JP2014132654A5 - - Google Patents

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Publication number
JP2014132654A5
JP2014132654A5 JP2013263336A JP2013263336A JP2014132654A5 JP 2014132654 A5 JP2014132654 A5 JP 2014132654A5 JP 2013263336 A JP2013263336 A JP 2013263336A JP 2013263336 A JP2013263336 A JP 2013263336A JP 2014132654 A5 JP2014132654 A5 JP 2014132654A5
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JP
Japan
Prior art keywords
ledge
socket
electrical contacts
array
host
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013263336A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014132654A (ja
JP5855082B2 (ja
Filing date
Publication date
Priority claimed from US13/724,056 external-priority patent/US9106027B2/en
Application filed filed Critical
Publication of JP2014132654A publication Critical patent/JP2014132654A/ja
Publication of JP2014132654A5 publication Critical patent/JP2014132654A5/ja
Application granted granted Critical
Publication of JP5855082B2 publication Critical patent/JP5855082B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013263336A 2012-12-21 2013-12-20 並列光通信モジュールを回路基板にミッドプレーン実装するための方法、装置及びシステム Expired - Fee Related JP5855082B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/724,056 2012-12-21
US13/724,056 US9106027B2 (en) 2012-12-21 2012-12-21 Methods, apparatuses and systems for mid-plane mounting parallel optical communications modules on circuit boards

Publications (3)

Publication Number Publication Date
JP2014132654A JP2014132654A (ja) 2014-07-17
JP2014132654A5 true JP2014132654A5 (enExample) 2015-08-27
JP5855082B2 JP5855082B2 (ja) 2016-02-09

Family

ID=50975117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013263336A Expired - Fee Related JP5855082B2 (ja) 2012-12-21 2013-12-20 並列光通信モジュールを回路基板にミッドプレーン実装するための方法、装置及びシステム

Country Status (3)

Country Link
US (1) US9106027B2 (enExample)
JP (1) JP5855082B2 (enExample)
TW (1) TWI530236B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2774465A4 (en) * 2011-10-31 2015-09-09 Thomson Licensing SHIELDING STRUCTURE FOR AN ELECTRONIC DEVICE
WO2017111951A1 (en) 2015-12-22 2017-06-29 Hewlett Packard Enterprise Development Lp Socket connector
US10705303B2 (en) 2016-02-26 2020-07-07 Hewlett Packard Enterprise Development Lp Optical connector assembly connectorized for non-permanent attachment to an optoelectronic substrate assembly
US10200187B2 (en) * 2016-03-23 2019-02-05 Avago Technologies International Sales Pte. Limited Methods and systems for dissipating heat in optical communications modules
US10678006B2 (en) * 2016-09-30 2020-06-09 Hewlett Packard Enterprise Development Lp Optical interfaces with solder that passively aligns optical socket
US10795091B2 (en) 2017-07-14 2020-10-06 Hewlett Packard Enterprise Development Lp Adaptor for optical component of optical connector
US11443998B2 (en) * 2019-06-05 2022-09-13 Te Connectivity Solutions Gmbh Electronic assembly including optical modules
DE102020100856A1 (de) * 2020-01-15 2021-07-15 Erni Production Gmbh & Co. Kg Direktstecksystem für die Verbindung eines Steckverbinders mit einer Leiterplatte
US11275222B2 (en) 2020-04-30 2022-03-15 Hewlett Packard Enterprise Development Lp Solder-aligned optical socket with interposer reference and methods of assembly thereof

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5184211A (en) * 1988-03-01 1993-02-02 Digital Equipment Corporation Apparatus for packaging and cooling integrated circuit chips
US5268814A (en) * 1992-05-20 1993-12-07 International Business Machines Corporation Module packaging
WO1996016440A1 (en) 1994-11-15 1996-05-30 Formfactor, Inc. Interconnection elements for microelectronic components
US6231370B1 (en) * 1998-03-19 2001-05-15 The Whitaker Corporation Electrical connector for leaded electronic component
US6205026B1 (en) * 2000-01-31 2001-03-20 Intel Corporation Heat sink retention components and system
US6551134B1 (en) * 2001-06-11 2003-04-22 Picolight Incorporated Mounted transceivers
US6435882B1 (en) * 2001-07-27 2002-08-20 Agilent Technologies, Inc. Socketable flexible circuit based electronic device module and a socket for the same
TW562261U (en) 2002-11-08 2003-11-11 Hon Hai Prec Ind Co Ltd Electrical connector assembly
DE112004003069B4 (de) * 2003-04-30 2017-01-19 Fujikura Ltd. Optisches Verbindungsstück
JP4001900B2 (ja) * 2003-04-30 2007-10-31 株式会社フジクラ 光コネクタアッセンブリ
JP4515215B2 (ja) * 2004-10-07 2010-07-28 モレックス インコーポレイテド ソケット
US7331796B2 (en) 2005-09-08 2008-02-19 International Business Machines Corporation Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
TWM298800U (en) * 2006-04-18 2006-10-01 Molex Taiwan Ltd Socket connector
CN201117933Y (zh) 2007-08-21 2008-09-17 富士康(昆山)电脑接插件有限公司 电连接器
CN101999198B (zh) * 2008-04-14 2013-07-24 古河电气工业株式会社 光模块安装单元以及光模块
TWM360483U (en) * 2008-09-30 2009-07-01 Hon Hai Prec Ind Co Ltd Electrical connector
WO2010038110A1 (en) 2008-09-30 2010-04-08 Fci Lead frame assembly for an electrical connector
TWM358427U (en) * 2008-10-28 2009-06-01 Hon Hai Prec Ind Co Ltd Electrical connector
JP5016692B2 (ja) * 2010-02-10 2012-09-05 日本航空電子工業株式会社 ソケットコネクタ
US8047856B2 (en) * 2010-02-24 2011-11-01 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Array connector for optical transceiver module
US8414309B2 (en) * 2010-05-03 2013-04-09 Avago Technologies Fiber Ip (Singapore) Pte. Ltd Receptacle for an optical transceiver module for protecting the module from airborne particles
US8188381B2 (en) * 2010-05-06 2012-05-29 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Mid-board module retention and EMI cage

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