JP2014118634A5 - - Google Patents

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Publication number
JP2014118634A5
JP2014118634A5 JP2013257021A JP2013257021A JP2014118634A5 JP 2014118634 A5 JP2014118634 A5 JP 2014118634A5 JP 2013257021 A JP2013257021 A JP 2013257021A JP 2013257021 A JP2013257021 A JP 2013257021A JP 2014118634 A5 JP2014118634 A5 JP 2014118634A5
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JP
Japan
Prior art keywords
substrate
electroplating
ion
electrolyte
electroplating apparatus
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JP2013257021A
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English (en)
Japanese (ja)
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JP6494910B2 (ja
JP2014118634A (ja
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Priority claimed from US13/893,242 external-priority patent/US9624592B2/en
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JP2013257021A 2012-12-12 2013-12-12 電気メッキ中の効率的な物質輸送のための電解質流体力学の強化 Active JP6494910B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201261736499P 2012-12-12 2012-12-12
US61/736,499 2012-12-12
US13/893,242 2013-05-13
US13/893,242 US9624592B2 (en) 2010-07-02 2013-05-13 Cross flow manifold for electroplating apparatus

Publications (3)

Publication Number Publication Date
JP2014118634A JP2014118634A (ja) 2014-06-30
JP2014118634A5 true JP2014118634A5 (es) 2019-02-07
JP6494910B2 JP6494910B2 (ja) 2019-04-03

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JP2013257021A Active JP6494910B2 (ja) 2012-12-12 2013-12-12 電気メッキ中の効率的な物質輸送のための電解質流体力学の強化

Country Status (4)

Country Link
JP (1) JP6494910B2 (es)
KR (1) KR102214898B1 (es)
CN (2) CN106947997B (es)
TW (2) TWI606154B (es)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
US10094034B2 (en) * 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
TWI550139B (zh) 2011-04-04 2016-09-21 諾菲勒斯系統公司 用於裁整均勻輪廓之電鍍裝置
KR102146910B1 (ko) * 2013-08-01 2020-08-24 대우조선해양 주식회사 컨테이너선의 워터 브레이커 형상 최적화 장치 및 그 방법
US9567685B2 (en) * 2015-01-22 2017-02-14 Lam Research Corporation Apparatus and method for dynamic control of plated uniformity with the use of remote electric current
US9988733B2 (en) * 2015-06-09 2018-06-05 Lam Research Corporation Apparatus and method for modulating azimuthal uniformity in electroplating
JP2017216443A (ja) * 2016-05-20 2017-12-07 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 再配線層における均一性を実現するためのシステム及び方法
US10364505B2 (en) * 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en) * 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
US10094035B1 (en) * 2017-10-16 2018-10-09 Lam Research Corporation Convection optimization for mixed feature electroplating
US10655240B2 (en) * 2018-05-01 2020-05-19 Lam Research Corporation Removing bubbles from plating cells
CN113056575B (zh) * 2018-11-19 2024-10-11 朗姆研究公司 用于防止在高对流电镀槽中起泡的横流导管
KR102388661B1 (ko) * 2020-11-16 2022-04-20 가부시키가이샤 에바라 세이사꾸쇼 플레이트, 도금 장치 및 플레이트의 제조 방법
CN116856022B (zh) * 2023-07-05 2024-02-20 诺博环保科技(中山)有限公司 一种电镀用合金添加剂及其制备方法
JP7569963B1 (ja) 2024-03-07 2024-10-18 株式会社荏原製作所 めっき装置、及びめっき方法

Family Cites Families (17)

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Publication number Priority date Publication date Assignee Title
JP2000087299A (ja) * 1998-09-08 2000-03-28 Ebara Corp 基板メッキ装置
US6132587A (en) * 1998-10-19 2000-10-17 Jorne; Jacob Uniform electroplating of wafers
JP3331332B2 (ja) * 1999-08-25 2002-10-07 日本エレクトロプレイテイング・エンジニヤース株式会社 カップ式めっき装置
KR100804714B1 (ko) * 2000-03-17 2008-02-18 가부시키가이샤 에바라 세이사꾸쇼 도금장치 및 방법
US8475636B2 (en) * 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US8308931B2 (en) * 2006-08-16 2012-11-13 Novellus Systems, Inc. Method and apparatus for electroplating
US6869515B2 (en) * 2001-03-30 2005-03-22 Uri Cohen Enhanced electrochemical deposition (ECD) filling of high aspect ratio openings
JP4043234B2 (ja) * 2001-06-18 2008-02-06 株式会社荏原製作所 電解加工装置及び基板処理装置
US7854828B2 (en) * 2006-08-16 2010-12-21 Novellus Systems, Inc. Method and apparatus for electroplating including remotely positioned second cathode
US7128823B2 (en) * 2002-07-24 2006-10-31 Applied Materials, Inc. Anolyte for copper plating
JP2004068158A (ja) * 2002-08-08 2004-03-04 Texas Instruments Inc Ｅｃｄ反応器内の電流密度改善および機構充填制御方法並びに装置
JP2004250785A (ja) * 2003-01-31 2004-09-09 Ebara Corp 電解処理装置及び基板処理装置
CN101056718A (zh) * 2004-11-19 2007-10-17 诺发系统有限公司 工件表面电化学加工期间清除残存空气的方法
CN101220500A (zh) * 2007-08-29 2008-07-16 中国电子科技集团公司第二研究所 晶圆凸点制造挂具
US8795480B2 (en) * 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
TWI550139B (zh) * 2011-04-04 2016-09-21 諾菲勒斯系統公司 用於裁整均勻輪廓之電鍍裝置
CN102719865B (zh) * 2012-07-13 2016-02-24 曲悦峰 一种镀膜模具

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