JP2014095719A - 半導体における周期構造の実時間分析 - Google Patents
半導体における周期構造の実時間分析 Download PDFInfo
- Publication number
- JP2014095719A JP2014095719A JP2013267269A JP2013267269A JP2014095719A JP 2014095719 A JP2014095719 A JP 2014095719A JP 2013267269 A JP2013267269 A JP 2013267269A JP 2013267269 A JP2013267269 A JP 2013267269A JP 2014095719 A JP2014095719 A JP 2014095719A
- Authority
- JP
- Japan
- Prior art keywords
- model
- theoretical
- width
- periodic structure
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000000737 periodic effect Effects 0.000 title claims abstract description 59
- 239000004065 semiconductor Substances 0.000 title description 3
- 238000010223 real-time analysis Methods 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 79
- 238000005259 measurement Methods 0.000 claims abstract description 53
- 230000003287 optical effect Effects 0.000 claims abstract description 34
- 230000004044 response Effects 0.000 claims abstract description 18
- 230000008569 process Effects 0.000 claims abstract description 14
- 239000000523 sample Substances 0.000 claims description 46
- 230000004048 modification Effects 0.000 claims description 5
- 238000012986 modification Methods 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 4
- 230000003595 spectral effect Effects 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- 238000012937 correction Methods 0.000 claims description 2
- 238000004364 calculation method Methods 0.000 abstract description 38
- 230000005855 radiation Effects 0.000 abstract description 3
- 238000004458 analytical method Methods 0.000 description 9
- 238000013459 approach Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000006978 adaptation Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000013074 reference sample Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000012804 iterative process Methods 0.000 description 1
- 238000010606 normalization Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000611 regression analysis Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000002798 spectrophotometry method Methods 0.000 description 1
- 238000000391 spectroscopic ellipsometry Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/21—Polarisation-affecting properties
- G01N21/211—Ellipsometry
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
Abstract
【解決手段】波 長の関数としての信号を発生させる分光計測モジュールがを使用する。出力信号はプロセッサーにより長方形構造の理論的な初期モデルを構築する。次いで、プロ セッサーは、この試料の広帯域放射に対する理論的な光学的応答を計算する。光学的応答の計算結果は、複数の波長において計測され正規化された値と比較され る。この比較に基づいて、モデルの構成は実際の計測された構造により近づくよう修正される。プロセッサーは修正されたモデルの光学的応答を再計算し、計算 結果を正規化されたデータと比較する。最適な方形が得られるまでこの処理が反復して繰り返される。その後、モデルを各々幅と高さを持つ層に分割しモデルの 複雑さを反復して増大させる。構造が周期構造に類似するような最適なモデルが得られるまで、反復処理によりデータが最適化される。
【選択図】図1
Description
この要求に答えるために、実時間ベースで周期構造の特性の高精度な解析を可能とするシステムを開発した。本発明の第1の特徴は、高度な精度を維持しながら 計算の効率を上げる改善された分析方法を開発したことである。本発明のこの特徴では、構造の理論モデルが作られた。この最初のモデルは、長方形の単一の高さと幅を持つものが好ましい。マクスウェルの方程式を用いて、このモデルによる検出された放射との相互の反応が計算される。反応についての計算結果は、測定結果と比較される。この比較に基づいて、モデルの変数は、最も計測データに適合する計算データを生成する長方形を生み出すまで反復修正される。
図2は、 周期構造を持った試料8のスキャタロメータによる計測を実施するためのシステム16のブロック図である。この発明の公開の目的として、周期構造とは、あらゆる繰り返しの形態を持つものをいい、この形態の大きさは、少なくとも光の一部は鏡面からの反射ではなく散乱するような試料の探査用の光線と同じか又は小さい。
Claims (29)
- 光学的測定データに基づいて周期構造の表面プロファイルを特徴付ける方法であって、前記周期構造は、垂直高さ及び幅を有する要素を含み、水平軸において変化でき、前記方法は、
前記光学的データに最良の適合を与える周期構造の要素についての理論的高さ及び幅を有する長方形モデルを決定し、
決定された長方形モデルを用いて第2のモデルを導き、この第2のモデルは底部幅とは異なる上部幅を有し、かつ、少なくとも二つの層を含み、その少なくとも二つの層の各々の高さ及び幅を反復的に修正して前記光学的測定データとの最良の適合を決定し、
付加的な理論的中間幅及び層を、適合性のレベルが所定のレベルに達するまで、反復最良適合性処理における第2のモデルへ加えることを含む方法。 - 請求項1の方法において、第2のモデルはスプライン・アルゴリズムを用いて定式化される方法。
- 請求項2の方法において、第2のモデルはキュービック・スプラインを有する方法。
- 請求項2の方法において、スプライン点はシグモイド関数を用いて割り当てられる方法。
- 光学的測定データに基づいて周期構造の表面プロファイルを特徴付ける方法であって、前記周期構造は、垂直高さ及び幅を有する要素を含み、水平軸において変化でき、前記方法は、
前記光学的データに最良の適合を与える周期構造の要素の長方形モデルの理論的高さ及び幅を決定し、
底部幅とは異なる上部幅を有し、かつ、少なくとも二つの層を含む第2のモデルに対する最良の適合長方形モデルを修正して、前記光学的測定データとの最良の適合を決定し、
付加的な理論的中間幅及び層を、適合性のレベルが所定のレベルに達するまで、反復最良適合プローブへ加えることにより前記修正段階を繰り返し、
第2のモデルをスプライン・アルゴリズムを用いて定式化し、
スパイラル点の間の薄片の数はd/nに等しく、ここでd=∫du|dw/du|、wは高さuの関数としての幅であり、nは第2のモデルにおける薄片の総数である方法。 - 光学的測定データに基づいて周期構造の表面プロファイルを特徴付ける方法であって、前記周期構造は、垂直高さ及び幅を有する要素を含み、水平軸において変化でき、前記方法は、
二つよりも多くない異なる幅と少なくとも一つの層とを有する第1の理論的モデルを規定し、その理論的モデルを前記周期構造の要素についての光学的測定データとの最良の適合を見つけるように修正し、
後続のモデルを導き、その各々は増大する数の理論的層を有し、適合アルゴリズムを用いて、後続理論的モデルの一つが、前記周期構造の形態を所定の適合レベルに近似させる構造を規定するまで、前記理論的層の各々の高さ及び幅を反復的に調整する方法。 - 請求項6の方法において、第2のモデルはスプライン・アルゴリズムを用いて定式化される方法。
- 請求項6の方法において、第2のモデルはキュービック・スプラインを有する方法。
- 請求項6の方法において、スプライン点はシグモイド関数を用いて割り当てられる方法。
- 光学的測定データに基づいて周期構造の表面プロファイルを特徴付ける方法であって、前記周期構造は、垂直高さ及び幅を有する要素を含み、水平軸において変化でき、前記方法は、
二つよりも多くない異なる幅と少なくとも一つの層とを有する第1の理論的モデルを規定し、その理論的モデルを前記周期構造の要素についての光学的測定データとの最良の適合を見つけるように修正し、
適合アルゴリズムを用いて、前記理論的モデルが、前記周期構造の形態を所定の適合レベルに近似させる構造を規定するまで、前記幅の数を反復的に増大し、
前記理論的モデルをスプライン・アルゴリズムを用いて定式化し、
スパイラル点の間の薄片の数はd/nに等しく、ここでd=∫du|dw/du|、wは高さuの関数としての幅であり、nは前記理論的モデルにおける薄片の総数である方法。 - 光学的測定データに基づいて周期構造の表面プロファイルを特徴付ける方法であって、前記周期構造は、垂直高さ及び幅を有する要素を含み、水平軸において変化でき、前記方法は、
(a)前記周期構造の要素についての理論的幅及び高さ有する第1の理論的モデルを規定し、その第1の理論的モデルの光学的応答を計算し、その応答を前記光学的測定データと比較し、
(b)第1の理論的モデルの前記理論的幅及び高さを反復的に修正し、その修正された第1の理論的モデルの光学的応答を計算し、この応答を、適合性の所定のレベルに達するまで、光学的測定データと比較し、
(c)段階(b)において得られた修正された第1の理論的モデルから導かれた一つよりも多くの幅と一つよりも多くの層とを有する第2の理論的モデルを規定し、この第2の理論的モデルの光学的応答を計算し、この応答を前記光学的測定データと比較し、
(d)第2の理論的モデルの前記幅、層厚、及び層位置を反復的に修正し、この修正された第2の理論的モデルの光学的応答を計算し、この応答を、適合性の所定のレベルに達するまで、前記光学的測定データと比較し、
(e)適合性のレベルが所定のレベルに達するまで、幅及び層を前記修正された第2の理論的モデルに加えることにより、段階(c)及び(d)を反復する方法。 - 請求項11の方法において、前記周期構造の前記光学的応答の計算段階が厳密結合波理論を用いて実行される方法。
- 請求項11の方法において、前記修正された第2の理論的モデルにおける層の数は、少なくとも2Y−1であるが2Y+1よりは多くなく、ここでYは幅の数である方法。
- 請求項11の方法において、前記修正された第2の理論的モデルにおける各層は、長方形状である方法。
- 請求項11の方法において、前記周期構造を含むサンプルに適用し、前記サンプルは一つよりも多くの物理的層を有し、前記修正された第2の理論的モデルを修正する段階の間、前記理論的層は前記サンプルの前記物理的層構造により拘束される方法。
- 請求項11の方法において、第2のモデルはスプライン・アルゴリズムを用いて定式化される方法。
- 請求項16の方法において、第2のモデルはキュービック・スプラインを有する方法。
- 請求項16の方法において、スプライン点はシグモイド関数を用いて割り当てられる方法。
- 請求項16の方法において、スパイラル点の間の薄片の数はd/nに等しく、ここでd=∫du|dw/du|、wは高さuの関数としての幅であり、nは前記理論的モデルにおける薄片の総数である方法。
- サンプルに形成された周期構造の特性を解析するための装置であり、
周期構造で反射するように指向された広帯域探査ビームと、複数の波長における前記広帯域探査ビームの振幅と位相との変化の一方を測定して、それに対応する出力信号を発生する検出モジュールとを含む分光計測システムと、
前記分光計測システムにより発生した前記出力信号を用いて、前記分光計測システムによりなされた計測に最良の適合を与える前記周期構造の要素についての理論的高さ及び幅を有する長方形モデルを決定するプロセッサーシステムとを備え、このプロセッサーシステムは、前記決定された長方形モデルを用いて第2のモデルを導き、その第2のモデルは、底部幅とは異なる上部幅を有し、かつ、少なくとも二つの層を含み、このプロセッサーシステムは、前記少なくとも二つの層の各々の高さ及び幅を反復的に修正して、前記分光計測システムによりなされた測定との最良の適合を判定する能力があると共に、付加的な理論的中間幅及び層を、適合性のレベルが所定のレベルに達するまで、反復最良適合処理における第2のモデルへ加える方法。 - 請求項20の装置において、前記分光計測システムは、分光反射率計と分光エリプソメータとのうちの一方である装置。
- 請求項20の装置において、第2のモデルはスプライン・アルゴリズムを用いて定式化される装置。
- 請求項20の方法において、第2のモデルはキュービック・スプラインにより定式化される装置。
- サンプルに形成された周期構造の特性を解析するための装置であり、
周期構造で反射するように指向された広帯域探査ビームと、複数の波長における前記広帯域探査ビームの振幅又は位相との変化の何れかを測定して、それに対応する出力信号を発生する検出モジュールとを含む分光計測システムと、
前記出力信号に基づいて前記周期構造の前記特性を評価するプロセッサーシステムとを備え、そのプロセッサーシステムは、二つよりも多くない幅と少なくとも一つの層とを有する第1の理論的モデルを規定し、かつ、その第1の理論的モデルを修正して、前記周期構造の要素についての前記分光計測システムによりなされた前記計測との最良の適合を見つけると共に、後続のモデルを導き、この後続のモデルの各々は増大する数の理論的層を有し、適合アルゴリズムを用いて、前記理論的層の各々の高さ及び幅を、前記後続の理論的モデルの一つが前記周期構造の形態を所定の適合レベルへ近似させるまで、反復的に調整する装置。 - 請求項24の装置において、前記分光計測システムは、分光反射率計と分光エリプソメータとのうちの一方である装置。
- 請求項24の装置において、各々の後続モデルはスピン・アルゴリズムを用いて定式化され、スパイラル点の間の薄片の数はd/nに等しく、ここでd=∫du|dw/du|、wは高さuの関数としての幅であり、nは前記理論的モデルにおける薄片の総数である装置。
- 請求項24の装置において、各々の後続モデルにおける層の数は、少なくとも2Y−1であるが2Y+1よりは多くなく、ここでYは幅の数である装置。
- 請求項24の装置において、各々の後続モデルにおける各層は、長方形状である装置。
- 請求項24の装置において、前記サンプルは一つよりも多くの物理的層を有し、後続のモデルの修正の間、前記理論的層は前記サンプルの前記物理的層構造により拘束される装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/906,290 US6704661B1 (en) | 2001-07-16 | 2001-07-16 | Real time analysis of periodic structures on semiconductors |
US09/906,290 | 2001-07-16 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011020410A Division JP2011123082A (ja) | 2001-07-16 | 2011-02-02 | 半導体における周期構造の実時間分析 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014095719A true JP2014095719A (ja) | 2014-05-22 |
JP5991960B2 JP5991960B2 (ja) | 2016-09-14 |
Family
ID=25422205
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003514342A Pending JP2004536314A (ja) | 2001-07-16 | 2002-06-17 | 半導体における周期構造の実時間分析 |
JP2011020410A Pending JP2011123082A (ja) | 2001-07-16 | 2011-02-02 | 半導体における周期構造の実時間分析 |
JP2013267269A Expired - Lifetime JP5991960B2 (ja) | 2001-07-16 | 2013-12-25 | 半導体における周期構造の実時間分析 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003514342A Pending JP2004536314A (ja) | 2001-07-16 | 2002-06-17 | 半導体における周期構造の実時間分析 |
JP2011020410A Pending JP2011123082A (ja) | 2001-07-16 | 2011-02-02 | 半導体における周期構造の実時間分析 |
Country Status (6)
Country | Link |
---|---|
US (5) | US6704661B1 (ja) |
EP (1) | EP1410110B1 (ja) |
JP (3) | JP2004536314A (ja) |
AT (1) | ATE467859T1 (ja) |
DE (1) | DE60236360D1 (ja) |
WO (1) | WO2003009063A2 (ja) |
Families Citing this family (136)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002042784A1 (en) * | 2000-11-22 | 2002-05-30 | Panduit Corp. | Network revision system with probe |
US6704661B1 (en) * | 2001-07-16 | 2004-03-09 | Therma-Wave, Inc. | Real time analysis of periodic structures on semiconductors |
US6785638B2 (en) * | 2001-08-06 | 2004-08-31 | Timbre Technologies, Inc. | Method and system of dynamic learning through a regression-based library generation process |
US7656903B2 (en) | 2002-01-30 | 2010-02-02 | Panduit Corp. | System and methods for documenting networks with electronic modules |
US7216045B2 (en) * | 2002-06-03 | 2007-05-08 | Timbre Technologies, Inc. | Selection of wavelengths for integrated circuit optical metrology |
US6919964B2 (en) * | 2002-07-09 | 2005-07-19 | Therma-Wave, Inc. | CD metrology analysis using a finite difference method |
DE10232746A1 (de) * | 2002-07-19 | 2004-02-05 | Leica Microsystems Semiconductor Gmbh | Verfahren zur Automatischen Ermittlung optischer Parameter eines Schichtstapels |
US7092110B2 (en) * | 2002-07-25 | 2006-08-15 | Timbre Technologies, Inc. | Optimized model and parameter selection for optical metrology |
US7330279B2 (en) * | 2002-07-25 | 2008-02-12 | Timbre Technologies, Inc. | Model and parameter selection for optical metrology |
US20040090629A1 (en) * | 2002-11-08 | 2004-05-13 | Emmanuel Drege | Diffraction order selection for optical metrology simulation |
WO2004046655A2 (en) * | 2002-11-20 | 2004-06-03 | Mehrdad Nikoohahad | System and method for characterizing three-dimensional structures |
US7304482B1 (en) * | 2002-12-04 | 2007-12-04 | Kay Robert L | Characterization of the nonlinearities of a display device by adaptive bisection with continuous user refinement |
US20080246951A1 (en) * | 2007-04-09 | 2008-10-09 | Phillip Walsh | Method and system for using reflectometry below deep ultra-violet (DUV) wavelengths for measuring properties of diffracting or scattering structures on substrate work-pieces |
US8564780B2 (en) | 2003-01-16 | 2013-10-22 | Jordan Valley Semiconductors Ltd. | Method and system for using reflectometry below deep ultra-violet (DUV) wavelengths for measuring properties of diffracting or scattering structures on substrate work pieces |
US7069153B2 (en) * | 2003-01-28 | 2006-06-27 | Therma-Wave, Inc. | CD metrology method |
FR2852389B1 (fr) * | 2003-03-12 | 2005-05-13 | Commissariat Energie Atomique | Procede de mesure d'objets tridimensionnels par ombroscopie optique a une seule vue |
US7064829B2 (en) * | 2003-03-20 | 2006-06-20 | Timbre Technologies, Inc. | Generic interface for an optical metrology system |
US7233390B2 (en) | 2003-03-31 | 2007-06-19 | Therma-Wave, Inc. | Scatterometry for samples with non-uniform edges |
US7145664B2 (en) * | 2003-04-18 | 2006-12-05 | Therma-Wave, Inc. | Global shape definition method for scatterometry |
US7085676B2 (en) | 2003-06-27 | 2006-08-01 | Tokyo Electron Limited | Feed forward critical dimension control |
US20050141431A1 (en) | 2003-08-06 | 2005-06-30 | Caveney Jack E. | Network managed device installation and provisioning technique |
US7265850B2 (en) * | 2003-10-23 | 2007-09-04 | International Business Machines Corporation | Fortified, compensated and uncompensated process-sensitive scatterometry targets |
US7725206B2 (en) * | 2003-11-12 | 2010-05-25 | The Boeing Company | System and method for manufacturing and after-market support using as-built data |
US7126700B2 (en) * | 2003-12-12 | 2006-10-24 | Timbre Technologies, Inc. | Parametric optimization of optical metrology model |
DE102004006258B4 (de) * | 2004-02-09 | 2007-08-02 | Infineon Technologies Ag | Verfahren zum Angleichen von zwei Messverfahren für die Messung von Strukturbreiten auf einem Substrat |
US7523076B2 (en) * | 2004-03-01 | 2009-04-21 | Tokyo Electron Limited | Selecting a profile model for use in optical metrology using a machine learning system |
US20050275850A1 (en) * | 2004-05-28 | 2005-12-15 | Timbre Technologies, Inc. | Shape roughness measurement in optical metrology |
US7212293B1 (en) | 2004-06-01 | 2007-05-01 | N&K Technology, Inc. | Optical determination of pattern feature parameters using a scalar model having effective optical properties |
US20080144036A1 (en) * | 2006-12-19 | 2008-06-19 | Asml Netherlands B.V. | Method of measurement, an inspection apparatus and a lithographic apparatus |
US7791727B2 (en) | 2004-08-16 | 2010-09-07 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
US20100036844A1 (en) * | 2004-10-21 | 2010-02-11 | Access Co., Ltd. | System and method of using conflicts to maximize concurrency in a database |
EP1810522A1 (en) * | 2004-11-03 | 2007-07-25 | Panduit Corp. | Method and apparatus for patch panel patch cord documentation and revision |
US20060109463A1 (en) * | 2004-11-22 | 2006-05-25 | Asml Netherlands B.V. | Latent overlay metrology |
US7280229B2 (en) * | 2004-12-03 | 2007-10-09 | Timbre Technologies, Inc. | Examining a structure formed on a semiconductor wafer using machine learning systems |
US7483133B2 (en) * | 2004-12-09 | 2009-01-27 | Kla-Tencor Technologies Corporation. | Multiple angle of incidence spectroscopic scatterometer system |
US7453577B2 (en) * | 2004-12-14 | 2008-11-18 | Asml Netherlands B.V. | Apparatus and method for inspecting a patterned part of a sample |
US7804934B2 (en) | 2004-12-22 | 2010-09-28 | Jordan Valley Semiconductors Ltd. | Accurate measurement of layer dimensions using XRF |
US20070091325A1 (en) * | 2005-01-07 | 2007-04-26 | Mehrdad Nikoonahad | Multi-channel optical metrology |
US7103142B1 (en) * | 2005-02-24 | 2006-09-05 | Jordan Valley Applied Radiation Ltd. | Material analysis using multiple X-ray reflectometry models |
US7443486B2 (en) * | 2005-02-25 | 2008-10-28 | Asml Netherlands B.V. | Method for predicting a critical dimension of a feature imaged by a lithographic apparatus |
US7421414B2 (en) * | 2005-03-31 | 2008-09-02 | Timbre Technologies, Inc. | Split machine learning systems |
US7315384B2 (en) * | 2005-05-10 | 2008-01-01 | Asml Netherlands B.V. | Inspection apparatus and method of inspection |
US7613124B2 (en) * | 2005-05-19 | 2009-11-03 | Panduit Corp. | Method and apparatus for documenting network paths |
US20060282529A1 (en) * | 2005-06-14 | 2006-12-14 | Panduit Corp. | Method and apparatus for monitoring physical network topology information |
US7355728B2 (en) * | 2005-06-16 | 2008-04-08 | Timbre Technologies, Inc. | Optical metrology model optimization for repetitive structures |
US7369235B1 (en) | 2005-06-24 | 2008-05-06 | Kla-Tencor Corporation | Method and system for measuring deep trenches in silicon |
US7532307B2 (en) * | 2005-06-30 | 2009-05-12 | Asml Netherlands B.V. | Focus determination method, device manufacturing method, and mask |
US20070002336A1 (en) * | 2005-06-30 | 2007-01-04 | Asml Netherlands B.V. | Metrology apparatus, lithographic apparatus, process apparatus, metrology method and device manufacturing method |
CN101268590B (zh) | 2005-08-08 | 2011-01-26 | 泛达公司 | 用于检测接插线端部连接的系统和方法 |
US7234944B2 (en) | 2005-08-26 | 2007-06-26 | Panduit Corp. | Patch field documentation and revision systems |
US7978845B2 (en) * | 2005-09-28 | 2011-07-12 | Panduit Corp. | Powered patch panel |
US20070093044A1 (en) * | 2005-10-25 | 2007-04-26 | Asml Netherlands B.V. | Method of depositing a metal layer onto a substrate and a method for measuring in three dimensions the topographical features of a substrate |
US7811119B2 (en) * | 2005-11-18 | 2010-10-12 | Panduit Corp. | Smart cable provisioning for a patch cord management system |
US7768418B2 (en) * | 2005-12-06 | 2010-08-03 | Panduit Corp. | Power patch panel with guided MAC capability |
KR101374308B1 (ko) * | 2005-12-23 | 2014-03-14 | 조르단 밸리 세미컨덕터즈 리미티드 | Xrf를 사용한 층 치수의 정밀 측정법 |
US20070153274A1 (en) * | 2005-12-30 | 2007-07-05 | Asml Netherlands B.V. | Optical metrology system and metrology mark characterization device |
US7567351B2 (en) * | 2006-02-02 | 2009-07-28 | Kla-Tencor Corporation | High resolution monitoring of CD variations |
US7480050B2 (en) * | 2006-02-09 | 2009-01-20 | Asml Netherlands B.V. | Lithographic system, sensor, and method of measuring properties of a substrate |
US7488206B2 (en) | 2006-02-14 | 2009-02-10 | Panduit Corp. | Method and apparatus for patch panel patch cord documentation and revision |
US7747424B2 (en) * | 2006-03-17 | 2010-06-29 | Kla-Tencor Corporation | Scatterometry multi-structure shape definition with multi-periodicity |
US7821650B2 (en) * | 2006-03-21 | 2010-10-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method with reduced scribe lane usage for substrate measurement |
US7486408B2 (en) * | 2006-03-21 | 2009-02-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method with reduced scribe lane usage for substrate measurement |
US7532305B2 (en) * | 2006-03-28 | 2009-05-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method using overlay measurement |
US7391513B2 (en) * | 2006-03-29 | 2008-06-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method using overlay measurement quality indication |
US20070274447A1 (en) * | 2006-05-15 | 2007-11-29 | Isaac Mazor | Automated selection of X-ray reflectometry measurement locations |
US7502103B2 (en) * | 2006-05-31 | 2009-03-10 | Asml Netherlands B.V. | Metrology tool, system comprising a lithographic apparatus and a metrology tool, and a method for determining a parameter of a substrate |
US7791724B2 (en) * | 2006-06-13 | 2010-09-07 | Asml Netherlands B.V. | Characterization of transmission losses in an optical system |
US7898662B2 (en) * | 2006-06-20 | 2011-03-01 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
US7692792B2 (en) * | 2006-06-22 | 2010-04-06 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
US7999940B2 (en) | 2006-06-30 | 2011-08-16 | Asml Netherlands B.V. | Apparatus for angular-resolved spectroscopic lithography characterization |
US7659988B2 (en) * | 2006-06-30 | 2010-02-09 | Asml Netherlands B.V. | Apparatus for angular-resolved spectroscopic lithography characterization and device manufacturing method |
US7916284B2 (en) | 2006-07-18 | 2011-03-29 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7808613B2 (en) * | 2006-08-03 | 2010-10-05 | Asml Netherlands B.V. | Individual wafer history storage for overlay corrections |
US7643666B2 (en) * | 2006-08-08 | 2010-01-05 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
US20080036984A1 (en) * | 2006-08-08 | 2008-02-14 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
US7589832B2 (en) * | 2006-08-10 | 2009-09-15 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device method |
US7564555B2 (en) * | 2006-08-15 | 2009-07-21 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
US7969577B2 (en) * | 2006-09-14 | 2011-06-28 | Asml Netherlands B.V. | Inspection apparatus, an apparatus for projecting an image and a method of measuring a property of a substrate |
US7532331B2 (en) * | 2006-09-14 | 2009-05-12 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7573584B2 (en) * | 2006-09-25 | 2009-08-11 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
US8233155B2 (en) * | 2006-10-13 | 2012-07-31 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US8294907B2 (en) * | 2006-10-13 | 2012-10-23 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7630087B2 (en) * | 2006-11-22 | 2009-12-08 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7710572B2 (en) * | 2006-11-30 | 2010-05-04 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US20080129986A1 (en) * | 2006-11-30 | 2008-06-05 | Phillip Walsh | Method and apparatus for optically measuring periodic structures using orthogonal azimuthal sample orientations |
US7557934B2 (en) * | 2006-12-07 | 2009-07-07 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US20080135774A1 (en) * | 2006-12-08 | 2008-06-12 | Asml Netherlands B.V. | Scatterometer, a lithographic apparatus and a focus analysis method |
US20080148875A1 (en) * | 2006-12-20 | 2008-06-26 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
IL180482A0 (en) * | 2007-01-01 | 2007-06-03 | Jordan Valley Semiconductors | Inspection of small features using x - ray fluorescence |
US7916927B2 (en) * | 2007-01-16 | 2011-03-29 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7619737B2 (en) * | 2007-01-22 | 2009-11-17 | Asml Netherlands B.V | Method of measurement, an inspection apparatus and a lithographic apparatus |
US7852459B2 (en) | 2007-02-02 | 2010-12-14 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7701577B2 (en) * | 2007-02-21 | 2010-04-20 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7724370B2 (en) * | 2007-03-01 | 2010-05-25 | Asml Netherlands B.V. | Method of inspection, a method of manufacturing, an inspection apparatus, a substrate, a mask, a lithography apparatus and a lithographic cell |
US7599064B2 (en) | 2007-03-07 | 2009-10-06 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method, substrate for use in the methods |
US7605907B2 (en) * | 2007-03-27 | 2009-10-20 | Asml Netherlands B.V. | Method of forming a substrate for use in calibrating a metrology tool, calibration substrate and metrology tool calibration method |
US7949618B2 (en) * | 2007-03-28 | 2011-05-24 | Tokyo Electron Limited | Training a machine learning system to determine photoresist parameters |
US7656518B2 (en) * | 2007-03-30 | 2010-02-02 | Asml Netherlands B.V. | Method of measuring asymmetry in a scatterometer, a method of measuring an overlay error in a substrate and a metrology apparatus |
US7570358B2 (en) * | 2007-03-30 | 2009-08-04 | Asml Netherlands Bv | Angularly resolved scatterometer, inspection method, lithographic apparatus, lithographic processing cell device manufacturing method and alignment sensor |
US7511835B2 (en) * | 2007-04-12 | 2009-03-31 | Tokyo Electron Limited | Optical metrology using a support vector machine with simulated diffraction signal inputs |
US7483809B2 (en) * | 2007-04-12 | 2009-01-27 | Tokyo Electron Limited | Optical metrology using support vector machine with profile parameter inputs |
US7372583B1 (en) | 2007-04-12 | 2008-05-13 | Tokyo Electron Limited | Controlling a fabrication tool using support vector machine |
US8189195B2 (en) * | 2007-05-09 | 2012-05-29 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7911612B2 (en) | 2007-06-13 | 2011-03-22 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7460237B1 (en) | 2007-08-02 | 2008-12-02 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7680243B2 (en) * | 2007-09-06 | 2010-03-16 | Jordan Valley Semiconductors Ltd. | X-ray measurement of properties of nano-particles |
US7912679B2 (en) * | 2007-09-20 | 2011-03-22 | Tokyo Electron Limited | Determining profile parameters of a structure formed on a semiconductor wafer using a dispersion function relating process parameter to dispersion |
WO2009052381A2 (en) | 2007-10-19 | 2009-04-23 | Panduit Corp. | Communication port identification system |
US8760649B1 (en) * | 2008-01-28 | 2014-06-24 | Kla-Tencor Corporation | Model-based metrology using tesselation-based discretization |
WO2009105632A1 (en) | 2008-02-21 | 2009-08-27 | Panduit Corp. | Intelligent inter-connect and cross-connect patching system |
US8267706B2 (en) | 2008-11-12 | 2012-09-18 | Panduit Corp. | Patch cord with insertion detection and light illumination capabilities |
US8306935B2 (en) | 2008-12-22 | 2012-11-06 | Panduit Corp. | Physical infrastructure management system |
US8128428B2 (en) | 2009-02-19 | 2012-03-06 | Panduit Corp. | Cross connect patch guidance system |
US8441639B2 (en) * | 2009-09-03 | 2013-05-14 | Kla-Tencor Corp. | Metrology systems and methods |
US9606453B2 (en) | 2010-09-30 | 2017-03-28 | Kla-Tencor Corporation | Method and system for providing tool induced shift using a sub-sampling scheme |
US8867041B2 (en) | 2011-01-18 | 2014-10-21 | Jordan Valley Semiconductor Ltd | Optical vacuum ultra-violet wavelength nanoimprint metrology |
JP2012181166A (ja) * | 2011-03-03 | 2012-09-20 | Dainippon Screen Mfg Co Ltd | 膜形状取得装置および膜形状取得方法 |
US8565379B2 (en) | 2011-03-14 | 2013-10-22 | Jordan Valley Semiconductors Ltd. | Combining X-ray and VUV analysis of thin film layers |
US9310296B2 (en) | 2011-06-20 | 2016-04-12 | Kla-Tencor Corporation | Optimizing an optical parametric model for structural analysis using optical critical dimension (OCD) metrology |
US9390984B2 (en) | 2011-10-11 | 2016-07-12 | Bruker Jv Israel Ltd. | X-ray inspection of bumps on a semiconductor substrate |
US8675188B2 (en) | 2012-01-09 | 2014-03-18 | Kla-Tencor Corporation | Method and system for determining one or more optical characteristics of structure of a semiconductor wafer |
US10255385B2 (en) | 2012-03-28 | 2019-04-09 | Kla-Tencor Corporation | Model optimization approach based on spectral sensitivity |
US9389192B2 (en) | 2013-03-24 | 2016-07-12 | Bruker Jv Israel Ltd. | Estimation of XRF intensity from an array of micro-bumps |
US11175589B2 (en) | 2013-06-03 | 2021-11-16 | Kla Corporation | Automatic wavelength or angle pruning for optical metrology |
US10386729B2 (en) | 2013-06-03 | 2019-08-20 | Kla-Tencor Corporation | Dynamic removal of correlation of highly correlated parameters for optical metrology |
US10481088B2 (en) * | 2013-06-04 | 2019-11-19 | Kla-Tencor Corporation | Automatic determination of fourier harmonic order for computation of spectral information for diffraction structures |
TWI623989B (zh) * | 2013-06-13 | 2018-05-11 | 克萊譚克公司 | 於定向自組裝程序中曝光參數之產品上推導及調整 |
US10895810B2 (en) | 2013-11-15 | 2021-01-19 | Kla Corporation | Automatic selection of sample values for optical metrology |
US9632043B2 (en) | 2014-05-13 | 2017-04-25 | Bruker Jv Israel Ltd. | Method for accurately determining the thickness and/or elemental composition of small features on thin-substrates using micro-XRF |
US9829448B2 (en) | 2014-10-30 | 2017-11-28 | Bruker Jv Israel Ltd. | Measurement of small features using XRF |
US10190868B2 (en) | 2015-04-30 | 2019-01-29 | Kla-Tencor Corporation | Metrology system, method, and computer program product employing automatic transitioning between utilizing a library and utilizing regression for measurement processing |
WO2017012840A1 (en) | 2015-07-17 | 2017-01-26 | Asml Netherlands B.V. | Methods and apparatus for simulating interaction of radiation with structures, metrology methods and apparatus, device manufacturing method |
WO2017148665A1 (en) * | 2016-03-01 | 2017-09-08 | Asml Netherlands B.V. | Metrology apparatus, method of measuring a structure and lithographic apparatus |
US11313809B1 (en) * | 2016-05-04 | 2022-04-26 | Kla-Tencor Corporation | Process control metrology |
TW201923332A (zh) | 2017-10-10 | 2019-06-16 | 荷蘭商Asml荷蘭公司 | 度量衡方法和設備、電腦程式及微影系統 |
CN117743732A (zh) * | 2024-02-19 | 2024-03-22 | 上海诺睿科半导体设备有限公司 | 一种理论光谱的获取方法、电子装置及介质 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0259604A (ja) * | 1988-08-25 | 1990-02-28 | Nippon Sheet Glass Co Ltd | ガラス材の反射歪検査装置 |
US5963329A (en) * | 1997-10-31 | 1999-10-05 | International Business Machines Corporation | Method and apparatus for measuring the profile of small repeating lines |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3896655A (en) * | 1972-07-27 | 1975-07-29 | Welders Ltd A I | Apparatus for sizing and shaping ends of pipes |
US4306134A (en) * | 1979-08-01 | 1981-12-15 | Midcon Pipeline Equipment Co. | Arc welding pipe apparatus |
US4418860A (en) * | 1981-06-29 | 1983-12-06 | Carl Stringer | Clamping method and apparatus for solid phase welding |
US4463938A (en) * | 1982-03-29 | 1984-08-07 | Dearman Timothy Charles | Internal clamping of pipes |
US4999014A (en) | 1989-05-04 | 1991-03-12 | Therma-Wave, Inc. | Method and apparatus for measuring thickness of thin films |
US5042951A (en) | 1989-09-19 | 1991-08-27 | Therma-Wave, Inc. | High resolution ellipsometric apparatus |
US5357632A (en) * | 1990-01-09 | 1994-10-18 | Hughes Aircraft Company | Dynamic task allocation in a multi-processor system employing distributed control processors and distributed arithmetic processors |
US5181080A (en) | 1991-12-23 | 1993-01-19 | Therma-Wave, Inc. | Method and apparatus for evaluating the thickness of thin films |
JPH06290283A (ja) * | 1993-04-05 | 1994-10-18 | Mitsubishi Electric Corp | 並列データ処理装置 |
US5412473A (en) | 1993-07-16 | 1995-05-02 | Therma-Wave, Inc. | Multiple angle spectroscopic analyzer utilizing interferometric and ellipsometric devices |
WO1996012941A1 (en) | 1994-10-21 | 1996-05-02 | Therma-Wave, Inc. | Spectroscopic ellipsometer |
US5608526A (en) | 1995-01-19 | 1997-03-04 | Tencor Instruments | Focused beam spectroscopic ellipsometry method and system |
US5607800A (en) | 1995-02-15 | 1997-03-04 | Lucent Technologies Inc. | Method and arrangement for characterizing micro-size patterns |
US5739909A (en) | 1995-10-10 | 1998-04-14 | Lucent Technologies Inc. | Measurement and control of linewidths in periodic structures using spectroscopic ellipsometry |
US5864633A (en) * | 1996-05-17 | 1999-01-26 | Therma-Wave, Inc. | Method and apparatus for optical data analysis |
JPH10124479A (ja) * | 1996-10-24 | 1998-05-15 | Sony Corp | 磁化分布の解析方法 |
US5933794A (en) * | 1997-02-25 | 1999-08-03 | Hughes Electronics Corporation | Scalable parallel processing apparatus and method for performing fast multipole scattering calculations |
US5889593A (en) | 1997-02-26 | 1999-03-30 | Kla Instruments Corporation | Optical system and method for angle-dependent reflection or transmission measurement |
US5867276A (en) | 1997-03-07 | 1999-02-02 | Bio-Rad Laboratories, Inc. | Method for broad wavelength scatterometry |
US5963392A (en) * | 1997-06-05 | 1999-10-05 | International Business Machines Corporation | Method and apparatus for disk shock protection |
WO1999002970A1 (en) | 1997-07-11 | 1999-01-21 | Therma-Wave, Inc. | An apparatus for analyzing multi-layer thin film stacks on semiconductors |
US6278519B1 (en) * | 1998-01-29 | 2001-08-21 | Therma-Wave, Inc. | Apparatus for analyzing multi-layer thin film stacks on semiconductors |
US6483580B1 (en) * | 1998-03-06 | 2002-11-19 | Kla-Tencor Technologies Corporation | Spectroscopic scatterometer system |
IL123727A (en) * | 1998-03-18 | 2002-05-23 | Nova Measuring Instr Ltd | Method and apparatus for measurement of patterned structures |
US6256097B1 (en) * | 1999-01-08 | 2001-07-03 | Rudolph Technologies, Inc. | Ellipsometer and ellipsometry method |
IL130874A (en) * | 1999-07-09 | 2002-12-01 | Nova Measuring Instr Ltd | System and method for measuring pattern structures |
IL132639A (en) * | 1999-10-28 | 2003-11-23 | Nova Measuring Instr Ltd | Optical measurements of patterned structures |
US6465265B2 (en) * | 2000-03-16 | 2002-10-15 | Therma-Wave, Inc. | Analysis of interface layer characteristics |
US6429943B1 (en) * | 2000-03-29 | 2002-08-06 | Therma-Wave, Inc. | Critical dimension analysis with simultaneous multiple angle of incidence measurements |
US6943900B2 (en) | 2000-09-15 | 2005-09-13 | Timbre Technologies, Inc. | Generation of a library of periodic grating diffraction signals |
US6891627B1 (en) * | 2000-09-20 | 2005-05-10 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension and overlay of a specimen |
US6694284B1 (en) * | 2000-09-20 | 2004-02-17 | Kla-Tencor Technologies Corp. | Methods and systems for determining at least four properties of a specimen |
US6704661B1 (en) * | 2001-07-16 | 2004-03-09 | Therma-Wave, Inc. | Real time analysis of periodic structures on semiconductors |
-
2001
- 2001-07-16 US US09/906,290 patent/US6704661B1/en not_active Expired - Lifetime
-
2002
- 2002-06-17 AT AT02746544T patent/ATE467859T1/de not_active IP Right Cessation
- 2002-06-17 JP JP2003514342A patent/JP2004536314A/ja active Pending
- 2002-06-17 WO PCT/US2002/018994 patent/WO2003009063A2/en active Application Filing
- 2002-06-17 EP EP02746544A patent/EP1410110B1/en not_active Expired - Lifetime
- 2002-06-17 DE DE60236360T patent/DE60236360D1/de not_active Expired - Lifetime
-
2003
- 2003-04-02 US US10/405,541 patent/US6778911B2/en not_active Expired - Lifetime
- 2003-12-11 US US10/733,598 patent/US6947850B2/en not_active Expired - Lifetime
-
2004
- 2004-06-25 US US10/877,397 patent/US6931361B2/en not_active Expired - Lifetime
-
2005
- 2005-07-08 US US11/177,699 patent/US7031848B2/en not_active Expired - Lifetime
-
2011
- 2011-02-02 JP JP2011020410A patent/JP2011123082A/ja active Pending
-
2013
- 2013-12-25 JP JP2013267269A patent/JP5991960B2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0259604A (ja) * | 1988-08-25 | 1990-02-28 | Nippon Sheet Glass Co Ltd | ガラス材の反射歪検査装置 |
US5963329A (en) * | 1997-10-31 | 1999-10-05 | International Business Machines Corporation | Method and apparatus for measuring the profile of small repeating lines |
Non-Patent Citations (1)
Title |
---|
JPN6013042102; John M. Jarem: 'A Rigorous Coupled-Wave Analysis and Crossed-Diffraction Grating Analysis of Radiation and Scatterin' IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION VOL. 46, NO. 5, 199805, p.740〜741 * |
Also Published As
Publication number | Publication date |
---|---|
WO2003009063A3 (en) | 2003-11-13 |
EP1410110A2 (en) | 2004-04-21 |
ATE467859T1 (de) | 2010-05-15 |
US6778911B2 (en) | 2004-08-17 |
US6931361B2 (en) | 2005-08-16 |
JP5991960B2 (ja) | 2016-09-14 |
WO2003009063A2 (en) | 2003-01-30 |
US7031848B2 (en) | 2006-04-18 |
JP2011123082A (ja) | 2011-06-23 |
US20040233462A1 (en) | 2004-11-25 |
US20030204326A1 (en) | 2003-10-30 |
US6947850B2 (en) | 2005-09-20 |
EP1410110B1 (en) | 2010-05-12 |
US6704661B1 (en) | 2004-03-09 |
JP2004536314A (ja) | 2004-12-02 |
US20050251350A1 (en) | 2005-11-10 |
US20040122599A1 (en) | 2004-06-24 |
DE60236360D1 (de) | 2010-06-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5991960B2 (ja) | 半導体における周期構造の実時間分析 | |
US6900892B2 (en) | Parametric profiling using optical spectroscopic systems | |
JP3740534B2 (ja) | 周期格子の回折信号のライブラリの生成 | |
US7826071B2 (en) | Parametric profiling using optical spectroscopic systems | |
KR102220435B1 (ko) | 웨이퍼에 걸친 파라미터 변동들에 기초한 측정 모델 최적화 | |
JP5527976B2 (ja) | 多変量解析を用いた半導体処理システムからの計測データの変換方法 | |
JP5021156B2 (ja) | 光学的測定に使用する仮想プロファイルの選択方法、システム及び仮想プロファイルを選択するコンピュータ実行可能なコードを有する記録媒体 | |
JP6861211B2 (ja) | 効率的な計測のために信号を高速自動判定するシステム、方法、およびコンピュータプログラム製品 | |
JP2004507719A (ja) | 回折微細構造の光学的測定のためのデータベース補間方法 | |
JP4805579B2 (ja) | 二次元構造用のシミュレート回折信号の生成 | |
Germer et al. | Developing an uncertainty analysis for optical scatterometry | |
KR20130116795A (ko) | 반복적인 공간 고조파 차수 절단 처리에 의한 계산 효율 | |
KR102518206B1 (ko) | 위상 공개 광학 및 x 선 반도체 계측 | |
US7747424B2 (en) | Scatterometry multi-structure shape definition with multi-periodicity | |
EP3891489B1 (en) | Scatterometry modeling in the presence of undesired diffraction orders | |
US9435735B1 (en) | Optical parametric model optimization |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140306 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140813 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20141007 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20150106 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20150206 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20150306 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150407 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20151006 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20160105 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20160119 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20160224 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20160304 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20160226 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160406 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160719 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160816 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5991960 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |