposed. The accommodating means 404 is a rail whose concave and convex shape formed in the longitudinal direction guides the electronic component 80. The storage means 404 moves the electronic component 80 in the longitudinal direction while basically maintaining the orientation by moving the electronic component 80 along the unevenness.

  Here, the housing means 404 is detachable from the stick chute 402, is attached to the stick chute 402 with the electronic component 80 held therein, and supplies the internal electronic component 80 to the holding position 450. It can be removed and another accommodating means 404 can be attached. In the state where the electronic device 80 is held inside, the housing unit 404 inserts a stopper 451a into the opening opposite to the opening 426 and inserts the stopper 451b into the opening 426, as shown in FIG. The electronic component 80 held inside can be prevented from coming out of the accommodating means 404. Thereby, the accommodating means 404 can suppress that the electronic component 80 comes out from the inside before mounting on the stick chute 402 at the time of conveyance or the like. The stopper 451a has a shape without a pawl, and the stopper 451b has a shape with a pawl. Further, the internal electronic component 80 is held in a state facing the same direction. In the electronic component 80, a so-called anode mark is provided on the main body 82, and the orientation of the product can be identified by the anode mark. The user can recognize the direction of the storage unit 404 when being mounted, can be mounted in a predetermined direction, and can supply the electronic component 80 in the same direction to the holding position 450. The accommodating means 404 is attached to the stick chute 402, and at least the stopper 451b that supplies the electronic component 80 to the holding position 450 is removed.

  The support unit 406 is disposed at a position adjacent to the opening 426 of the storage unit 404, specifically, at a holding position 450. The support means 406 has a concavo-convex shape similar to that of the support means 406 at a portion facing the vertical lower surface of the electronic component 80, and the vertical upper surface is open. The support unit 406 holds the electronic component 80 that has been transported from the opening 426 of the housing unit 404 and moved to the holding position 450. The support means 406 has a length in the longitudinal direction of the accommodating means 404 longer than one length of the electronic component 80. In addition, the holding position 450 is longer in the longitudinal direction of the accommodating means 404 than the length of one electronic component 80.

  The locking means 408 is disposed at a position adjacent to the end of the support means 406 opposite to the opening 426 side in the longitudinal direction of the storage means 404. The locking unit 408 is a member that regulates the movement position of the electronic component 80 in the longitudinal direction of the storage unit 404. The locking means 408 comes into contact with the electronic component 80 moved to the holding position 450 along the support means 406 and cannot move further in the direction opposite to the opening 426 from that position.

  The vibration means 418 is disposed between the base 401 and the stick chute 402 as described above. The vibration means 418 vibrates the stick chute 402 with respect to the base 401. That is, in the vibration means 418, the stator is fixed to the base 401, the vibrator is fixed to the stick chute 402, and the vibrator is vibrated with respect to the stator. As shown in FIG. 12, the vibration means 418 of the present embodiment includes two individual vibration means 418D and 418U. That is, the vibration means 418 supports the stick chute 402 at two places by the individual vibration means 418D and 418U, and vibrates the stick chute 402 at the two places. The vibration means 418 performs vibration using a motor as a drive source.

  A stick chute 402 extending in the electronic component transport direction is provided above the two vibration means 418U and 418D. The stick chute 402 holds an electronic component sent out from a tip portion of a storage unit 404 described later at a holding position. The vibration control means 419 controls the operation of the vibration means 418. The vibration control unit 419 is connected to the control device 20 and the component supply control unit 64, and controls a signal, power, and the like supplied to the vibration unit 418 based on the control of the control device 20 and the component supply control unit 64. . The vibration means 418 of this embodiment is a linear vibration actuator, and the vibration control means 419 is a linear controller that controls the linear vibration actuator.

  The component detection sensor 421 detects whether or not the electronic component 80 is present at the holding position 450 of the support unit 406. The component detection sensor 421 sends the detection result to the component supply control unit 64. As the component detection sensor 421, various sensors that detect whether or not the electronic component 80 is present at the holding position 450 that is the measurement target position can be used, and for example, a reflective photomicrosensor can be used.

  Here, the electronic component supply apparatus 90 of the present embodiment further includes a suction unit. The suction means has a vacuum hole 430 and an air ejector (suction pump) 470. The vacuum hole 430 and the air ejector 470 are connected by piping. The vacuum hole 430 is opened on the end surface of the locking means 408 on the support means 406 side. In the electronic component supply device 90, a vacuum hole 430R is formed on the end surface of the locking unit 408R on the support unit 406R side, and a vacuum hole 430L is formed on the end surface of the locking unit 408L on the support unit 406L side. Specifically, the vacuum hole 430 is formed at a position facing the main body 82 of the electronic component 80 moved to the support means 406.

  The air ejector 470 is a suction pump and is connected to the vacuum hole 430 through a pipe. As the air ejector 470, a vacuum pump that performs vacuum suction can be used. The suction means drives the air ejector 470 and sucks air from the vacuum hole 430, thereby supporting the electronic component 80 in the holding position 450 at a predetermined position of the locking means 408. The suction force of the suction means is weaker than the suction force by the nozzles 32 of the head 15.

  The electronic component supply device 90 vibrates the accommodating means 404 supported by the stick chute 402 by vibrating the stick chute 402 by the vibration means 418. The electronic component supply device 90 vibrates the housing unit 404, so that the electronic component 80 held inside the housing unit 404 is moved to the holding position 450 side (hereinafter also referred to as the front) along the longitudinal direction of the housing unit 404. Move. Specifically, the electronic component mounting apparatus 90 pushes the electronic component 80 at a position close to the holding position 450 adjacent to the electronic component 80 at a position farther from the holding position 450 toward the holding position 450, thereby accommodating the storage unit 404. The plurality of electronic components 80 arranged in a row are sequentially moved to the holding position 450 side. In the electronic component supply device 90, when there is no electronic component on the support unit 406, the electronic component 80 closest to the locking unit 408 among the electronic components 80 stored in the storage unit 404 passes through the opening 426. Thus, the support means 406 is moved to the holding position 450.

  The electronic component supply device 90 supports the electronic component 80 in the holding position 450 at a predetermined position of the locking unit 408 by sucking air from the vacuum hole 430 by the suction unit as described above.

  The electronic component 80 moved to the holding position 450 is mounted on the substrate 8 by being held by the nozzle 32 of the head 15. Further, in the electronic component supply device 90, when the electronic component 80 at the holding position 450 is held and moved by the nozzle 32, the electronic component 80 held in the housing unit 404 is moved, and the electronic component 80 adjacent to the electronic component 80 is moved. The component 80 is moved to the holding position 450.

  In addition, when the electronic component supply apparatus 90 according to the present embodiment determines that the electronic component 80 is in the holding position 450 by both the component detection sensors 421 of the two units, the vibration of the stick chute 402 by the vibration unit 418 is performed. Stop.

  The electronic component supply device 90 can support the electronic component 80 at the holding position 450 at a predetermined position by providing suction means and sucking and holding the electronic component 80 at the holding position 450 through the vacuum hole 430. Thereby, the electronic component 80 in the holding position 450 can be stably supported, and the accuracy of the holding operation of the nozzle 32 can be further increased.

  In particular, when the two units are vibrated by one vibration means 418 as in the present embodiment, the electronic component supply device 90 is specifically configured to move the electronic component 80 to both holding positions 450. The stick chute 402 continues to be vibrated by the vibration means 418 until the parts are detected by both the parts detection sensors 421. That is, the electronic component supply device 90 stops the vibration by the vibration means 418 when the electronic component is supplied to both the holding positions 450. For this reason, even if the electronic component 80 is moved to the holding position 450 of one unit, the vibration by the vibration means 418 may be continued. Also in this case, the electronic component supply apparatus 90 according to the present embodiment suppresses the electronic component at the holding position 450 from being moved by the vibration by the vibrating unit 418 by sucking the electronic component 80 by the suction unit. be able to.

  Since the electronic component supply device 90 can hold the electronic component at the holding position 450 at an appropriate position as described above, it is possible to suppress a holding error from occurring in the difference in the holding operation by the nozzle 32. Thereby, an electronic component can be efficiently mounted on the board | substrate 8, and production performance can be made high.

  The suction means of this embodiment can adsorb and support the electronic component 80 at the holding position 450 by providing the vacuum hole 430 in the locking means 408. The position where the vacuum hole 430 is provided is not limited to the surface on the holding position 450 side of the locking means 408. The suction means only needs to suck the electronic component 80 at the holding position 450 and support it at a predetermined position. For example, the vacuum hole 430 may be formed in the support means 406. Further, the number and number of vacuum holes 430 to be formed are not particularly limited.

  Next, operations and processing operations of the electronic component supply apparatus 90 and the electronic component mounting apparatus 10 will be described with reference to FIGS. FIG. 14 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus 10. FIG. 14 shows an example of a work process when the electronic component supply apparatus 90 according to the present embodiment is attached to and detached from the main body of the electronic component mounting apparatus 10.

  First, the electronic component supply device 90 is mounted on the bank as step S202. Next, in step S204, the electronic component supply device 90 connects the I / F cable (interface cable) connected to the electronic component supply device 90 to the main body (connector of the housing) of the electronic component mounting apparatus 10. As a result, the electronic component supply device 90 is mounted on the electronic component mounting apparatus 10. The electronic component supply device 90 may be connected to the I / F cable at the same time when the electronic component supply device 90 is attached to the bank by the clamp unit. If necessary, the interface cable of the bank to which the electronic component supply device 90 is fixed is also connected to the main body (connector of the casing) of the electronic component mounting apparatus.

  The electronic component mounting apparatus 10 starts production of the board 8 when the electronic component supply apparatus 90 is mounted in step S206. When the electronic component supply apparatus 90 is mounted on the electronic component mounting apparatus 10 and production of the substrate 8 is started, an electronic component supply operation is executed as step S208. Next, the electronic component mounting apparatus 10 determines whether production is completed as step S210. If the electronic component mounting apparatus 10 determines in step S210 that the production has not ended (No in step S210), the electronic component mounting apparatus 10 returns to step S208 and continues the electronic component supply operation by the electronic component supply apparatus 90. When the electronic component mounting apparatus 10 determines that the production is finished in Step S210 (Yes in Step S210), the electronic component mounting apparatus 10 stops the electronic component supply operation by the electronic component supply apparatus 90. Thereafter, in step S212, the electronic component mounting apparatus 10 removes the I / F cable of the electronic component supply apparatus 90 connected to the main body of the electronic component mounting apparatus (connector of the housing), and in step S214, supplies the electronic component. Device 90 is removed from the bank.

  Next, the electronic component supply operation of the electronic component supply device 90, specifically, the operation of supplying the electronic component to the holding position will be described. FIG. 15 is a flowchart illustrating an example of the operation of the electronic component supply apparatus. FIG. 15 shows an example of vibration control by the motor. Note that the processing shown in FIG. 15 can be executed by the control device 20 and the component supply control unit 64 described above controlling each unit in an integrated manner.

  When the production of the substrate 8 is started, the electronic component supply device 90 starts an electronic component supply operation. In step S220, the electronic component supply apparatus 90 determines whether to send an electronic component (also referred to as a component), that is, to transport the electronic component to the supply position. If it is determined in step S220 that the electronic component is not sent (No in step S220), the electronic component supply apparatus 90 returns to step S220 and performs the process of step S220 again. If it is determined that the electronic component is to be sent in step S220 (Yes in step S220), the electronic component supply apparatus 90 drives the motor in step S222. Here, the motor is a motor that is a drive source of the vibration means 418. That is, the electronic component supply device 90 executes a process of driving the vibration unit 418 by driving the motor to vibrate the stick chute 402 and moving the electronic component 80 housed in the housing unit 404.

  After driving the motor, the electronic component supply apparatus 90 determines whether the electronic component (component) has arrived at the holding position 450 in step S224. When the electronic component mounting apparatus 10 and the electronic component supply apparatus 90 of the present embodiment detect that the electronic component 80 is present at the holding position 450 by both the component detection sensors 421 of the two units, the electronic component (component) arrives. It is determined that

  If it is determined in step S224 that no electronic component has arrived (No in step S224), that is, if no electronic component is detected by at least one component detection sensor 421, the electronic component supply apparatus 90 proceeds to step S224. Return and perform the determination again. The electronic component supply device 90 continues to convey the electronic component while driving the motor until it is determined that the electronic component has arrived. When it is determined that the electronic component has arrived at step S224 (Yes at step S224), the electronic component supply device 90 stops the motor as step S226, that is, stops the vibration of the stick chute 402, and the electronic component as step S228. It is determined whether (component) is sucked, that is, whether the electronic component at the holding position is sucked by the nozzle 32 of the head 15. In the present embodiment, suction is used, but the mechanism in which the nozzle 32 holds the electronic component is not particularly limited, and the electronic component may be gripped.

  When the electronic component supply apparatus 90 determines in step S228 that the electronic component is not attracted (No in step S228), that is, when the state where the electronic component is detected by the two component detection sensors 421 is maintained. Returning to step S228, the determination is performed again. If the electronic component supply apparatus 90 determines in step S228 that the electronic component has been attracted (Yes in step S228), that is, if the electronic component is not detected by at least one component detection sensor 421, step S230 is performed. And the motor is driven to resume the electronic component conveying operation. Next, in step S232, the electronic component supply apparatus 90 determines whether the production is finished, that is, it is not necessary to supply the electronic component. If the electronic component supply apparatus 90 determines that the production is not finished in step S232 (No in step S232), the electronic component supply apparatus 90 returns to step S224. In addition, when it is determined that the production is finished in Step S232 (Yes in Step S232), the electronic component supply device 90 finishes this process.

  The electronic component supply device 90 supplies the electronic component to the holding position 450 by controlling the drive source (motor) of the vibration means 418 as described above. The electronic component supply device 90 holds (sucks and holds) the electronic component 80 at the holding position 450 of the unit having the electronic component at the holding position 450 in a state where there is no electronic component at the holding position 450 of some units. You can also.

  Next, the electronic component supply operation of the electronic component supply apparatus and the holding operation of the electronic component 80 of the head 15 will be described with reference to FIG. FIG. 16 is a timing chart showing an example of the operation of the electronic component mounting apparatus. Here, the XY axis in FIG. 16 is the movement of the head 15 in the XY axis direction. The Z axis is the movement of the nozzle 32 of the head in the Z axis direction. In the Z-axis, the rising and lowering are positions in the Z-axis direction, and the tip of the nozzle 32 is in the rising position (position away from the holding position 450) or the lowered position (position where the electronic component at the holding position 450 can be held). It shows whether or not. The component suction ejector indicates ON / OFF of the function of sucking air from the vacuum hole 430 of the suction means. ON is a state where air is sucked from the vacuum hole 430, and OFF is a state where air is not sucked from the vacuum hole 430. The presence / absence of a component indicates whether or not the electronic component 80 is detected by the component detection sensor 421. The component feed vibration indicates ON / OFF of the vibration means 418.

  The electronic component mounting apparatus 10 moves the head 15 in the XY directions while moving the nozzle 32 to the holding position 450 of the electronic component supply apparatus while maintaining the nozzle 32 in the raised position. In this embodiment, since the electronic component is not detected by the component detection sensor 421, the stick chute 402 is vibrated by the vibration means 418, and the electronic component is moved to the feeding position. Further, even when the electronic component is not in the holding position, the suction means is driven to suck air from the vacuum hole 430.

  In this state, if the electronic component feeding operation is continued by the electronic component supply device 90, the electronic component is moved to the holding position 450 at time t1, and the component detection sensor 421 detects the electronic component, and the presence or absence of the component is detected. It switches from nothing to existence.

  Thereafter, when the electronic component mounting apparatus 10 reaches time t2, the position of the head 15 on the XY plane is in the vicinity of the target position, and deceleration of the moving speed is started. Thereafter, the electronic component mounting apparatus 10 stops the vibration means 418 and turns off the component feed vibration at a time t3 when a predetermined time has passed since the determination that the component is present.

  Thereafter, when the electronic component mounting apparatus 10 reaches time t4, the position of the head 15 on the XY plane becomes the target position, and the movement on the XY plane stops. In addition, the electronic component mounting apparatus 10 starts the movement of the nozzle 32 in the Z-axis direction, and executes a process of switching the component suction ejector from ON to OFF. Thereafter, in the electronic component mounting apparatus 10, the component suction ejector is turned off at time t5 when a certain time td has elapsed from time t4. Here, when the component suction ejector is turned off, air is not sucked from the vacuum hole 430. That is, the suction means requires time td from the start of the air suction stop operation until air is no longer sucked. This time td can also be said to be the time taken for the vacuum break.

  Thereafter, when the electronic component mounting apparatus 10 reaches time t6, the position of the nozzle 32 in the Z-axis direction becomes the lowered position. That is, the electronic component mounting apparatus 10 starts the process of switching the component suction ejector from ON to OFF at least time td before the time point when the nozzle 32 reaches the lowered position, and the component suction ejector is turned OFF due to the difference in time t6. To do.

  Thereafter, the electronic component mounting apparatus 10 performs the holding operation of the electronic component by the nozzle 32 between the time t6 and the time t7. When the time t7 is reached, the electronic component mounting apparatus 10 starts to raise the nozzle 32, and the electronic component held together with the nozzle 32 is removed. Move upward in the Z-axis direction.

  In the electronic component mounting apparatus 10, when the electronic component is moved by the nozzle 32 and the electronic component is moved from the holding position, the electronic component is not detected by the component detection sensor 421 between time t8 and time t9, and the presence or absence of the component is detected. It changes from existence to nothing.

  Further, the electronic component mounting apparatus 10 moves the nozzle 32 to the ascending position in the Z-axis direction at time t9, and then moves the head 15 on the XY plane after a certain period of time, that is, moves to the mounting position or another nozzle In 32, movement to a position for holding the electronic component is started, and suction by the suction means is started. Further, the electronic component mounting apparatus 10 starts the vibration by the vibration means 418 at a time t10 after a predetermined time has elapsed from the time t9, and turns on the component feed vibration. Thereafter, the electronic component mounting apparatus 10 is in a state in which air is sucked from the vacuum hole 430 by the suction means at a constant suction force at time t11, that is, the component suction ejector is turned on, and the moving speed of the head 15 is predetermined at time t12. It becomes speed.

  As shown in FIG. 16, the electronic component mounting apparatus 10 and the electronic component supply apparatus 90 suck the air from the vacuum hole 430 by the suction unit and turn on the component suction ejector, whereby the electronic component held in the storage unit 404 is obtained. The component can be suitably transported to the holding position. That is, it can be moved to the holding position side by the air suction force in addition to the vibration force. Thereby, it is possible to suppress the electronic component 80 closest to the holding position in the housing unit 404 from stopping at the midway position, and it is possible to suitably transport the electronic component 80 to the holding position. Further, the electronic component at the holding position can be maintained at the predetermined position of the holding position by keeping the component suction ejector ON even after the electronic component is moved to the holding position.

  Furthermore, the electronic component mounting apparatus 10 and the electronic component suction apparatus 90 according to the present embodiment switch the suction operation by the suction means from driving to stopping before a predetermined time before holding the electronic component by the nozzle 32 and before the time td. Thus, when the electronic component is held by the nozzle 32, the suction means can be in a state where the electronic component is not sucked. That is, the suction can be stopped, and the vacuum state can be broken and no suction force can be generated. Thereby, it is possible to suppress the suction unit from adversely affecting the holding operation by the nozzle 32.

  Further, in the above-described embodiment, the control has been described as the control at the time of production of the substrate 8. However, the electronic component mounting apparatus 10 and the electronic component supply apparatus 90 can perform the electronic component measurement process, the calibration process, and the electronic component production operation. When performing an operation of holding the electronic component supplied from the electronic component supply device by the nozzle 32, such as during teaching, or when setting the condition, the suction unit is controlled similarly, and the operation of the suction unit is also performed. By setting this condition, it is possible to execute the same operation other than during the production operation, and the electronic component supply device can more appropriately supply the electronic component.

  For example, the electronic component mounting apparatus 10 can reproduce the same condition as the operation at the time of production by performing the above-described control also at the time of component measurement. That is, when the head 15 moves in the XY direction, the vacuum suction from the locking means 408 side is started, and the vacuum suction from the locking means 408 side is stopped while the head 15 starts to descend in the Z direction and descends to a predetermined position. Then, after the head 15 rises again to the predetermined height in the Z direction, the vacuum suction from the locking means 408 side is resumed.

  In addition, the same conditions as in production can be reproduced by performing the above control also during holding position teaching. That is, the vacuum suction from the stopper side is started simultaneously with the start of the suction position teaching, and the vacuum suction from the locking means 408 side is stopped at the end of the suction position teaching.

  Further, the electronic component mounting apparatus 10 and the electronic component suction apparatus 90 can drive or stop the suction operation by the suction means under various conditions. An example of the processing operation for stopping the operation of the suction unit of the electronic component supply device will be described with reference to FIGS. 17 and 18. 17 and 18 are flowcharts showing an example of the operation of the electronic component mounting apparatus, respectively.

  As illustrated in FIG. 17, when the electronic component mounting apparatus 10 detects that the pause button of the operation unit has been pressed in step S252, the electronic component mounting apparatus 10 starts a process of moving the head 15 to the standby position in step S254. When the movement of the head 15 to the standby position is completed as step S256, the electronic component mounting apparatus 10 stops the vacuum suction on the stopper (locking means) side, that is, the suction of the air ejector 470 of the suction means as step S258. Stop operation. After that, the electronic component mounting apparatus 10 displays a screen indicating that the display unit 27 is temporarily stopped as step S260.

  As described above, the electronic component mounting apparatus 10 can reduce the energy consumption by stopping the suction operation by the suction means during the temporary stop of the production operation, thereby achieving energy saving and cost saving. Moreover, although FIG. 17 demonstrated as the time of pressing down of a pause button, it is not limited to this. The same effect can be obtained by stopping the suction operation in the same way even when an automatic pause due to part failure or other error occurs, or when production is stopped due to an error or the like.

  Next, as shown in FIG. 18, the electronic component mounting apparatus 10 releases the clamp of the substrate 8 by the substrate transfer unit 12 in step S <b> 272 when the production of the substrate 8 is completed in step S <b> 270. The electronic component mounting apparatus 10 stops the vacuum suction on the stopper side after releasing the clamp in step S274, and carries out the substrate 8 that has been released in step S276. When the production of the substrate 8 is completed and the clamp of the substrate 8 is released, the electronic component mounting apparatus 10 can save energy and cost by stopping the suction by the suction means.

  An example of the processing operation for starting the operation of the suction unit of the electronic component supply device will be described with reference to FIGS. 19 and 20. 19 and 20 are flowcharts showing an example of the operation of the electronic component mounting apparatus, respectively.

  FIG. 19 shows processing executed when starting production of the electronic component mounting apparatus 10 from the state where production of the substrate 8 is stopped, that is, when mounting operation of the electronic component 80 on the substrate 8 is started. When the electronic component mounting apparatus 10 detects that the start button of the operation unit 26 has been pressed in step S302, the electronic component mounting apparatus 10 starts a process of moving the head 15 from the standby position in the XY directions in step S304. Specifically, the head 15 is moved toward the electronic component supply apparatus 90, the substrate 8, or various calibration mechanisms that are necessary for starting production. When the movement of the head 15 is started, the electronic component mounting apparatus 10 starts the vacuum suction from the stopper side of the electronic component supply apparatus 90, that is, starts the suction operation by the suction means in step S306. Thereafter, in step S308, the electronic component mounting apparatus 10 completes the movement of the head 15 in the XY directions.

  Next, the relationship between the supply of the substrate 8 of the electronic component mounting apparatus 10 and the operation of the suction means will be described with reference to FIG. In step S312, the electronic component mounting apparatus 10 moves the substrate 8 to the position at the time of production by the substrate load, that is, the substrate transport unit 12, and completes the clamping of the substrate 8 at the position at the time of production in step S314. Then, the process of moving the head 15 from the standby position in the XY direction is started. When the movement of the head 15 is started, the electronic component mounting apparatus 10 starts vacuum suction from the stopper side of the electronic component supply apparatus 90, that is, starts the suction operation by the suction means, in step S318. Thereafter, in step S320, the electronic component mounting apparatus 10 completes the movement of the head 15 in the XY directions.

  The electronic component mounting apparatus 10 starts the suction operation by the suction means while moving the head 15 in the XY direction at the start of production. As a result, a sufficient time can be secured from the start of suction until the electronic component is held by the nozzle 32 of the head 15, and the electronic component can be suitably held at the holding position by the suction means.

(Other embodiments)
Next, an electronic component supply apparatus according to another embodiment will be described with reference to FIGS. FIG. 21 is a schematic diagram illustrating a schematic configuration of another example of the electronic component supply apparatus. FIG. 22 is an enlarged view of the electronic component supply apparatus shown in FIG. FIG. 23 is a timing chart showing an example of the operation of the electronic component mounting apparatus. FIG. 24 is an explanatory diagram for explaining the function of the electronic component supply apparatus shown in FIG. The electronic component supply apparatus 101 according to another embodiment has the same configuration as the electronic component supply apparatus 90 except for the position and function of the suction unit. Hereinafter, points unique to the electronic component supply apparatus 101 will be described.

  In the electronic component supply apparatus 101, the length in the longitudinal direction (the moving direction of the electronic component) of the housing unit 404 of the support unit 406 is the length of the plurality of electronic components 80, as shown in FIG. 21. The electronic component supply apparatus 101 includes suction means. The suction means has a vacuum hole 431 and an air ejector 470. The vacuum hole 431 is formed on the upper surface of the support unit 406 in the vertical direction. Specifically, the vacuum hole 431 is a surface facing the main body 82 of the electronic component 80 of the support means 406 and a position adjacent to the holding position 450 in the moving direction of the electronic component 80 (when the electronic component is at the holding position). The electronic component adjacent to the electronic component is formed at a position).

  The suction means is the second electronic device from the top when the leading electronic component 80 is in the holding position among the electronic components 80 supported on the support rail by sucking air from the vacuum hole 431 by the air ejector 470. The part 80 is sucked. Note that the position of the vacuum hole 431 takes into account the size and suction force of the target part, for example, based on the position where the part detection sensor 421 detects the presence or absence of the leading part at the holding position (the chain line in FIG. 22). When the leading electronic component is at the holding position 450, no suction force is applied to the leading electronic component from below, and the second electronic component from the leading can be held at the position where the vacuum hole 431 is formed. Set the position by calculation.

  As shown in FIG. 23, when the electronic component mounting apparatus 10 determines that there is an electronic component at the detection position by the component detection sensor 421, that is, there is the electronic component 80 at the head, the component adsorption ejector is turned on, that is, the suction means Aspirate. Further, when the electronic component mounting apparatus 10 determines that there is no electronic component at the detection position by the component detection sensor 421, that is, there is no electronic component 80 at the head, the electronic component mounting ejector is turned off, that is, the air is not sucked by the suction means.

  In the electronic component mounting apparatus according to another embodiment, the position of the second electronic component 80 is determined by sucking the second electronic component 80 from the head by the suction means when the leading electronic component 80 is in the holding position. It can be held in place. Accordingly, it is possible to suppress the leading electronic component 80 from being tilted by being pushed by the second and subsequent electronic components 80 and the subsequent electronic component 80 from being climbed on the leading electronic component 80. That is, as in the electronic component supply apparatus 110 shown in FIG. 24, the electronic component continues to move toward the holding position, and the second and subsequent electronic components come into contact with the electronic component 80 at the holding position and the electronic at the holding position. It is possible to suppress the inclination of the parts. In particular, even when the electronic component is a molded component and a burr is formed around the electronic component main body 82, the leading electronic component 80 is pushed from the succeeding electronic component by the burr, or the subsequent It is possible to prevent the electronic component from being carried on.

  21 and 22, a gap is formed between the first electronic component 80 and the second electronic component 80 from the beginning, but this gap may not be present. In the present embodiment, it is important that the leading electronic component 80 does not receive the pressing force from the succeeding electronic component 80. The detection position of the leading electronic component 80 described above and the position from below are important. If the positional relationship with the vacuum hole 431 for vacuum suction can be satisfied, this gap may or may not exist. Further, the strength of vacuum suction from below the second electronic component from the top is such that the second electronic component advances to the stopper side while the top electronic component 80 is in the holding position and waits for suction by the nozzle 32. It is only necessary to be able to reduce the speed, and it is not necessary to completely stop the progress of the second electronic component.

  Here, in the present embodiment, the length of the support unit 406 in the longitudinal direction of the housing unit 404 (the moving direction of the electronic component) is the length of the plurality of electronic components 80, but is not limited thereto. In the electronic component supply device, the length of the support unit 406 in the longitudinal direction of the housing unit 404 (the moving direction of the electronic component) may be the length of one electronic component 80. In this case, the suction means may be provided with the vacuum hole 431 in the accommodation means 404 (position where the electronic component at the end of the accommodation means 404 on the support means 406 side is present). As described above, the vacuum hole 431 may be provided with the accommodating means 404 as long as the second electronic component 80 from the top can be sucked when the top electronic component 80 is in the holding position.

  Note that the electronic component supply device may include both the suction unit of the electronic component supply device 90 and the suction unit of the electronic component supply device 101. That is, both a mechanism for sucking an electronic component at the holding position and a mechanism for sucking an electronic component adjacent to the electronic component may be provided. Moreover, it is preferable to control both suction operation separately. The electronic component supply apparatus can hold the electronic component at the holding position more suitably by providing both functions.

  8 substrate, 10 electronic component mounting apparatus, 11 housing, 12 substrate transport unit, 14, 14f, 14r component supply unit, 15 head, 16 XY moving mechanism, 17 VCS unit, 18 replacement nozzle holding mechanism, 19 component storage unit, 20 control device, 22 X-axis drive unit, 24 Y-axis drive unit, 26 operation unit, 27 display unit, 30 head body, 31 head support, 32 nozzles, 34 nozzle drive unit, 34a Z-axis motor, 38 laser recognition device , 60 control unit, 62 head control unit, 64 component supply control unit, 80 electronic component, 82 main body (electronic component main body), 84 lead, 90 electronic component supply device, 401 base, 402 stick chute, 404 housing means, 406 support Means, 408 locking means, 418 vibration means (vibrating body), 419 vibration control means, 421 Component detection sensor, 426 opening, 430, 431 Vacuum hole, 470 Air ejector

Claims (10)

A storage means for holding a plurality of electronic components in a row and having an opening formed at an end in an arrangement direction, which is a direction in which the plurality of electronic components are arranged,
A support means that is arranged adjacent to the end of the accommodating means and supports the electronic component that has passed through the opening;
Vibration means for vibrating at least the accommodating means and moving the plurality of electronic components accommodated in the accommodating means toward the end;
Locking means that is arranged on the opposite side of the support means from the housing means side in the arrangement direction, restricts movement of the electronic components to the tip side in the arrangement direction, and holds the electronic components in a holding position. When,
Suction means is formed in at least one of the locking means, the support means, and the storage means, sucks air from the suction port, and sucks the electronic component at a position facing the suction port; An electronic component supply device comprising: Vibration control means for controlling the vibration means;
Detecting means for detecting the presence or absence of the electronic component at the holding position;
The electronic component supply apparatus according to claim 1, wherein the vibration control unit controls stop and operation of the vibration unit according to a detection result of the detection unit. A plurality of units including the accommodating means, the supporting means, and the suction means;
The electronic component supply apparatus according to claim 1, wherein the vibration unit vibrates two units integrally.   4. The electronic component according to claim 1, wherein one of the suction ports is formed in the locking unit and sucks the electronic component in the holding position. 5. Feeding device.   5. The electron according to claim 1, wherein one of the suction ports is formed in the support means and sucks an electronic component at a position adjacent to the holding position. Parts supply device. The electronic component supply device according to any one of claims 1 to 5,
A head having at least one nozzle for holding the electronic component at a predetermined position of the support means, and transporting the electronic component held by the nozzle;
Control means for controlling the vertical and horizontal movements of the nozzle,
The electronic component mounting apparatus, wherein the control means stops or operates the suction means in conjunction with the vertical movement of the nozzle.   The electronic component mounting apparatus according to claim 6, wherein the control unit stops sucking the electronic component at the holding position a predetermined time before the time when the electronic component at the holding position is sucked by the nozzle. A plurality of electronic components are held in a row, and a storage unit having an opening formed at an end in an arrangement direction, which is a direction in which the plurality of electronic components are arranged, and adjacent to the end of the storage unit A support means for supporting the electronic component disposed and passing through the opening, at least a vibration means for vibrating the storage means, and arranged on the opposite side of the support means from the storage means side in the arrangement direction. And an electronic component supply method using an electronic component supply device that includes a locking unit that restricts movement of the electronic component to the distal end side in the arrangement direction and holds the electronic component in a holding position,
A conveying step of oscillating at least the accommodating means with the vibration means, moving the plurality of electronic components accommodated in the accommodating means toward the end, and moving the electronic components to the holding position;
A suction step in which a suction port is formed in at least one of the locking unit, the support unit, and the storage unit, sucks air from the suction port, and sucks the electronic component at a position facing the suction port; An electronic component supply method comprising:   The electronic component supply method according to claim 8, wherein the suction step sucks the electronic component at the holding position.   The electronic component supply method according to claim 8 or 9, wherein the suction step sucks an electronic component at a position adjacent to the holding position.

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