JP5577859B2 - Manufacturing method of electronic device - Google Patents

Description

  The present invention relates to a method for manufacturing an electronic device in which an electronic component is mounted on one surface of a substrate and the electronic component is sealed with a sealing resin.

  In general, this type of electronic device uses a substrate having a substrate electrode on one surface, the electronic component is mounted on one surface of the substrate, and the electronic component and the substrate electrode are electrically connected by a conductive adhesive or solder. After that, the electronic component and the connection part between the electronic component and the substrate electrode are sealed with a sealing resin on one surface of the substrate by a transfer molding method or the like.

  Here, since there are a plurality of electronic components, there is a desire to shorten the tact time by mounting the plurality of electronic components together on one surface of the substrate.

  On the other hand, in Patent Document 1, a jig having an engraving corresponding to an electronic component is used, and the electronic component is mounted with the mounting surface facing upward in engraving the jig, and a solder paste is placed thereon. There has been proposed a method in which a printed substrate is put together with a jig and then reflowed together.

  As a result, a plurality of electronic components can be mounted on the substrate in a lump. After that, the sealing portion further seals the electronic component and the connection portion between the electronic component and the substrate electrode. Separately, a sealing step with these resins is required.

  On the other hand, in Patent Document 2, as a method of mounting a plurality of electronic components on a substrate in a lump, a plurality of heating elements are pasted on a heat sink in advance by attaching a plurality of heating elements on the substrate in a lump. Then, a soldering method has been proposed. Thereby, the batch connection of the electronic components can be achieved, but the case where the heights of the electronic components are different cannot be coped with.

  In Patent Documents 3 and 4, a plurality of electronic components are placed on a temporary substrate, sealed with resin in that state, and after curing of the resin is completed, a plurality of electronic components are removed from the temporary substrate together with the resin. A method has been proposed in which a plurality of electronic components can be collectively connected to a regular substrate by handling the components as a single workpiece.

  However, in this case, although the electronic component is sealed with the sealing resin, it is further separated from the electrical connection portion between the connection surface of the electronic component exposed from the sealing resin and the substrate electrode on the substrate. It is necessary to seal using a resin or the like, which requires cost and labor.

Japanese Patent Laid-Open No. 10-12992 JP-A-6-163694 JP 2002-110714 A JP 2001-308116 A

  In any case, conventionally, an electronic component is mounted on one surface of the substrate to electrically connect the electronic component and the substrate electrode, and further, the electronic component and the electronic component are connected to the substrate electrode on one surface of the substrate. In manufacturing an electronic device in which a portion is sealed with a sealing resin, there has been no method capable of collectively mounting electronic components and sealing with a sealing resin. This is a common problem regardless of whether the electronic component is plural or singular.

  The present invention has been made in view of the above problems, and in mounting an electronic component on one surface of a substrate and manufacturing an electronic device in which the electronic component is sealed with a sealing resin, the mounting of the electronic component is performed. It is another object of the present invention to collectively perform sealing of an electronic component using a sealing resin and a connection portion between the electronic component and a substrate electrode.

  In order to achieve the above object, according to the first aspect of the present invention, the electronic component (30) is mounted on the one surface (11) of the substrate (10) having the substrate electrode (20) on the one surface (11). The electronic component (30-34) and the substrate electrode (20) are electrically connected to each other, and the electronic component (30-34) is sealed with a sealing resin (40) on one surface (11) of the substrate (10). The manufacturing method of the electronic device formed by sealing has the following points.

  The electronic component (30 to 34) is embedded in the plate-shaped resin sheet (110) made of the thermosetting resin in the B stage state, and the connection surface with the substrate electrode (20) in the electronic component (30 to 34) A sheet member (100) that is exposed on one plate surface (111) of the resin sheet (110) and a substrate (10).

  -One plate surface (111) of the resin sheet (110) in the sheet member (100) and one surface (11) of the substrate (10) are opposed to one plate surface (111) of the resin sheet (110). And performing an alignment step of aligning the connection surfaces of the electronic components (30 to 34) exposed to the substrate electrodes (20) connected thereto.

Subsequently, the sheet member (100) is pressed against the substrate (10) side to electrically connect the connection surfaces of the electronic components (30 to 34) and the substrate electrode (20), and the substrate electrode (20). In the meantime, the resin sheet (110) is deformed so as to be pushed into the one surface (11) side of the substrate (10), and the portion between the substrate electrodes (20) in the one surface (11) of the substrate (10). -out paste to, a part other than the substrate electrode (20) of the portion immediately below the electronic part (30 to 34), the resin sheet (110) which has been deformed by so goes around, the connection surface and the substrate electrode (20 A sealing step of sealing the connecting portion with the resin sheet (110).

  -Then, the resin sheet (110) is heated more than the curing temperature to be completely cured, and a curing process is performed in which the cured resin sheet (110) is used as the sealing resin (40). The manufacturing method is characterized by including these points.

  The present invention has been made by paying attention to the fact that the sealing resin is made of a thermosetting resin. According to this, the electronic components (30 to 34) are made from the thermosetting resin of the B stage which is in a semi-cured state. An electronic component (30˜) exposed from the resin sheet (110) is mounted on one surface (11) of the substrate (10) using a sheet member (100) embedded and integrated in the resin sheet (110). By connecting the connection surface 34) and the substrate electrode (20), it is possible to mount the electronic components (30 to 34) in a sealed state.

  At the same time, when the electronic components (30 to 34) are mounted, the resin sheet (110) of the B stage is pressed against the substrate (10) to be deformed, and the substrate of the one surface (11) of the substrate (10). Since the connection portion between the connection surface and the substrate electrode (20) is sealed with the resin sheet (110) by being attached to the portion between the electrodes (20), the connection portion is sealed. .

  Therefore, according to the present invention, the mounting of the electronic components (30 to 34) and the connection between the electronic components (30 to 34) and the electronic components (30 to 34) and the substrate electrode (20) by the sealing resin (40). The parts can be sealed together. It is obvious that the effect of the present invention can be similarly achieved regardless of whether the number of electronic components is one or more.

  Here, in the invention according to claim 2, in the method of manufacturing the electronic device according to claim 1, any one of the connection surface of the electronic component (30 to 34) and the substrate electrode (20) connected to the connection surface. One of them is provided with a conductive bump (60) projecting from one side toward the other side connected thereto, and the electrical connection between the connection surface and the substrate electrode (20) through the bump (60). Connection is performed, and a connection portion between the connection surface of the electronic component (30 to 34) and the substrate electrode (20) is configured by the connection surface, the bump (60), and the substrate electrode (20). It is said.

  The bump (60) protrudes from one plate surface (111) of the resin sheet (110), and the connection surface of the electronic component (30 to 34) and the one plate surface (111) are in the same plane. As compared with the above, connection to the substrate electrode (20) is facilitated.

  According to a third aspect of the present invention, in the electronic device manufacturing method according to the first or second aspect, in the prepared sheet member (100), the connection surface of the electronic component (30 to 34). Is protruded from one plate surface (111) of the resin sheet (110), and a connection portion between the connection surface of the electronic component (30 to 34) and the substrate electrode (20) is formed on the resin sheet (110). It is characterized by comprising a connection surface protruding from one plate surface (111) and a substrate electrode (20).

  In this case, the connection surface of the electronic components (30 to 34) protrudes from one plate surface (111) of the resin sheet (110), and the connection surface and the one plate surface (111) are in the same plane. Compared to a certain case, the connection to the substrate electrode (20) becomes easier.

Further, characterized in that according the invention described in claim 1, in the sheet member to be use meaning (100), to be affixed to the metal sheet (80) on the other plate surface of the resin sheet (110) (112) It is said.

  According to that, since the adhesion part of the other board surface (112) of the resin sheet (110) is coat | covered with the metal sheet (80), it is excellent in handleability.

According to a fourth aspect of the present invention, in the electronic device manufacturing method according to any one of the first to third aspects, the electronic components (30 to 34) are embedded in the resin sheet (110). In the process, a recess (113) having a shape corresponding to the electronic component (30 to 34) is provided in the resin sheet (110) made of a thermosetting resin in a B stage state, and the electronic component (30 to 34) is provided in the recess (113). 34) and the electronic components (30 to 34) are fixed to the resin sheet (110) by the tack force of the resin sheet (110).

  Thus, since the resin sheet (110) is a B stage, the electronic component (30 to 34) can be fixed by the tack force, and the electronic component (30 to 34) and the resin sheet (110) are integrated. Can be done easily.

According to a fifth aspect of the present invention, in the electronic device manufacturing method according to any one of the first to third aspects, the electronic components (30 to 34) are embedded in the resin sheet (110). In the process, a resin sheet (110) made of a thermosetting resin in a B-stage state is pressed against the electronic component (30-34) from the side opposite to the connection surface of the electronic component (30-34), and the resin sheet (110 ) Is embedded with electronic components (30 to 34).

  Thus, the electronic component (30-34) and the resin sheet (the resin sheet (110)) are inserted into the electronic component (30-34) by using the B stage that is deformed by weight. 110) can be easily integrated.

  In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

It is a figure which shows schematic structure of the electronic device which concerns on 1st Embodiment of this invention, (a) is a schematic sectional drawing, (b) is a schematic plan view. It is process drawing which shows the 1st formation method of a sheet | seat member. It is process drawing which shows the 2nd formation method of a sheet | seat member. It is process drawing which shows the process after the formation process of the sheet member in the manufacturing method of the electronic device of 1st Embodiment. It is process drawing which shows the manufacturing method of the electronic device which concerns on 2nd Embodiment of this invention. It is process drawing which shows another example of the manufacturing method of the electronic device which concerns on 2nd Embodiment. It is process drawing which shows the manufacturing method of the electronic device which concerns on 3rd Embodiment of this invention. It is process drawing which shows the manufacturing method of the electronic device which concerns on 4th Embodiment of this invention. It is a schematic sectional drawing which shows the electronic apparatus which concerns on 5th Embodiment of this invention. It is a schematic sectional drawing which shows the electronic apparatus which concerns on 6th Embodiment of this invention. It is a schematic sectional drawing which shows the electronic apparatus which concerns on 7th Embodiment of this invention. It is a schematic sectional drawing which shows the electronic apparatus which concerns on 8th Embodiment of this invention. It is a schematic sectional drawing which shows the electronic apparatus which concerns on 9th Embodiment of this invention. It is a schematic sectional drawing which shows the electronic apparatus which concerns on 10th Embodiment of this invention. It is process drawing which shows the manufacturing method of the electronic device which concerns on 11th Embodiment of this invention. FIG. 16 is a process diagram illustrating a method for manufacturing the electronic device following FIG. 15. It is process drawing which shows the manufacturing method of the electronic device which concerns on 12th Embodiment of this invention. It is a schematic plan view which shows the principal part of the electronic device which concerns on 13th Embodiment of this invention. It is process drawing which shows the manufacturing method of the electronic device which concerns on 14th Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

(First embodiment)
FIG. 1 is a diagram illustrating a schematic configuration of an electronic device according to a first embodiment of the present invention, in which (a) is a schematic cross-sectional view and (b) is a schematic plan view. Note that FIG. 1B is a top view of FIG. 1A and shows the components inside through the sealing resin 40.

  The electronic device according to the present embodiment is broadly configured to mount the electronic components 30 to 34 on the one surface 11 of the substrate 10 having the substrate electrode 20 on the one surface 11 to electrically connect the electronic components 30 to 34 and the substrate electrode 20. In addition, the electronic components 30 to 34 are sealed with the sealing resin 40 on the one surface 11 of the substrate 10.

  The substrate 10 has a plate shape, and one plate surface is defined as one surface 11 and the other plate surface is defined as the other surface 12. As this board | substrate 10, wiring boards, such as a printed circuit board and a ceramic board | substrate, are mentioned.

  Here, the substrate 10 has a substrate electrode 20 as a surface electrode on one surface 11 and a back electrode 21 on the other surface 12. These electrodes 20 and 21 are generally made of Al or Cu, for example, and are patterned by printing or etching into a shape corresponding to the connection surface of the electronic components 30 to 34.

  In the substrate 10, the electrodes 20 and 21 on both surfaces 11 and 12 are electrically connected to each other by a via provided in the substrate 10 and an internal wiring 22 as an interlayer wiring.

  Here, the electronic components 30 to 34 are electrically connected to the substrate electrode 20 on the first surface 11, and electrical connection with the outside is performed by the rear surface electrode 21 on the other surface 12. As a result, the electronic components 30 to 34 are brought into conduction with the outside via the substrate electrode 20, the internal wiring 22, and the back electrode 21.

  The electronic components 30 to 34 are not particularly limited as long as they can be mounted on the one surface 11 of the substrate 10. Here, a plurality of electronic components 30 to 34 are mounted on one surface 11 of the substrate 10. When there are a plurality of electronic components 30 to 34, these plurality of components may be of the same type or different types.

  In the example of FIG. 1, the electronic components 30 to 34 are electrically connected to a chip resistor 30, a flip chip 32 having a protruding electrode, a chip capacitor 32, a power element 33 such as a MOS transistor, and the power element 33. A lead member 34 is shown.

  The connection surfaces of these electronic components 30 to 34, specifically, the electrode of the chip resistor 30, the protruding electrode made of Au or the like of the flip chip 31, the electrode of the chip capacitor 32, the back electrode of the power element 33, the lead member 34. Is electrically connected to the substrate electrode 20 opposed thereto via a conductive bonding member 50 such as a general solder or a conductive adhesive.

  The sealing resin 40 is made of a thermosetting resin such as an epoxy resin used as a molding material for an electronic device. This sealing resin 40 is on one surface 11 of the substrate 10, the electronic components 30 to 34, the electrical connection part between the electronic components 30 to 34 and the substrate electrode 20, and between the substrate electrodes 20 among the one surface 11 of the substrate 10. These parts are sealed and these parts to be sealed are protected.

  Here, the electrical connection portion between the electronic components 30 to 34 and the substrate electrode 20 is configured by the connection surfaces of the electronic components 30 to 34 connected to each other, the conductive bonding member 50, and the substrate electrode 20. Is.

  Here, the sealing resin 40 is further described. The sealing resin 40 is a thermosetting resin, and is a C stage that is in a completely cured state (cured end state) from a B stage that is in a semi-cured state (cured intermediate state). Until it is cured. For example, in the case of a general epoxy resin, for example, a B stage state is obtained by heating at 120 ° C. for 30 minutes, and a C stage state is obtained by heating at 150 ° C. for 30 minutes.

  Next, a method for manufacturing the electronic device of this embodiment will be described with reference to FIGS. In the present manufacturing method, the electronic device is manufactured by previously forming the sheet member 100 in which the electronic components 30 to 34 and the resin that is the material of the sealing resin 40 are integrated, and attaching the sheet member 100 to the one surface 11 of the substrate 10. To do.

  Here, the sheet member 100 is formed by embedding the electronic components 30 to 34 in the plate-shaped resin sheet 110 made of a thermosetting resin in a B-stage state, and connecting to the substrate electrode 20 in the electronic components 30 to 34. This is done by exposing the surface at one plate surface 111 of the resin sheet 110.

  As a specific method for forming the sheet member 100, a first forming method shown in FIG. 2 and a second forming method shown in FIG. 3 are shown. FIG. 2 is a process diagram showing a first method for forming a sheet member, and shows each workpiece in cross-section. FIG. 3 is a process diagram showing a second method for forming a sheet member, and shows each workpiece in cross-section.

  First, in the first forming method, a plate-shaped resin sheet 110 made of a thermosetting resin in a B-stage state is formed by a mold or the like. Specifically, the thermosetting resin put into the mold is heated to a temperature lower than the complete curing temperature to obtain a B stage state. In the case of an epoxy resin, as described above, for example, heating is performed at 120 ° C. for 30 minutes. As a result, a plate-shaped resin sheet 110 having both plate surfaces 111 and 112 in a front-back relationship is formed.

  As described above, the B stage state refers to an intermediate curing state of the thermosetting resin. For example, Japanese Patent No. 4407456, Japanese Patent No. 4390056, and Japanese Patent No. 4096394 are used for this B stage. It is also described in publications. The resin in the state of the B stage has an adhesive force (tack force) and is softened by weighting or heating.

  And in the 1st formation method, as shown in Drawing 2 (a), dent 113 dented in the shape according to the shape of electronic parts 30-34 by press processing is formed in one side 111 of resin sheet 110. . Thereafter, as shown in FIG. 2B, the electronic components 30 to 34 are embedded in the recess 113 while the connection surface is exposed on the one surface 111 of the resin sheet 110.

  Thus, the electronic components 30 to 34 can be embedded inside the resin sheet 110, and the electronic components 30 to 34 that have entered the recess 113 are fixed to the resin sheet 110 by the tack force of the resin sheet 110 on the B stage. At this time, the resin sheet 110 may be heated to increase the tack force. The above is the first forming method as a process of embedding the electronic components 30 to 34 inside the resin sheet 110.

  Thus, since the resin sheet 110 is a B stage, the electronic components 30 to 34 can be fixed by the tack force, and the electronic components 30 to 34 and the resin sheet 110 can be easily integrated.

  Further, the step of embedding the electronic components 30 to 34 in the resin sheet 110 may be the second forming method shown in FIG.

  In this case, as shown in FIG. 3A, the electronic components 30 to 34 are arranged on the flat surface of the jig 10 having a flat surface so as to have the same arrangement as that on the one surface 11 of the substrate 10. Mount. At this time, each of the electronic components 30 to 34 is fixed to the jig K1 so as not to be displaced from the jig K1 by suction through the vacuum suction hole K2. In addition, it may replace with this adsorption | suction and may fix with adhesives, such as a tape.

  Then, as shown in FIG. 3A, a plate-like resin sheet 110 made of the same B-stage thermosetting resin as described above is prepared, and its one surface 111 is opposed to the electronic components 30 to 34. Then, as shown in FIG. 3B, the resin sheet 110 is pressed against the electronic components 30 to 34 from the side opposite to the connection surface of the electronic components 30 to 34 from the one surface 111 side, and the resin sheet 110 is electronically applied to the resin sheet 110. The parts 30 to 34 are inserted.

  After that, as shown in FIG. 3C, the resin sheet 110 is peeled off from the jig K1 in the B stage state. As described above, in the second forming method, the electronic components 30 to 34 and the resin are formed by indenting the electronic components 30 to 34 using the fact that the resin sheet 110 is a B stage that is deformed by weight. The sheet 110 can be easily integrated.

  Thus, the sheet member 100 is prepared by the first or second forming method. On the other hand, the substrate 10 on which the electrodes 20 and 21 and the internal wiring 22 are formed is prepared. The substrate 10 is manufactured by a general method for manufacturing a ceramic substrate or a printed circuit board.

  Subsequently, the prepared sheet member 100 and the substrate 10 are attached. FIG. 4 is a process diagram illustrating processes after the sheet member forming process in the method of manufacturing the electronic device according to the present embodiment.

  In the alignment step shown in FIG. 4A, one plate surface 111 of the resin sheet 110 in the sheet member 100 and one surface 11 of the substrate 10 are opposed to each other and exposed on the one plate surface 111 of the resin sheet 110. The connection surfaces of the electronic components 30 to 34 to be aligned and the substrate electrode 20 connected to the connection surfaces are aligned. At this time, a conductive bonding member 50 made of solder or a conductive adhesive is disposed on the substrate electrode 20 or the connection surfaces of the electronic components 30 to 34 by plating or printing.

  Subsequently, in the sealing step shown in FIGS. 4B and 4C, the sheet member 100 is pressed against the substrate 10 side. This pressing may be performed by pressing the sheet member 100 by applying a load to the sheet member 100 or the like.

  And the connection surface of the electronic components 30-34 and the board | substrate electrode 20 are electrically connected by pressing of this sheet | seat member 100 (refer FIG.4 (b)). Here, the electrical connection is performed via the conductive bonding member 50. At the same time, the pressing is further advanced, and the resin sheet 110 is deformed and attached to the portion between the substrate electrodes 20 in the one surface 11 of the substrate 10.

  According to this further pressing, the resin sheet 110 is deformed so as to be pushed into the one surface 11 side of the substrate 10 between the substrate electrodes 20, and contacts the portion between the substrate electrodes 20 on the one surface 11 of the substrate 10. Then stick. By doing so, the electrical connection part of the connection surface of the electronic components 30 to 34 and the substrate electrode 20 is sealed with the resin sheet 110. At this time, the deformed resin sheet 110 wraps around the portion directly below the electronic components 30 to 34 other than the substrate electrode 20. The above is the sealing process.

  Thereafter, in the curing step, the resin sheet 110 is heated to the curing temperature or higher to be completely cured. In this case, as described above, for example, in the case of an epoxy resin, complete curing, that is, a C stage is obtained by heating at 150 ° C. or higher for 30 minutes. Thus, the cured resin sheet 110 is used as the sealing resin 40. The above is the curing process.

  In this curing step, it is desirable to complete the connection by the conductive bonding member 50 at the same time. For example, when the conductive bonding member 50 is a conductive adhesive that is cured by heat, the conductive adhesive 50 is interposed between the connection surfaces of the electronic components 30 to 34 and the substrate electrode 20 in the sealing step. In this state, the sheet member 100 is pressed against the substrate 10 side to electrically connect the connection surfaces of the electronic components 30 to 34 and the substrate electrode 20.

  In the curing step, when the resin sheet 110 is heated to the curing temperature or higher, the temperature is set to the curing temperature or higher and the conductive adhesive 50 or higher (for example, 150 ° C. or higher). Thereby, in this hardening process, hardening of resin sheet 110 and hardening of conductive adhesive 50 are completed.

  Further, for example, when the conductive joining member 50 is solder by heat, in the sealing step, the sheet member with the solder 50 interposed between the connection surfaces of the electronic components 30 to 34 and the substrate electrode 20. 100 is pressed to the substrate 10 side to electrically connect the connection surfaces of the electronic components 30 to 34 and the substrate electrode 20.

  In the curing step, when the resin sheet 110 is heated to the curing temperature or higher, the temperature is set to the curing temperature or higher and the melting temperature of the solder 50 or higher (for example, 180 ° C. or higher). Thereby, hardening of the resin sheet 110 and reflow and solidification of the solder 50 can be performed collectively. Thus, the electronic device of this embodiment is completed with the end of the curing process.

  By the way, according to this embodiment, the plate-shaped resin sheet 110 made of a thermosetting resin in a B-stage state and the electronic components 30 to 34 embedded in the resin sheet 110 are provided, and the electronic components 30 to 34 are provided. A sheet member 100 is provided in which a connection surface with the outside is exposed on one plate surface 111 of the resin sheet 110.

  In this embodiment, such a sheet member 100 is used and mounted on one surface 11 of the substrate 10 to connect the connection surfaces of the electronic components 30 to 34 exposed from the resin sheet 110 and the substrate electrode 20. By doing so, mounting the electronic components 30 to 34 in a sealed state is realized.

  At the same time, when the electronic components 30 to 34 are mounted, the resin sheet 110 of the B stage is pressed against the substrate 10 to be deformed and attached to a portion between the substrate electrodes 20 on the one surface 11 of the substrate 10. Thus, since the connection portion between the connection surfaces of the electronic components 30 to 34 and the substrate electrode 20 is sealed with the resin sheet 110, the connection portion is sealed.

  Therefore, according to the present embodiment, the mounting of the electronic components 30 to 34 and the sealing of the electronic components 30 to 34 and the connection portion between the electronic components 30 to 34 and the substrate electrode 20 by the sealing resin 40 are performed collectively. Yes.

(Second Embodiment)
FIG. 5 is a process diagram showing an alignment process in the method for manufacturing an electronic device according to the second embodiment of the present invention, and shows a workpiece in cross section. This embodiment is different from the first embodiment in the configuration of the connection portion between the connection surfaces of the electronic components 30 to 34 and the substrate electrode 20, and here, the difference will be mainly described. And

  As shown in FIG. 5, in this embodiment, conductive bumps 60 projecting toward the substrate electrode 20 are provided on the connection surfaces of the electronic components 30 to 34 in the prepared sheet member 100. The bump 60 is made of solder, Au, or the like.

  In the alignment step, one plate surface 111 of the resin sheet 110 in the sheet member 100 and one surface 11 of the substrate 10 are opposed to each other and are connected to the bumps 60 on the connection surfaces of the electronic components 30 to 34. The substrate electrode 20 is aligned.

  Subsequently, in the sealing step, the sheet member 100 is pressed against the substrate 10 side as described above, whereby the connection surfaces of the electronic components 30 to 34 and the substrate electrode 20 are electrically connected via the bumps 60 and the conductive bonding member 50. In addition, the resin sheet 110 is deformed and attached to a portion between the substrate electrodes 20 on the one surface 11 of the substrate 10.

  As a result, the resin sheet 110 is adhered to the portion between the substrate electrodes 20 of the one surface 11 of the substrate 10 between the substrate electrodes 20, and as a result, the connection surfaces of the electronic components 30 to 34 and the substrate electrode 20. Is electrically sealed with a resin sheet 110. Here, the electrical connection portion is configured by the connection surfaces of the electronic components 30 to 34, the bumps 60, and the substrate electrode 20.

  Thereafter, in the same manner as described above, the curing process is performed, the resin sheet 110 is completely cured, and the connection by the conductive bonding member 50 is completed at the same time, whereby the electronic device of this embodiment is completed. The electronic device of the present embodiment has a configuration in which bumps 60 are interposed between the electronic components 30 to 34 and the substrate electrode 20 in FIG.

  According to this embodiment, in the prepared sheet member 100, the bump 60 protrudes from one plate surface 111 of the resin sheet 110, so that the connection surfaces of the electronic components 30 to 34 and the one plate surface 111 are arranged. Is easier to connect to the substrate electrode 20 than in the case where they are on the same plane.

  FIG. 6 is a process diagram showing another example of the alignment process of the manufacturing method of the electronic device according to the second embodiment, and shows the workpiece in cross section. In the example shown in FIG. 5, the bumps 60 are provided on the sheet member 100 side, that is, on the electronic components 30 to 34 side, but the bumps 60 may be provided on the substrate electrode 20 side as in the example of FIG. 6.

  In this case, in the prepared substrate 10, bumps 60 made of solder, Au, or the like are provided on the substrate electrode 20, and the conductive bonding member 50 is disposed thereon. In this state, as shown in FIG. 6, in the alignment step, one plate surface 111 of the resin sheet 110 in the sheet member 100 and the one surface 11 of the substrate 10 are opposed to each other, and the electronic components 30 to 34. The connection surface and the bump 60 of the substrate electrode 20 connected to the connection surface are aligned.

  Subsequently, in the sealing process, in the same manner as described above, the connection surfaces of the electronic components 30 to 34 and the substrate electrode 20 are electrically connected via the bumps 60 and the conductive bonding members 50, and the electronic components 30 to 34 are connected. The electrical connection portion constituted by the connection surface 34, the bump 60 and the substrate electrode 20 is sealed with the resin sheet 110. The subsequent curing process is the same as described above.

  According to the present embodiment, in the prepared substrate 10, the bumps 60 further protrude from the substrate electrode 20, so that the connection to the substrate electrode 20 is facilitated.

(Third embodiment)
FIG. 7 is a process diagram showing an alignment process of the method for manufacturing an electronic device according to the third embodiment of the present invention, and shows a work in section. In this embodiment, the difference from the first embodiment will be mainly described.

  As shown in FIG. 7, in the present embodiment, in the prepared sheet member 100, a connection surface side portion of the electronic components 30 to 34 is protruded from the resin sheet 110, thereby connecting the connection surfaces of the electronic components 30 to 34. Is made to protrude from one plate surface 111 of the resin sheet 110.

  In such a state, for example, the depth of the recess 113 is adjusted in the first forming method shown in FIG. 2, or the degree of the resin sheet 110 is adjusted in the second forming method shown in FIG. This is easily realized.

  Then, in the same manner as described above, the alignment step and the sealing step are performed. At this time, the connection portion between the connection surface of the electronic components 30 to 34 and the substrate electrode 20 protrudes from one plate surface 111 of the resin sheet 110. The connection surface and the substrate electrode 20 are configured. Then, if the curing step similar to the above is performed, an electronic device similar to that shown in FIG. 1 is completed also in this embodiment.

  Thus, according to the manufacturing method of the present embodiment, the connection surface of the electronic components 30 to 34 protrudes from the one plate surface 111 of the resin sheet 110, and the connection surface and the one plate surface 111 are formed. Compared to the case of being in the same plane, connection to the substrate electrode 20 is facilitated. In the present embodiment, the bumps of the second embodiment may be further provided on the connection surfaces of the protruding electronic components 30 to 34, or the bumps may be provided on the substrate 10 side.

(Fourth embodiment)
FIG. 8 is a process diagram showing an alignment process of the method for manufacturing an electronic device according to the fourth embodiment of the present invention, and shows a workpiece in cross section.

  As in the present embodiment, in the alignment step, a non-conductive sheet 70 made of NCF (non-conductive film, non-conductive film) is provided in advance on one surface 11 of the substrate 10, and this non-conductive sheet 70 is provided. Alternatively, the sheet member 100 and the substrate 10 may be bonded together. In this case, the connection surfaces of the electronic components 30 to 34 and the substrate electrode 20 are connected through the non-conductive sheet 70.

  This is an effective method because the non-conductive sheet 70 functions as an underfill when the underfill property of the portion immediately below the electronic components 30 to 34 by the sealing resin 40 cannot be secured. This non-conductive sheet 70 may be provided on all electronic components or only on necessary electronic components. Needless to say, this embodiment can be applied in combination with the above-described embodiments.

(Fifth embodiment)
FIG. 9 is a schematic sectional view showing an electronic apparatus according to the fifth embodiment of the present invention. In this embodiment, the difference from the first embodiment will be mainly described.

  As shown in FIG. 9, in the present embodiment, in the prepared sheet member 100, the other plate surface opposite to the one plate surface 111 where the connection surface of the electronic components 30 to 34 in the resin sheet 110 is exposed. A metal sheet 80 is attached to 112. The metal sheet 80 is made of Cu, Al, or the like, and is attached and fixed by the tack force of the resin sheet 110.

  According to this, since the adhesive portion of the other plate surface 112 of the resin sheet 110 is covered with the metal sheet 80, when the sheet member 100 is handled during the manufacturing process, the adhesive portion does not stick to the adhesive portion. It will be excellent in handling. Further, if the metal sheet 80 is left as it is in the completed electronic device, the heat capacity of the device is increased and the heat dissipation is excellent, and the effect of shielding against noise can be expected.

  In addition, since the metal sheet 80 is affixed on the other plate surface 112 of the resin sheet 110 in the sheet member 100, the fifth embodiment is combined with each of the above embodiments in addition to the first embodiment. Can be applied.

(Sixth embodiment)
FIG. 10 is a schematic sectional view showing an electronic apparatus according to the sixth embodiment of the present invention. In this embodiment, the difference from the first embodiment will be mainly described.

  In the first embodiment, the back electrode 21 on the other surface 12 of the substrate 10 is electrically connected to the outside. However, as in the electronic device of the present embodiment, it is further connected to the outside. Connection may be made by the connection terminal frame 90. In this case, the connection to the outside may be performed only by the connection terminal frame 90, and the back electrode 21 may not be used or may be omitted.

  As shown in FIG. 10, the frame 90 is held by the sealing resin 40 in the same manner as the other electronic components 30 to 34, and is fixed to the substrate 10 with a part protruding from the sealing resin 40. Yes. Specifically, the frame 90 is electrically connected to the substrate electrode 20 through the conductive bonding member 50 in the sealing resin 40.

  In this case, the frame 90 may be mounted on the substrate 10 in a state of being integrated with the resin sheet 110 as the sheet member 100 as in the case of the electronic components 30 to 34, or in a state where the frame 90 is mounted on the substrate 10 in advance. Thus, the sheet member 100 may be attached and the frame 90 may be sealed with the resin sheet 110.

  In addition, since the sixth embodiment has a configuration in which the frame 90 is added, the sixth embodiment can be applied in combination with the above-described embodiments in addition to the first embodiment.

(Seventh embodiment)
FIG. 11 is a schematic cross-sectional view showing an electronic device according to a seventh embodiment of the present invention. In this embodiment, the difference from the first embodiment will be mainly described.

  In the first embodiment, electrical connection with the outside is performed by the back electrode 21 on the other surface 12 of the substrate 10. On the other hand, in this embodiment, as shown in FIG. 11, the sealing resin 40 is disposed in a state in which a part of the one surface 11 is exposed instead of the entire one surface 11 of the substrate 10. The substrate electrode 20 positioned is configured as a terminal for connecting to the outside.

  In this case, the connection terminal frame 90 shown in the sixth embodiment is further connected to the substrate electrode 20 as the external connection terminal, and the external connection is made through the frame 90. It may be.

  In the seventh embodiment, a part of one surface 11 of the substrate 10 is exposed from the sealing resin 40, and the substrate electrode 20 located in the exposed portion is used as an external connection terminal. In addition to forms, the present invention can be applied in combination with the above embodiments.

(Eighth embodiment)
FIG. 12 is a schematic sectional view showing an electronic apparatus according to the eighth embodiment of the present invention. In the present embodiment, two electronic devices of the first embodiment are stacked and integrated. In FIG. 12, the arrangement of the electronic devices 30 to 34 and the arrangement of the internal wiring 22 of the substrate 10 are different from those in FIG. 1 of the first embodiment, but the basic configuration is the same.

  In this embodiment, as shown in FIG. 12, both electronic devices are bonded to each other on the surface of the sealing resin 40 in each electronic device opposite to the substrate 10. The electrical connection between the two substrates 10 is performed by using the connection post 100 provided on the substrate electrode 20 of the substrate 10 or the electronic component.

  The post 100 is for electrically connecting the two substrates 10 beyond both the sealing resins 40, and the post 100 extending from one substrate 10 side and the post 100 extending from the other substrate 10 side are: It may be in contact at the interface between the two sealing resins 40 or may be a single one extending from the one to the other.

  And the structure of this embodiment is formed as follows. First, two sets of the sheet member 100 and the substrate 10 to be connected to each other are prepared, and for each of these sets, the alignment process and the sealing process are performed in the same manner as described above. A connection structure formed by connecting the substrates 10 is formed.

  Thereafter, the other plate surface 112 of the resin sheet 110 in one connection structure and the other plate surface 112 of the resin sheet 110 in the other connection structure are bonded together. At this time, as described above, when the number of the posts 100 is two, both the posts 100 are brought into contact with each other at the interface between the both resin sheets 110. As described above, in the case of the single post 100, the post 100 protruding from one side What is necessary is just to insert a part in the other resin sheet.

  Subsequently, when the same curing process is performed on both connection structures, the electronic device of this embodiment shown in FIG. 12 is completed.

(Ninth embodiment)
FIG. 13 is a schematic sectional view showing an electronic device according to the ninth embodiment of the present invention. This embodiment uses the same sheet member 100 on the other surface 12 side of the substrate 10 as the one surface 11 side of the substrate 10 with respect to the electronic device of the first embodiment. , 32, 33, and 34 are mounted and sealed with a sealing resin 40.

  As shown in FIG. 13, in this embodiment, on the other surface 12 side of the substrate 10, the electronic components 30, 32, 33, 34 are formed on the back electrode 21 as the substrate electrode on the other surface 12 of the substrate 10. These electronic components and their electrical connection portions are sealed with a sealing resin 40 through a conductive bonding member 50.

  The configuration on the other surface 12 of the substrate 10 is formed as follows. Similarly to the above, a sheet member 100 in which the electronic components 30, 32, 33, and 34 are embedded in the resin sheet 110 is prepared. Each electronic component is connected to the back electrode 21 of the surface 12 via the conductive bonding member 50, and the electrical connection portion is sealed with the resin sheet 110.

  Thereafter, similarly to the above, the curing step is performed, the resin sheet 110 is completely cured, and the connection by the conductive bonding member 50 is completed at the same time. By performing these steps on the one surface 11 side and the other surface 12 side of the substrate 10, the electronic device of the present embodiment is completed. The electrodes 20 and 21 on both surfaces 11 and 12 of the substrate 10 are electrically connected by the internal wiring 22.

(10th Embodiment)
FIG. 14 is a schematic sectional view showing an electronic apparatus according to the tenth embodiment of the present invention. In the present embodiment, like the eighth embodiment, two electronic devices of the first embodiment are stacked and integrated, but the stacking method is different.

  As shown in FIG. 14, in this embodiment, the other surface 12 of the substrate 10 in the other electronic device is bonded to the surface of the sealing resin 40 in one electronic device opposite to the substrate 10. ing.

  Also here, the electrical connection between the two substrates 10 is performed between the substrate electrode 20 of one substrate 10 and the back electrode 21 of the other substrate 10, or between the electronic component on one substrate 10 and the other substrate 10. The connection post 100 is used to connect the back electrode 21 to the back electrode 21.

  In such an electronic device of the present embodiment, after the alignment process and the sealing process are performed on each of the one substrate 10 and the other substrate 10, the other surface 112 of the resin sheet 110 on the one substrate 10. In addition, the other surface 12 of the other substrate 10 is attached, and then a curing process is performed.

  In this case, FIG. 14 shows a configuration in which two substrates 10 are stacked. However, by performing a similar stacking process, three, four,... May be stacked.

(Eleventh embodiment)
FIG. 15 is a process diagram showing a method for manufacturing an electronic device according to an eleventh embodiment of the present invention, and FIG. 16 is a process diagram showing a method for manufacturing an electronic device following FIG. Each workpiece is shown in cross section.

  Each of the above-described embodiments may be performed for each of the substrates 10, but as in the present embodiment, the sheet member 100 in a multiple state is also used for the multiple state substrate 10. After that, these may be divided into units of one electronic device to form an electronic device.

  Specifically, as shown in FIG. 15, a multiple-state substrate 10 in which a plurality of substrates are integrally connected is prepared, while an electronic component corresponding to the multiple-state substrate 10 is prepared. A sheet member 100 in which 30 to 34 are embedded in the resin sheet 110 is prepared. Then, using these both 10 and 100, the same alignment process and sealing process as described above are performed.

  Next, after subjecting this to the same curing process as described above, as shown in FIG. 16A, this is divided into individual electronic device units along the dicing line DL by dicing cut. Thereby, as shown in FIG. 16B, a plurality of electronic devices are completed. In this case, dicing cut may be performed before the curing process, and the curing process may be performed on the separated workpiece.

(Twelfth embodiment)
FIG. 17 is a process diagram showing an alignment process of the electronic device manufacturing method according to the twelfth embodiment of the present invention, and shows a workpiece in cross section. In this embodiment, the difference from the first embodiment will be mainly described.

  As shown in FIG. 17, in this embodiment, a protrusion 114 formed by projecting a part of the resin sheet 110 is provided on one surface 111 of the resin sheet 110 in the sheet member 100, and at the same time, the protrusion 114 is provided with the protrusion 114. On one surface 11 of the corresponding substrate 10, a recess 10a into which the projection 114 is fitted is formed. For example, the protrusion 114 is columnar, and the recess 10a is a columnar hole.

  As a result, in the alignment step and the sealing step, the projection 114 and the recess 10a are used for alignment, and if the projection 114 is inserted into the recess 10a, the sheet member 100 and the substrate 10 are desired. It can be easily assembled at the position.

  In the twelfth embodiment, the alignment projection 114 is formed on the one surface 111 of the resin sheet 110 in the prepared sheet member 100, and the corresponding concave portion 10a is also provided on the one surface 11 side of the substrate 10. Therefore, in addition to the first embodiment, the present invention can be applied in combination with each of the above embodiments.

(13th Embodiment)
FIG. 18 is a schematic plan view showing the main part of the electronic device according to the thirteenth embodiment of the present invention. 18A is a schematic plan view of the substrate electrode 20 on the one surface 11 of the substrate 10, and FIG. 18B is a schematic plan view showing a state in which the electronic device 30 is mounted on the substrate electrode 20 of FIG. .

  In each of the above-described embodiments, the interval between adjacent electronic components is constrained by the B-stage resin sheet 110 in the sheet member 100. Therefore, since the interval L between the electronic components 30 shown in FIG. 18B can be as small as possible, high-density mounting of the electronic components on the one surface 11 of the substrate 10 is possible.

(14th Embodiment)
FIG. 19 is a process diagram showing an alignment process of an electronic device manufacturing method according to a fourteenth embodiment of the present invention, and shows a workpiece in cross section. This embodiment is different from the first embodiment in the configuration of the resin sheet 110, and here, the difference will be mainly described.

  As shown in FIG. 19, in the present embodiment, the prepared resin sheet 110 includes a first resin 110a located on the other surface 112 side in the thickness direction and a second resin located on the one surface 111 side. 110b is laminated.

  Here, the first and second resins 110a and 110b are both thermosetting resins, but the first resin 110a has a lower curing temperature than the second resin 110b. Such a difference in curing temperature can be easily realized by adjusting the type and amount of the curing catalyst in a general thermosetting resin such as an epoxy resin.

  In the present embodiment, the sheet member 100 is formed by embedding the electronic components 30 to 34 using the resin sheet 110 made of such two layers of resin. At this time, the part of the electronic components 30 to 34 on the connection surface side is embedded in the second resin 110b, and the part of the electronic components 30 to 34 opposite to the connection surface is embedded in the first resin 110a. .

  As the sheet member 100 used in the alignment step, the second resin 110b is a B stage, and the first resin 110a is a completely cured C stage. This can be easily realized by the difference in the curing temperatures of the first and second resins 110a and 110b.

  Specifically, a resin sheet 110 in which both resins 110a and 110b are both B stages is prepared, and the electronic components 30 to 34 may be embedded in the resin sheet 110 by the same method as in the first embodiment. .

  And in such a sheet | seat member 100, since the 1st resin 110a is fully hardened, the electronic components 30-34 are restrained by this 1st resin 110a, and the connection surface of the electronic components 30-34 Since the second resin 110b on the side is a B stage, the resin sheet 110 at the electrical connection portion between the connection surface of the electronic components 30 to 34 and the substrate electrode 20 in the sealing step is the same as in the above embodiments. Sealing can be performed easily.

  That is, according to the present embodiment, the positions of the electronic components 30 to 34 can be reliably fixed by the first resin 110a in the resin sheet 110 in the alignment step and the sealing step. It is possible to prevent the positional deviation of .about.34 more reliably. Of course, this embodiment can be combined with each of the above embodiments.

(Other embodiments)
In each of the above embodiments, the electrical connection between the connection surfaces of the electronic components 30 to 34 and the substrate electrode 20 is performed via the conductive bonding member 50 such as solder or conductive adhesive. For example, electrical connection by solid phase bonding or the like may be performed in a state where the connection surfaces of the electronic components 30 to 34 and the substrate electrode 20 are in direct contact.

If this is also possible, even when connecting via the bump 60 described above, by direct contact between the bump 60 and the substrate electrode 20 or direct contact between the bump 60 and the connection surface of the electronic component, Electrical connection may be made,
In each of the above embodiments, there are a plurality of electronic components. However, a single electronic component may be used, and in that case as well, the effect of each of the above embodiments is exhibited.

DESCRIPTION OF SYMBOLS 10 Board | substrate 11 One side of board | substrate 12 Board | substrate other side 20 Board | substrate electrode 30 Electronic component 31 Electronic component 32 Electronic component 33 Electronic component 34 Electronic component 40 Sealing resin 60 Bump 100 Sheet member 110 Resin sheet 111 One board surface 112 of resin sheet The other surface of the resin sheet 113

Claims (5)

An electronic component (30) is mounted on the one surface (11) of the substrate (10) having the substrate electrode (20) on the one surface (11), and the electronic component (30 to 34) and the substrate electrode (20) are mounted. And electrically connecting the electronic components (30-34) with a sealing resin (40) on one surface (11) of the substrate (10),
The electronic component (30-34) is embedded in a plate-shaped resin sheet (110) made of a thermosetting resin in a B-stage state, and the substrate electrode (20) in the electronic component (30-34) is embedded. A sheet member formed by exposing a connection surface at one plate surface (111) of the resin sheet (110) and attaching a metal sheet (80) to the other plate surface (112) of the resin sheet (110). 100)
Preparing the substrate (10);
One plate surface (111) of the resin sheet (110) in the sheet member (100) and one surface (11) of the substrate (10) are opposed to each other, and one plate surface ( 111) performing an alignment step of aligning the connection surfaces of the electronic components (30 to 34) exposed at 111) and the substrate electrodes (20) connected thereto,
Then, by the sheet member (100) pressed into the substrate (10) side, as well as electrically connecting the said connection surface and the substrate electrode of the electronic component (30 to 34) (20), wherein The resin sheet (110) is deformed so as to be pushed into the one surface (11) side of the substrate (10) between the substrate electrodes (20), and the one of the one surfaces (11) of the substrate (10) -out paste at a site between the substrate electrode (20), wherein a part other than the substrate electrode (20) of the portion immediately below the electronic part (30 to 34), wherein the resin sheet (110) such that wrap around the deformed doing, a sealing step of sealing the connection part between the between the connecting surface the substrate electrode (20) in the resin sheet (110),
Thereafter, the resin sheet (110) is heated to a temperature equal to or higher than its curing temperature to be completely cured, and a curing process is performed using the cured resin sheet (110) as the sealing resin (40). A method for manufacturing an electronic device. Conductive bumps projecting from one of the connection surfaces of the electronic components (30 to 34) and the substrate electrode (20) connected to the connection surface to the other side connected to the one of the substrate electrodes (20) (60) is provided, and the connection surface and the substrate electrode (20) are electrically connected via the bump (60),
A connection portion between the connection surface of the electronic component (30 to 34) and the substrate electrode (20) is configured by the connection surface, the bump (60), and the substrate electrode (20). A method for manufacturing an electronic device according to claim 1. In the prepared sheet member (100), the connection surface of the electronic components (30 to 34) is left in a state of protruding from one plate surface (111) of the resin sheet (110),
A connection portion between the connection surface of the electronic component (30 to 34) and the substrate electrode (20) includes the connection surface protruding from one plate surface (111) of the resin sheet (110) and the substrate electrode (20). 3. The method of manufacturing an electronic device according to claim 1, wherein: In the step of embedding the electronic components (30 to 34) inside the resin sheet (110), the resin sheet (110) made of a thermosetting resin in a B stage state corresponds to the electronic components (30 to 34). The electronic component (30-34) is placed in the recess (113), and the electronic component (30-34) is placed in the recess (113) by the tack force of the resin sheet (110). 110. The method of manufacturing an electronic device according to any one of claims 1 to 3 , wherein the electronic device is fixed to 110). In the step of embedding the electronic components (30 to 34) inside the resin sheet (110), the resin sheet (110) made of a thermosetting resin in a B-stage state is used as the electronic component (30 to 34). the connecting surfaces against the said from the opposite side electronic components (30 to 34), wherein the resin sheet (110) to the electronic component according to claim 1 to 3, characterized in that sink into the (30-34) The manufacturing method of the electronic device as described in any one.

Images