JP2014154580A5 - - Google Patents

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Publication number
JP2014154580A5
JP2014154580A5 JP2013020319A JP2013020319A JP2014154580A5 JP 2014154580 A5 JP2014154580 A5 JP 2014154580A5 JP 2013020319 A JP2013020319 A JP 2013020319A JP 2013020319 A JP2013020319 A JP 2013020319A JP 2014154580 A5 JP2014154580 A5 JP 2014154580A5
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JP
Japan
Prior art keywords
pattern opening
conductor
pattern
virtual line
outer edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013020319A
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English (en)
Japanese (ja)
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JP6097088B2 (ja
JP2014154580A (ja
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Priority to JP2013020319A priority Critical patent/JP6097088B2/ja
Priority claimed from JP2013020319A external-priority patent/JP6097088B2/ja
Publication of JP2014154580A publication Critical patent/JP2014154580A/ja
Publication of JP2014154580A5 publication Critical patent/JP2014154580A5/ja
Application granted granted Critical
Publication of JP6097088B2 publication Critical patent/JP6097088B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013020319A 2013-02-05 2013-02-05 プリント配線板およびプリント配線板用導体シート Active JP6097088B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013020319A JP6097088B2 (ja) 2013-02-05 2013-02-05 プリント配線板およびプリント配線板用導体シート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013020319A JP6097088B2 (ja) 2013-02-05 2013-02-05 プリント配線板およびプリント配線板用導体シート

Publications (3)

Publication Number Publication Date
JP2014154580A JP2014154580A (ja) 2014-08-25
JP2014154580A5 true JP2014154580A5 (cg-RX-API-DMAC7.html) 2016-01-07
JP6097088B2 JP6097088B2 (ja) 2017-03-15

Family

ID=51576191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013020319A Active JP6097088B2 (ja) 2013-02-05 2013-02-05 プリント配線板およびプリント配線板用導体シート

Country Status (1)

Country Link
JP (1) JP6097088B2 (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200135330A (ko) * 2018-03-23 2020-12-02 소니 세미컨덕터 솔루션즈 가부시키가이샤 회로 기판, 반도체 장치, 및, 전자 기기
JP6987700B2 (ja) * 2018-05-29 2022-01-05 京セラ株式会社 印刷配線板
CN113411946B (zh) * 2020-03-16 2022-07-26 浙江宇视科技有限公司 一种印刷电路板以及制作方法
CN111450961B (zh) * 2020-04-23 2021-11-05 中电浩普(江苏)科技有限公司 一种垃圾破碎发电一体化系统
US20230318203A1 (en) * 2020-10-02 2023-10-05 Dai Nippon Printing Co., Ltd. Wiring board and method of manufacturing wiring board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0119414Y2 (cg-RX-API-DMAC7.html) * 1980-07-02 1989-06-05
CN101207968B (zh) * 2006-12-22 2011-11-09 鸿富锦精密工业（深圳）有限公司 电路板
JP2010135692A (ja) * 2008-12-08 2010-06-17 Lintec Corp 転写用配線回路板及び配線回路部材
JP2010226026A (ja) * 2009-03-25 2010-10-07 Sony Corp 多層配線基板
JP2012094646A (ja) * 2010-10-26 2012-05-17 Daisho Denshi Co Ltd 特性インピーダンスコントロール対応プリント配線基板

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