JP2014098611A - Magnetic sensor device and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a magnetic sensor device capable of electrically connecting a terminal of an element substrate to a terminal of a flexible wiring board at a comparatively low cost with high reliability, and a method for manufacturing the magnetic sensor device.SOLUTION: When electrically connecting second terminals 31 of a flexible wiring board 30 to a plurality of first terminals 16 including a magnetoresistive film 13 extending from a magnetoresistive element 14 in the element substrate 10 of a magnetic sensor device, solder layers 33 are formed on the surfaces of the second terminals 31, and then a composition 8 for solder joint having a plurality of solder particles 81 having a melting point lower than that of the solder layer 33 and dispersed in a thermosetting resin material 80 is interposed between the element substrate 10 and the flexible wiring boards 30 and is heated while being pressurized in this state.

Description

  The present invention relates to a magnetic sensor device in which a flexible wiring board is connected to an element substrate on which a magnetoresistive element is formed, and a method for manufacturing the same.

  When conducting a plurality of terminals formed on the rigid substrate and a plurality of terminals formed on the flexible wiring substrate, or a plurality of terminals formed on the first flexible wiring substrate and a plurality of terminals formed on the second flexible wiring substrate When conducting electrical connection with the terminal, gold, copper, or the like is formed on the surface of the terminal, and a paste-like solder bonding composition in which solder particles are dispersed in the resin material is interposed between the substrates and heated under pressure. A joining method may be employed.

  When the terminal of the flexible wiring board is made to conduct to the terminal provided with the magnetoresistive film extending from the magnetoresistive element as in the magnetic sensor device, if the surface of the terminal is made of gold or copper, the magnetic sensor Conventionally, it is difficult to apply the above technique because the cost of the apparatus is excessively increased.

  On the other hand, in the manufacturing process of a magnetic sensor device, a method using an anisotropic conductive sheet has been proposed when a flexible wiring board is connected to one side of an element substrate on which a magnetoresistive element is formed (see Patent Document 1). ).

JP 7-159197 A

  However, even in the technique described in Patent Document 1, since the anisotropic conductive sheet is expensive and a gold layer needs to be formed on the surface of the terminal, there is a problem that the cost is too high for the magnetic sensor device. is there.

  In view of the above problems, an object of the present invention is to provide a magnetic sensor device capable of electrically connecting a terminal of an element substrate and a terminal of a flexible wiring substrate at a relatively low cost, and a manufacturing method thereof. There is to do.

  In order to solve the above-described problems, the present invention provides an element substrate in which a plurality of first terminals each including a magnetoresistive film extending from a magnetoresistive element are arranged in a connection region, and conductive to each of the plurality of first terminals And a flexible wiring board having a plurality of second terminals, wherein a solder layer is formed on a surface of the second terminal, and in the connection region, the element substrate and the flexible wiring board And a solder bonding composition in which a plurality of solder particles having a melting point lower than that of the solder layer are dispersed in a resin material, the element substrate and the flexible wiring board are bonded by the resin material, Among the plurality of solder particles, the first terminal and the second terminal are electrically connected by the solder particles melted in the overlapping region of the first terminal and the second terminal, and the first terminal and the second terminal Solder particles present in the non-overlapping region of the terminal is characterized in that it is dispersed in the resin material.

  Further, the present invention provides a connection region in which a plurality of first terminals provided with a magnetoresistive film extending from the magnetoresistive element on the element substrate are arranged, and each of the plurality of second terminals formed on the flexible wiring board is In the method of manufacturing a magnetic sensor device having a joining step for conducting with a plurality of first terminals, a solder layer is formed on the surface of the second terminal, and in the joining step, the connection region and the flexible wiring board A first step of disposing a paste-like solder bonding composition in which a plurality of solder particles having a melting point lower than that of the solder layer are dispersed in a resin material; and the flexible wiring substrate and the element substrate in the connection region And a second step of heating the solder bonding composition at a temperature higher than the melting point of the solder particles and lower than the melting point of the solder layer while pressurizing the solder particles. .

  In the present invention, the element substrate and the flexible wiring board can be bonded by the resin material of the solder bonding composition, and the first terminal and the second terminal are formed by the solder particles melted in the overlapping region between the first terminal and the second terminal. Therefore, the manufacturing cost can be reduced as compared with the case where an anisotropic conductive film is used.

  In the present invention, the surface of the first terminal is preferably made of the magnetoresistive film. According to such a configuration, the cost can be reduced because the gold layer or the like is not formed on the surface of the first terminal.

  In the present invention, the resin material is preferably made of a thermosetting resin. According to such a configuration, the element substrate and the flexible wiring substrate can be securely bonded, and the moisture resistance performance at the junction between the terminals can be improved.

  In this invention, it is preferable that the said composition for solder joining goes around from the said connection area | region to the side surface of the said element substrate, and has adhere | attached the said side surface and the said flexible wiring board. According to this configuration, the flexible wiring board can be firmly connected to the element substrate.

  In the present invention, the solder particles preferably contain tin and a metal selected from copper, silver, bismuth, antimony and indium, and have a melting point of 200 ° C. or lower. According to this configuration, bonding can be performed at a relatively low temperature.

  In this invention, when performing the said 2nd process, a buffer member is arrange | positioned on the opposite side to the said element substrate with respect to the said flexible wiring board, and the said flexible wiring board is faced to the said element substrate via the said buffer member. It is preferable to apply pressure. According to such a configuration, the second terminal of the flexible wiring board can be appropriately pressed against the first terminal of the element substrate.

  In this invention, it is preferable that the said resin material consists of thermosetting resins, and performs the 3rd process of heating the said connection area | region at the temperature lower than melting | fusing point of the said solder particle after a said 2nd process. According to this structure, the uncured component of the resin material can be reliably cured.

  In the present invention, the element substrate and the flexible wiring board can be bonded by the resin material of the solder bonding composition, and the first terminal and the second terminal are formed by the solder particles melted in the overlapping region between the first terminal and the second terminal. Therefore, the manufacturing cost can be reduced as compared with the case where an anisotropic conductive film is used.

It is explanatory drawing which shows the whole structure of the magnetic sensor apparatus to which this invention is applied. It is explanatory drawing of the element substrate module of the magnetic sensor apparatus to which this invention is applied. It is process sectional drawing which shows the joining process which joins an element substrate and a flexible wiring board among the manufacturing processes of the magnetic sensor apparatus to which this invention is applied.

  A magnetic sensor device and a manufacturing method to which the present invention is applied will be described with reference to the drawings.

(Overall configuration of magnetic sensor device 1)
FIG. 1 is an explanatory diagram showing an overall configuration of a magnetic sensor device 1 to which the present invention is applied. FIGS. 1A, 1B, and 1C are explanatory diagrams of an encoder using the magnetic sensor device 1. FIG. 3 is a perspective view of the magnetic sensor device 1 as viewed from the sensor surface 2 side, and a perspective view of the magnetic sensor device 1 as viewed from the sensor surface 2 side with the shield member 9 removed.

  As shown in FIG. 1, when the magnetic sensor device 1 according to this embodiment is used for a magnetic linear encoder, the bottom surface (sensor surface 2) of the magnetic sensor device 1 provided on a fixing member (not shown) is used. The magnetic scale 1a fixed to a movable member (not shown) is opposed. On the magnetic scale 1a, for example, N poles and S poles are alternately arranged along the longitudinal direction (moving direction). Therefore, if the output signal from the magnetic sensor device 1 when the movable member moves in the longitudinal direction of the magnetic scale 1a together with the magnetic scale 1a is detected, the position and moving speed of the movable member can be detected. The magnetic sensor device 1 includes a housing 6 made of a substantially rectangular parallelepiped aluminum die-cast product, a rectangular plate-like cover 90 that covers an opening of the housing 6, and a cable 7 that extends from the housing 6. The cover 90 is fixed to the housing 6 with screws 91. In the housing 6, a bottom surface 60 facing the magnetic scale 1 a is formed with a substrate placement portion 62 that is recessed on the side opposite to the sensor surface 2, and an element substrate 10 to be described later is placed on the substrate placement portion 62. Has been.

  On the bottom surface 60 of the housing 6, a shield member fixing portion 66 made of a groove opened on the sensor surface 2 side is formed around the substrate placement portion 62, and the shield member fixing portion 66 allows the element substrate 10 to be formed. On the other hand, a plate-like shield member 9 is fixed on the sensor surface 2 side. More specifically, the shield member 9 includes a rectangular end plate portion 9a that covers the substrate placement portion 62 and the element substrate 10 on the sensor surface 2 side, and an outer edge of the end plate portion 9a on the side opposite to the sensor surface 2 side. 4 side plate portions (not shown) which are bent and fitted into the shield member fixing portion 66 are provided, and the side plate portions are fixed inside the shield member fixing portion 66 by an adhesive or the like. Note that the inside of the housing 6 is filled with a resin material (not shown) in the substrate placement portion 62, and between the housing 6 and the element substrate 10 or between the housing 6 and the shield member 9. Is filled with resin material. In this embodiment, the resin material is soft, and an epoxy resin can be used as the resin material.

(Configuration of element substrate 10 etc.)
2 is an explanatory view of the element substrate module 3 of the magnetic sensor device 1 to which the present invention is applied. FIGS. 2A, 2B, 2C, and 2D are side views of the element substrate module 3. FIG. The bottom view of the element substrate module 3 as viewed from the sensor surface 2 side (shield member 9 side), the explanatory view schematically showing the cross-sectional configuration of the connection portion between the element substrate 10 and the flexible wiring board 30, and the element substrate 10 and the flexible 3 is an explanatory diagram schematically showing a cross-sectional configuration of a connection portion with a wiring board 30 in an enlarged manner. FIG.

  As shown in FIGS. 1 and 2, the magnetoresistive element 14 is formed with the magnetoresistive film 13 on the main surface 11 (one surface) facing the sensor surface 2 side of the magnetic sensor device 1 in the element substrate 10. A region 15 and a connection region 17 in which a plurality of first terminals 16 are arranged along the substrate edge are formed. In this embodiment, the connection region 17 is formed only at one end of the element substrate 10. The magnetosensitive region 15 is formed in an inner region separated from the side surface 19 of the element substrate 10 by a predetermined dimension, and is located at a position separated from the connection region 17 by a predetermined dimension. The substrate body of the element substrate 10 is a glass substrate or a silicon substrate.

  In the magnetosensitive region 15, an A-phase magnetoresistive element 14a, a B-phase magnetoresistive element 14b, and a Z-phase magnetoresistive element 14z are formed as the magnetoresistive element 14. The one terminal 16 is electrically connected by a wiring portion 18. The magnetoresistive element 14 is constituted by a magnetoresistive film 13. The magnetoresistive film 13 is made of a magnetic film such as a ferromagnetic NiFe formed on the main surface 11 of the element substrate 10 by a semiconductor process, and constitutes a Wheatstone bridge or the like. The magnetoresistive film 13 may be a magnetic film containing Co.

  In the present embodiment, the wiring portion 18 and the first terminal 16 are configured by the magnetoresistive film 13, similarly to the magnetoresistive element 14. That is, the wiring portion 18 and the first terminal 16 are formed by the magnetoresistive film 13 extending from the magnetosensitive region 15, and at least the uppermost layer of the wiring portion 18 and the first terminal 16 is made of the magnetoresistive film 13. . In this embodiment, the entire wiring portion 18 and the first terminal 16 are made of the magnetoresistive film 13. Note that an insulating film made of a silicon oxide film or the like is formed on the main surface 11 of the element substrate 10 in a region where the magnetosensitive region 15 and the wiring portion 18 are formed. Such an insulating film is not formed in the connection region 17, and the surface of the first terminal 16 is exposed.

  An end 34 of the flexible wiring board 30 is connected to the connection region 17 of the element substrate 10, and the element substrate 10 and the flexible wiring board 30 serve as the element substrate module 3 of the housing 6 described with reference to FIG. 1. Retained inside.

  As shown in FIG. 2, the flexible wiring board 30 has a configuration in which a conductive pattern 32 made of a copper layer or the like is formed on one surface of a base film 35 made of polyimide or the like. The plurality of second terminals 31 that are respectively connected to the plurality of first terminals 16 of the element substrate 10 are formed at the end portion 34 of the flexible wiring board 30. In the flexible wiring board 30, the surface side of the conductive pattern 32 is covered with an insulating film. However, the insulating film is not formed on the surface of the second terminal 31, and the surface of the second terminal 31 is exposed from the insulating film.

(Conduction structure between the first terminal 16 and the second terminal 31)
As shown in FIG. 2D, in the magnetic sensor device 1 of the present embodiment, when the plurality of first terminals 16 of the element substrate 10 and the plurality of second terminals 31 of the flexible wiring substrate 30 are electrically connected, In the second terminal 31, a solder layer 33 is formed on the surface of a conductive pattern 32 made of a copper layer formed on the flexible wiring board 30.

  In the connection region 17, a solder bonding composition 8 in which a plurality of solder particles 81 having a melting point lower than that of the solder layer 33 is dispersed in the resin material 80 is interposed between the element substrate 10 and the flexible wiring substrate 30. The element substrate 10 and the flexible wiring substrate 30 are bonded by the resin material 80. Further, among the plurality of solder particles 81, the first terminal 16 and the second terminal 31 are electrically connected by the solder particles 812 melted in the overlapping region between the first terminal 16 and the second terminal 31. Here, in the overlapping region between the first terminal 16 and the second terminal 31, three to four solder particles 812 are melted and aggregated.

  In addition, among the plurality of solder particles 81, the solder particles 811 existing outside the overlapping region of the first terminal 16 and the second terminal 31 are between the adjacent first terminals 16 or between the adjacent second terminals 31. Or the like in the resin material 80. Here, the particle size of the solder particles 81 is smaller than the interval between the first terminals 16 and the interval between the second terminals 31. For example, the interval between the first terminals 16 and the interval between the second terminals 31 is about 100 μm, whereas the particle size of the solder particles 81 is about 1 to 12 μm. For this reason, the solder particles 81 dispersed in the resin material 80 between the adjacent first terminals 16 or between the adjacent second terminals 31 or the like are adjacent to each other between the adjacent first terminals 16 or the adjacent second terminals. The terminals 31 are not short-circuited.

  In the present embodiment, an epoxy-based thermosetting resin is used as the resin material 80. The solder particles 81 contain tin and any one of copper, silver, bismuth, antimony and indium, and are made of a low melting point solder material having a melting point of 200 ° C. or less. For example, the solder particles 81 are made of a tin-bismuth solder material and have a melting point of about 140 ° C. On the other hand, the solder layer 33 is made of a solder material having a melting point higher than that of the solder particles 81, and the melting point is a temperature exceeding 200 ° C. For example, the solder layer 33 is made of a tin-copper solder material and has a melting point of about 230 ° C. The solder layer 33 may be a tin-silver-copper or tin-bismuth solder material in addition to a tin-copper solder material.

  Here, as shown in FIG. 2A, the solder bonding composition 8 has a portion 88 that extends from the connection region 17 to the side surface 19 of the element substrate 10. And the flexible wiring board 30 are bonded.

(Manufacturing method of the magnetic sensor device 1)
FIG. 3 is a process cross-sectional view illustrating a joining process for joining the element substrate 10 and the flexible wiring board 30 in the manufacturing process of the magnetic sensor device 1 to which the present invention is applied.

  In manufacturing the magnetic sensor device 1 of the present embodiment, a bonding process for bonding the element substrate 10 and the flexible wiring substrate 30 is performed. When performing such a joining process, the solder layer 33 described with reference to FIG. 2D is formed on the second terminal 31 of the flexible wiring board 30.

  In the joining step, first, in the first step shown in FIGS. 3A and 3B, between the connection region 17 and the end portion 34 of the flexible wiring board 30, the solder joining described with reference to FIG. Composition 8 is placed. At this time, the solder bonding composition 8 is uncured and is in a paste form. In this embodiment, as shown in FIG. 3A, after disposing the paste-like uncured solder bonding composition 8 in the connection region 17 of the element substrate 10 by a method such as application by a dispenser or mask printing, As shown in FIG. 3B, the end portions 34 of the flexible wiring board 30 are overlapped. At that time, the first terminal 16 of the element substrate 10 and the second terminal 31 of the flexible wiring substrate 30 are overlapped.

Next, in the second step shown in FIG. 3C, solder bonding is performed at a temperature higher than the melting point of the solder particles 81 and lower than the melting point of the solder layer 33 while pressing the flexible wiring substrate 30 and the element substrate 10 in the connection region 17. The composition 8 for heating is heated. In this embodiment, the element substrate 10 is placed on the stage 4, and the flexible wiring substrate 30 is pressurized and heated by the heater chip 5 toward the element substrate 10. In this embodiment, the heater chip 5, to apply a load of ^{5g / mm 2 ~20g / mm 2} . In this embodiment, the solder bonding composition 8 is heated to about 200 ° C. by the heater chip 5. Further, in this embodiment, in the solder bonding composition 8, the resin material 80 shown in FIG. 2D is blended as a thermosetting resin-containing flux.

  Further, in this embodiment, when performing the second step, the buffer member 50 is disposed on the side opposite to the element substrate 10 side with respect to the flexible wiring substrate 30, that is, between the flexible wiring substrate 30 and the heater chip 5. The flexible wiring board 30 is pressurized toward the element substrate 10 via the buffer member 50. In this embodiment, as the buffer member 50, a sheet having high thermal conductivity such as an aluminum sheet or a sheet obtained by bonding a fluororesin sheet to the aluminum sheet is used. The thickness of the buffer member 50 is 20 μm to 100 μm. The thickness of the buffer member 50 is preferably 1 to 2 times the thickness of the base film 35 of the flexible wiring board 30. For example, when the thickness of the base film 35 of the flexible wiring board 30 is 25 μm, the thickness of the buffer member 50 is preferably 25 μm to 50 μm.

  As a result of the second step, as described with reference to FIG. 2D, the resin material 80 is cured between the element substrate 10 and the flexible wiring substrate 30, and the element substrate 10 and the flexible wiring substrate 30. Glue. At that time, the resin material 80 spreads between the element substrate 10 and the flexible wiring substrate 30, and the resin material 80 completely fills between the connection region 17 of the element substrate 10 and the end portion 34 of the flexible wiring substrate 30. Further, as described with reference to FIG. 2A, a part of the solder bonding composition 8 wraps around from the connection region 17 to the side surface 19 of the element substrate 10, and the portion 88 includes the side surface 19 and the flexible wiring. The substrate 30 is bonded. Further, among the plurality of solder particles 81, the solder particles 812 located in the overlapping region between the first terminal 16 and the second terminal 31 are melted and aggregated between the first terminal 16 and the second terminal 31. The first terminal 16 and the second terminal 31 are electrically connected via the solder particles 812. Further, among the plurality of solder particles 81, the solder particles 811 existing outside the overlapping region of the first terminal 16 and the second terminal 31 are between the adjacent first terminals 16 or between the adjacent second terminals 31. The first terminals 16 adjacent to each other and the second terminals 31 adjacent to each other are not short-circuited.

  In this embodiment, from the viewpoint of completely curing the uncured component of the resin material 80, the connection region 17 is heated at a temperature lower than the melting point of the solder particles 81, for example, a temperature of 120 ° C. to 140 ° C. after the second step. A third step (after cure step) is performed.

(Main effects of this form)
As described above, in this embodiment, the connection region 17 of the element substrate 10 and the flexible wiring are formed using the solder bonding composition 8 in which a plurality of solder particles 81 having a melting point lower than that of the solder layer 33 are dispersed in the resin material 80. The end portion 34 of the substrate 30 is joined. Therefore, the resin material 80 of the solder bonding composition 8 can bond the connection region of the element substrate 10 and the end portion 34 of the flexible wiring substrate 30, and also the first terminal 16 of the element substrate 10 and the flexible wiring. The first terminals 16 and the second terminals 31 can be made conductive by the solder particles 81 (solder particles 811) melted in the overlapping region of the substrate 30 with the second terminals 31. Therefore, the manufacturing cost can be reduced as compared with the case where an anisotropic conductive film is used.

  Further, in the second terminal 31, since the solder layer 33 is formed on the surface of the conductive pattern 32 made of the copper layer formed on the flexible wiring board 30, there are problems such as surface oxidation of the conductive pattern 32 made of the copper layer. Does not occur. Therefore, a stable electrical connection can be made.

  In addition, since the connection region 17 is sealed with the resin material 80, the moisture resistance can be improved. Furthermore, since the short-circuiting between adjacent terminals can be prevented by the particle size and blending amount of the solder particles 81, it is possible to sufficiently cope with a short distance between terminals. Further, the solder layer 33 may be formed on the surface of the second terminal 31, and it is not necessary to form a gold layer, so that the manufacturing cost can be reduced also in this respect. Furthermore, since the melting point of the solder particles 81 in the solder bonding composition 8 is lower than the melting point of the solder layer 33 on the surface of the second terminal 31, it is possible to prevent the solder layer 33 on the surface of the second terminal 31 from being eroded. can do. Furthermore, even when the solder bonding composition 8 contains a flux, the flux is sealed in the resin material 80, so that flux cleaning can be omitted.

  Further, since the surface of the first terminal 16 may remain the magnetoresistive film 13, the cost can be reduced because it is not necessary to form a gold layer or the like on the surface of the first terminal 16.

  Moreover, since the resin material 80 consists of thermosetting resin, while being able to adhere | attach the element substrate 10 and the flexible wiring board 30 reliably, the moisture resistance performance of the junction part of terminals can be improved. Moreover, in this embodiment, after the second step, the third step (after-cure step) of heating the connection region 17 at a temperature lower than the melting point of the solder particles 81 is performed, so that the uncured component of the resin material 80 is surely cured. Can be made. Therefore, the flexible wiring board 30 can be firmly connected to the element substrate 10 and the generation of uncured components as outer gas can be suppressed.

  Further, the solder bonding composition 8 goes from the connection region 17 to the side surface 19 of the element substrate 10 to bond the side surface 19 and the flexible wiring substrate 30. For this reason, the flexible wiring board 30 can be firmly connected to the element substrate 10.

  Furthermore, when performing the second step, a buffer member 50 is disposed on the opposite side of the element substrate 10 to the flexible wiring board 30, and the flexible wiring board 30 is applied toward the element substrate 10 via the buffer member 50. Press. For this reason, the second terminal 31 of the flexible wiring board 30 can be appropriately pressed against the first terminal 16 of the element substrate 10.

(Other embodiments)
In the embodiment described above, the magnetic sensor device 1 in which the flexible wiring board 30 is connected to one end of the element substrate 10 is illustrated. However, the magnetic sensor in which the flexible wiring board 30 is connected to both ends of the element substrate 10. The present invention may be applied to a sensor device.

  In the above-described embodiment, the magnetic sensor device 1 used for the magnetic linear encoder is illustrated. However, in the magnetic rotary encoder, the magnetic sensor is disposed so as to face the magnetic scale disposed on the outer peripheral surface or end surface of the rotating drum (movable member). The present invention may be applied to a magnetic sensor device.

DESCRIPTION OF SYMBOLS 1 Magnetic sensor apparatus 3 Element substrate module 8 Solder bonding composition 10 Element substrate 11 Main surface 13 Magnetoresistive film 14 Magnetoresistive element 15 Magnetosensitive region 16 First terminal 17 Connection region 30 Flexible wiring substrate 31 Second terminal 33 Solder layer 50 Buffer member 80 Resin material 81 Solder particles

Claims (9)

An element substrate having a plurality of first terminals provided with a magnetoresistive film extending from the magnetoresistive element and arranged in a connection region, and a flexible wiring substrate having a plurality of second terminals electrically connected to each of the plurality of first terminals In a magnetic sensor device having:
A solder layer is formed on the surface of the second terminal,
In the connection region, a solder bonding composition in which a plurality of solder particles having a melting point lower than that of the solder layer is dispersed in a resin material is interposed between the element substrate and the flexible wiring substrate.
The element substrate and the flexible wiring board are bonded by the resin material,
Among the plurality of solder particles, the first terminal and the second terminal are electrically connected to each other by solder particles melted in an overlapping region between the first terminal and the second terminal, and the first terminal and the second terminal. Solder particles that exist outside the overlapping region are dispersed in the resin material.   The magnetic sensor device according to claim 1, wherein the surface of the first terminal is made of the magnetoresistive film.   The magnetic sensor device according to claim 1, wherein the resin material is made of a thermosetting resin.   4. The solder bonding composition according to claim 1, wherein the solder bonding composition wraps around from the connection region to a side surface of the element substrate and bonds the side surface to the flexible wiring substrate. The magnetic sensor device described.   5. The solder particle according to claim 1, wherein the solder particles contain tin and a metal selected from copper, silver, bismuth, antimony, and indium, and have a melting point of 200 ° C. or less. The magnetic sensor device according to one item. A plurality of second terminals formed on the flexible wiring board are respectively connected to the plurality of first terminals in a connection region in which a plurality of first terminals having a magnetoresistive film extending from the magnetoresistive element is arranged on the element substrate. In the method of manufacturing a magnetic sensor device having a joining step for conducting,
Forming a solder layer on the surface of the second terminal;
In the joining step,
A first step of disposing a paste-like solder bonding composition in which a plurality of solder particles having a melting point lower than that of the solder layer are dispersed in a resin material between the connection region and the flexible wiring board;
A second step of heating the solder bonding composition at a temperature higher than the melting point of the solder particles and lower than the melting point of the solder layer while pressurizing the flexible wiring board and the element substrate in the connection region;
The manufacturing method of the magnetic sensor apparatus characterized by performing.   The method of manufacturing a magnetic sensor device according to claim 6, wherein a surface of the first terminal is made of the magnetoresistive film.   When performing the second step, a buffer member is disposed on the opposite side of the element substrate with respect to the flexible wiring substrate, and the flexible wiring substrate is pressurized toward the element substrate via the buffer member. 8. A method of manufacturing a magnetic sensor device according to claim 6 or 7, wherein: The resin material is made of a thermosetting resin,
The magnetic sensor device according to any one of claims 6 to 8, wherein after the second step, a third step of heating the connection region at a temperature lower than the melting point of the solder particles is performed. Method.

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