TWI530236B - 用以在電路板上中平面安置平行光通信模組之方法、裝置及系統 - Google Patents

用以在電路板上中平面安置平行光通信模組之方法、裝置及系統 Download PDF

Info

Publication number
TWI530236B
TWI530236B TW102142867A TW102142867A TWI530236B TW I530236 B TWI530236 B TW I530236B TW 102142867 A TW102142867 A TW 102142867A TW 102142867 A TW102142867 A TW 102142867A TW I530236 B TWI530236 B TW I530236B
Authority
TW
Taiwan
Prior art keywords
socket
array
host
electrical contacts
lugs
Prior art date
Application number
TW102142867A
Other languages
English (en)
Chinese (zh)
Other versions
TW201436668A (zh
Inventor
陳星權
柴譚雅 亞克
徐輝
Original Assignee
安華高科技通用Ｉｐ（新加坡）公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 安華高科技通用Ｉｐ（新加坡）公司 filed Critical 安華高科技通用Ｉｐ（新加坡）公司
Publication of TW201436668A publication Critical patent/TW201436668A/zh
Application granted granted Critical
Publication of TWI530236B publication Critical patent/TWI530236B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/7017—Snap means
    • H01R12/7029—Snap means not integral with the coupling device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Optical Couplings Of Light Guides (AREA)
  • Light Receiving Elements (AREA)
  • Optical Communication System (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
TW102142867A 2012-12-21 2013-11-25 用以在電路板上中平面安置平行光通信模組之方法、裝置及系統 TWI530236B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/724,056 US9106027B2 (en) 2012-12-21 2012-12-21 Methods, apparatuses and systems for mid-plane mounting parallel optical communications modules on circuit boards

Publications (2)

Publication Number Publication Date
TW201436668A TW201436668A (zh) 2014-09-16
TWI530236B true TWI530236B (zh) 2016-04-11

Family

ID=50975117

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102142867A TWI530236B (zh) 2012-12-21 2013-11-25 用以在電路板上中平面安置平行光通信模組之方法、裝置及系統

Country Status (3)

Country Link
US (1) US9106027B2 (enExample)
JP (1) JP5855082B2 (enExample)
TW (1) TWI530236B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2774465A4 (en) * 2011-10-31 2015-09-09 Thomson Licensing SHIELDING STRUCTURE FOR AN ELECTRONIC DEVICE
WO2017111951A1 (en) 2015-12-22 2017-06-29 Hewlett Packard Enterprise Development Lp Socket connector
US10705303B2 (en) 2016-02-26 2020-07-07 Hewlett Packard Enterprise Development Lp Optical connector assembly connectorized for non-permanent attachment to an optoelectronic substrate assembly
US10200187B2 (en) * 2016-03-23 2019-02-05 Avago Technologies International Sales Pte. Limited Methods and systems for dissipating heat in optical communications modules
US10678006B2 (en) * 2016-09-30 2020-06-09 Hewlett Packard Enterprise Development Lp Optical interfaces with solder that passively aligns optical socket
US10795091B2 (en) 2017-07-14 2020-10-06 Hewlett Packard Enterprise Development Lp Adaptor for optical component of optical connector
US11443998B2 (en) * 2019-06-05 2022-09-13 Te Connectivity Solutions Gmbh Electronic assembly including optical modules
DE102020100856A1 (de) * 2020-01-15 2021-07-15 Erni Production Gmbh & Co. Kg Direktstecksystem für die Verbindung eines Steckverbinders mit einer Leiterplatte
US11275222B2 (en) 2020-04-30 2022-03-15 Hewlett Packard Enterprise Development Lp Solder-aligned optical socket with interposer reference and methods of assembly thereof

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5184211A (en) * 1988-03-01 1993-02-02 Digital Equipment Corporation Apparatus for packaging and cooling integrated circuit chips
US5268814A (en) * 1992-05-20 1993-12-07 International Business Machines Corporation Module packaging
WO1996016440A1 (en) 1994-11-15 1996-05-30 Formfactor, Inc. Interconnection elements for microelectronic components
US6231370B1 (en) * 1998-03-19 2001-05-15 The Whitaker Corporation Electrical connector for leaded electronic component
US6205026B1 (en) * 2000-01-31 2001-03-20 Intel Corporation Heat sink retention components and system
US6551134B1 (en) * 2001-06-11 2003-04-22 Picolight Incorporated Mounted transceivers
US6435882B1 (en) * 2001-07-27 2002-08-20 Agilent Technologies, Inc. Socketable flexible circuit based electronic device module and a socket for the same
TW562261U (en) 2002-11-08 2003-11-11 Hon Hai Prec Ind Co Ltd Electrical connector assembly
DE112004003069B4 (de) * 2003-04-30 2017-01-19 Fujikura Ltd. Optisches Verbindungsstück
JP4001900B2 (ja) * 2003-04-30 2007-10-31 株式会社フジクラ 光コネクタアッセンブリ
JP4515215B2 (ja) * 2004-10-07 2010-07-28 モレックス インコーポレイテド ソケット
US7331796B2 (en) 2005-09-08 2008-02-19 International Business Machines Corporation Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
TWM298800U (en) * 2006-04-18 2006-10-01 Molex Taiwan Ltd Socket connector
CN201117933Y (zh) 2007-08-21 2008-09-17 富士康(昆山)电脑接插件有限公司 电连接器
CN101999198B (zh) * 2008-04-14 2013-07-24 古河电气工业株式会社 光模块安装单元以及光模块
TWM360483U (en) * 2008-09-30 2009-07-01 Hon Hai Prec Ind Co Ltd Electrical connector
WO2010038110A1 (en) 2008-09-30 2010-04-08 Fci Lead frame assembly for an electrical connector
TWM358427U (en) * 2008-10-28 2009-06-01 Hon Hai Prec Ind Co Ltd Electrical connector
JP5016692B2 (ja) * 2010-02-10 2012-09-05 日本航空電子工業株式会社 ソケットコネクタ
US8047856B2 (en) * 2010-02-24 2011-11-01 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Array connector for optical transceiver module
US8414309B2 (en) * 2010-05-03 2013-04-09 Avago Technologies Fiber Ip (Singapore) Pte. Ltd Receptacle for an optical transceiver module for protecting the module from airborne particles
US8188381B2 (en) * 2010-05-06 2012-05-29 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Mid-board module retention and EMI cage

Also Published As

Publication number Publication date
JP2014132654A (ja) 2014-07-17
US20140179129A1 (en) 2014-06-26
US9106027B2 (en) 2015-08-11
TW201436668A (zh) 2014-09-16
JP5855082B2 (ja) 2016-02-09

Similar Documents

Publication Publication Date Title
TWI530236B (zh) 用以在電路板上中平面安置平行光通信模組之方法、裝置及系統
US20240069294A1 (en) Optical transceiver with versatile positioning
TWI891636B (zh) 使用直接配對纜線總成之通訊系統
US8047856B2 (en) Array connector for optical transceiver module
KR101904022B1 (ko) 커넥터
CN104638425B (zh) 光电连接器
US6565384B2 (en) Electro-optical connector with flexible circuit
US9810866B2 (en) Cable-equipped connector
JP5269613B2 (ja) 光電変換接続装置
US8936402B2 (en) Method and apparatus for mounting and positioning parallel optical transceiver modules in a mid-plane mounting configuration with improved mounting density and alignment accuracy
EP3745176B1 (en) Optical connector
JP2017208284A (ja) 光学電子部品とソケットの接続構造
KR102583336B1 (ko) 커넥터 어셈블리
US20060089015A1 (en) Socket connector having multi-piece housing
CN113853060B (zh) 一种光笼子组件及光通信设备
US7266305B2 (en) Optical Communication module, manufacturing method thereof, and electronic apparatus
KR102768587B1 (ko) 커넥터
JP6264921B2 (ja) 光電変換ユニットおよび光電変換ユニットの製造方法
US20040076380A1 (en) Optical connector
KR100874144B1 (ko) 커넥터
JP2014096266A (ja) 光電気複合コネクタ装置
JP2014006335A (ja) 光トランシーバ、光トランシーバ付き基板、光通信機器、及び、光トランシーバの製造方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees