JP2014088005A - Thermal head and thermal printer including the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermal head in which possibility of occurring displacement of a substrate is reduced.SOLUTION: A thermal head X1 includes: a substrate 7; a plurality of heating parts 9 that are provided on the substrate 7 and arranged in a row; an electrode that is provided on the substrate 7 and electrically connected to the heating parts 9; a radiator 1 on which the substrate 7 is mounted; and connection members 6 and 8 for connecting the substrate 7 with the radiator 1. On a first surface 7d that faces the radiator 1 of the substrate 7, a first coating layer 2 for coating a part of the electrode and a second coating layer 4 separated from the first coating layer 2 are provided. Between the first coating layer 2 and the second coating layer 4, the connection members 6 and 8 are arranged.

Description

  The present invention relates to a thermal head and a thermal printer including the same.

  Conventionally, various thermal heads have been proposed as printing devices such as facsimiles and video printers. The thermal head is provided on the substrate, a plurality of heat generating portions arranged in a row, an electrode provided on the substrate and electrically connected to the heat generating portion, and heat dissipation on which the substrate is placed. The thing provided with the connection member which connects a body and a board | substrate and a heat radiator is known. In this thermal head, a first coating layer that covers a part of the electrode is provided on the first surface of the substrate on the radiator side, and the first coating layer and the radiator are connected by a connecting member (for example, Patent Document 1).

JP 2001-260403 A

  However, in the above-described conventional thermal head, the bonding strength between the first coating layer and the heat radiating body is weak, and there is a possibility that the substrate placed on the heat radiating body is displaced.

  A thermal head according to an embodiment of the present invention includes a substrate, a plurality of heat generating units arranged on the substrate and arranged in a row, and provided on the substrate and electrically connected to the heat generating unit. And an electrode, a radiator on which the substrate is placed, and a connection member for connecting the substrate and the radiator. In addition, a first coating layer that covers a part of the electrode and a second coating layer that is separated from the first coating layer are provided on the first surface of the substrate on the radiator side. Further, the connection member is disposed between the first coating layer and the second coating layer.

  A thermal printer according to an embodiment of the present invention includes a thermal head according to any one of the above, a transport mechanism that transports a recording medium onto a plurality of heating units, and presses the recording medium onto the plurality of heating units. And a platen roller.

  According to the present invention, the connection strength between the radiator and the substrate can be improved, and the possibility that the substrate is displaced can be reduced.

1 is a plan view showing a thermal head according to a first embodiment of the present invention. (A) is a left side view of the thermal head shown in FIG. 1, and (b) is a right side view of the thermal head shown in FIG. In addition, in this figure, illustration of the protective layer and 2nd insulating layer on a thermal storage layer is abbreviate | omitted. (A) is a back view of the board | substrate 7 which comprises the thermal head shown in FIG. 1, (b) is the top view which mounted the board | substrate on the heat radiator. It is the II sectional view taken on the line of the thermal head shown in FIG. It is the II-II sectional view taken on the line of the thermal head shown in FIG. 1 is a schematic configuration diagram showing a schematic configuration of an embodiment of a thermal printer of the present invention. The thermal head which concerns on other embodiment of this invention is shown, (a) is a back view of the board | substrate which comprises a thermal head, (b) is the III-III sectional view taken on the line of (a), (c) is a modification. It is sectional drawing corresponding to a III-III sectional view. The thermal head which concerns on other embodiment of this invention is shown, (a) is a back view of the board | substrate which comprises a thermal head, (b) is the IV-IV sectional view taken on the line of (a), (c) is a modification. It is sectional drawing corresponding to IV-IV line sectional drawing. The thermal head which concerns on other embodiment of this invention is shown, (a) is a back view of the board | substrate which comprises a thermal head, (b) is the VV sectional view taken on the line of (a), (c) is a modification. It is sectional drawing corresponding to the VV sectional view taken on the line. 6 shows a thermal head according to still another embodiment of the present invention, in which (a) is a rear view of a substrate constituting the thermal head, (b) is a sectional view taken along line VI-VI in (a), and (c) is a modified example. It is sectional drawing corresponding to the VI-VI sectional view taken on the line. (A) is a back view of the board | substrate which comprises the thermal head concerning other embodiment, (b) is the top view which mounted the board | substrate on the heat radiator. (A) is a top view of the heat radiator which comprises the thermal head shown in FIG. 11, (b) is the VII-VII sectional view taken on the line of (a). (A) is a top view of the thermal radiation body which comprises another thermal head, (b) is the VIII-VII sectional view taken on the line of (a). It is a left view which shows the modification of the thermal head of this invention.

<First Embodiment>
The thermal head X1 according to the first embodiment of the present invention will be described below with reference to the drawings. As shown in FIGS. 1 to 5, the thermal head X <b> 1 includes a radiator 1, a head base 3 placed on the radiator 1, and a flexible printed wiring board 5 (hereinafter referred to as FPC 5) connected to the head base 3. ). In FIG. 1, illustration of the FPC 5 is omitted, and a region where the FPC 5 is arranged is indicated by a two-dot chain line.

  As shown in FIGS. 1-5, the heat radiator 1 is arrange | positioned on the upper surface of the rectangular plate-shaped base part 1a and the base part 1a in planar view, and follows one long side of the base part 1a. And a projecting portion 1b that extends. The radiator 1 is made of, for example, a metal material such as copper, iron, or aluminum, and a part of the heat that does not contribute to printing out of the heat generated in the heat generating portion 9 of the head base 3 as described later. It has a function to dissipate heat.

  As shown in FIGS. 1 and 2, the head base 3 includes a substrate 7, a plurality of heat generating units 9 provided on the substrate 7, and a drive IC 11 that controls driving of the heat generating unit 9. The substrate 7 has a rectangular shape in plan view. The substrate 7 has a first end surface 7a, a second end surface 7b, a first main surface 7c, and a second main surface 7d. The first end surface 7a is a surface adjacent to the first main surface 7c and the second main surface 7d. The second end surface 7b is a surface located on the opposite side of the first end surface 7a. The first major surface 7c is a surface adjacent to the first end surface 7a and the second end surface 7b. The second main surface 7d is a surface located on the opposite side of the first main surface 7c. The heat generating portions 9 are provided in a row along the longitudinal direction of the substrate 7 on the first end surface 7a. A plurality of drive ICs 11 are provided on the first main surface 7c.

  As shown in FIGS. 1 to 5, the head base 3 is disposed on the upper surface of the base 1 a of the radiator 1, and the second end surface 7 b is disposed so as to face the protrusion 1 b of the radiator 1. ing.

The substrate 7 is formed of an electrically insulating material such as alumina ceramic or a semiconductor material such as single crystal silicon. The substrate 7 has a rectangular shape in plan view, but the substrate 7 having a chamfered corner is also included in the rectangular substrate in plan view of the present invention.

  As shown in FIGS. 4 and 5, the heat storage layer 13 is formed on the first end surface 7 a of the substrate 7. The first end surface 7a of the substrate 7 has a convex curved surface when viewed in cross section, and the heat storage layer 13 is formed on the first end surface 7a. Therefore, the surface of the heat storage layer 13 is also curved. The heat storage layer 13 having a curved surface functions so as to satisfactorily press a recording medium to be printed on a protective layer 25 described later formed on the heat generating portion 9.

  The heat storage layer 13 is made of, for example, glass, and temporarily stores part of the heat generated in the heat generating unit 9. In addition, it is preferable that glass is glass with low heat conductivity. Therefore, at the time of printing, the time required to raise the temperature of the heat generating portion 9 can be shortened, and the thermal response characteristics of the thermal head X1 can be improved. In the present embodiment, as shown in FIG. 4, the heat storage layer 13 is formed only on the first end surface 7 a of the substrate 7, and heat can be stored at a position close to the heat generating portion 9. Therefore, the thermal response characteristics of the thermal head X1 can be improved more effectively. The heat storage layer 13 is obtained by applying a predetermined glass paste obtained by mixing a glass powder with an appropriate organic solvent onto the first end surface 7a of the substrate 7 by screen printing or the like, and baking it. Can be formed.

  As shown in FIGS. 4 and 5, an electric resistance layer 15 is provided on the first main surface 7 c of the substrate 7, on the heat storage layer 13, on the second main surface 7 d of the substrate 7 and on the second end surface 7 b. Yes. The electrical resistance layer 15 is interposed between the substrate 7 and the heat storage layer 13 and a common electrode 17, an individual electrode 19, and an IC-FPC connection electrode 21 described later.

  The region of the electrical resistance layer 15 located on the first main surface 7c of the substrate 7 is formed in the same shape as the common electrode 17, the individual electrode 19 and the IC-FPC connection electrode 21 in plan view as shown in FIG. Has been.

  As shown in FIG. 2, the region of the electric resistance layer 15 located on the heat storage layer 13 is a region formed in the same shape as the common electrode 17 and the individual electrode 19 as viewed from the side, and the common electrode 17 and the individual electrode 19. And a plurality of exposed regions exposed from between.

  Although not shown in detail, the region of the electric resistance layer 15 located on the second main surface 7d of the substrate 7 is provided over the entire second main surface 7d of the substrate 7 as shown in FIGS. It is formed in the same shape as the common electrode 17.

  Since each region of the electrical resistance layer 15 is formed in this way, in FIG. 1, the electrical resistance layer 15 is covered with the common electrode 17, the individual electrode 19, and the IC-FPC connection electrode 21, and is illustrated. Absent. In FIG. 2, the electric resistance layer 15 is covered with the common electrode 17 and the individual electrode 19, and only the exposed region is illustrated.

  Each exposed region of the electrical resistance layer 15 forms the heat generating portion 9 described above. A plurality of exposed regions are arranged in a row on the heat storage layer 13 as shown in FIG. The plurality of heat generating portions 9 are illustrated in a simplified manner in FIG. 2, but are arranged with a density of 180 dpi to 2400 dpi (dot per inch), for example. Further, as shown in FIG. 2, the heat generating portion 9 is provided on the heat storage layer 13 at a substantially central portion in the thickness direction of the substrate 7.

  The electric resistance layer 15 is made of a material having a relatively high electric resistance, such as TaN, TaSiO, TaSiNO, TiSiO, TiSiCO, or NbSiO. Therefore, when a voltage is applied between the common electrode 17 and the individual electrode 19 described later and a current is supplied to the heat generating portion 9, the heat generating portion 9 generates heat due to Joule heat generation.

  As shown in FIGS. 1 to 5, a common electrode 17, a plurality of individual electrodes 19, and a plurality of IC-FPC connection electrodes 21 are provided on the electrical resistance layer 15. The common electrode 17, the individual electrode 19, and the IC-FPC connection electrode 21 are formed of a conductive material, for example, any one of aluminum, gold, silver, and copper, or an alloy thereof. Has been.

  The plurality of individual electrodes 19 are for connecting each heat generating part 9 and the drive IC 11. As shown in FIGS. 1 to 3, each individual electrode 19 is connected to the heat generating portion 9 at one end and individually extends in a band shape from the first end surface 7 a of the substrate 7 to the first main surface 7 c of the substrate 7. Yes.

  The other end portion of each individual electrode 19 is disposed in the arrangement region of the drive IC 11, and the other end portion of each individual electrode 19 is connected to the drive IC 11. Thereby, each heat generating part 9 and the drive IC 11 are electrically connected. More specifically, the individual electrode 19 divides a plurality of heat generating portions 9 into a plurality of groups, and electrically connects the heat generating portions 9 of each group to a drive IC 11 provided corresponding to each group.

  The plurality of IC-FPC connection electrodes 21 are for connecting the driving IC 11 and the FPC 5. As shown in FIGS. 1 and 4, each IC-FPC connection electrode 21 extends in a strip shape on the first main surface 7 c of the substrate 7, and one end thereof is arranged in the arrangement region of the drive IC 11. The other end portion of each IC-FPC connection electrode 21 is disposed in the vicinity of the main wiring portion 17 a of the common electrode 17 located on the second end surface 7 b side on the first main surface 7 c of the substrate 7. The plurality of IC-FPC connection electrodes 21 are electrically connected to the drive IC 11 at one end and electrically connected to the FPC 5 at the other end, thereby electrically connecting the drive IC 11 and the FPC 5. Connected.

  As shown in FIG. 1, the drive IC 11 is disposed corresponding to each group of the plurality of heat generating units 9. The drive IC 11 is connected to the other end of the individual electrode 19 and one end of the IC-FPC connection electrode 21. The drive IC 11 is for controlling the energization state of each heat generating part 9, and controls the heat generation drive of each heat generating part 9 by switching a plurality of switching elements (not shown) provided therein.

  The drive IC 11 is sealed by being covered with a covering member 28 made of a resin such as an epoxy resin or a silicone resin while being connected to the individual electrode 19 and the IC-FPC connection electrode 21. Thereby, it is possible to protect the drive IC 11 itself and the connection portion between the drive IC 11 and these wirings.

  The common electrode 17 is for electrically connecting the plurality of heat generating units 9 and the FPC 5. The common electrode 17 has a main wiring portion 17a and a lead portion 17c. As shown in FIGS. 1, 4, and 5, the main wiring portion 17 a is formed over the entire second main surface 7 d and the second end surface 7 b of the substrate 7, and is formed on the first main surface 7 c of the substrate 7. It is formed so as to extend along end face 7b. The lead portion 17 c is formed on the first end surface 7 a of the substrate 7, and one end portion electrically connects the main wiring portion 17 a provided on the second main surface 7 d of the substrate 7 and each heat generating portion 9. doing. In addition, each lead portion 17 c is arranged so that one end thereof is opposed to the individual electrode 19 and is connected to each heat generating portion 9.

  In this way, the common electrode 17 is disposed so that one end thereof faces the one end of the individual electrode 19 and is connected to the heat generating portion 9. Then, it extends over the first main surface 7 c of the substrate 7 from the first end surface 7 a of the substrate 7 through the second main surface 7 d of the substrate 7 and the second end surface 7 b of the substrate 7.

  A method for forming the electrical resistance layer 15, the common electrode 17, the individual electrode 19, and the IC-FPC connection electrode 21 will be described. The material layers constituting each are sequentially laminated on the substrate 7 on which the heat storage layer 13 is formed by a conventionally well-known thin film forming technique such as a sputtering method. Next, the laminate can be formed by processing it into a predetermined pattern using a conventionally known photoetching or the like. Moreover, the thickness of the electrical resistance layer 15 is, for example, 0.01 μm to 0.2 μm, and the thicknesses of the common electrode 17, the individual electrode 19, and the IC-FPC connection electrode 21 are, for example, 0.05 μm to 2.5 μm. be able to. Note that the thickness of the common electrode 17 on the first main surface 7c may be different from the thickness of the common electrode 17 on the second main surface 7d, and the thickness may be different depending on the portion of the electrode.

  As shown in FIGS. 1 to 5, the protective layer 25 is formed on the heat storage layer 13 and on the first main surface 7 c and the second main surface 7 d of the substrate 7, a heating portion 9, a part of the common electrode 17, and the individual electrode 19. It is provided so that a part of may be covered. As shown in FIGS. 1, 4, and 5, the protective layer 25 is provided on the first main surface 7 c of the substrate 7 so as to cover the left region. The protective layer 25 is provided on the heat storage layer 13 so as to cover the whole. The protective layer 25 is provided on the second main surface 7 d of the substrate 7 so as to cover the left region as in the case of the first main surface 7 c of the substrate 7. In this way, the protective layer 25 is formed from the first end surface 7a of the substrate 7 to the first main surface 7c of the substrate 7, and the second main surface of the substrate 7 from the first end surface 7a of the substrate 7. It is formed over the surface 7d. For convenience of explanation, in FIG. 1, the formation region of the protective layer 25 is indicated by a one-dot chain line, and the illustration is omitted.

  The protective layer 25 contacts the recording medium that prints or corrodes the areas covered with the heat generating portion 9, part of the common electrode 17 and part of the individual electrode 19 due to adhesion of moisture or the like contained in the atmosphere. It has a function to protect against abrasion due to. The protective layer 25 can be made of, for example, a SiC-based material, a SiN-based material, a SiO-based material, or a SiON-based material. A small amount of other elements such as Al or Ti may be contained.

  The protective layer 25 can be formed using, for example, a conventionally well-known thin film forming technique such as sputtering or vapor deposition, or a thick film forming technique such as screen printing. The thickness of the protective layer 25 can be 3-12 micrometers, for example. The protective layer 25 may be formed by stacking a plurality of material layers.

  As shown in FIGS. 1, 4, and 5, an insulating layer 27 that partially covers the individual electrode 19 and the IC-FPC connection electrode 21 is provided on the first main surface 7 c of the substrate 7. As shown in FIG. 1, the insulating layer 27 is provided so as to partially cover a region on the right side of the protective layer 25 on the first main surface 7 c of the substrate 7. For convenience of explanation, in FIG. 1, the formation region of the insulating layer 27 is indicated by a one-dot chain line, and the illustration is omitted.

  The insulating layer 27 has a function of protecting the region covered with the individual electrode 19 and the IC-FPC connection electrode 21 from oxidation due to contact with the atmosphere or corrosion due to adhesion of moisture or the like contained in the atmosphere. . The insulating layer 27 can be formed of a resin material such as an epoxy resin or a polyimide resin, for example. The insulating layer 27 can be formed using a thick film forming technique such as a screen printing method. The insulating layer 27 has electrical insulation and has a configuration in which the adjacent individual electrodes 19 are not short-circuited even when the individual electrodes 19 are covered as described above.

  As shown in FIGS. 1 and 4, an end portion of an IC-FPC connection electrode 21 for connecting an FPC 5 described later is provided exposed from the insulating layer 27 and can be connected to the FPC 5.

  The insulating layer 27 is formed with openings (not shown) for exposing the individual electrodes 19 that connect the drive IC 11 and the ends of the IC-FPC connection electrodes 21. The individual electrode 19 and the IC-FPC connection electrode 21 are connected to the driving IC 11 through the opening. In the present embodiment, the conductive layer 30 is formed on the ends of the individual electrode 19 and the IC-FPC connection electrode 21 exposed from the opening 27a. The individual electrode 19 and the IC-FPC connection electrode 21 are soldered to the drive IC 11 via the conductive layer 30. In this way, the connection strength of the drive IC 11 on the individual electrode 19 and the IC-FPC connection electrode 21 can be improved by soldering the drive IC 11 on the conductive layer 30.

  The conductive layer 30 can be formed of a metal or an alloy, for example, can be formed by well-known electroless plating or electrolytic plating. Further, as the conductive layer 30, for example, a first plating layer (not shown) made of nickel plating is formed on the common electrode 17, and a second plating layer (not shown) made of gold plating is formed on the first plating layer. May be. In this case, the thickness of the first coating layer can be set to, for example, 1.5 μm to 4 μm, and the thickness of the second coating layer can be set to, for example, 0.02 μm to 0.1 μm.

  As shown in FIGS. 3 to 5, the first coating layer 2 that partially covers the common electrode 17 on the second main surface 7 d of the substrate 7 is formed on the second main surface 7 d of the substrate 7. . The first covering layer 2 is provided adjacent to the protective layer 25 and is provided so as to extend in the longitudinal direction of the substrate 7.

  The first covering layer 2 has a function of protecting the region covered with the common electrode 17 from corrosion due to oxidation due to contact with the atmosphere or adhesion of moisture contained in the atmosphere by covering the common electrode 17. Have. As with the insulating layer 27, the first cover layer 2 can be formed of a resin material such as an epoxy resin or a polyimide resin. Moreover, the 1st coating layer 2 can be formed using thick film forming techniques, such as a screen printing method, for example. The thickness of the 1st coating layer 2 can be 20-60 micrometers, for example.

  The second coating layer 4 is provided on the second main surface 7 d of the substrate 7 in a state of being separated from the first coating layer 2, and is provided so as to extend in the longitudinal direction of the substrate 7. The second coating layer 4 is made of the same material as the first coating layer 2. Therefore, the 1st coating layer 2 and the 2nd coating layer 4 can be formed simultaneously using a thick film formation technique. In FIG. 3, the second coating layer 4 is provided in a state of being separated from the second end surface 7b, but may be provided from the second end surface 7b to the second main surface 7d.

  Hereinafter, the connection structure between the substrate 7 and the radiator 1 will be described with reference to FIGS.

  As shown in FIG. 3B, the substrate 7 is disposed so that the second main surface 7 d faces the radiator 1. Therefore, the 2nd main surface 7d of the board | substrate 7 means the 1st surface of this invention.

  As shown in FIGS. 4 and 5, the substrate 7 and the radiator 1 are connected by a first connection member 6 and a second connection member 8. The first connecting member 6 and the second connecting member 8 are formed of an adhesive made of a double-sided tape or a thermosetting resin. Here, the 1st connection member 6 and the 2nd connection member 8 mean the connection member of this invention. Hereinafter, description will be made using an example in which the first connection member 6 is formed of a double-sided tape and the second connection member 8 is formed of an adhesive.

  The first connecting member 6 connects the second main surface 7 d of the substrate 7 and the heat radiator 1, and is provided between the first covering layer 2 of the substrate 7 and the heat radiator 1. The first connection member 6 is formed in substantially the same shape as the first coating layer 2 in plan view. Thereby, the board | substrate 7 and the heat radiator 1 can be connected.

  The second connecting member 8 connects a part of the second main surface 7d of the substrate 7, the second coating layer 4, a part of the second end surface 7b, and the radiator 1 as shown in FIGS. As shown in FIG. 4, between the second main surface 7d of the substrate 7 and the radiator 1, between the second end surface 7b of the substrate 7 and the radiator 1, the first coating layer 2 and the second coating layer 4 Between. The second connection member 8 is provided so as to extend in the longitudinal direction of the substrate 7.

  As described above, the second connecting member 8 is provided between the second main surface 7d of the substrate 7 and the radiator 1, and between the second end surface 7b of the substrate 7 and the radiator 1. The substrate 7 and the radiator 1 can be connected.

  Furthermore, the second connection member 8 is provided between the first coating layer 2 and the second coating layer 4. Since the second connecting member 8 is provided between the first coating layer 2 and the second coating layer 4, it is orthogonal to the conveyance direction D1 (hereinafter referred to as the first direction D1) of the recording medium (not shown). In the direction D2 (hereinafter referred to as the second direction D2) to be performed, the possibility that the substrate 7 is displaced can be reduced.

  Specifically, the second connecting member 8 disposed between the first covering layer 2 and the second covering layer 4 functions as a wedge, so that the substrate 7 and the radiator 1 are in the second direction D2. The connection strength can be improved, and the possibility that the substrate 7 is displaced in the second direction D2 can be reduced.

  From another viewpoint, in the present embodiment, the second coating layer 4 is embedded in the second connection member 8. Since the second covering layer 4 is embedded in the second connecting member 8, the second covering layer 4 functions as a wedge with respect to the second direction D 2. The connection strength with the radiator 1 can be improved, and the possibility that the substrate 7 is displaced in the second direction D2 can be reduced.

  Further, since the second coating layer 4 extends in the arrangement direction of the heat generating portions 9 (hereinafter referred to as the third direction D3), the second coating layer 4 is disposed between the first coating layer 2 and the second coating layer 4. The made second connecting member 8 can further increase the function as a wedge, and can further reduce the possibility of the substrate 7 being displaced in the second direction D2. In particular, since the second coating layer 4 extends in the third direction D3, the possibility that the substrate 7 is inclined with respect to the second direction D2 can be reduced, and the recording medium in the third direction D3 can be reduced. The contact with the thermal head X1 can be made uniform.

  In addition, although the example using the 1st connection member 6 and the 2nd connection member 8 was shown as a connection member, you may connect the board | substrate 7 and the heat radiator 1 only by the 1st connection member 6, or a 2nd connection. You may connect only with the member 8. FIG.

  As shown in FIGS. 1, 4, and 5, the FPC 5 extends along the longitudinal direction of the substrate 7, and the main wiring portion 17 a of the common electrode 17 located on the first main surface 7 c of the substrate 7 as described above. In addition, each IC-FPC connection electrode 21 is connected. The FPC 5 is a well-known one in which a plurality of printed wirings are wired inside an insulating resin layer, and each printed wiring is electrically connected to an external power supply device and control device (not shown) via a connector 31. It has become so. Such a printed wiring is formed by, for example, a metal foil such as a copper foil, a conductive thin film formed by a thin film forming technique, or a conductive thick film formed by a thick film printing technique.

More specifically, as shown in FIGS. 4 and 5, the FPC 5 has a conductive bonding material in which each printed wiring 5 b formed inside the insulating resin layer 5 a is exposed at the end on the second end face 7 b side. 32 are joined. Examples of the conductive bonding material 32 include a conductive bonding material, a solder material, or an anisotropic conductive material (ACF) in which conductive particles are mixed in an electrically insulating resin. The printed wiring 5b of the FPC 5 is connected to the end of the main wiring portion 17a of the common electrode 17 and the end of each IC-FPC connection electrode 21 located on the first main surface 7c of the substrate 7.

  In the present embodiment, since the conductive layer 30 is formed on the common electrode 17 located on the first main surface 7c of the substrate 7, as described above, the printed wiring 5b connected to the common electrode 17 is used. Are connected to the conductive layer 30 through the conductive bonding material 32. Further, since the conductive layer 30 is also formed on the end portion of each IC-FPC connection electrode 21, the printed wiring 5 b connected to each IC-FPC connection electrode 21 is also conductive through the conductive bonding material 32. Connected on layer 30. Thus, the connection strength between the printed wiring 5b, the common electrode 17 and the IC-FPC connection electrode 21 can be improved by connecting the printed wiring 5b onto the conductive layer 30 formed by plating.

  Each printed wiring 5b of the FPC 5 is electrically connected to an external power supply device and control device (not shown) via a connector 31. Thereby, the common electrode 17 and the IC-FPC electrode 21 are supplied with voltage from the outside.

  The FPC 5 is fixed on the radiator 1 by being adhered to the upper surface of the protrusion 1b of the radiator 1 with an adhesive (not shown) such as double-sided tape or resin.

  Next, an embodiment of the thermal printer of the present invention will be described with reference to FIG. FIG. 6 is a schematic configuration diagram of the thermal printer Z of the present embodiment.

  As shown in FIG. 6, the thermal printer Z of the present embodiment includes the above-described thermal head X1, the transport mechanism 40, the platen roller 50, the power supply device 60, and the control device 70. The thermal head X1 is attached to an attachment surface 80a of an attachment member 80 provided in a housing (not shown) of the thermal printer Z. The thermal head X1 is attached to the attachment member 80 so that the arrangement direction of the heat generating portions 9 is along the main scanning direction which is a direction orthogonal to the conveyance direction S of the recording medium P. Therefore, in the thermal head X1, the first main surface 7c side of the substrate 7 is the upstream side in the conveyance direction of the recording medium P, and the second main surface 7d side of the substrate 7 is the downstream side in the conveyance direction of the recording medium P.

  The transport mechanism 40 is for transporting the recording medium P such as thermal paper, image receiving paper, card or the like in the direction of the arrow S in FIG. 6 and transports the recording medium P onto the plurality of heat generating portions 9 of the thermal head X1. 43, 45, 47, 49. The transport rollers 43, 45, 47, and 49 are formed by, for example, covering cylindrical shaft bodies 43a, 45a, 47a, and 49a made of metal such as stainless steel with elastic members 43b, 45b, 47b, and 49b made of butadiene rubber or the like. Can be configured. Although not shown, when the recording medium P is an image receiving paper or a card, an ink film is transported together with the recording medium P between the recording medium P and the heat generating portion 9 of the thermal head X1.

  The platen roller 50 has a function of pressing the recording medium P onto the heat generating portion 9 of the thermal head X1. The platen roller 50 is disposed so as to extend along a direction perpendicular to the conveyance direction S of the recording medium P, and both ends are supported so as to be rotatable while the recording medium P is pressed onto the heat generating portion 9. Has been. The platen roller 50 can be configured by, for example, covering a cylindrical shaft body 50a made of metal such as stainless steel with an elastic member 50b made of butadiene rubber or the like.

The power supply device 60 has a function of supplying a voltage for generating heat from the heat generating portion 9 of the thermal head X1 and a voltage for operating the drive IC 11 as described above. Control device 70
Has a function of supplying the drive IC 11 with a control signal for controlling the operation of the drive IC 11 in order to selectively heat the heat generating portion 9 of the thermal head X1 as described above.

  In the thermal printer Z of the present embodiment, the heat generating unit 9 is selectively heated by the power supply device 60 and the control device 70 while the recording medium P is transported onto the heat generating unit 9 of the thermal head X1 by the transport mechanism 40. Thereby, predetermined printing can be performed on the recording medium P. When the recording medium P is an image receiving paper or a card, printing on the recording medium P can be performed by thermally transferring ink of an ink film (not shown) conveyed with the recording medium P to the recording medium P. .

Second Embodiment
The thermal head X2 will be described with reference to FIGS. 7 (a) and 7 (b). The thermal head X2 is different from the thermal head X1 in that it has two in the direction in which the second coating layer 4 intersects the third direction D3, in other words, in the second direction D2. .

  As shown in FIG. 7A, in the thermal head X2, the first coating layer 2 is provided on the second main surface 7d of the substrate 7, and is separated from the first coating layer 2 in the second direction D2. A second coating layer 4 is provided. The 2nd coating layer 4 has the 2nd coating layer 4a provided in the 2nd end surface 7b side of the 2nd direction D2, and the 2nd coating layer 4b adjacent to the 2nd coating layer 4a. The second coating layer 4b is provided in a state separated from the first coating layer 2, and the second coating layer 4a is provided in a state separated from the second coating layer 4b. The second coating layer 4 is provided by extending the second coating layer 4a and the second coating layer 4b in parallel to each other in the D3 direction. In addition, the 2nd coating layer 4a and the 2nd coating layer 4b can be formed simultaneously, for example, when forming by a thick film formation technique.

  As shown in FIG. 7B, the substrate 7 and the radiator 1 are connected by the first connecting member 6 and the second connecting member 8. The first connecting member 6 is provided between the second main surface 7d of the substrate 7 and the radiator 1, and between the first coating layer 2 and the radiator 1, the second coating layer 4b and the radiator. 1 and between the first coating layer 2 and the second coating layer 4b. Thereby, the 1st connection member 6 can reduce possibility that the board | substrate 7 will shift | deviate to the 2nd direction D2, while connecting the board | substrate 7 and the thermal radiation body 1. FIG.

  The second connecting member 8 is provided between the second main surface 7d of the substrate 7, the second end surface 7b of the substrate 7, and the heat radiating body 1, and the second covering layer 4a and the second covering layer 4b Between the second covering layer 4 a and the heat radiating body 1, and between the second main surface 7 d and the second end surface 7 b of the substrate 7 and the heat radiating body 1. Thereby, the 2nd connection member 8 can reduce possibility that the board | substrate 7 will shift | deviate to the 2nd direction D2 while connecting the board | substrate 7 and the thermal radiation body 1. FIG.

  Thus, when the board | substrate 7 and the heat radiator 1 are connected by the 1st connection member 6 and the 2nd connection member 8, the 2nd coating layer 4 is provided with two or more by the 2nd direction D2, The 1st coating layer 2 and the second coating layer 4b, and between the second coating layer 4b and the second coating layer 4a, the first connecting member 6 or the second connecting member 8 is further arranged in the second direction. It is possible to reduce the possibility that the substrate 7 is displaced at D2.

  In addition, although the example in which the second coating layer 4a and the second coating layer 4b are provided to extend in the third direction D3 in parallel with each other is shown, the second coating layer 4a and the second coating layer 4b are provided. They may be provided inclined with respect to each other. For example, when the second coating layer 4a and the second coating layer 4b are provided to be inclined with respect to each other, at least one of them is inclined with respect to the first end surface 7a, and the second coating layer 4a or the second coating layer 4b is formed. However, it functions as a wedge in the third direction D3. Thereby, the possibility that the substrate 7 is displaced in the third direction D3 can be reduced, and the possibility that the substrate 7 is displaced in the second direction D2 and the third direction D3 can be reduced.

  A modified example of the thermal head X2 will be described with reference to FIG. The thermal head X2 ′ has a shape in which the upper surface of the first connecting member 6 ′ is cut off at the end in the second direction D2. Therefore, the upper surface of the first connection member 6 ′ is connected to the first coating layer 2, and a part of the first connection member 6 ′ protrudes from the first coating layer 2 in plan view. . Then, the second connection member 8 enters the protruding first connection member 6 ′.

  Therefore, the second connection member 8 is disposed between the second main surface 7d and the second end surface 7b of the substrate 7 and the radiator 1, and between the first coating layer 2 and the second coating layer 4b. And it will be arrange | positioned between the 2nd coating layer 4b and the 2nd coating layer 4a.

  By adopting such a configuration, for example, when the second connecting member 8 is formed of a material having higher fluidity than the first connecting member 6 ′, the connection between the substrate 7 and the radiator 1 can be easily performed. Can do. In particular, the first connecting member 6 ′ is formed of double-sided tape, and the second connecting member 8 is formed of an epoxy resin having a higher fluidity than the first connecting member 6 ′, thereby simplifying the manufacture of the thermal head X2 ′. Can be.

  Further, as shown in FIG. 7 (c), a part of the protruding first connecting member 6 ′ has a convex shape with a slope protruding downward, so that the function of a guide for guiding the second connecting member 8 is provided. And can efficiently flow between the first coating layer 2 and the second coating layer 4.

<Third Embodiment>
The thermal head X3 will be described with reference to FIG. In the thermal head X3, the configuration of the second coating layer 4 is different from that of the thermal head X2, and other configurations are the same as those of the thermal head X2, and the description thereof is omitted.

  As shown in FIG. 8A, the second coating layer 4 includes a second coating layer 4a extending in the third direction D3 and a second coating layer 4c scattered in a row in the third direction D3. I have. The second coating layer 4 c forms a second coating layer sequence 10.

  On the second main surface 7d of the substrate 7, the first coating layer 2, the second coating layer 4c spaced apart from the first coating layer 2 in the second direction D2, the second coating layer 4c and the second coating layer 2 are provided. And a second covering layer 4a provided in a direction D2 apart from each other.

  Thus, the 1st connecting member 6 or the 2nd connecting member 8 is arranged around the 2nd covering layer 4c because the 2nd covering layer 4c is scattered in the shape of a line in the 3rd direction D3. Will be. Thereby, the connection area of the 2nd coating layer 4c and the 1st connection member 6 or the 2nd connection member 8 can be increased, and the connection strength of the board | substrate 7 and the heat radiator 1 can be improved.

  Further, since the second coating layer 4c is embedded in the first connection member 6 or the second connection member 8, the substrate 7 functions as a wedge and can be displaced in the second direction D2 and the third direction D3. Can be reduced.

Furthermore, the second coating layer 4 is formed by the second coating layer 4a extending in the third direction D3 and the second coating layer 4c scattered in a row in the third direction D3, so that the second The displacement of the substrate 7 in the second direction D2 can be reduced by the coating layer 4a, and the displacement of the substrate 7 in the third direction D3 can be reduced by the second coating layer 4c. Therefore, in the second direction D2, it can be firmly fixed by the second coating layer 4a, and in the third direction D3, it is fixed by the second coating layer 4c, and between the substrate 7 and the radiator 1. It can reduce that the quantity of the 2nd connection member 8 provided decreases. Thereby, the connection between the substrate 7 and the radiator 1 can be strengthened.

  In addition, although the 2nd coating layer 4 showed the example formed by the 2nd coating layer 4a extended in the 3rd direction D3 and the 2nd coating layer 4c dotted in the 3rd direction D3, As shown in FIG. 8C, the second coating layer 4c and the second coating layer 4c ′ may be formed in a row in the third direction D3. Even in this case, the contact area between the second coating member 4 disposed around the second coating layer 4c and the second coating layer 4c ′ and the second coating layer 4c and the second coating layer 4c ′ is increased. The possibility that the substrate 7 is displaced in the second direction D2 and the third direction D3 can be reduced.

  Furthermore, it is preferable that the second coating layer 4c and the second coating layer 4c ′ are arranged so as to be shifted from each other in the third direction D3. By setting it as such a structure, it can reduce that the area | region where few 2nd connection members 8 are provided between the board | substrate 7 and the thermal radiation body 1 in the 2nd direction D2.

<Fourth Embodiment>
The thermal head X4 will be described with reference to FIG. The thermal head X4 is different in configuration from the thermal head X1 in that the hole 12 is provided in the second coating layer 4, and the other points are the same, so that the description thereof is omitted.

  The second coating layer 4 is provided on the second main surface 7d, and is provided in a state of being separated from the first coating layer 2 in the second direction D2. The second coating layer 4 has a plurality of holes 12 in the third direction D3.

  The hole 12 may be provided so as to penetrate the second coating layer 4, or may be provided such that a part of the second coating layer 4 is cut off. In addition, although the hole part 12 showed planar view and the example of circular shape was shown, rectangular shape, polygonal shape, and elliptical shape may be sufficient.

  In the thermal head X <b> 4, the hole 12 is provided in the second coating layer 4, and the second connection member 8 is disposed inside the hole 12. Therefore, the 2nd connection member 8 arrange | positioned inside the hole part 12 functions as a wedge, and can reduce possibility that the board | substrate 7 will shift | deviate in the 2nd direction D2.

  Moreover, since the hole 12 is provided in the 2nd coating layer 4, as shown in FIG.9 (b), it becomes a structure that the 2nd coating layer 4 is divided | segmented into two in a certain position. Therefore, the divided second coating layers 4 function as wedges, respectively, and can reduce the possibility that the substrate 7 is displaced in the second direction D2.

  In addition, as shown in FIG.9 (c), the hole part 12 provided in the 2nd coating layer 4 may be one. Even in this case, the possibility that the substrate 7 is displaced in the second direction D2 can be reduced by disposing the second connection member 8 inside the hole 12.

<Fifth Embodiment>
The thermal head X5 will be described with reference to FIG. The configuration of the thermal head X5 is different from that of the thermal head X1 in that the second coating layer 4 has the protruding portion 14 and the wide portion 16 provided on the protruding portion 14, and the other points are the same, and the description thereof is omitted. To do.

  The second coating layer 4 includes a second coating layer 4a extending along the third direction D3, and a projecting portion 14 projecting from the second coating layer 4a in the second direction D2 in the third direction in plan view. A plurality of D3 are provided. Each protrusion 14 has the same shape in plan view.

  The protrusion 14 has one wide portion 16 having a large width in the third direction D3. A width W2 of the wide portion 16 in the third direction D3 is longer than a width W1 of the protruding portion 14 excluding the wide portion 16 in the third direction D3. Therefore, the protrusion 14 has a substantially T-shape in plan view.

  Thus, since the protrusion part 14 is substantially T-shaped in plan view, when the substrate 7 and the radiator 1 are connected by the first connection member 6 and the second connection member 8. The protruding portion 14 is embedded in the first connecting member 6 or the second connecting member 8. The protruding portion 14 embedded in the first connecting member 6 or the second connecting member 8 has a portion wider than the protruding portion 14 of the wide portion 16 functions as a wedge. It is possible to reduce the possibility of deviation.

  In addition, as shown in FIG.10 (c), it is good also as a structure which does not provide the wide part 16 in the protrusion part 14. As shown in FIG. Even in this case, since the second coating layer 4 includes the second coating layer 4a extending along the third direction D3, the possibility that the substrate 7 is displaced in the second direction D2 can be reduced. . Moreover, since the protrusion part 14 is provided, possibility that a shift | offset | difference will arise in the board | substrate 7 in the 3rd direction D3 can be reduced.

  Furthermore, you may change the protrusion length of the protrusion part 14 with the position in the 3rd direction D3. For example, as shown in FIG. 10C, the lengths of the protrusions 14a and 14e located at both ends in the third direction D3 are set to the lengths of the protrusions 14b, 14c and 14d located in the center of the third direction D3. By making the length longer than this, it is possible to reduce the possibility that the substrate 7 is displaced at both ends in the third direction D3 where stress is likely to occur. In addition, in the 3rd direction D3, it is good also as a structure which the length of protrusion part 14a-14e becomes short gradually from both ends to a center part.

<Sixth Embodiment>
The thermal head X6 will be described with reference to FIGS. The thermal head X6 is different from the thermal head X1 in the configuration of the radiator 1, and the other points are common and will not be described.

  As shown in FIG. 12 (a), the radiator 1 includes a protrusion 1b provided on the base 1a and a protrusion 1c provided apart from the protrusion 1b. As shown in FIG. 11B, the protruding portion 1c is provided to extend along the third direction D3. And the protrusion height of the protrusion part 1c is lower than the protrusion height of the protrusion part 1b. Similarly, the second covering layer 4 of the substrate 7 is provided extending in the third direction D3. And the board | substrate 7 is mounted on the heat radiator 1 so that the 2nd coating layer 4 of the board | substrate 7 and the protrusion part 1c of the heat radiator 1 may overlap.

  As shown in FIG. 12B, the tip of the protrusion 1 c of the heat radiating body 1 is embedded in the second coating layer 4. Therefore, in the thermal head X6, the protruding portion 1c of the heat radiating body 1 bites into the second covering layer 4, and the connection strength between the substrate 7 and the heat radiating body 1 in the second direction D2 and the third direction D3 can be improved. .

  In addition, the protrusion height of the protrusion part 1c of the heat radiator 1 may not be constant in the third direction D3. For example, the protrusion height may be the highest in the center part in the third direction D3. Moreover, the 2nd coating layer 4 should just be provided above the area | region in which the protrusion part 1c of the heat radiator 1 was provided, and the protrusion part 1c of the heat radiator 1 is not continuously provided in the 3rd direction D3. May be. For example, by providing the protrusion 1c of the heat radiating body 1 only at the central portion in the third direction D3, the possibility that the substrate 7 is displaced at the central portion in the third direction D3 that receives the most pressing force from the recording medium is reduced. can do.

<Seventh Embodiment>
The thermal head X7 will be described with reference to FIG. The thermal head X7 is different from the thermal head X6 in the configuration of the heat radiating body 1, and the other points are the same as the thermal head X6, and the description thereof is omitted.

  The radiator 1 is provided with a base 1a, a protrusion 1b protruding from the base 1a, and a through hole 1d provided in the base 1a and the protrusion 1b at the center in the third direction D3. And the protrusion part 1c is provided in the edge of the through-hole 1d.

  The through hole 1d of the heat radiating body 1 is provided for inserting the second connection member 8, and the second connection member 8 inserted from the through hole 1d spreads from the central part in the third direction D3 to both ends. It is provided as follows. In addition, you may provide the 2nd connection member 8 only in the center part of the 3rd direction D3.

  In the thermal head X7, as shown in FIG. 13B, the second connecting member 8 inserted from the through hole 1d is disposed between the second main surface 7d of the substrate 7 and the radiator 1, and the second coating layer 4 is provided. And the radiator 1, the second end surface 7 b of the substrate 7, and the inside of the through hole 1 d. And in the 2nd coating layer 4, the front-end | tip of the projection part 1c of the heat radiator 1 is embed | buried.

  Due to such a configuration, the thermal head X7 can reduce the possibility that the substrate 7 is displaced in the second direction D2, and also reduces the possibility that the substrate 7 is displaced also in the third direction D3. be able to. In addition, since the through hole 1d is provided, the substrate 7 and the radiator 1 can be firmly fixed by the second connecting member 8 after the substrate 7 and the radiator 1 are fixed by the first connecting member 6. Therefore, the thermal head X7 can be easily manufactured.

  Further, when the through hole 1d is provided in the heat radiating body 1, there is a possibility that a burr or the like is generated at the edge of the through hole 1d, but the burr protrudes by providing the second coating layer 4 above the edge of the through hole 1d. It functions as the portion 1c and can be embedded in the second covering layer 4, and the possibility that the substrate 7 is displaced in the second direction D2 and the third direction D3 can be reduced. Therefore, the edge of the through hole 1d is preferably located below the second coating layer 4.

  As mentioned above, although one Embodiment of this invention was described, this invention is not limited to the said embodiment, A various change is possible unless it deviates from the meaning. For example, although the thermal printer Z using the thermal head X1 according to the first embodiment is shown, the present invention is not limited to this, and the thermal heads X2 to X7 may be used for the thermal printer Z. Further, the thermal heads X1 to X7 may be appropriately combined.

  In the thermal head X1, the common electrode 17 extends from the first end surface 7a of the substrate 7 over the upper surface of the substrate 7 via the second main surface 7d of the substrate 7 and the second end surface 7b of the substrate 7. However, it is not limited to this. For example, the common electrode 17 may be formed only on the first end surface 7 a and the second main surface 7 d of the substrate 7. In this case, the common electrode 17 formed on the second main surface 7d of the substrate 7 and the printed wiring 5b of the FPC 5 may be connected by a separately provided jumper line (not shown). In addition, a conductive layer may be provided on the common electrode 17 formed on the second main surface 7d, and the jumper line and the common electrode 17 may be connected.

In the thermal head X1, the common electrode 17 and the IC-FPC connection electrode 21 provided on the substrate 7 of the head base 3 are electrically connected to an external power supply device, a control device, and the like via the FPC 5. However, the present invention is not limited to this. For example, instead of a flexible printed wiring board having flexibility like the FPC 5, various wirings of the head base 3 may be electrically connected to an external power supply device or the like via a hard printed wiring board. In this case, for example, the common electrode 17 and the IC-FPC connection electrode 21 of the head substrate 3 and the printed wiring of the printed wiring board may be connected by wire bonding, ACF connection, solder connection, or the like.

  In the thermal head X1, as shown in FIGS. 4 and 5, the electric resistance layer 15 is provided not only on the heat storage layer 13 but also on the first main surface 7c and the second main surface 7d of the substrate 7. However, as long as it is connected to the lead portion 17 c on the first end surface 7 a of the substrate 7 and the individual electrode layer 19, it is not limited to this. For example, it may be provided only on the heat storage layer 13. Further, the common electrode 17 and the individual electrode 19 on the first end surface 7 a of the substrate 7 are formed directly on the heat storage layer 13, and between the tip of the common electrode 17 on the heat storage layer 13 and the tip of the individual electrode 19. The electric resistance layer 15 may be provided only in the region.

  As shown in FIG. 14, instead of the common electrode 17, a plurality of heat generating portions 9 may be connected by heat generating portion connection wiring 18 that connects the heat generating portions 9 for every two adjacent heat generating portions 9. In this case, although a detailed description is omitted, the drive IC is configured such that a voltage is applied between the two individual electrodes 19 connected to the two adjacent heat generating portions 9 connected to the heat generating portion connecting wiring 18. Or the heat generating part 9 can be made to generate heat by changing the configuration of various wirings.

  Furthermore, although the example in which the heat generating portion 9 is provided on the first end surface 7a of the substrate 7 has been shown, the present invention is not limited to this. For example, the present invention can be applied to a flat head in which the heat generating portion 9 is provided on the first main surface 7c.

X1 to X7 Thermal head 1 Radiator 1a Base 1b Protrusion 1c Protrusion 1d Through hole 2 First covering layer 3 Head base 4 Second covering layer 5 Flexible printed wiring board 6 First connecting member 7 Substrate 7a First end face 7b 2nd end surface 7c 1st main surface 7d 2nd main surface 8 2nd connection member 9 Heat generating part 10 2nd coating layer sequence 11 Drive IC
12 hole part 13 heat storage layer 14 protrusion part 16 wide part 17 common electrode 19 individual electrode 21 IC-FPC connection electrode 25 protective layer 27 insulating layer

Claims (11)

A substrate,
A plurality of heating portions provided on the substrate and arranged in a row;
An electrode provided on the substrate and electrically connected to the heat generating portion;
A radiator on which the substrate is placed;
A connecting member for connecting the substrate and the radiator,
A first coating layer that covers a part of the electrode and a second coating layer that is spaced apart from the first coating layer are provided on a first surface of the substrate that faces the radiator.
A thermal head, wherein the connection member is disposed between the first coating layer and the second coating layer.   The thermal head according to claim 1, wherein the second coating layer extends in an arrangement direction of the heat generating portions.   The thermal head according to claim 2, wherein a plurality of the second coating layers are provided in a direction intersecting with the arrangement direction of the heat generating portions.   4. The thermal head according to claim 1, wherein the second coating layers are scattered in a row in the arrangement direction of the heat generating portions. 5.   The thermal head according to any one of claims 1 to 4, wherein the second coating layer is provided with a hole, and the connection member is disposed in the hole.   The thermal head according to claim 5, wherein a plurality of the hole portions are provided in the arrangement direction of the heat generating portions.   7. The thermal head according to claim 1, wherein the second coating layer includes a plurality of projecting portions that project in a direction intersecting with the arrangement direction of the heat generating portions when seen in a plan view.   The second covering layer is provided with a wide portion at the protruding portion, and the length of the wide portion in the arrangement direction of the heat generating portions is the arrangement direction of the heat generating portions of the protruding portions excluding the wide portion. The thermal head according to claim 7, wherein the thermal head is longer than   The heat dissipation body is provided with a protruding portion protruding toward the substrate in a region where the second covering layer is disposed, and the protruding portion is embedded in the second covering layer. The thermal head according to any one of 1 to 8.   The heat radiator is provided with a through hole into which the connection member is inserted, and the second covering layer is provided on an edge of the through hole. Thermal head.   11. The thermal head according to claim 1, a transport mechanism that transports a recording medium onto the heat generating portion, and a platen roller that presses the recording medium onto the heat generating portion. A thermal printer.

Images