JP2014065646A - Glass substrate processing device and glass substrate processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a glass substrate processing device and a glass substrate processing method capable of improving a processing yield.SOLUTION: A glass substrate processing device 1 comprises: a first film formation part 2 for forming a first protective film on a first surface of a glass substrate; a first film removing part 3 for partially removing the first protective film by radiating laser beam on a face of the first protective film on the first surface opposite to the glass substrate; a second film formation part 4 for forming a second protective film on a second surface of the glass substrate from which the first protective film is partially removed; a second film removing part 5 for partially removing the second protective film by radiating laser beam to a portion opposed to a portion on the first surface of the glass substrate from which the first protective film is removed, on a face of the second protective film on the second surface opposite to the glass substrate; and an etching part 6 for treating the glass substrate from which the second protective film is partially removed with etching liquid.

Description

  Embodiments described herein relate generally to a glass substrate processing apparatus and a glass substrate processing method.

  The glass substrate processing apparatus is an apparatus that performs processing for cutting a tempered glass substrate (for example, a chemically tempered glass substrate) into a desired shape. This glass substrate processing apparatus is widely used in the manufacturing process of electronic components such as semiconductor devices and liquid crystal display devices. The chemically tempered glass substrate is a glass substrate in which a stress generation layer (strengthening layer) is formed at a depth of several tens of μm from the surface of the glass substrate by chemical treatment.

  Usually, as a method of cutting chemically tempered glass, a resist material (protective film) having an etching solution resistance is applied to a tempered glass substrate, and a glass substrate exposed portion having a desired shape is formed through exposure and development processes. Thereafter, a method of etching and cutting the glass substrate with an etching solution has been proposed. In addition, the resist material (protective film) is partially removed directly by a laser beam without passing through exposure and development steps to form a glass substrate exposed portion of a desired shape, and then the glass substrate is etched with an etchant. A method of cutting is also proposed.

JP 2009-292699 A

  The problem to be solved by the present invention is to provide a glass substrate processing apparatus and a glass substrate processing method capable of improving the processing yield.

  The glass substrate processing apparatus according to the embodiment forms a first protective film having laser light absorption and etching resistance on a first surface of a glass substrate having a first surface and a second surface facing each other. The first film forming portion and the first protective film formed on the first surface of the glass substrate are irradiated with laser light on the surface opposite to the glass substrate side, and formed on the first surface of the glass substrate. The first film removing portion for removing the first protective film and the second surface of the glass substrate from which the first protective film has been partially removed from the first surface are provided with laser light absorption and etching resistance. A second film forming portion for forming a second protective film having a second surface of the glass substrate, and a surface of the second protective film formed on the second surface of the glass substrate opposite to the glass substrate side. Opposite the location where the first protective film on the surface of 1 is removed A second film removing portion for partially removing the second protective film formed on the second surface of the glass substrate by irradiating the portion with laser light; and the second protective film is partially removed from the second surface. And an etching unit for treating the glass substrate with an etching solution.

  A glass substrate processing apparatus according to an embodiment includes a first protective film having laser light absorption and etching resistance formed on a first surface of a glass substrate having a first surface and a second surface facing each other. A first film removing section for irradiating a surface opposite to the glass substrate side with laser light to partially remove the first protective film formed on the first surface of the glass substrate; and a second surface of the glass substrate. The surface of the second protective film formed on the side opposite to the glass substrate side in the second protective film having laser light absorption and etching resistance, where the first protective film on the first surface of the glass substrate is removed. A second film removing unit that irradiates a laser beam to the opposite part and partially removes the second protective film formed on the second surface of the glass substrate;

  In the glass substrate processing method according to the embodiment, a first protective film having laser light absorption and etching resistance is formed on a first surface of a glass substrate having a first surface and a second surface facing each other. A step of irradiating a surface of the first protective film formed on the first surface of the glass substrate opposite to the glass substrate side with a laser beam to form a first protection formed on the first surface of the glass substrate; A step of partially removing the film, and forming a second protective film having laser light absorption and etching resistance on the second surface of the glass substrate from which the first protective film has been partially removed from the first surface In the step where the first protective film on the first surface of the glass substrate is removed on the surface opposite to the glass substrate side in the second protective film formed on the second surface of the glass substrate Irradiate the laser beam to the opposite location And a step of second protective layer portion is removed which is formed on the second surface of the substrate, and a step in which the second protective film for processing a glass substrate was partially removed from the second surface with an etchant.

  A glass substrate processing method according to an embodiment includes a first protective film having laser light absorption and etching resistance formed on a first surface of a glass substrate having a first surface and a second surface facing each other. A step of irradiating a surface opposite to the glass substrate with laser light to partially remove the first protective film formed on the first surface of the glass substrate; and a laser formed on the second surface of the glass substrate. The laser is applied to the surface of the second protective film having light absorption and etching resistance on the side opposite to the glass substrate side and facing the portion of the first surface of the glass substrate where the first protective film is removed. Irradiating light and partially removing the second protective film formed on the second surface of the glass substrate.

  According to the present invention, the processing yield can be improved.

It is a block diagram which shows schematic structure of the glass substrate processing apparatus which concerns on 1st Embodiment. It is a 1st process sectional view for explaining the flow of the glass substrate processing process concerning a 1st embodiment. It is a 2nd process sectional view for explaining the flow of the glass substrate processing process concerning a 1st embodiment. It is a 3rd process sectional view for explaining the flow of the glass substrate processing process concerning a 1st embodiment. It is sectional drawing which shows the comparative example with respect to FIG. It is a 4th process sectional view for explaining the flow of the glass substrate processing process concerning a 1st embodiment. It is a 5th process sectional view for explaining the flow of the glass substrate processing process concerning a 1st embodiment. It is a 6th process sectional view for explaining the flow of the glass substrate processing process concerning a 1st embodiment. It is a block diagram which shows schematic structure of the glass substrate processing apparatus which concerns on 2nd Embodiment.

(First embodiment)
A first embodiment will be described with reference to FIGS.

  As shown in FIG. 1, the glass substrate processing apparatus 1 according to the first embodiment includes a first film forming unit 2, a first film removing unit 3, a second film forming unit 4, and a second film removing unit. A part 5 and an etching part 6 are provided. Transfer between these units 2 to 6 is performed by a transfer unit (not shown) such as robot handling or a belt conveyor. Hereinafter, each part 2-6 is demonstrated, referring FIG. 2 thru | or FIG.

  As shown in FIG. 2, the first film forming unit 2 spin-coats, inkjet-coats, etc. the 1st surface M1 of the glass substrate 11 with the 1st protective film 12 which has laser-light absorptivity and etching resistance The first film forming process is used. The glass substrate 11 has a first surface M1 and a second surface M2 facing each other. As the glass substrate 11, for example, a tempered glass substrate (for example, a chemically tempered glass substrate) having a tempering layer (stress generation layer) on both sides can be used, and the first protective film 12 can be used. For example, a resist material or the like can be used. Note that it is not necessary to use an expensive resist material, and a resist material in which a laser absorbent is contained in an etching-resistant protective paint may be used.

  As shown in FIG. 3, the first film removal unit 3 uses the laser irradiation unit 3 a and the glass substrate 11 side in the first protective film 12 formed on the first surface M <b> 1 of the glass substrate 11. The opposite surface (exposed surface) is irradiated with laser light to partially remove the first protective film 12 on the first surface M1 of the glass substrate 11 into a desired shape (first film removal step). .

  By this first film removal process, the first protective film 12 is laser-scribed to a desired position and shape so as to selectively etch the glass substrate 11, for example, the reinforcing layer, in an etching process which is a subsequent process. . Thereby, as shown in FIG. 4, a digging portion (groove) 12a is formed in the first protective film 12 on the first surface M1 of the glass substrate 11, and an exposed portion (glass substrate) of the first surface M1 is formed. Exposed portion) M1a is formed. Note that the first protective film 12 has a property of absorbing the wavelength of the laser beam to be used. Further, the laser beam used is desirably a laser beam having a wavelength that is not easily absorbed by glass.

  Here, in the first film removal step, the first protective film 12 on the first surface M1 of the glass substrate 11 is gradually processed from the irradiation side surface by laser light irradiation as shown in FIG. To go. At this time, since the laser light is consumed for processing the first protective film 12, there is almost no influence on the glass substrate 11. Thereafter, processing by laser irradiation proceeds, and as shown in FIG. 4, when the first protective film 12 almost disappears, the laser light reaches the glass substrate 11 and heats the glass substrate 11. However, if a laser beam having a wavelength that is difficult to be absorbed by glass is selected as the laser beam to be used, heating is reduced.

  At this time, as shown in FIG. 5, when the protective film 21 is formed on the second surface M2 on the back side (comparative example), the laser light transmitted through the glass substrate 11 is transmitted to the protective film on the second surface M2. 21 is also processed. At this time, the laser light is incident on the protective film 21 from the glass substrate 11 and the portion of the protective film 21 that is in direct contact with the glass substrate 11 is processed, so the heat generated by this processing is on the front side (laser irradiation side). Unlike the processing of the first protective film 12, the temperature becomes high. For this reason, the thermal influence on the glass substrate 11 becomes extremely large, and the strength of the substrate is reduced and cracks 22 are generated (in the worst case, crushing occurs). In order to avoid this, in the laser scribe described above, as shown in FIGS. 3 and 4, the first protective film 12 is formed only on the first surface M1 on the front side of the glass substrate 11, and the second surface on the back side. M2 has no protective film, and the laser beam is irradiated from the first surface M1 on the front side.

  As shown in FIG. 6, the second film forming unit 4 has a laser light absorption property and etching resistance on the second surface M2 of the glass substrate 11 from which the first protective film 12 has been partially removed. The second protective film 13 is formed by a film forming method such as spin coating or ink jet coating (second film forming step). As the second protective film 13, for example, a resist material or the like can be used in the same manner as the first protective film 12 described above.

  As shown in FIG. 7, the second film removing unit 5 uses the laser irradiation unit 5 a and the glass substrate 11 side in the second protective film 13 formed on the second surface M <b> 2 of the glass substrate 11. The opposite surface (exposed surface) which is irradiated with laser light on the first surface M1 of the glass substrate 11 where the first protective film 12 is removed (exposed portion M1a) is irradiated with laser light. The second protective film 13 on the second surface M2 of the substrate 11 is partially removed into a desired shape (second film removal step).

  At this time, the second film removing unit 5 uses the alignment unit 5b to remove the first protective film 12 on the first surface M1 of the glass substrate 11 from the laser beam emitted by the laser irradiation unit 5a. The laser irradiation position is adjusted so that the light is incident on the part facing the part. The alignment unit 5b confirms the processing location of the first protective film 12 by an imaging unit such as a camera, and adjusts the laser irradiation position with reference to the position of the processing location. In addition to confirming the processing location of the first protective film 12, a mechanism and a process for forming a mark serving as a reference on the glass substrate 11 that enables positioning are provided, and the mark is confirmed by the imaging unit. You may make it become a reference | standard.

  By this second film removal process, the second protective film 13 is laser-scribed to a desired position and shape so as to selectively etch the glass substrate 11, for example, the reinforcing layer, in an etching process which is a subsequent process. . As a result, as shown in FIG. 8, a digging portion (groove) 13a is formed in the second protective film 13 on the second surface M2 of the glass substrate 11, and an exposed portion (glass substrate) of the second surface M2 is formed. Exposed portion) M2a is formed. Note that the second protective film 13 has the property of absorbing the wavelength of the laser light to be used, like the first protective film 12. Further, the laser beam used is desirably a laser beam having a wavelength that is not easily absorbed by glass.

  Here, in the second film removal step, the second protective film 13 on the second surface M2 of the glass substrate 11 is gradually processed from the irradiation side surface by laser light irradiation as shown in FIG. To go. At this time, since the laser light is consumed for processing the second protective film 13, there is almost no influence on the glass substrate 11. Thereafter, processing by laser irradiation proceeds, and as shown in FIG. 8, the laser beam reaches the glass substrate 11 when the second protective film 13 almost disappears, and the glass substrate 11 is heated. However, if a laser beam having a wavelength that is difficult to be absorbed by glass is selected as the laser beam to be used, heating is reduced.

  At this time, if a protective film exists on the exposed portion M1a of the first surface M1 on the front side, the laser light transmitted through the glass substrate 11 processes the protective film on the first surface M1. At this time, the laser light is incident on the protective film from the glass substrate 11, and the portion of the protective film that is in direct contact with the glass substrate 11 is processed. Therefore, the heat generated by this processing is the second on the back side (laser irradiation side). Unlike the protective film 13 of FIG. For this reason, the thermal influence on the glass substrate 11 becomes extremely large, and the strength of the substrate is reduced and cracks occur (in the worst case, crushing occurs). In order to avoid this, in the laser scribe described above, as shown in FIGS. 6 and 7, the second protective film 13 is formed on the second surface M2 on the back side of the glass substrate 11, and the laser light is emitted from the glass substrate 11. Irradiation is performed on a location on the first surface M1 opposite to the location where the first protective film 12 is removed (exposed portion M1a).

  That is, when the portion where the first protective film 12 is not removed by the first film removing step is laser-scribed from the back side during the second film removing step, the protective film is formed on both surfaces if only the laser irradiated portion is seen. As a result, a thermal effect on the glass substrate 11 is inevitable. Therefore, when performing the second film removal step, it is necessary to align the processed portion with the portion where the first protective film 12 has been removed in the first film removal step. Therefore, the laser irradiation position is determined by positioning the glass substrate 11 at a position where the first protective film 12 on the first surface M1 of the glass substrate 11 has been removed by the alignment unit 5b from the laser irradiation unit 5a. Thus, it is adjusted so as to be incident on the opposite portion.

  The etching unit 6 supplies an etching solution (liquid for corroding glass) to the glass substrate 11 in which the first protective film 12 and the second protective film 13 are processed into a desired shape, The reinforcing layers on both sides (the reinforcing layers having a predetermined depth) are etched, and the reinforcing layers on both sides of the glass substrate 11 are partially removed (etching step). Thereby, the reinforced layer (strengthened layer exposed portion) that is not protected by the first protective film 12 and the second protective film 13 is removed, and the glass material of the glass substrate 11 (ordinary severable glass material) is partially formed. Exposed. Then, the glass substrate 11 is cut | disconnected by the cutting part using a cutter, a blade, etc. from the glass material exposure part. Thereby, the glass substrate 11 is cut into a desired shape. It is also possible to continue the etching and cut the glass substrate 11 without using a cutting part such as a cutter or a blade. After such an etching process, the first protective film 12 and the second protective film 13 are removed from the glass substrate 11.

  Here, as the supply of the etching solution, the glass substrate 11 may be immersed in the etching solution, or the etching solution may be applied to the glass substrate 11, and either the batch processing or the single wafer processing is performed. It may be used. When supplying the etching solution to the glass substrate 11, the etching solution is supplied while rotating the glass substrate 11, or the etching solution is supplied while the glass substrate 11 is conveyed by a roller. The method is not particularly limited.

  In such a glass substrate processing step, during laser irradiation, the protective film (first protective film 12 or second protective film 13) is formed on both surfaces of the glass substrate 11 (first surface M1 and second surface M2). Is not present on both of them, and is present only on one side of either. The laser irradiation direction is a direction from the exposed surface side of the protective film toward the inside. In the first film removal step, the first protective film 12 is formed only on the first surface M1 of the glass substrate 11, and the second surface M2 on the opposite side has no protective film, and the first surface M1. Laser light is irradiated from the side. In the second film removal step, the second protective film 13 is formed on the entire surface of the second surface M2, and laser light is irradiated from the second surface M2 side. At this time, since the first protective film 12 has been removed on the opposite side of the desired processing location, that is, the first surface M1 side by the first film removal step, it is limited to the laser light irradiation location. The second protective film 13 is formed on the back side, but there is no protective film on the front side. Thus, by separating the first film removal process on the front side and the second film removal process on the back side, the film removal process (laser scribing) is performed for each side, thereby reducing the thermal effect on the glass substrate 11. Since the generation of cracks and the like caused by laser scribing is drastically reduced, the film can be removed while preventing the occurrence of cracks, and as a result, the processing yield can be improved.

  As described above, according to the first embodiment, the first protective film 12 is formed on the first surface M1 of the glass substrate 11, and the first protective film 12 on the first surface M1 is formed. The first protective film 12 is partially removed by irradiating the surface opposite to the glass substrate 11 side with laser light, and then the second surface M2 of the glass substrate 11 from which the first protective film 12 is partially removed is applied to the second surface M2. The second protective film 13 is formed, and the first protection on the first surface M1 of the glass substrate 11 is the surface of the second protective film 13 on the second surface M2 opposite to the glass substrate 11 side. The second protective film 12 is partially removed by irradiating the portion opposite the portion from which the film 12 has been removed, and finally the glass substrate 11 from which the second protective film 12 has been partially removed is treated with an etching solution. To do. Therefore, when the first protective film 12 or the second protective film 13 on the glass substrate 11 is removed by the laser light, the laser light removes the first protective film 12 or the second protective film 13 to remove the glass substrate. However, since the protective film is not present on the surface of the glass substrate 11 opposite to the laser incident side, the glass substrate 11 is transmitted as it is. For this reason, heat is not generated by the laser beam due to the presence of the protective film on the opposite surface, and the thermal effect on the glass substrate 11 is reduced, thereby preventing a decrease in substrate strength, generation of cracks, and the like. Thus, the processing yield of the glass substrate 11 can be improved.

(Second Embodiment)
A second embodiment of the present invention will be described with reference to FIG. In the second embodiment, differences from the first embodiment will be described, the same parts as those described in the first embodiment will be denoted by the same reference numerals, and the description thereof will also be omitted.

  As shown in FIG. 9, the glass substrate processing apparatus 1 according to the second embodiment includes a first film formation unit 2, a first film removal unit 3, a second film formation unit 4, and a second film removal. In addition to the unit 5 and the etching unit 6, a first cleaning unit 7 and a second cleaning unit 8 are provided. Transfer between these units 2 to 8 is performed by a transfer unit (not shown) such as robot handling or a belt conveyor. In addition, the 1st washing | cleaning part 7 and the 2nd washing | cleaning part 8 may be provided only in one rather than both.

  The first cleaning unit 7 cleans the second surface M2 of the glass substrate 11 on which the first protective film 12 is formed on the first surface M1. Thereby, before the step of partially removing the first protective film 12 on the first surface M1, the second surface of the glass substrate 11 on which the first protective film 12 is formed on the first surface M1. There will be a step of washing M2. After this cleaning step, the first protective film 12 is partially removed from the first surface M1.

  The second cleaning unit 8 cleans the first surface M1 of the glass substrate 11 from which the first protective film 12 has been partially removed from the first surface M1. Thus, the first surface of the glass substrate 11 from which the first protective film 12 is partially removed from the first surface M1 before the step of partially removing the second protective film 13 on the second surface M2. There will be a step of washing M1. After this cleaning process, the second protective film 13 is partially removed from the second surface M2.

  Here, when the first protective film 12 on the first surface M1 is removed, even if the protective film is not present on the second surface M2 on the back surface, the processing scattered matter, residue, etc. If the deposit is present, the state is the same as the state in which the protective film is on the second surface M2, and heat from the laser light is generated in the portion of the deposit that is in direct contact with the glass substrate 11. The thermal effect on the substrate 11 is extremely large. Since this causes damage to the glass substrate 11, it is desirable to keep the surface opposite to the laser irradiation side in the glass substrate 11, that is, the second surface M2. Further, when removing the second protective film 13 on the second surface M2, for the same reason, the surface of the glass substrate 11 opposite to the laser irradiation side, that is, the first surface M1 (particularly, the exposed portion M1a). It is desirable to keep it clean.

  Therefore, before removing the first protective film 12 on the first surface M1, the laser on the glass substrate 11 is cleaned by cleaning the second surface M2 on the back surface by the first cleaning unit 7 described above. The surface opposite to the irradiation side, that is, the second surface M2 can be kept clean. Similarly, before removing the second protective film 13 on the second surface M2, the glass substrate is cleaned by cleaning the first surface M1 opposite to the second cleaning unit 8 described above. 11, the surface opposite to the laser irradiation side, that is, the first surface M1 (particularly, the exposed portion M1a) can be kept clean.

  As described above, according to the second embodiment, the same effect as that of the first embodiment can be obtained. Furthermore, by providing the first cleaning unit 7 and the second cleaning unit 8, the surface opposite to the laser irradiation side in the glass substrate 11 is maintained clean, which is attributed to the presence of deposits on the opposite surface. Heat is not generated by the laser light, and the thermal influence on the glass substrate 11 is reduced. As a result, it is possible to reliably prevent the substrate strength from being lowered and the occurrence of cracks, and the processing yield of the glass substrate 11 can be more reliably improved.

  Here, when the second protective film 13 is formed on the second surface M2 on the back side in the second film forming step described above, the first surface M1 on the front side (especially the exposed portion M1a) due to wraparound or the like. If a protective film is formed on the glass substrate 11, it causes damage to the glass substrate 11 for the same reason as described above, and must be avoided. For this reason, in the second film formation step, the second protective film 13 is prevented from wrapping around from the second surface M2 of the glass substrate 11 to the first surface M1, and in particular, the first film on the first surface M1. The second protective film 13 is formed on the second surface M <b> 2 while preventing entry into the dug portion 12 a existing in the protective film 12. In addition, when the 2nd protective film 13 wraps around from the 2nd surface M2 of the glass substrate 11 to the 1st surface M1, the 2nd protective film 13 of the wraparound part is removed. Here, as a specific example for preventing the second protective film 13 from wrapping from the second surface M2 of the glass substrate 11 to the first surface M1, a wraparound prevention cover is attached to the spin coater, and the spin coater is used to The second protective film 13 is formed on the second surface M2.

  In the first or second embodiment described above, the first film forming unit 2 and the second film forming unit 4 are provided, and the first film removing unit 3 and the second film removing unit 5 are provided. However, the present invention is not limited to this. For example, one film forming unit may be shared as the first film forming unit 2 and the second film forming unit 4. One film removing unit may be shared as the film removing unit 3 and the second film removing unit 5.

  As mentioned above, although some embodiment of this invention was described, these embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 1 Glass substrate processing apparatus 2 1st film | membrane formation part 3 1st film | membrane removal part 4 2nd film | membrane formation part 5 2nd film | membrane removal part 5b Positioning part 6 Etching part 7 1st washing | cleaning part 8 1st Cleaning unit 11 Glass substrate 12 First protective film 13 Second protective film M1 First surface M2 Second surface

Claims (14)

A first film forming section for forming a first protective film having laser light absorption and etching resistance on a first surface of a glass substrate having a first surface and a second surface facing each other;
The first protective film formed on the first surface of the glass substrate is irradiated with laser light on the surface of the first protective film opposite to the glass substrate side, and the first surface formed on the first surface of the glass substrate. A first film removing unit for partially removing the protective film;
Second film formation for forming a second protective film having laser light absorption and etching resistance on the second surface of the glass substrate from which the first protective film has been partially removed from the first surface And
The surface of the second protective film formed on the second surface of the glass substrate is the surface opposite to the glass substrate side, and the first protective film on the first surface of the glass substrate is removed. A second film removal unit that irradiates a part facing the part with a laser beam and partially removes the second protective film formed on the second surface of the glass substrate;
An etching portion for treating the glass substrate from which the second protective film has been partially removed from the second surface with an etchant;
A glass substrate processing apparatus comprising: A cleaning unit for cleaning the second surface of the glass substrate on which the first protective film is formed on the first surface;
2. The glass substrate processing apparatus according to claim 1, wherein the first film removing unit irradiates the glass substrate with the second surface cleaned with laser light. 3. A cleaning unit for cleaning the first surface of the glass substrate from which the first protective film has been partially removed from the first surface;
3. The glass substrate processing apparatus according to claim 1, wherein the second film removing unit irradiates the glass substrate with the first surface cleaned with laser light. 4.   The second film forming unit forms the second protective film on the second surface while suppressing the second protective film from flowing from the second surface to the first surface. The glass substrate processing apparatus as described in any one of Claims 1 thru | or 3 characterized by the above-mentioned.   The said 2nd film | membrane removal part removes the said 2nd protective film which wraps around the said 1st surface from the said 2nd surface, The any one of Claim 1 thru | or 3 characterized by the above-mentioned. The glass substrate processing apparatus of description.   The second film removing unit includes an alignment unit that aligns an irradiation position of the laser beam at a position facing the position where the first protective film is removed on the first surface of the glass substrate. The glass substrate processing apparatus as described in any one of Claim 1 thru | or 5. The first protective film formed on the first surface of the glass substrate having the first surface and the second surface facing each other on the surface opposite to the glass substrate side in the first protective film having laser light absorption and etching resistance. A first film removing unit that irradiates a laser beam and partially removes the first protective film formed on the first surface of the glass substrate;
The second protective film formed on the second surface of the glass substrate and having a laser light absorption property and etching resistance is a surface opposite to the glass substrate side and the surface of the first surface of the glass substrate. A second film removing unit that irradiates a portion facing the portion from which the first protective film has been removed with a laser beam, and partially removes the second protective film formed on the second surface of the glass substrate; ,
A glass substrate processing apparatus comprising: Forming a first protective film having laser light absorption and etching resistance on a first surface of a glass substrate having a first surface and a second surface facing each other;
The first protective film formed on the first surface of the glass substrate is irradiated with laser light on the surface of the first protective film opposite to the glass substrate side, and the first surface formed on the first surface of the glass substrate. Removing part of the protective film,
Forming a second protective film having laser light absorption and etching resistance on the second surface of the glass substrate from which the first protective film has been partially removed from the first surface;
The surface of the second protective film formed on the second surface of the glass substrate is the surface opposite to the glass substrate side, and the first protective film on the first surface of the glass substrate is removed. Irradiating a portion facing the portion with laser light, partially removing the second protective film formed on the second surface of the glass substrate;
Treating the glass substrate from which the second protective film has been partially removed from the second surface with an etchant;
The glass substrate processing method characterized by having.   Before the step of partially removing the first protective film, the method further comprises the step of cleaning the second surface of the glass substrate on which the first protective film is formed on the first surface. The glass substrate processing method of Claim 8.   Before the step of partially removing the second protective film, the method further comprises a step of cleaning the first surface of the glass substrate from which the first protective film has been partially removed from the first surface. The glass substrate processing method according to claim 8 or 9.   In the step of forming the second protective film, the second protective film is formed on the second surface while preventing the second protective film from flowing from the second surface to the first surface. The glass substrate processing method according to any one of claims 8 to 10, wherein:   11. The method according to claim 8, wherein, in the step of partially removing the second protective film, the second protective film that has wrapped around the first surface from the second surface is removed. The glass substrate processing method as described in any one of Claims.   In the step of partially removing the second protective film, the irradiation position of the laser beam is aligned with a position on the first surface of the glass substrate opposite to the position where the first protective film is removed. The glass substrate processing method as described in any one of Claims 8 thru | or 12. The first protective film formed on the first surface of the glass substrate having the first surface and the second surface facing each other on the surface opposite to the glass substrate side in the first protective film having laser light absorption and etching resistance. Irradiating a laser beam to partially remove the first protective film formed on the first surface of the glass substrate;
The second protective film formed on the second surface of the glass substrate and having a laser light absorption property and etching resistance is a surface opposite to the glass substrate side and the surface of the first surface of the glass substrate. Irradiating a portion facing the portion from which the first protective film has been removed with laser light, and partially removing the second protective film formed on the second surface of the glass substrate;
The glass substrate processing method characterized by having.

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