JP2014091676A - セラミックス部材と金属部材との接合体及びその製法 - Google Patents
セラミックス部材と金属部材との接合体及びその製法 Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 42
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 18
- 239000002184 metal Substances 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000000034 method Methods 0.000 title description 4
- 239000011248 coating agent Substances 0.000 claims abstract description 25
- 238000000576 coating method Methods 0.000 claims abstract description 25
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 17
- 239000011148 porous material Substances 0.000 claims abstract description 10
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 229910052709 silver Inorganic materials 0.000 claims abstract description 8
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 7
- 229910017945 Cu—Ti Inorganic materials 0.000 claims description 15
- 229910017401 Au—Ge Inorganic materials 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000005304 joining Methods 0.000 abstract description 9
- 239000010408 film Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- 238000005219 brazing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 241001292396 Cirrhitidae Species 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 238000013507 mapping Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000011104 metalized film Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910008332 Si-Ti Inorganic materials 0.000 description 1
- 229910006749 Si—Ti Inorganic materials 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004453 electron probe microanalysis Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
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Abstract
【解決手段】接合体10は、板状のアルミナ又は窒化アルミニウムのセラミックス部材12に設けた凹部12aに、Ni被膜、Au被膜又はNi−Au被膜(下地がNi)を有するMo又はTi製の端子14を接合層16を介して接合したものである。接合層16は、Au,Ge,Ag,Cu及びTiを含有し、凹部12aの側面の少なくとも一部(ここでは全部)及び底面と接している。この接合層16のうちセラミックス部材12との接合界面には、Tiがリッチに存在している。また、接合体10を接合体10の厚み方向に切断したとき、接合層16の断面積に占める気孔の断面積の総和の割合(気孔率)が0.1〜15%である。
【選択図】図1
Description
アルミナ又は窒化アルミニウムのセラミックス部材に設けた凹部に、Ni被膜、Au被膜又はNi−Au被膜(下地がNi)を有するMo又はTi製の金属部材を接合層を介して接合した接合体であって、
前記接合層は、Au,Ge,Ag,Cu及びTiを含有し、前記凹部の側面の少なくとも一部及び底面と接しており、
前記接合層のうち前記セラミックス部材との接合界面には、Tiがリッチに存在しており、
前記接合体を前記接合体の厚み方向に切断したとき、前記接合層の断面積に占める前記気孔の断面積の総和の割合(気孔率)が0.1〜15%
のものである。
(a)凹部が設けられたアルミナ又は窒化アルミニウムのセラミックス部材を用意する工程と、
(b)前記凹部の側面の少なくとも一部及び底面にAg−Cu−Tiペーストを塗布し、真空雰囲気で800℃〜900℃に加熱することにより、前記凹部の側面の少なくとも一部及び底面にメタライズ層を形成する工程と、
(c)前記メタライズ層を形成した前記凹部の底面にAu−Geシートをセットし、その上にNi被膜、Au被膜又はNi−Au被膜(下地がNi)を有するMo又はTi製の金属部材をセットし、真空雰囲気で360〜450℃に加熱することにより、前記メタライズ層と前記Au−Geシートとが渾然一体となった接合層を前記金属部材と前記セラミックス部材との間に形成する工程と、
を含むものである。
直径6mm、深さ0.5mmの凹部(端子穴)が設けられたアルミナセラミックス部材を用意した。このアルミナセラミックス部材の凹部の周りをマスキングテープでマスキングし、その凹部の側面及び底面にディスペンサー装置によりAg−Cu−Tiペーストを塗布した。塗布完了後、10分自然放置し、その後、クリーンオーブンで120℃(物温)で1時間乾燥した。マスキングテープをはがし、焼成温度850℃、焼成時間10分、真空度5×10-5Torr以下で焼き付けを行った。これにより、凹部の側面及び底面にAg−Cu−Tiのメタライズ層が形成された。メタライズ層の膜厚は30μmであった。なお、Ag−Cu−TiペーストのTi含有率は1.7wt%とした。
上述した代表例において、凹部にメタライズ層を形成したときの膜厚が表1に示す値となるように接合体を作製した。作製した接合体の破断強度を測定すると共に、接合直後の接合体のアルミナセラミックス部材にクラックが見られるか否かを検査した。その結果を表1に示す。なお、破断強度は、引張破断荷重と同義であり、アルミナセラミックス部材が下になるように接合体を支持台に上下動しないようにしっかりと固定し、端子の上面から垂直下向きに設けられたネジ穴に引張棒の先端をねじ込み、この引張棒に垂直上向きの荷重を加え、接合層が破断したときの荷重を破断強度とした。
上述した代表例において、気孔率が表1に示す0〜35%となるようにAg−Cu−Tiペースト中のTi含有率を調整して接合体を作製した。作製した当初の接合体の破断強度とクラックの有無を測定した。また、熱サイクル試験後の接合体の破断強度とクラックの有無も測定した。熱サイクル試験は、室温から200℃まで加熱したあと室温に冷却する操作を1サイクルとし、これを1000サイクル繰り返した。その結果を表2に示す。
Claims (6)
- アルミナ又は窒化アルミニウムのセラミックス部材に設けた凹部に、Ni被膜、Au被膜又はNi−Au被膜(下地がNi)を有するMo又はTi製の金属部材を接合層を介して接合した接合体であって、
前記接合層は、Au,Ge,Ag,Cu及びTiを含有し、前記凹部の側面の少なくとも一部及び底面と接しており、
前記接合層のうち前記セラミックス部材との接合界面には、Tiがリッチに存在しており、
前記接合体を前記接合体の厚み方向に切断したとき、前記接合層の断面積に占める気孔の断面積の総和の割合(気孔率)が0.1〜15%である
接合体。 - Tiは、前記接合層の内部に存在する前記気孔の周囲に凝集している、
請求項1に記載の接合体。 - (a)凹部が設けられたアルミナ又は窒化アルミニウムのセラミックス部材を用意する工程と、
(b)前記凹部の側面の少なくとも一部及び底面にAg−Cu−Tiペーストを塗布し、真空雰囲気で800℃〜900℃に加熱することにより、前記凹部の側面の少なくとも一部及び底面にメタライズ層を形成する工程と、
(c)前記メタライズ層を形成した前記凹部の底面にAu−Geシートをセットし、その上にNi被膜、Au被膜又はNi−Au被膜(下地がNi)を有するMo又はTi製の金属部材をセットし、真空雰囲気で360〜450℃に加熱することにより、前記メタライズ層と前記Au−Geシートとが渾然一体となった接合層を前記金属部材と前記セラミックス部材との間に形成する工程と、
を含む接合体の製法。 - 前記工程(b)では、前記メタライズ層の厚みを5〜75μmとする、
請求項3に記載の接合体の製法。 - 前記工程(b)では、前記Ag−Cu−TiペーストはTiを1.50〜2.10wt%含有している、
請求項3又は4に記載の接合体の製法。 - 前記接合体は、請求項1又は2に記載の接合体である、
請求項3〜5のいずれか1項に記載の接合体の製法。
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