JP2014072511A - 積層体 - Google Patents
積層体 Download PDFInfo
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- JP2014072511A JP2014072511A JP2012220296A JP2012220296A JP2014072511A JP 2014072511 A JP2014072511 A JP 2014072511A JP 2012220296 A JP2012220296 A JP 2012220296A JP 2012220296 A JP2012220296 A JP 2012220296A JP 2014072511 A JP2014072511 A JP 2014072511A
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- 239000002245 particle Substances 0.000 claims abstract description 51
- 239000000463 material Substances 0.000 claims abstract description 23
- 230000003746 surface roughness Effects 0.000 claims abstract description 21
- 239000003989 dielectric material Substances 0.000 claims description 7
- 239000010408 film Substances 0.000 description 107
- 238000000034 method Methods 0.000 description 38
- 238000005530 etching Methods 0.000 description 31
- 238000010304 firing Methods 0.000 description 16
- 229920002120 photoresistant polymer Polymers 0.000 description 12
- 230000001681 protective effect Effects 0.000 description 10
- 239000000843 powder Substances 0.000 description 9
- 238000006073 displacement reaction Methods 0.000 description 8
- 238000005507 spraying Methods 0.000 description 8
- 239000002002 slurry Substances 0.000 description 7
- 238000004528 spin coating Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000012528 membrane Substances 0.000 description 5
- 230000005684 electric field Effects 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052454 barium strontium titanate Inorganic materials 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/1051—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/082—Shaping or machining of piezoelectric or electrostrictive bodies by etching, e.g. lithography
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
Abstract
【解決手段】この圧電/電歪膜型素子10は、支持体Sの上に順に積層された下部電極20、圧電体層30、及び上部電極40を備える。圧電体層30を構成する圧電材料の粒子の平均粒径dが0.5〜10μmの範囲内にあり、圧電体層30の断面形状が、「高さが0.5〜15μmの範囲内にあり、且つ、底辺の端点にある角の大きさθが85〜105°の範囲内の四角形(略長方形)」である。圧電体層30の側面の表面粗さが、最大高さ粗さRz(JIS B 0601:2001に準拠)で、0.05d〜0.5dμm以下である。
【選択図】図2
Description
以下、本発明の実施形態に係る圧電/電歪膜型素子の構成について図面を参照しながら説明する。図1、図2に示すように、本発明の実施形態に係る圧電/電歪膜型素子10は、支持体Sの上面の複数個所に所定の間隔を置いて整列するように、それぞれ設けられている。各圧電/電歪膜型素子10は、インクジェットプリンタのインクジェットヘッドの駆動源として使用される。
次に、上述した圧電/電歪膜型素子10の製造方法について図3、図4を参照しながら説明する。
次に、上述の製造方法によって形成された圧電/電歪膜型素子10の圧電体層30(焼成体)の特徴について図5、図6を参照しながら説明する。なお、説明の便宜上、図5、図6では、圧電体層30の上面に上部電極40が形成されていない形態が表されている。また、図5、図6は、横方向(x軸方向)において圧縮されて(縦方向(z軸方向)において誇張されて)描かれている。
上述のように、本実施例では、圧電/電歪膜型素子10の圧電体層30として、「前記仮想線で表される形状が、L4が30〜500μmであり、L5が0.5〜15μmであり、且つ、θが85〜105°の四角形」(換言すれば、圧電体層30の断面形状が、長さが30〜500μmであり、高さが0.5〜15μmである略長方形)であり、且つ、「圧電体層30を構成する圧電材料の粒子の平均粒径dが0.5〜10μm」であるもの、が想定される。
この試験では、図3、図4に示す手順に従って作製される圧電/電歪膜型素子10について、圧電材料、圧電体層30の幅(層幅)L4(図6を参照)、圧電体層30の厚さ(層厚)L5(図6を参照)、圧電材料の平均粒径d、角度θ(図6を参照)、並びに、圧電体層30の側面の表面粗さ、の組み合わせが異なる複数のサンプルが作製された。具体的には、表1に示すように、24種類の水準(組み合わせ)が準備された。各水準に対して10個のサンプル(N=10)が作製された。
Claims (3)
- 支持体の上に設けられた下部電極と、
前記下部電極の上に設けられた誘電体層と、
前記誘電体層の上に前記下部電極と平行に向かい合うように設けられた上部電極と、
を備えた積層体であって、
前記誘電体層は焼成体であり、前記誘電体層を構成する誘電材料の粒子の平均粒径dが0.5μm以上10μm以下であり、
前記誘電体層における厚さ方向の断面の形状の輪郭を近似した仮想線で表される形状が、高さが0.5μm以上15μm以下であり、且つ、底辺の端点にある角の大きさが85°以上105°以下の四角形であり、
前記誘電体層の側面の表面粗さは、最大高さ粗さRzで、0.05dμm以上0.5dμm以下である、積層体。 - 請求項1に記載の積層体において、
前記誘電体層が、圧電材料の粒子からなる焼成体である圧電体層であり、
圧電/電歪膜型素子として機能する、積層体。 - 請求項2に記載の積層体において、
前記圧電体層の断面形状における底辺の端点にある角の大きさが90°以上105°以下である、積層体。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012220296A JP2014072511A (ja) | 2012-10-02 | 2012-10-02 | 積層体 |
US14/043,135 US20140091678A1 (en) | 2012-10-02 | 2013-10-01 | Laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012220296A JP2014072511A (ja) | 2012-10-02 | 2012-10-02 | 積層体 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2014072511A true JP2014072511A (ja) | 2014-04-21 |
Family
ID=50384502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012220296A Pending JP2014072511A (ja) | 2012-10-02 | 2012-10-02 | 積層体 |
Country Status (2)
Country | Link |
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US (1) | US20140091678A1 (ja) |
JP (1) | JP2014072511A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107032285A (zh) * | 2015-11-24 | 2017-08-11 | 精工爱普生株式会社 | Mems器件、液体喷射头以及液体喷射装置 |
JP2022530121A (ja) * | 2019-04-26 | 2022-06-27 | ピーアイ・セラミック・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | セラミック絶縁体を有する電気機械アクチュエータおよびその製造方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9147826B2 (en) * | 2014-01-23 | 2015-09-29 | Tdk Corporation | Thin film piezoelectric element, thin film piezoelectric actuator, and thin film piezoelectric sensor; and hard disk drive, and inkjet printer |
JP2016091589A (ja) * | 2014-11-11 | 2016-05-23 | 株式会社東芝 | サスペンションアッセンブリ、ヘッドサスペンションアッセンブリ、およびこれを備えたディスク装置 |
US9076469B1 (en) * | 2015-02-11 | 2015-07-07 | Tdk Corporation | Head assembly |
JP2017199892A (ja) * | 2016-02-17 | 2017-11-02 | 株式会社リコー | 電気−機械変換素子とその製造方法、電気−機械変換素子を備えた液体吐出ヘッドおよび液体吐出装置 |
JP2019006019A (ja) * | 2017-06-26 | 2019-01-17 | セイコーエプソン株式会社 | ノズルプレート、液体噴射ヘッド、液体噴射装置及びノズルプレートの製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000044054A1 (fr) * | 1999-01-22 | 2000-07-27 | Kansai Research Institute | Dispositif a film mince piezoelectrique, procede de production associe et tete d'enregistrement a jet d'encre |
JP2008109072A (ja) * | 2006-09-26 | 2008-05-08 | Ngk Insulators Ltd | モノモルフ型圧電/電歪素子、及びその製造方法 |
US20110289744A1 (en) * | 2010-05-26 | 2011-12-01 | Ngk Insulators, Ltd. | Method of manufacturing piezoelectric element |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69223096T2 (de) * | 1991-07-18 | 1998-05-28 | Ngk Insulators Ltd | Piezoelektrischer/elektrostriktiver Element mit einem keramischen Substrat aus stabilisiertem Zirkoniumdioxid |
JP3120260B2 (ja) * | 1992-12-26 | 2000-12-25 | 日本碍子株式会社 | 圧電/電歪膜型素子 |
JP3209082B2 (ja) * | 1996-03-06 | 2001-09-17 | セイコーエプソン株式会社 | 圧電体薄膜素子及びその製造方法、並びにこれを用いたインクジェット式記録ヘッド |
US9147826B2 (en) * | 2014-01-23 | 2015-09-29 | Tdk Corporation | Thin film piezoelectric element, thin film piezoelectric actuator, and thin film piezoelectric sensor; and hard disk drive, and inkjet printer |
-
2012
- 2012-10-02 JP JP2012220296A patent/JP2014072511A/ja active Pending
-
2013
- 2013-10-01 US US14/043,135 patent/US20140091678A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000044054A1 (fr) * | 1999-01-22 | 2000-07-27 | Kansai Research Institute | Dispositif a film mince piezoelectrique, procede de production associe et tete d'enregistrement a jet d'encre |
JP2008109072A (ja) * | 2006-09-26 | 2008-05-08 | Ngk Insulators Ltd | モノモルフ型圧電/電歪素子、及びその製造方法 |
US20110289744A1 (en) * | 2010-05-26 | 2011-12-01 | Ngk Insulators, Ltd. | Method of manufacturing piezoelectric element |
WO2011148969A1 (ja) * | 2010-05-26 | 2011-12-01 | 日本碍子株式会社 | 圧電素子の製造方法 |
EP2579350A1 (en) * | 2010-05-26 | 2013-04-10 | NGK Insulators, Ltd. | Method for manufacturing piezoelectric element |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107032285A (zh) * | 2015-11-24 | 2017-08-11 | 精工爱普生株式会社 | Mems器件、液体喷射头以及液体喷射装置 |
CN107032285B (zh) * | 2015-11-24 | 2021-08-10 | 精工爱普生株式会社 | Mems器件、液体喷射头以及液体喷射装置 |
JP2022530121A (ja) * | 2019-04-26 | 2022-06-27 | ピーアイ・セラミック・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | セラミック絶縁体を有する電気機械アクチュエータおよびその製造方法 |
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US20140091678A1 (en) | 2014-04-03 |
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