JP2012023263A - Bonding method of electronic component - Google Patents

Bonding method of electronic component Download PDF

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JP2012023263A
JP2012023263A JP2010161355A JP2010161355A JP2012023263A JP 2012023263 A JP2012023263 A JP 2012023263A JP 2010161355 A JP2010161355 A JP 2010161355A JP 2010161355 A JP2010161355 A JP 2010161355A JP 2012023263 A JP2012023263 A JP 2012023263A
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electronic component
resin adhesive
resin
circuit board
substrate
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JP2010161355A
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JP5370300B2 (en
Inventor
Koji Motomura
耕治 本村
Hiroki Maruo
弘樹 圓尾
Hideki Eifuku
秀喜 永福
Tadahiko Sakai
忠彦 境
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Panasonic Corp
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Panasonic Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

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  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a bonding method of an electronic component which can enhance bonding strength of an electronic component to a circuit board.SOLUTION: A blower 8 blows gas to a rigid substrate 1 after a resin adhesive 4 is supplied thereto thus accelerating transpiration of any one or both of moisture and solvent component contained in the resin adhesive 4. Subsequently, a flexible substrate 11 is hot pressed to the rigid substrate 1 while aligning the electrode 12 of the flexible substrate 11 and the terminal 2 of the rigid substrate 1. Consequently, generation of a void due to moisture or solvent component can be prevented effectively, and bonding strength of the flexible substrate 11 to the rigid substrate 1 can be enhanced.

Description

本発明は、回路基板の端子に電子部品の電極を電気的に接続した状態で両者を接合する電子部品接合方法に関するものである。   The present invention relates to an electronic component bonding method in which both electrodes of an electronic component are electrically connected to a terminal of a circuit board.

回路基板に半導体チップやフレキシブルコネクタを実装する方法として、半田粒子を含有した熱硬化性樹脂が予め供給された回路基板に電子部品を熱圧着により接合する技術が知られている。この方法では、半田粒子によって回路基板の端子と電子部品の電極とを電気的に接続するとともに、熱硬化した熱硬化性樹脂によって電子部品を回路基板の表面に固着する（例えば特許文献１参照）。   As a method of mounting a semiconductor chip or a flexible connector on a circuit board, a technique is known in which an electronic component is joined to a circuit board supplied with a thermosetting resin containing solder particles in advance by thermocompression bonding. In this method, the terminals of the circuit board and the electrodes of the electronic component are electrically connected by the solder particles, and the electronic component is fixed to the surface of the circuit board by the thermosetting resin (for example, see Patent Document 1). .

このような電子部品実装工法においては、回路基板と電子部品との樹脂接着剤による接合強度を充分に確保することが実装品質上重要となる。このため、特許文献１に示す先行技術においては、樹脂接着剤としての絶縁性樹脂の供給に先立って基板を予め加熱する基板ベーク工程を行って、基板のビルドアップ層の未硬化層に含まれる残留した溶剤成分などのガスを揮発させるようにしている。これにより、残留ガスを内部に閉じこめたまま樹脂接着剤が熱硬化することによって生じるボイドを減少させることができる。   In such an electronic component mounting method, it is important in terms of mounting quality to sufficiently secure the bonding strength between the circuit board and the electronic component by the resin adhesive. For this reason, in the prior art shown in Patent Document 1, a substrate baking process for preheating the substrate prior to the supply of the insulating resin as the resin adhesive is performed, and the substrate is included in the uncured layer of the build-up layer of the substrate. Gases such as remaining solvent components are volatilized. As a result, voids generated by the thermosetting of the resin adhesive with the residual gas confined inside can be reduced.

特開平１０−２２３６８６号公報JP-A-10-223686

しかしながら、上述の特許文献例に示す先行技術には、電子機器の小型化の進展に伴う実装対象の微細化や接合信頼性の更なる向上の要請などに起因して、以下に説明するような不都合が指摘されている。すなわち特許文献１に示す例においては、基板ベーク工程において未硬化層の残留ガスを減少させる効果はあるものの、その後に生じる再吸湿による水分や樹脂接着剤に含まれる溶剤成分が残留することによるボイド発生に対しては効果を期待することができない。このように、熱硬化性樹脂を含む樹脂接着剤を用いる従来の電子部品接合方法には、水分や溶剤成分などに起因するボイドの発生を有効に防止することが困難で、電子部品の回路基板への接合強度を向上させることが難しいという問題があった。   However, according to the prior art shown in the above-mentioned patent document example, due to the demand for further miniaturization of the mounting object and further improvement of the bonding reliability accompanying the progress of miniaturization of the electronic device, as described below. Inconvenience has been pointed out. That is, in the example shown in Patent Document 1, although there is an effect of reducing residual gas in the uncured layer in the substrate baking process, voids due to residual moisture due to reabsorption and solvent components contained in the resin adhesive remain. No effect can be expected on the occurrence. As described above, in the conventional electronic component bonding method using a resin adhesive containing a thermosetting resin, it is difficult to effectively prevent generation of voids due to moisture, solvent components, etc. There was a problem that it was difficult to improve the bonding strength to.

そこで本発明は、電子部品の回路基板への接合強度を向上させることができる電子部品接合方法を提供することを目的とする。   Then, an object of this invention is to provide the electronic component joining method which can improve the joint strength to the circuit board of an electronic component.

本発明の電子部品接合方法は、回路基板の端子に電子部品の電極を電気的に接続した状態で前記回路基板と電子部品とを接合する電子部品接合方法であって、前記回路基板の端子を含む表面に熱硬化性樹脂を含む樹脂接着剤を供給する接着剤供給工程と、前記接着剤供給工程後の前記回路基板に対して気体を吹き付けることにより前記樹脂接着剤に含まれる水分および溶剤成分のうちのいずれかまたは両方の蒸散を促進するブロー工程と、前記ブロー工程の後、前記電子部品の電極を前記回路基板の端子とを位置合わせしてこの電子部品を回路基板に熱圧着する圧着工程とを含む。   The electronic component bonding method of the present invention is an electronic component bonding method for bonding the circuit board and the electronic component in a state where the electrodes of the electronic component are electrically connected to the terminals of the circuit board, and the terminals of the circuit board are connected to each other. An adhesive supply step of supplying a resin adhesive containing a thermosetting resin to the surface thereof, and water and solvent components contained in the resin adhesive by blowing gas to the circuit board after the adhesive supply step A blow process that promotes transpiration of either or both, and after the blow process, the electrodes of the electronic component are aligned with the terminals of the circuit board, and the electronic component is thermocompression bonded to the circuit board Process.

本発明の電子部品接合方法は、熱硬化性樹脂を含む樹脂接着剤を供給した後の回路基板に対して気体を吹き付けることにより樹脂接着剤に含まれる水分および溶剤成分のうちのいずれかまたは両方を蒸散を促進した後、電子部品の電極を回路基板の端子とを位置合わせしてこの電子部品を回路基板に熱圧着することにより、水分や溶剤成分などに起因するボイドの発生を有効に防止ことができ、電子部品の回路基板への接合強度を向上させることができる。   In the electronic component bonding method of the present invention, either or both of moisture and solvent components contained in the resin adhesive by blowing gas onto the circuit board after supplying the resin adhesive containing the thermosetting resin. After the evaporation is promoted, the electrodes of the electronic components are aligned with the terminals of the circuit board and the electronic components are thermocompression bonded to the circuit board to effectively prevent the occurrence of voids due to moisture and solvent components. It is possible to improve the bonding strength of the electronic component to the circuit board.

本発明の一実施の形態の電子部品接合方法を示す工程説明図Process explanatory drawing which shows the electronic component joining method of one embodiment of this invention 本発明の一実施の形態の電子部品接合方法を示す工程説明図Process explanatory drawing which shows the electronic component joining method of one embodiment of this invention 本発明の一実施の形態の電子部品接合方法を示す工程説明図Process explanatory drawing which shows the electronic component joining method of one embodiment of this invention 本発明の一実施の形態の電子部品接合方法を示す工程説明図Process explanatory drawing which shows the electronic component joining method of one embodiment of this invention 本発明の一実施の形態の電子部品接合方法におけるリジッド基板の部分断面図The fragmentary sectional view of the rigid board | substrate in the electronic component joining method of one embodiment of this invention 本発明の一実施の形態の電子部品接合方法におけるリジッド基板とフレキシブル基板の接合部の部分断面図The fragmentary sectional view of the joined part of a rigid substrate and a flexible substrate in an electronic component joining method of an embodiment of the invention 本発明の一実施の形態の電子部品接合方法におけるリジッド基板とフレキシブル基板の接合部の部分断面図The fragmentary sectional view of the joined part of a rigid substrate and a flexible substrate in an electronic component joining method of an embodiment of the invention

次に本発明の実施の形態を図面を参照して説明する。まず、図１〜図４を参照して、電子部品接合方法について説明する。この電子部品接合方法は、回路基板であるリジッド基板１（図１）に電子部品であるフレキシブル基板１１（図４）を接合するものであり、リジッド基板１の端子２にフレキシブル基板１１の電極１２を電気的に接続した状態で、リジッド基板１とフレキシブル基板１１とを熱圧着により接着するものである。   Next, embodiments of the present invention will be described with reference to the drawings. First, an electronic component bonding method will be described with reference to FIGS. In this electronic component bonding method, a flexible substrate 11 (FIG. 4) as an electronic component is bonded to a rigid substrate 1 (FIG. 1) as a circuit substrate, and an electrode 12 of the flexible substrate 11 is connected to a terminal 2 of the rigid substrate 1. The rigid substrate 1 and the flexible substrate 11 are bonded together by thermocompression bonding in a state where they are electrically connected.

図１（ａ）に示すように、リジッド基板１の接続面１ａ（表面）には端子２が形成されている。端子２は銅（Ｃｕ）または銅系の合金より成り、図１（ｂ）に示すように、端子２の表面２ａは大気暴露により生成した酸化膜３によって覆われている。電子部品接合に際しては、リジッド基板１において端子２を含む接続面１ａ側に、図１（ｃ）に示すように、酸化膜除去能力を有する活性剤を含む熱硬化性樹脂に半田粒子を含有させた樹脂接着剤（熱硬化接着剤）４が、ディスペンサ５によって端子２を覆って供給される（接着剤供給工程）。なお、樹脂接着剤４の供給方法として、ディスペンサ５による塗布に替えて、樹脂接着剤４を予めフィルム状に成形した接着フィルムを接続面１ａに貼り付けるようにしてもよい。   As shown in FIG. 1A, terminals 2 are formed on the connection surface 1 a (front surface) of the rigid substrate 1. The terminal 2 is made of copper (Cu) or a copper-based alloy, and as shown in FIG. 1B, the surface 2a of the terminal 2 is covered with an oxide film 3 generated by exposure to the atmosphere. When electronic components are joined, solder particles are contained in a thermosetting resin containing an activator having an ability to remove an oxide film, as shown in FIG. 1C, on the connection surface 1a side including the terminals 2 in the rigid substrate 1. Resin adhesive (thermosetting adhesive) 4 is supplied over the terminal 2 by the dispenser 5 (adhesive supply step). As a method of supplying the resin adhesive 4, instead of applying by the dispenser 5, an adhesive film obtained by previously forming the resin adhesive 4 into a film shape may be attached to the connection surface 1a.

図１（ｃ）に示すように樹脂接着剤４は、熱硬化性樹脂４ａに半田粒子４ｂを所定の含有比率（例えば３０〜７５ｗｔ％）で含有させた構成となっており、熱硬化性樹脂４ａを熱硬化させるための硬化剤として、酸無水物または潜在性硬化剤を含んでいる。ここで使用可能な酸無水物の種類としては、メチルヘキサヒドロ無水フタル酸、更には無水ナジック酸、メチルヘキサハイドロ無水フタル酸、メチルテトラハイドロ無水フタル酸などの液状酸無水物、無水フタル酸、テトラハイドロフタル酸などの固形酸無水物が挙げられる。また使用可能な潜在性硬化剤の種類としては、イミダゾール系、ヒドラジド系、三フッ化ホウ素−アミン錯体、アミンイミド、ポリアミンの塩、アミンアダクト、ジシアンジアミド等が上げられる。   As shown in FIG. 1C, the resin adhesive 4 has a structure in which solder particles 4b are contained in a thermosetting resin 4a at a predetermined content ratio (for example, 30 to 75 wt%), and the thermosetting resin is used. As a curing agent for thermally curing 4a, an acid anhydride or a latent curing agent is included. The types of acid anhydrides that can be used here include methylhexahydrophthalic anhydride, liquid acid anhydrides such as nadic acid anhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, phthalic anhydride, Examples thereof include solid acid anhydrides such as tetrahydrophthalic acid. Examples of the latent curing agent that can be used include imidazole series, hydrazide series, boron trifluoride-amine complex, amine imide, polyamine salt, amine adduct, dicyandiamide, and the like.

また熱硬化性樹脂の種類としてはエポキシ樹脂が最適であるが、アクリル樹脂、フェノール樹脂、ウレタン樹脂、シリコーン樹脂なども使用できる。本発明に用いられるエポキシ樹脂としては、特に限定されることなく公知のものが使用可能である。例えば、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、グリンジルアミン型エポキシ樹脂、脂環式エポキシ樹脂、ハロゲン化エポキシ樹脂等から選択して用いられる。   Epoxy resin is the most suitable type of thermosetting resin, but acrylic resin, phenol resin, urethane resin, silicone resin, etc. can also be used. As an epoxy resin used for this invention, a well-known thing can be used without being specifically limited. For example, a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a grindylamine type epoxy resin, an alicyclic epoxy resin, a halogenated epoxy resin or the like is used. .

半田粒子４ｂは錫（Ｓｎ）を主成分とする半田を所定粒径の粒状にしたものであり、半田の種類としては、Ｓｎ−Ａｇ−Ｃｕ系、Ｓｎ−Ａｇ−Ｃｕ系以外にも、Ｓｎ、Ｓｎ−Ａｇ系、Ｓｎ−Ｐｂ系、Ｓｎ−Ｐｂ−Ａｇ系、Ｓｎ−Ｂｉ系、Ｓｎ−Ｂｉ−Ａｇ系、Ｓｎ−Ｂｉ−Ｉｎ系、Ｓｎ−Ｃｕ系、Ｓｎ−Ａｇ−Ｃｕ−Ｓｂ系、Ｓｎ−Ａｇ−Ｉｎ−Ｂｉ系、Ｓｎ−Ｚｎ系、Ｓｎ−Ｚｎ−Ｂｉ系、Ｓｎ−ｉｎなどを用いることが可能である。なお、硬化剤としては、半田粒子４ｂに用いられる半田の融点温度（例えば２２０℃）よりも高い硬化温度（例えば２３０℃）で熱硬化性樹脂４ａを熱硬化させるものが望ましい。   The solder particles 4b are made of solder containing tin (Sn) as a main component in a granular shape with a predetermined particle size. As the kind of solder, other than Sn-Ag-Cu and Sn-Ag-Cu, Sn is used. Sn-Ag system, Sn-Pb system, Sn-Pb-Ag system, Sn-Bi system, Sn-Bi-Ag system, Sn-Bi-In system, Sn-Cu system, Sn-Ag-Cu-Sb system Sn-Ag-In-Bi system, Sn-Zn system, Sn-Zn-Bi system, Sn-in, and the like can be used. In addition, as a hardening | curing agent, what hardens the thermosetting resin 4a at the curing temperature (for example, 230 degreeC) higher than melting | fusing point temperature (for example, 220 degreeC) of the solder used for the solder particle 4b is desirable.

半田粒子４ｂの表面は製造後の大気暴露によって生じた酸化膜で覆われており、このような状態の半田粒子４ｂを酸化膜３によって覆われた端子２と半田接合するため、樹脂接着剤４には、酸化膜３を除去する作用を有する活性剤が配合されている。本実施の形態では、活性剤として、Ｎ（２−ヒドロキシエチル）イミノ２酢酸，ｍ−ヒドロキシ安息香酸、メサコン酸、更にはｏ−ヒドロキシケイ皮酸、ウスニン酸、３，４−ジヒドロキシ安息香酸、ｍ−ヒドロキシ安息香酸、馬尿酸、コハク酸、ｏ−メトキシケイ皮酸、ｐ−アニス酸、リトコール酸、リンゴ酸などの有機酸を用いている。なお上述と同様の酸化膜除去能力を有し活性剤として作用する酸無水物などを硬化剤として配合する場合には、上述の活性剤を省略もしくは減量してもよい。   The surface of the solder particle 4b is covered with an oxide film generated by exposure to the atmosphere after manufacture. In order to solder-bond the solder particle 4b in such a state to the terminal 2 covered with the oxide film 3, the resin adhesive 4 Contains an activator having an action of removing the oxide film 3. In the present embodiment, N (2-hydroxyethyl) iminodiacetic acid, m-hydroxybenzoic acid, mesaconic acid, o-hydroxycinnamic acid, usnic acid, 3,4-dihydroxybenzoic acid, Organic acids such as m-hydroxybenzoic acid, hippuric acid, succinic acid, o-methoxycinnamic acid, p-anisic acid, lithocholic acid and malic acid are used. In addition, when the acid anhydride etc. which have the same oxide film removal capability as the above-mentioned, and act as an activator are mix | blended as a hardening | curing agent, you may abbreviate | omit or reduce the above-mentioned activator.

次に、接着剤供給工程後のリジッド基板１を対象として、リジッド基板１へのフレキシブル基板１１の熱圧着に先立って、図２（ａ）に示すように、予め樹脂接着剤４を加熱する予備加熱が行われる。この予備加熱は、熱圧着の際の諸条件を改善するために、以下の効果を得ることを目的として行われる。まず、樹脂接着剤４を予め設定された所定の温度まで昇温させることにより、樹脂接着剤４に配合された活性剤を賦活して表面２ａの酸化膜３を除去する能力を発揮させる。これにより、熱圧着に至る過程において樹脂接着剤４中の活性剤が実質的に酸化膜３に作用する時間を十分に確保することができる。   Next, for the rigid substrate 1 after the adhesive supplying step, prior to thermocompression bonding of the flexible substrate 11 to the rigid substrate 1, as shown in FIG. Heating is performed. This preheating is performed for the purpose of obtaining the following effects in order to improve various conditions during thermocompression bonding. First, by raising the temperature of the resin adhesive 4 to a predetermined temperature set in advance, the ability to activate the activator blended in the resin adhesive 4 and remove the oxide film 3 on the surface 2a is exhibited. Thereby, it is possible to ensure a sufficient time for the activator in the resin adhesive 4 to substantially act on the oxide film 3 in the process leading to thermocompression bonding.

この結果、酸化膜３を除去する活性作用が向上し、図２（ｂ）に示すように、表面２ａから酸化膜３を良好に除去することができ、熱圧着時の半田接合における表面２ａの半田濡れ性が改善される。これにより、樹脂接着剤４の組成において活性剤として活性作用が弱い成分を選択し、あるいは活性剤の配合比率を低く設定した場合にあっても、予備加熱によって活性剤が賦活されることから、所望の半田濡れ性を確保することが可能となる。したがって、従来技術において生じていた問題、すなわち活性剤の作用に起因して樹脂接着剤の保存安定性が損なわれ、ポットライフが短くなって製品としての使用性が低下するという問題が解決される。   As a result, the activity of removing the oxide film 3 is improved, and as shown in FIG. 2B, the oxide film 3 can be satisfactorily removed from the surface 2a, and the surface 2a of the solder joint during thermocompression bonding can be removed. Solder wettability is improved. Thereby, in the case of selecting a component having a weak active action as an activator in the composition of the resin adhesive 4, or even when the blending ratio of the activator is set low, the activator is activated by preheating, It becomes possible to ensure desired solder wettability. Therefore, the problem that has occurred in the prior art, that is, the problem that the storage stability of the resin adhesive is impaired due to the action of the activator, the pot life is shortened, and the usability as a product is reduced is solved. .

さらに加えて、樹脂接着剤４を昇温させることにより、樹脂接着剤４の溶剤成分４ｃとともに、大気曝露中の再吸湿によるリジッド基板１の内部や表面の水分が、樹脂接着剤４の塗布後も樹脂接着剤４に含まれたままとなっている残留水分４ｄや、リジッド基板１の積層時に内部に閉じ込められた残留有機ガスなどの外部への蒸散が促進される。したがって、これらのガス成分が樹脂接着剤４の熱硬化後においてなお内部に閉じ込められて残留することに起因するボイド（空隙部）の発生を減少させることができる。すなわちここでは、リジッド基板１上に供給された樹脂接着剤４を、樹脂接着剤４中の活性剤成分が酸化膜除去能力を発揮する温度まで加熱することにより、樹脂接着剤４に含まれる水分および溶剤成分のいずれかまたは両方を蒸散させて除去する（予備加熱工程）。   In addition, by raising the temperature of the resin adhesive 4, the moisture inside the surface of the rigid substrate 1 due to reabsorption during exposure to the atmosphere together with the solvent component 4 c of the resin adhesive 4 is applied after the resin adhesive 4 is applied. Further, the evaporation of the residual moisture 4d remaining in the resin adhesive 4 and the residual organic gas confined inside when the rigid substrate 1 is laminated is promoted. Therefore, it is possible to reduce the generation of voids (voids) due to these gas components still confined and remaining inside the resin adhesive 4 after thermosetting. That is, here, the moisture contained in the resin adhesive 4 is heated by heating the resin adhesive 4 supplied onto the rigid substrate 1 to a temperature at which the activator component in the resin adhesive 4 exhibits the ability to remove the oxide film. And / or solvent components are removed by evaporation (preheating step).

この予備加熱には、以下に例示する方法など種々の方法を用いることができる。図２（ｃ）は、リジッド基板１を介した熱伝達によって加熱する方法を示している。すなわち、ヒータを内蔵したホットプレート６上にリジッド基板１を載置し、ホットプレート６を発熱させてリジッド基板１を介して樹脂接着剤４を加熱する。また図２（ｄ）は、加熱室７ａ内に熱源部９を備えた加熱炉７を用いる例を示している。すなわち、加熱室７ａに設けられた保持テーブル７ｂ上にリジッド基板１を載置し、熱源部９から下方へ吹き出される熱風（矢印ａ）によって樹脂接着剤４を加熱する。また加熱室７ａの内部にリジッド基板１を収容することなく、開放雰囲気で熱風を樹脂接着剤４に対して吹き付けるようにしてもよい。   Various methods such as the following methods can be used for this preheating. FIG. 2C shows a method of heating by heat transfer through the rigid substrate 1. That is, the rigid substrate 1 is placed on a hot plate 6 with a built-in heater, the hot plate 6 is heated, and the resin adhesive 4 is heated via the rigid substrate 1. Moreover, FIG.2 (d) has shown the example using the heating furnace 7 provided with the heat-source part 9 in the heating chamber 7a. That is, the rigid substrate 1 is placed on a holding table 7b provided in the heating chamber 7a, and the resin adhesive 4 is heated by hot air (arrow a) blown downward from the heat source unit 9. Further, hot air may be blown against the resin adhesive 4 in an open atmosphere without housing the rigid substrate 1 in the heating chamber 7a.

なお、接着剤供給工程後のリジッド基板１に対して気体を吹き付けるブロー工程を実行することにより、樹脂接着剤４に含まれる水分および溶剤成分のうちのいずれかまたは両方の蒸散を促進することができる。すなわちこのブロー工程では、エアや窒素ガスなどの気体を樹脂接着剤４の表面で流動させて、樹脂接着剤４から蒸散するガスを速やかに拡散させる。このブロー工程には、予備加熱工程における加熱方法に応じて、種々の方法を用いることができる。例えば、図３（ａ）は、予備加熱をホットプレート６によって行う場合の例を示しており、この場合には、ブロア８からドライエアを樹脂接着剤４に対して吹き付けることにより（矢印ｂ）、樹脂接着剤４から蒸散するガスを拡散させる。なお、リジッド基板１に耐熱性に劣る電子部品が既実装部品として存在する場合には、ブロー工程において吹き付ける気体として常温の空気を用いることにより、これらの既実装部品への熱ダメージを防止することができる。   In addition, by performing the blow process which sprays gas with respect to the rigid board | substrate 1 after an adhesive supply process, transpiration of either or both of the water | moisture content contained in the resin adhesive 4 and a solvent component may be accelerated | stimulated. it can. That is, in this blowing process, a gas such as air or nitrogen gas is caused to flow on the surface of the resin adhesive 4 to quickly diffuse the gas that evaporates from the resin adhesive 4. Various methods can be used for this blow process according to the heating method in the preliminary heating process. For example, FIG. 3A shows an example in which the preheating is performed by the hot plate 6, and in this case, by blowing dry air from the blower 8 against the resin adhesive 4 (arrow b), The gas evaporated from the resin adhesive 4 is diffused. In addition, when the electronic component inferior to heat resistance exists in the rigid board | substrate 1 as an already mounted component, the thermal damage to these already mounted components should be prevented by using normal temperature air as a gas sprayed in a blowing process. Can do.

また図３（ｂ）に示すように、予備加熱を加熱炉７によって行う場合には、熱源部９から吹き出される加熱エアが樹脂接着剤４に対して吹き付けられることにより、樹脂接着剤４の表面近傍では加熱エアの流動が生じ（矢印ｃ）、同様の効果を得る。なお、予備加熱を加熱炉７によって行う場合において、図３（ｃ）に示すように、加熱源として輻射式の熱源部９Ａを用い、熱源部９Ａからの輻射熱（矢印ｄ）によって樹脂接着剤４を加熱する場合には、加熱室７ａ内にブロア７ｃを別途配設して、樹脂接着剤４の表面に対してエアを吹き付けるようにする（矢印ｅ）。   Further, as shown in FIG. 3B, when the preheating is performed by the heating furnace 7, the heated air blown from the heat source portion 9 is blown against the resin adhesive 4, so that the resin adhesive 4 Near the surface, heated air flows (arrow c), and the same effect is obtained. In the case where the preheating is performed by the heating furnace 7, as shown in FIG. 3C, a radiant heat source unit 9A is used as a heating source, and the resin adhesive 4 is radiated by the radiant heat (arrow d) from the heat source unit 9A. Is heated separately in the heating chamber 7a so that air is blown onto the surface of the resin adhesive 4 (arrow e).

この予備加熱における加熱条件は、上述の効果を確保することができるような所定の温度、すなわち樹脂接着剤４中に配合された活性剤成分が酸化膜除去能力を発揮する適正温度が保たれるようなホットプレート６、熱源部９、９Ａの加熱温度と加熱継続時間との組み合わせを、試行実験によって求めることにより決定される。さらにこの加熱条件は、樹脂接着剤４中の熱硬化性樹脂の熱硬化反応が過度に進行せず、後工程である圧着工程においてフレキシブル基板１１を搭載する際に熱硬化性樹脂の流動性が失われないような条件に決定される。これにより、圧着工程において樹脂接着剤４を介してフレキシブル基板１１（図４参照）をリジッド基板１に搭載して押圧する際に、樹脂接着剤４は水平方向に容易に押し広げられ、均一な接合状態が実現される。   The heating condition in this preheating is maintained at a predetermined temperature at which the above-described effects can be ensured, that is, an appropriate temperature at which the activator component blended in the resin adhesive 4 exhibits the ability to remove the oxide film. Such a combination of the heating temperature of the hot plate 6 and the heat source units 9 and 9A and the heating duration is determined by a trial experiment. Further, under this heating condition, the thermosetting reaction of the thermosetting resin in the resin adhesive 4 does not proceed excessively, and the fluidity of the thermosetting resin is increased when the flexible substrate 11 is mounted in the subsequent crimping process. The conditions are such that they are not lost. As a result, when the flexible substrate 11 (see FIG. 4) is mounted on the rigid substrate 1 and pressed through the resin adhesive 4 in the crimping step, the resin adhesive 4 is easily spread in the horizontal direction and is uniform. A joined state is realized.

またこの予備加熱工程では、樹脂接着剤４中の熱硬化性樹脂の熱硬化反応が過度に進行しない温度範囲で樹脂接着剤４を昇温させることにより、次のような効果を得る。すなわち樹脂接着剤４の昇温過程においては、熱硬化が進行する前に一旦粘度が低下して流動性が増加する。これにより、接続面１ａに塗布された樹脂接着剤４中において端子２の上方に存在する半田粒子４ｂは、自重により沈降して表面２ａの近傍まで移動し、圧着過程における半田粒子４ｂの端子２による捕捉率が向上する。   Moreover, in this preheating process, the following effects are acquired by heating up the resin adhesive 4 in the temperature range in which the thermosetting reaction of the thermosetting resin in the resin adhesive 4 does not advance excessively. That is, in the process of raising the temperature of the resin adhesive 4, the viscosity is once lowered and the fluidity is increased before the thermosetting proceeds. As a result, the solder particles 4b existing above the terminals 2 in the resin adhesive 4 applied to the connection surface 1a settle down due to their own weight and move to the vicinity of the surface 2a, and the terminals 2 of the solder particles 4b in the crimping process. The capture rate by is improved.

このとき前述の加熱条件における加熱温度を、半田粒子４ｂの溶融温度よりも高い温度に設定して、樹脂接着剤４をこの加熱温度まで昇温させることにより、半田粒子４ｂの挙動は図５（ａ）に示すようなものとなる。この場合には、樹脂接着剤４中の半田粒子４ｂは溶融しながら熱硬化性樹脂４ａ内を沈降して端子２の表面２ａに接触し、表面２ａに沿って濡れ広がって溶融した半田粒子４ｂの表面層を形成する。すなわち、表面２ａの半田濡れ性を優先的に確保したい場合には、加熱温度を半田粒子４ｂの溶融温度よりも高い温度に設定し、予備加熱工程において半田粒子４ｂの溶融温度よりも高い温度まで樹脂接着剤４を加熱する。   At this time, the heating temperature under the above-described heating conditions is set to a temperature higher than the melting temperature of the solder particles 4b, and the behavior of the solder particles 4b is as shown in FIG. As shown in a). In this case, the solder particles 4b in the resin adhesive 4 settle in the thermosetting resin 4a while melting and come into contact with the surface 2a of the terminal 2, and are wet spread along the surface 2a and melted to melt the solder particles 4b. Forming a surface layer. That is, when preferentially ensuring the solder wettability of the surface 2a, the heating temperature is set to a temperature higher than the melting temperature of the solder particles 4b, and the temperature is higher than the melting temperature of the solder particles 4b in the preheating step. The resin adhesive 4 is heated.

これに対し、加熱条件における加熱温度を半田粒子４ｂの溶融温度よりも低い温度に設定して、樹脂接着剤４をこの加熱温度まで昇温させることにより、半田粒子４ｂの挙動は図５（ｂ）に示すようなものとなる。この場合には、樹脂接着剤４中の半田粒子４ｂは溶融せずに粒子形状を保ったまま熱硬化性樹脂４ａ内を沈降して、端子２の表面２ａに接触する。これにより、半田粒子４ｂは確実に表面２ａに接触し、熱圧着工程において表面２ａと確実に半田接合される。すなわち、端子２の電気的な導通を優先的に確保したい場合には、加熱温度を半田粒子４ｂの溶融温度よりも低い温度に設定し、予備加熱工程において半田粒子４ｂの溶融温度よりも低い温度まで樹脂接着剤４を加熱する。   On the other hand, by setting the heating temperature under the heating conditions to a temperature lower than the melting temperature of the solder particles 4b and raising the temperature of the resin adhesive 4 to this heating temperature, the behavior of the solder particles 4b is as shown in FIG. ). In this case, the solder particles 4b in the resin adhesive 4 do not melt and settle in the thermosetting resin 4a while maintaining the particle shape, and come into contact with the surface 2a of the terminal 2. As a result, the solder particles 4b reliably come into contact with the surface 2a, and are securely soldered to the surface 2a in the thermocompression bonding step. That is, when it is desired to preferentially secure the electrical conduction of the terminal 2, the heating temperature is set to a temperature lower than the melting temperature of the solder particles 4b, and the temperature lower than the melting temperature of the solder particles 4b in the preheating step. The resin adhesive 4 is heated up to.

次に予備加熱工程の後、フレキシブル基板１１の電極１２をリジッド基板１の端子２と位置合わせしてフレキシブル基板１１をリジッド基板１に熱圧着する圧着工程が実行される。すなわち、図４（ａ）に示すように、まず一方側の面に電極１２が形成されたフレキシブル基板１１を、電極１２が下面側の姿勢で圧着ヘッド１０によって保持し、次いで接続面１ａ上に端子２を覆って樹脂接着剤４が供給されたリジッド基板１上に位置合わせする。   Next, after the preheating step, a crimping step is performed in which the electrode 12 of the flexible substrate 11 is aligned with the terminal 2 of the rigid substrate 1 and the flexible substrate 11 is thermocompression bonded to the rigid substrate 1. That is, as shown in FIG. 4A, first, the flexible substrate 11 having the electrode 12 formed on one surface is held by the crimping head 10 with the electrode 12 positioned on the lower surface side, and then on the connection surface 1a. The terminal 2 is covered and positioned on the rigid substrate 1 supplied with the resin adhesive 4.

この後、図４（ｂ）に示すように、圧着ヘッド１０を下降させて、電極１２を端子２に対向させた状態で、フレキシブル基板１１を樹脂接着剤４を介してリジッド基板１に対して着地させる。そしてフレキシブル基板１１をリジッド基板１に対して所定の押圧荷重で押圧しながら、圧着ヘッド１０に内蔵されたヒータによってフレキシブル基板１１を介して樹脂接着剤４を加熱する。これにより、図４（ｃ）に示すように、端子２と電極１２とを半田接合して電気的に接続する半田接合部４ｂ＊が形成されるとともに、熱硬化性樹脂４ａが熱硬化してフレキシブル基板１１をリジッド基板１に固着する樹脂補強部４ａ＊が形成される。   Thereafter, as shown in FIG. 4 (b), the flexible substrate 11 is attached to the rigid substrate 1 via the resin adhesive 4 in a state where the crimping head 10 is lowered and the electrode 12 is opposed to the terminal 2. Land. Then, the resin adhesive 4 is heated via the flexible substrate 11 by the heater built in the pressure-bonding head 10 while pressing the flexible substrate 11 against the rigid substrate 1 with a predetermined pressing load. As a result, as shown in FIG. 4C, a solder joint 4b * for soldering and electrically connecting the terminal 2 and the electrode 12 is formed, and the thermosetting resin 4a is thermoset. A resin reinforcing portion 4a * for fixing the flexible substrate 11 to the rigid substrate 1 is formed.

このとき前述の加熱条件における加熱温度を、半田粒子４ｂの溶融温度よりも高い温度に設定した場合には、図６（ａ）に示すように、樹脂接着剤４中の半田粒子４ｂが表面２ａに沿って濡れ広がって半田粒子４ｂの表面層を形成した状態で、電極１２が端子２に対して下降する。これにより、図６（ｂ）に示すように、端子２と電極１２とを接続する半田接合部４ｂ＊が形成されるとともに、熱硬化性樹脂４ａが熱硬化してフレキシブル基板１１をリジッド基板１に固着する樹脂補強部４ａ＊が形成される。このとき、表面２ａにおける半田濡れ性が確保されていることから、半田接合部４ｂ＊の良好な接合強度が保証される。   At this time, when the heating temperature under the above-described heating conditions is set to a temperature higher than the melting temperature of the solder particles 4b, the solder particles 4b in the resin adhesive 4 are exposed to the surface 2a as shown in FIG. The electrode 12 descends with respect to the terminal 2 in a state where the surface layer of the solder particles 4b is formed by wetting and spreading along the surface. As a result, as shown in FIG. 6B, a solder joint 4b * for connecting the terminal 2 and the electrode 12 is formed, and the thermosetting resin 4a is thermoset to allow the flexible substrate 11 to be rigid. A resin reinforcing portion 4a * is formed which is fixed to the surface. At this time, since the solder wettability on the surface 2a is ensured, good bonding strength of the solder bonding portion 4b * is ensured.

また加熱条件における加熱温度を半田粒子４ｂの溶融温度よりも低い温度に設定した場合には、図７（ａ）に示すように、樹脂接着剤４中の半田粒子４ｂが粒子形状を保ったまま表面２ａに接触した状態で、電極１２が端子２に対して下降する。これにより、図７（ｂ）に示すように、端子２と電極１２とを接続する半田接合部４ｂ＊が形成されるとともに、熱硬化性樹脂４ａが熱硬化してフレキシブル基板１１をリジッド基板１に固着する樹脂補強部４ａ＊が形成される。このとき、半田粒子４ｂは確実に表面２ａに接触して電極１２との間に挟み込まれることから、端子２と電極１２との電気的な導通が確保される。   When the heating temperature under the heating conditions is set to a temperature lower than the melting temperature of the solder particles 4b, the solder particles 4b in the resin adhesive 4 remain in the particle shape as shown in FIG. The electrode 12 descends with respect to the terminal 2 in contact with the surface 2a. As a result, as shown in FIG. 7B, a solder joint 4b * for connecting the terminal 2 and the electrode 12 is formed, and the thermosetting resin 4a is thermoset to dispose the flexible substrate 11 to the rigid substrate 1. A resin reinforcing portion 4a * is formed which is fixed to the surface. At this time, the solder particles 4b are surely brought into contact with the surface 2a and are sandwiched between the electrode 12 and electrical continuity between the terminal 2 and the electrode 12 is ensured.

上記説明したように、本実施の形態の電子部品接合方法は、熱硬化性樹脂を含む樹脂接着剤４を供給した後のリジッド基板１に対して気体を吹き付けることにより樹脂接着剤４に含まれる水分および溶剤成分のうちのいずれかまたは両方を蒸散を促進した後、フレキシブル基板１１の電極１２をリジッド基板１の端子２とを位置合わせしてフレキシブル基板１１をリジッド基板１に熱圧着するようにしたものである。これにより、水分や溶剤成分などに起因するボイドの発生を有効に防止ことができ、電子部品の回路基板への接合強度を向上させることができる。   As described above, the electronic component bonding method according to the present embodiment is included in the resin adhesive 4 by blowing gas onto the rigid substrate 1 after supplying the resin adhesive 4 containing the thermosetting resin. After promoting evaporation of either or both of the moisture and solvent components, the electrode 12 of the flexible substrate 11 is aligned with the terminal 2 of the rigid substrate 1 so that the flexible substrate 11 is thermocompression bonded to the rigid substrate 1. It is a thing. Thereby, generation | occurrence | production of the void resulting from a water | moisture content, a solvent component, etc. can be prevented effectively, and the joining strength to the circuit board of an electronic component can be improved.

なお本実施の形態においては、回路基板および電子部品の組み合わせとして、リジッド基板１にフレキシブル基板１１を実装する例を示したが、本発明はこれに限定されるものではない。例えば、回路基板としてのフレキシブル基板に、電子部品としてのベアチップを熱硬化性樹脂を含む樹脂接着剤によって接合する場合などについても、本発明の適用対象となる。   In the present embodiment, an example in which the flexible substrate 11 is mounted on the rigid substrate 1 as a combination of a circuit board and an electronic component has been described. However, the present invention is not limited to this. For example, the present invention is also applicable to a case where a bare chip as an electronic component is bonded to a flexible substrate as a circuit board with a resin adhesive containing a thermosetting resin.

また本実施の形態においては、樹脂接着剤として熱硬化性樹脂４ａに半田粒子４ｂを含有させた組成のものを用いているが、これ以外の組成の樹脂接着剤であっても、熱硬化性樹脂を含むものであれば本発明の適用対象となる。さらに、本実施の形態においては、リジッド基板１に供給された樹脂接着剤４を予備加熱する例を示しているが、本発明においては予備加熱は必須要件ではなく、単に回路基板に供給された状態の樹脂接着剤に気体を吹き付ける構成であれば、本発明の適用対象となる。   In the present embodiment, a resin adhesive having a composition in which solder particles 4b are contained in the thermosetting resin 4a is used. However, even a resin adhesive having a composition other than this is thermosetting. If it contains resin, it becomes an application object of this invention. Further, in the present embodiment, an example is shown in which the resin adhesive 4 supplied to the rigid substrate 1 is preheated. However, in the present invention, preheating is not an essential requirement, and is simply supplied to the circuit board. If it is the structure which sprays gas on the resin adhesive of a state, it will become an application object of this invention.

本発明の電子部品接合方法は、水分や溶剤成分などに起因するボイドの発生を有効に防止して、電子部品の回路基板への接合強度を向上させることができるという効果を有し、リジッド基板にフレキシブル基板を実装する電子部品実装分野などにおいて有用である。   The electronic component bonding method of the present invention has the effect of effectively preventing the generation of voids due to moisture, solvent components, etc., and improving the bonding strength of the electronic component to the circuit board. It is useful in the field of electronic component mounting where a flexible board is mounted.

１ リジッド基板
１ａ 接続面
２ 端子
３ 酸化膜
４ 樹脂接着剤
４ａ 熱硬化性樹脂
４ａ＊ 樹脂補強部
４ｂ 半田粒子
４ｂ＊ 半田接合部
４ｃ 溶剤成分
４ｄ 水分
６ ホットプレート
７ 加熱炉
１１ フレキシブル基板
１２ 電極 DESCRIPTION OF SYMBOLS 1 Rigid board | substrate 1a Connection surface 2 Terminal 3 Oxide film 4 Resin adhesive 4a Thermosetting resin 4a * Resin reinforcement part 4b Solder particle 4b * Solder joint part 4c Solvent component 4d Water | moisture content 6 Hot plate 7 Heating furnace 11 Flexible board 12 Electrode

Claims (2)

回路基板の端子に電子部品の電極を電気的に接続した状態で前記回路基板と電子部品とを接合する電子部品接合方法であって、
前記回路基板の端子を含む表面に熱硬化性樹脂を含む樹脂接着剤を供給する接着剤供給工程と、
前記接着剤供給工程後の前記回路基板に対して気体を吹き付けることにより前記樹脂接着剤に含まれる水分および溶剤成分のうちのいずれかまたは両方の蒸散を促進するブロー工程と、
前記ブロー工程の後、前記電子部品の電極を前記回路基板の端子とを位置合わせしてこの電子部品を回路基板に熱圧着する圧着工程とを含むことを特徴とする電子部品接合方法。 An electronic component joining method for joining the circuit board and the electronic component in a state where the electrodes of the electronic component are electrically connected to the terminals of the circuit board,
An adhesive supply step of supplying a resin adhesive containing a thermosetting resin to the surface including the terminals of the circuit board;
A blowing step of promoting transpiration of either or both of moisture and solvent components contained in the resin adhesive by blowing gas to the circuit board after the adhesive supplying step;
An electronic component joining method comprising: a crimping step of aligning an electrode of the electronic component with a terminal of the circuit board after the blowing step and thermocompression bonding the electronic component to the circuit board. 前記ブロー工程において、前記気体として常温の空気を用いることを特徴とする請求項１記載の電子部品接合方法。   The electronic component joining method according to claim 1, wherein air at room temperature is used as the gas in the blowing step.
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