JP2014065647A - Glass substrate processing device and glass substrate processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a glass substrate processing device and a glass substrate processing method capable of improving a processing yield.SOLUTION: A glass substrate processing device 1 comprises: a first film formation part 2 for forming a first light absorption film on a second reinforced layer of a glass substrate; a first film removing part 3 for partially removing the first light absorbing film on the second reinforced layer while generating a crack part on the second reinforced layer with heat generated on the first light absorption film by radiation of laser beam from a first reinforced layer side; a second film formation part 4 for forming a second light absorption film on the first reinforced layer of the glass substrate; a second film removing part 5 for partially removing the second light absorption film on the first reinforced layer while generating a crack part on the first reinforced layer with heat generated on the second light absorption film by radiation of laser beam from a portion of the second reinforced layer at which the crack part is generated; and an etching part 6 for treating the glass substrate from which the first light absorption film and the second light absorption film are partially removed with etching liquid.

Description

  Embodiments described herein relate generally to a glass substrate processing apparatus and a glass substrate processing method.

  The glass substrate processing apparatus is an apparatus that performs processing for cutting a tempered glass substrate (for example, a chemically tempered glass substrate) into a desired shape. This glass substrate processing apparatus is widely used in the manufacturing process of electronic components such as semiconductor devices and liquid crystal display devices. The chemically strengthened glass substrate is a glass substrate in which a strengthening layer (stress generation layer) is formed to a depth of several tens of μm from the surface of the glass substrate by chemical treatment.

  Usually, as a method of cutting a tempered glass substrate, a resist material (light absorption film) having an etching solution resistance is applied to the glass substrate, and a glass substrate exposed portion having a desired shape is formed through exposure and development processes. Thereafter, a method of etching and cutting the glass substrate with an etching solution has been proposed. There has also been proposed a method in which a resist material is partially removed directly by a laser beam without passing through exposure and development steps to form a glass substrate exposed portion having a desired shape. Furthermore, a method has been proposed in which a microcrack or an altered portion is formed inside a glass substrate by laser irradiation without using a resist material before etching.

JP 2009-292699 A

  The problem to be solved by the present invention is to provide a glass substrate processing apparatus and a glass substrate processing method capable of improving the processing yield.

  The glass substrate processing apparatus according to the embodiment has the first reinforcing layer on the second reinforcing layer in the glass substrate having the first reinforcing layer as the first surface layer and the second reinforcing layer as the second surface layer opposite to the first surface layer. A first film forming portion for forming a first light absorption film having laser light absorption, and a first light absorption film formed on the second reinforcement layer from the first reinforcement layer side. The laser beam is irradiated, and the second reinforcing layer in contact with the first light absorption film is caused to generate cracks or altered portions by the heat generated in the first light absorption film by the laser light irradiation, while the second A first film removing portion for partially removing the first light absorbing film formed on the reinforcing layer, and a second light absorbing film having laser light absorptivity on the first reinforcing layer of the glass substrate. The second film forming portion to be formed and the first portion from the place where the crack portion or the altered portion in the second reinforcing layer is generated. The first light absorption film formed on the reinforcing layer is irradiated with laser light, and the first light contact with the second light absorption film is generated by the heat generated in the second light absorption film by the laser light irradiation. A second film removing portion for partially removing the second light absorbing film formed on the first reinforcing layer while generating a cracked portion or an altered portion in the reinforcing layer; a first light absorbing film; And an etching part for treating the glass substrate from which the light absorption film is partially removed with an etching solution.

  The glass substrate processing apparatus which concerns on embodiment is on the 1st reinforcement | strengthening layer in the glass substrate which has a 1st reinforcement layer as a 1st surface layer, and a 2nd reinforcement layer as a 2nd surface layer on the opposite side of a 1st surface layer. Forming a first light-absorbing film having laser light absorption on the second reinforcing layer and forming a second light-absorbing film having laser light-absorbing on the second reinforcing layer; and on the first reinforcing layer The first light absorption film is irradiated with laser light from the first light absorption film side toward the second light absorption film formed on the second reinforcing layer, and the first light absorption film is irradiated with the laser light. The first light-absorbing film formed on the first reinforcing layer is partially removed while generating cracks or altered portions in the first reinforcing layer in contact with the first light-absorbing film by the generated heat, and the laser The second reinforcing layer in contact with the second light absorption film is heated by the heat generated in the second light absorption film by light irradiation. A film removal portion for partially removing the second light absorption film formed on the second reinforcing layer, the first light absorption film, and the second light absorption film. And an etching section for treating the partially removed glass substrate with an etching solution.

  The glass substrate processing apparatus according to the embodiment includes a film forming portion that forms a light absorbing film having laser light absorption on a reinforcing layer in a glass substrate having a reinforcing layer as a surface layer, and light absorption formed on the reinforcing layer. Light absorption film formed on the reinforcing layer while irradiating the film with laser light and generating cracks or altered portions in the reinforcing layer in contact with the light absorbing film by the heat generated in the light absorbing film by the laser light irradiation The film removal part which removes partially, and the etching part which permeate | etches an etching liquid in the location where the crack part or the altered part in a reinforcement layer produced | generated are provided.

  The glass substrate processing apparatus according to the embodiment irradiates a light absorbing film having a laser light absorption property formed on a reinforcing layer in a glass substrate having a reinforcing layer as a surface layer, and absorbs the light by irradiation of the laser light. A film removal unit is provided that partially removes the light absorption film formed on the reinforcement layer while generating cracks or altered portions in the reinforcement layer in contact with the light absorption film by heat generated in the film.

  The glass substrate processing method which concerns on embodiment is on the 2nd reinforcement layer in the glass substrate which has a 1st reinforcement layer as a 1st surface layer, and a 2nd reinforcement layer as a 2nd surface layer on the opposite side of a 1st surface layer. And a step of forming a first light absorption film having laser light absorption, and irradiating the first light absorption film formed on the second enhancement layer from the first enhancement layer side with the laser beam. On the second reinforcing layer, a crack or an altered portion is generated in the second reinforcing layer in contact with the first light absorbing film by the heat generated in the first light absorbing film by the irradiation of the laser light. A step of partially removing the formed first light-absorbing film, a step of forming a second light-absorbing film having laser light absorption on the first reinforcing layer of the glass substrate, and a second reinforcing layer The second light formed on the first reinforcing layer from the place where the crack portion or the altered portion is generated A laser beam is irradiated toward the collecting film, and a crack portion or an altered portion is generated in the first reinforcing layer in contact with the second light absorption film by the heat generated in the second light absorption film by the laser light irradiation. Meanwhile, the step of partially removing the second light absorption film formed on the first reinforcing layer and the glass substrate from which the first light absorption film and the second light absorption film have been partially removed are treated with an etching solution. The process of carrying out.

  The glass substrate processing method which concerns on embodiment is on the 1st reinforcement layer in the glass substrate which has a 1st reinforcement layer as a 1st surface layer, and a 2nd reinforcement layer as a 2nd surface layer on the opposite side of a 1st surface layer. Forming a first light-absorbing film having laser light-absorbing property on the second reinforcing layer and forming a second light-absorbing film having laser-light absorbing property on the second reinforcing layer; Laser light is irradiated from the first light absorption film side toward the second light absorption film formed on the second reinforcing layer, and is generated in the first light absorption film by the laser light irradiation. The first light absorption film formed on the first reinforcement layer is partially removed while generating cracks or altered parts in the first reinforcement layer in contact with the first light absorption film by heat, and the laser light A crack is applied to the second reinforcing layer in contact with the second light absorption film by the heat generated in the second light absorption film by irradiation. A step of partially removing the second light absorption film formed on the second reinforcing layer, and a portion of the first light absorption film and the second light absorption film were partially removed And a step of treating the glass substrate with an etching solution.

  The glass substrate processing method according to the embodiment includes a step of forming a light absorbing film having laser light absorption on a reinforcing layer in a glass substrate having a reinforcing layer as a surface layer, and a light absorbing film formed on the reinforcing layer. A portion of the light absorbing film formed on the reinforcing layer is irradiated with a laser beam, and a crack or altered portion is generated in the reinforcing layer in contact with the light absorbing film by the heat generated in the light absorbing film by the laser light irradiation. A step of removing, and a step of treating the glass substrate by infiltrating an etching solution into a portion where the cracked portion or the altered portion in the reinforcing layer is generated.

  The glass substrate processing method which concerns on embodiment irradiates a laser beam to the light absorption film which has a laser beam absorptivity formed on the reinforcement layer in the glass substrate which has a reinforcement layer as a surface layer, and light absorption is carried out by the irradiation of the laser beam There is a step of partially removing the light absorbing film formed on the reinforcing layer while generating cracks or altered portions in the reinforcing layer in contact with the light absorbing film by the heat generated in the film.

  According to the present invention, the processing yield can be improved.

It is a block diagram which shows schematic structure of the glass substrate processing apparatus which concerns on 1st Embodiment. It is a 1st process sectional view for explaining the flow of the glass substrate processing process concerning a 1st embodiment. It is a 2nd process sectional view for explaining the flow of the glass substrate processing process concerning a 1st embodiment. It is a 3rd process sectional view for explaining the flow of the glass substrate processing process concerning a 1st embodiment. It is a 4th process sectional view for explaining the flow of the glass substrate processing process concerning a 1st embodiment. It is a 5th process sectional view for explaining the flow of the glass substrate processing process concerning a 1st embodiment. It is a 6th process sectional view for explaining the flow of the glass substrate processing process concerning a 1st embodiment. It is a 7th process sectional view for explaining the flow of the glass substrate processing process concerning a 1st embodiment. It is an 8th process sectional view for explaining the flow of the glass substrate processing process concerning a 1st embodiment. It is a 9th process sectional view for explaining the flow of the glass substrate processing process concerning a 1st embodiment. It is a block diagram which shows schematic structure of the glass substrate processing apparatus which concerns on 2nd Embodiment. It is a 1st process sectional view for explaining the flow of the glass substrate processing process concerning a 2nd embodiment. It is a 2nd process sectional view for explaining the flow of the glass substrate processing process concerning a 2nd embodiment. It is a 3rd process sectional view for explaining the flow of the glass substrate processing process concerning a 2nd embodiment. It is a 4th process sectional view for explaining the flow of the glass substrate processing process concerning a 2nd embodiment. It is a 5th process sectional view for explaining the flow of the glass substrate processing process concerning a 2nd embodiment.

(First embodiment)
A first embodiment will be described with reference to FIGS.

  As shown in FIG. 1, the glass substrate processing apparatus 1 according to the first embodiment includes a first film forming unit 2, a first film removing unit 3, a second film forming unit 4, and a second film removing unit. A part 5 and an etching part 6 are provided. Transfer between these units 2 to 6 is performed by a transfer unit (not shown) such as robot handling or a belt conveyor. Hereinafter, each part 2-6 is demonstrated, referring FIG. 2 thru | or FIG.

  As shown in FIG. 2, the first film forming unit 2 forms a film such as spin coating or ink jet coating on the second surface M2 of the glass substrate 11 with the first light absorbing film 12 having laser light absorption. It forms by the method (1st film | membrane formation process). The glass substrate 11 has a first surface M1 and a second surface M2 facing each other. The glass substrate 11 has a first reinforcing layer (stress generation layer) 11a that is a first surface layer having a predetermined depth (for example, several tens of μm) from the first surface M1, and a predetermined value from the second surface M2. A tempered glass substrate (for example, a chemically tempered glass substrate) having a second tempering layer (stress generation layer) 11b which is a second surface layer having a depth of (for example, several tens of μm).

  In the present embodiment, the first light absorption film 12 also has etching resistance. As the first light absorbing film 12, for example, a resist material or the like can be used. However, it is not necessary to use an expensive resist material, and a resist material in which a laser absorbing agent is contained in an etching-resistant protective paint may be used.

  As shown in FIG. 3, the first film removing unit 3 uses the laser irradiation unit 3 a to form the second reinforcing layer 11 b (the second surface M2 of the glass substrate 11) from the first reinforcing layer 11 a side. As shown in FIG. 4, the first light absorption film 12 formed on the first light absorption film 12 is irradiated with laser light, and the first light absorption film 12 is heated by the heat generated in the first light absorption film 12 by the laser light irradiation. As shown in FIG. 5, the first light absorption film 12 on the second surface M2 of the glass substrate 11 is partially formed in a desired shape while generating the crack portion 21 in the second reinforcing layer 11b in contact with the film 12. (First film removal step).

  By this first film removal step, the first light absorption film 12 on the second reinforcing layer 11b selectively etches the glass substrate 11, for example, the second reinforcing layer 11b, in an etching step which is a subsequent step. The laser is scribed to a desired position and shape. Thereby, as shown in FIG. 5, a digging portion (groove) 12a is formed in the first light absorption film 12 on the second surface M2 of the glass substrate 11, and an exposed portion (glass) of the second surface M2 is formed. Substrate exposed portion) M2a is formed. At this time, the first light absorption film 12 is gradually processed from the irradiation side surface by irradiation with laser light. Note that the laser beam to be used is desirably a laser beam having a wavelength that is not easily absorbed by glass.

  Here, in the first film removal step, the first light absorption film 12 is processed by scribing, but at the same time, near the surface layer of the glass substrate 11, that is, in the first layer due to the thermal stress generated when the irradiated portion becomes high temperature. A fine crack (crack part 21) is formed only in a part of the second reinforcing layer 11b in contact with the light absorption film 12. This is because fine cracks are particularly easily formed in the reinforcing layer (stress generation layer) on the surface layer of the glass substrate 11. Further, it is possible to form fine cracks only in the reinforcing layer by appropriately selecting the laser processing conditions. Instead of the crack portion 21 which is a fine crack, an altered portion where the etching solution permeates or penetrates may be formed by heat by laser irradiation.

  The fine crack (size of the crack portion 21) is 100 μm or less in the depth direction, and there is no particular limitation on the width thereof, but about 500 μm to 2 mm in view of the contact area with the etching solution and the stress release range of the reinforcing layer. desirable. If this width is too narrow, residual stress concentrates on the stress release part and cracks tend to grow, so cracks are likely to occur in areas other than the irradiated part in both the depth and width directions, and the possibility of crushing is high. Become.

  As shown in FIG. 6, the second film forming unit 4 has a second light absorption having a laser light absorption property on the first surface M <b> 1 of the glass substrate 11 from which the first light absorption film 12 has been partially removed. The film 13 is formed by a film forming method such as spin coating or ink jet coating (second film forming step). In the present embodiment, the second light absorption film 13 also has etching resistance. As the second light absorption film 13, for example, a resist material or the like can be used as in the case of the first light absorption film 12. For example, the second light absorption film 13 absorbs a laser in an etchant-resistant protective paint. A resist material containing an agent may be used.

  As shown in FIG. 7, the second film removal unit 5 uses the laser irradiation unit 5 a to form the first reinforcement layer 11 a (from the glass substrate 11) from the place where the crack part 21 in the second reinforcement layer 11 b is generated. Laser light is irradiated toward the second light absorption film 13 formed on the first surface M1), and the second light absorption film 13 is generated by the laser light irradiation as shown in FIG. As shown in FIG. 9, the second light-absorbing film on the second surface M2 of the glass substrate 11 is generated while the crack portion 22 is generated in the first reinforcing layer 11a in contact with the second light-absorbing film 13 by heat. 13 is partially removed into a desired shape (second film removal step).

  At this time, the second film removing unit 5 uses the alignment unit 5b so that the laser light emitted from the laser irradiation unit 5a is incident on the cracked portion 22 in the second reinforcing layer 11b. Adjust the laser irradiation position. The alignment unit 5b confirms the processing location of the first light absorption film 12 by an imaging unit such as a camera, and adjusts the laser irradiation position based on the location of the processing location. In addition to confirming the processing location of the first light absorption film 12, a mechanism and a process for forming a reference mark that enables positioning on the glass substrate 11 are provided, and the mark is confirmed by the imaging unit. It may be used as a reference.

  By this second film removal step, the second light absorbing film 13 on the first reinforcing layer 11a selectively etches the glass substrate 11, for example, the first reinforcing layer 11a, in an etching step which is a later step. The laser is scribed to a desired position and shape. As a result, as shown in FIG. 9, a digging portion (groove) 13a is formed in the second light absorption film 13 on the first surface M1 of the glass substrate 11, and an exposed portion (glass) of the first surface M1 is formed. Substrate exposed portion) M1a is formed. At this time, the first light absorption film 12 is gradually processed from the irradiation side surface by irradiation with laser light. Note that the laser beam to be used is desirably a laser beam having a wavelength that is not easily absorbed by glass.

  Here, in the second film removal step, the second light absorption film 13 is processed by scribing, and at the same time, near the surface layer of the glass substrate 11, that is, the second layer due to thermal stress generated when the irradiated portion becomes high temperature. A fine crack (crack portion 22) is formed only in a part of the first reinforcing layer 11a in contact with the light absorption film 13. This is because fine cracks are particularly formed in the reinforcing layer (stress generation layer) on the surface layer of the glass substrate 11. Further, it is possible to form fine cracks only in the reinforcing layer by appropriately selecting the laser processing conditions. Instead of the crack portion 22 which is a fine crack, an altered portion where the etching solution permeates or penetrates may be formed by heat by laser irradiation.

  Similar to the first film removal step, the fine crack (size of the crack portion 22) is 100 μm or less in the depth direction, and the width is not particularly limited, but the contact area with the etching solution and stress release of the reinforcing layer are released. Considering the range, about 500 μm to 2 mm is desirable. If this width is too narrow, residual stress concentrates on the stress release part and cracks tend to grow, so cracks are likely to occur in areas other than the irradiated part in both the depth and width directions, and the possibility of crushing is high. Become.

  The etching unit 6 supplies an etching solution (liquid for corroding glass) to the glass substrate 11 in which the first light absorption film 12 and the second light absorption film 13 are processed into a desired shape, and FIG. As shown in FIG. 3, the first reinforcing layer 11a and the second reinforcing layer 11b on both surfaces of the glass substrate 11 are selectively removed by etching (etching process). As a result, the reinforcing layer (enhanced layer exposed portion) that is not protected by the first light absorbing film 12 and the second light absorbing film 13, that is, the crack portion 21 and the crack portion 22 (see FIG. 9) is removed. As shown in FIG. 10, the glass material of the glass substrate 11 (a normal severable glass material) is partially exposed. Then, the glass substrate 11 is cut | disconnected by the cutting part using a cutter, a blade, etc. from the glass material exposure part. Thereby, the glass substrate 11 is cut into a desired shape. It is also possible to continue the etching and cut the glass substrate 11 without using a cutting part such as a cutter or a blade. After such an etching process, the first light absorption film 12 and the second light absorption film 13 are removed from the glass substrate 11.

  Here, as the supply of the etching solution, the glass substrate 11 may be immersed in the etching solution, or the etching solution may be applied to the glass substrate 11, and either the batch processing or the single wafer processing is performed. It may be used. When supplying the etching solution to the glass substrate 11, the etching solution is supplied while rotating the glass substrate 11, or the etching solution is supplied while the glass substrate 11 is conveyed by a roller. The method is not particularly limited.

  In this etching step, when the etching solution is supplied to the glass substrate 11, the crack enters the crack portion 21 and the crack portion 22 formed in the glass substrate 11. Each etching rate is faster than other non-cracked portions. As the etching proceeds, the crack portion 21 and the crack portion 22 of the glass substrate 11 are selectively etched. In addition, since these crack part 21 and crack part 22 itself lose | disappear by etching, quality does not fall by the crack part 21 and the crack part 22 remaining.

  According to such a substrate processing step, the second reinforcing layer 11b of the glass substrate 11 is indirectly heated by using the heat generated by processing the first light absorption film 12, so that the first Cracks 21 are generated by inducing cracks due to thermal stress in the two reinforcing layers 11b. Similarly, the first reinforcing layer 11a of the glass substrate 11 is indirectly heated by utilizing the heat generated by processing the second light absorption film 13, so that the first reinforcing layer 11a is heated. The crack part 22 is generated by inducing a crack due to stress. Such a crack is likely to be selectively generated in the vicinity of the heat generating portion, and is particularly likely to be selectively generated in the first reinforcing layer 11a and the second reinforcing layer 11b to which stress is applied. By generating the crack portion 21 and the crack portion 22 as described above, it becomes possible to appropriately remove the first reinforcing layer 11a and the second reinforcing layer 11b in the portion to be processed of the glass substrate 11. The glass substrate 11 being processed can be processed while preventing breakage (cracking, crushing, etc.).

  Furthermore, when the crack is generated, the first reinforcing layer 11a and the second reinforcing layer 11b can be relieved of stress, and at the same time, the glass substrate 11 can be formed by the first light absorbing film 12 and the second light absorbing film 13. Therefore, crushing can be surely prevented. For this reason, since the generation | occurrence | production of the damage (a crack, crushing, etc.) of the glass substrate 11 which arises by a laser scribe reduces sharply, it can process, preventing the damage of the glass substrate 11, and improves a process yield as a result. Can do.

  In addition, when the etching solution is supplied to the glass substrate 11, the cracks 21 and cracks 22 formed in the glass substrate 11 enter (penetrate), so that the cracks 21 and 22 Since the etching rate is faster than other non-cracked portions, the etching time can be shortened as compared with the case where the crack portion 21 and the crack portion 22 do not exist. Thereby, etching time, ie, processing time, can be shortened, suppressing the fall of processing yield.

  As described above, according to the first embodiment, laser light is irradiated from the first reinforcing layer 11a side toward the first light absorption film 12 formed on the second reinforcing layer 11b, While the crack part (or altered part) 21 is generated in the second reinforcing layer 11b by the heat generated in the first light absorbing film 12, the first light absorbing film 12 on the second reinforcing layer 11b is partially Remove. Similarly, the second light absorbing film 13 formed on the first reinforcing layer 11a is irradiated with laser light from the portion where the crack portion 21 is generated in the second reinforcing layer 11b, and the second light The second light absorbing film 13 on the first reinforcing layer 11a is partially removed while the crack (or altered part) 22 is generated in the first reinforcing layer 11a by the heat generated in the absorbing film 13. Thereby, since the 1st reinforcement | strengthening layer 11a and the 2nd reinforcement | strengthening layer 11b of the part used as the process target of the glass substrate 11 are removed appropriately, damage (a crack, crushing, etc.) of the glass substrate 11 in process is prevented. However, it is possible to perform processing while improving the processing yield of the glass substrate 11.

  In the first embodiment, as the first light absorption film 12 and the second light absorption film 13, a light absorption film having laser light absorption and etching resistance is used. However, the present invention is not limited to this. For example, a light absorption film having only laser light absorption may be used. In this case, each of the first reinforcing layer 11a and the second reinforcing layer 11b is etched as a whole in the etching process, but the etchant enters the crack part 21 and the crack part 22 which are a part of them. (Penetration) and the crack portion 21 and the crack portion 22 are removed earlier than other portions, so the first reinforcing layer 11a and the second reinforcing layer 11b are selectively etched, The same effect as described above can be obtained.

  In the first embodiment, the first film forming unit 2 and the second film forming unit 4 are provided, and the first film removing unit 3 and the second film removing unit 5 are provided. However, the present invention is not limited to this. For example, one film forming unit may be shared as the first film forming unit 2 and the second film forming unit 4, and the first film removing unit 3 may be used. A single film removing unit may be shared as the second film removing unit 5.

(Second Embodiment)
A second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, the difference from the first embodiment (single-sided processing), that is, simultaneous processing on both sides will be described, and the same parts as those described in the first embodiment will be denoted by the same reference numerals, The description is basically omitted.

  As shown in FIG. 11, the glass substrate processing apparatus 1 according to the second embodiment includes a film forming unit 2, a film removing unit 3, and an etching unit 6. Transfer between these units 2, 3 and 6 is performed by a transfer unit (not shown) such as robot handling or a belt conveyor. Hereinafter, each part 2, 3 and 6 will be described with reference to FIGS.

  As shown in FIG. 12, the film forming unit 2 forms the first light absorbing film 12 having laser light absorption on the first surface M1 of the glass substrate 11 by a film forming method such as spin coating or inkjet coating. Further, a second light absorbing film 13 having laser light absorptivity is formed on the second surface M2 of the glass substrate 11 by a film forming method such as spin coating or ink jet coating (film forming process). The glass substrate 11, the first light absorption film 12, and the second light absorption film 13 are the same as those in the first embodiment, and the first light absorption film 12 and the second light absorption film 13 are Similar to the first embodiment, it also has etching resistance.

  As shown in FIG. 13, the film removing unit 3 uses the laser irradiation unit 3a to form the first light absorbing film 12 formed on the first reinforcing layer 11a (the first surface M1 of the glass substrate 11). Laser light is irradiated from the side toward the second light absorption film 13 formed on the second reinforcing layer 11b (the first surface M2 of the glass substrate 11), and as shown in FIG. The crack portion 21 is generated in the first reinforcing layer 11a in contact with the first light absorbing film 12 by the heat generated in the first light absorbing film 12 by the irradiation of The light absorption film 12 is partially removed, and further, as shown in FIG. 15, the second reinforcing layer 11b that is in contact with the second light absorption film 13 by the heat generated in the second light absorption film 13 by irradiation with laser light. As shown in FIG. 16, the second reinforcing layer A second light absorbing layer 13 on 1b portion is removed (film removing step).

  By this film removal process, the first light absorption film 12 on the first reinforcement layer 11a and the second light absorption film 13 on the second reinforcement layer 11b are formed in the glass substrate 11 in an etching process which is a subsequent process. For example, laser scribing is performed to a desired position and shape so as to selectively etch the first reinforcing layer 11a and the second reinforcing layer 11b. Thereby, as shown in FIG. 16, a digging portion (groove) 12a is formed in the first light absorption film 12 on the first surface M1 of the glass substrate 11, and an exposed portion (glass) of the first surface M1 is formed. Substrate exposed portion) M1a is formed. Further, a dug portion (groove) 13a is formed in the second light absorption film 13 on the second surface M2 of the glass substrate 11, and an exposed portion (glass substrate exposed portion) M2a of the second surface M2 is formed. The

  Subsequent processing is the same as that of the first embodiment, and the first reinforcing layer 11a and the second reinforcing layer 11b on both surfaces of the glass substrate 11 are selectively etched by the etching process by the etching unit 6 and partially processed. Removed. Thereby, the 1st reinforcement layer 11a and the 2nd reinforcement layer 11b of the part used as the process target of the glass substrate 11 are removed appropriately (refer FIG. 10).

  According to such a substrate processing step, as in the first embodiment, the first reinforcing layer 11a of the glass substrate 11 is indirectly used by using heat generated by processing the first light absorption film 12. Is heated to induce cracks due to thermal stress in the first reinforcing layer 11a to generate cracks 21. Similarly, the second reinforcing layer 11b of the glass substrate 11 is indirectly heated by using heat generated by processing the second light absorption film 13, so that the first reinforcing layer 11b is heated. The crack part 22 is generated by inducing a crack due to stress. Such a crack is likely to be selectively generated in the vicinity of the heat generating portion, and is particularly likely to be selectively generated in the first reinforcing layer 11a and the second reinforcing layer 11b to which stress is applied. By generating the crack portion 21 and the crack portion 22 as described above, it becomes possible to appropriately remove the first reinforcing layer 11a and the second reinforcing layer 11b in the portion to be processed of the glass substrate 11. The glass substrate 11 being processed can be processed while preventing breakage (cracking, crushing, etc.).

  Further, as in the first embodiment, when the crack is generated, the first reinforcing layer 11a and the second reinforcing layer 11b can be relieved of stress, and at the same time, the first light absorbing film 12 and the second reinforcing layer 11b can be released. Since the glass substrate 11 is held by the light absorption film 13, it is possible to reliably prevent crushing. For this reason, since the generation | occurrence | production of the damage (a crack, crushing, etc.) of the glass substrate 11 which arises by a laser scribe reduces sharply, it can process, preventing the damage of the glass substrate 11, and improves a process yield as a result. Can do.

  In addition, as in the first embodiment, when the etching solution is supplied to the glass substrate 11, the cracks 21 and the cracks 22 formed in the glass substrate 11 enter (penetrate). Since the etching rate of the crack portion 21 and the crack portion 22 is faster than that of other non-crack portions, the etching time can be shortened as compared with the case where the crack portion 21 and the crack portion 22 do not exist. Thereby, etching time, ie, processing time, can be shortened, suppressing the fall of processing yield.

  Here, when both surfaces are processed simultaneously as in the present embodiment, the thermal effect on the first reinforcing layer 11a until the first light absorption film 12 (laser light absorption film) on the irradiation side is substantially removed. Becomes smaller. For this reason, in order to raise the emitted-heat amount at the time of removing the irradiation side 1st light absorption film 12, compared with the time of removing the 2nd light absorption film 13 on the opposite side to an irradiation side, laser power, laser intensity, etc. It is desirable to set high.

  As described above, according to the second embodiment, the same effect as that of the first embodiment can be obtained. That is, the laser beam is irradiated from the first light absorption film 12 formed on the first enhancement layer 11a toward the second light absorption film 13 formed on the second enhancement layer 11b, The first light absorbing film 12 on the first reinforcing layer 11a is partially removed while the crack (or altered portion) 21 is generated in the first reinforcing layer 11a by the heat generated in the first light absorbing film 12. To do. Furthermore, the second light absorbing film 13 on the second reinforcing layer 11b is formed while the crack (or altered part) 22 is generated in the second reinforcing layer 11b by the heat generated in the second light absorbing film 13. Partial removal. Thereby, since the 1st reinforcement | strengthening layer 11a and the 2nd reinforcement | strengthening layer 11b of the part used as the process target of the glass substrate 11 are removed appropriately, damage (a crack, crushing, etc.) of the glass substrate 11 in process is prevented. However, it is possible to perform processing while improving the processing yield of the glass substrate 11.

  In the first or second embodiment described above, the glass substrate 11 is described using a tempered glass substrate having a tempered layer on both sides. However, the present invention is not limited to this, for example, only on one side. The above-described processing may also be performed on a tempered glass substrate having a tempered layer. In this case as well, the light absorption film formed on the reinforcement layer is irradiated with laser light, and the reinforcement layer is heated by the heat generated in the light absorption film, as in the processing for one side according to each of the embodiments described above. Each of the above-described embodiments is caused by generating a crack portion (or altered portion), and then treating the glass substrate 11 by infiltrating an etching solution into the portion where the crack portion (or altered portion) in the reinforcing layer is generated. Similar effects can be obtained.

  As mentioned above, although some embodiment of this invention was described, these embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 1 Glass substrate processing apparatus 2 1st film | membrane formation part 3 1st film | membrane removal part 4 2nd film | membrane formation part 5 2nd film | membrane removal part 6 Etching part 11 Glass substrate 11a 1st reinforcement | strengthening layer 11b 2nd reinforcement | strengthening Layer 12 First light absorption film 13 Second light absorption film 21 Crack part 22 Crack part

Claims (8)

Laser absorption is provided on the second reinforcing layer in the glass substrate having the first reinforcing layer as the first surface layer and the second reinforcing layer as the second surface layer opposite to the first surface layer. A first film forming part for forming a first light absorption film;
Laser light is irradiated from the first reinforcing layer side toward the first light absorbing film formed on the second reinforcing layer, and generated by the laser light irradiation in the first light absorbing film The first light absorbing film formed on the second reinforcing layer is partially removed while generating cracks or altered portions in the second reinforcing layer in contact with the first light absorbing film by the heat generated. A first film removing unit that
A second film forming portion for forming a second light absorption film having laser light absorption on the first reinforcing layer of the glass substrate;
The laser beam is irradiated from the portion where the crack or altered portion of the second reinforcing layer is generated toward the second light absorption film formed on the first reinforcing layer, and the laser beam is irradiated. Due to the heat generated in the second light absorption film, the first reinforcement layer in contact with the second light absorption film is formed on the first reinforcement layer while generating a crack portion or an altered portion. A second film removal portion for partially removing the second light absorption film;
An etching unit for treating the glass substrate from which the first light absorption film and the second light absorption film have been partially removed with an etchant;
A glass substrate processing apparatus comprising: The first reinforcing layer in the glass substrate having the first reinforcing layer as the first surface layer and the second reinforcing layer as the second surface layer opposite to the first surface layer has laser light absorption on the first reinforcing layer. Forming a first light absorption film, and forming a second light absorption film having laser light absorption on the second reinforcing layer;
Laser light is irradiated from the first light absorption film side formed on the first enhancement layer toward the second light absorption film formed on the second enhancement layer, and the laser beam Formed on the first reinforcing layer while generating cracks or altered portions in the first reinforcing layer in contact with the first light absorbing film by the heat generated in the first light absorbing film by irradiation of The first light-absorbing film is partially removed, and a crack portion is formed in the second reinforcing layer in contact with the second light-absorbing film by heat generated in the second light-absorbing film due to the laser light irradiation. Alternatively, a film removal unit that partially removes the second light absorption film formed on the second reinforcing layer while causing an altered portion,
An etching unit for treating the glass substrate from which the first light absorption film and the second light absorption film have been partially removed with an etchant;
A glass substrate processing apparatus comprising: On the reinforcing layer in the glass substrate having a reinforcing layer as a surface layer, a film forming part for forming a light absorbing film having laser light absorbability,
The light absorbing film formed on the reinforcing layer is irradiated with laser light, and a crack portion or an altered portion is formed in the reinforcing layer in contact with the light absorbing film by heat generated in the light absorbing film due to the laser light irradiation. A film removing part for partially removing the light absorption film formed on the reinforcing layer,
An etching part that treats the glass substrate by infiltrating an etching solution into a place where a crack part or an altered part in the reinforcing layer has occurred;
A glass substrate processing apparatus comprising:   The light absorption film formed on the reinforcing layer of the glass substrate having a reinforcing layer as a surface layer is irradiated with laser light, and the light is generated by heat generated in the light absorbing film by the laser light irradiation. An apparatus for processing a glass substrate, comprising: a film removing unit that partially removes the light absorption film formed on the reinforcing layer while generating a cracked portion or an altered portion in the reinforcing layer in contact with the absorbing film. Laser absorption is provided on the second reinforcing layer in the glass substrate having the first reinforcing layer as the first surface layer and the second reinforcing layer as the second surface layer opposite to the first surface layer. Forming a first light absorption film;
Laser light is irradiated from the first reinforcing layer side toward the first light absorbing film formed on the second reinforcing layer, and generated by the laser light irradiation in the first light absorbing film The first light absorbing film formed on the second reinforcing layer is partially removed while generating cracks or altered portions in the second reinforcing layer in contact with the first light absorbing film by the heat generated. And a process of
Forming a second light absorption film having laser light absorption on the first reinforcing layer of the glass substrate;
The laser beam is irradiated from the portion where the crack or altered portion of the second reinforcing layer is generated toward the second light absorption film formed on the first reinforcing layer, and the laser beam is irradiated. Due to the heat generated in the second light absorption film, the first reinforcement layer in contact with the second light absorption film is formed on the first reinforcement layer while generating a crack portion or an altered portion. Partially removing the second light absorption film;
Treating the glass substrate from which the first light absorption film and the second light absorption film have been partially removed with an etchant;
The glass substrate processing method characterized by having. The first reinforcing layer in the glass substrate having the first reinforcing layer as the first surface layer and the second reinforcing layer as the second surface layer opposite to the first surface layer has laser light absorption on the first reinforcing layer. Forming a light absorption film of 1 and forming a second light absorption film having laser light absorption on the second reinforcing layer;
Laser light is irradiated from the first light absorption film side formed on the first enhancement layer toward the second light absorption film formed on the second enhancement layer, and the laser beam Formed on the first reinforcing layer while generating cracks or altered portions in the first reinforcing layer in contact with the first light absorbing film by the heat generated in the first light absorbing film by irradiation of The first light-absorbing film is partially removed, and a crack portion is formed in the second reinforcing layer in contact with the second light-absorbing film by heat generated in the second light-absorbing film due to the laser light irradiation. Alternatively, the step of partially removing the second light absorption film formed on the second reinforcing layer while generating an altered portion;
Treating the glass substrate from which the first light absorption film and the second light absorption film have been partially removed with an etchant;
The glass substrate processing method characterized by having. Forming a light-absorbing film having laser light absorption on the reinforcing layer in the glass substrate having a reinforcing layer as a surface layer;
The light absorbing film formed on the reinforcing layer is irradiated with laser light, and a crack portion or an altered portion is formed in the reinforcing layer in contact with the light absorbing film by heat generated in the light absorbing film due to the laser light irradiation. A step of partially removing the light absorption film formed on the reinforcing layer,
A step of treating the glass substrate by infiltrating an etching solution into a cracked portion or an altered portion in the reinforcing layer; and
The glass substrate processing method characterized by having.   The light absorption film formed on the reinforcing layer of the glass substrate having a reinforcing layer as a surface layer is irradiated with laser light, and the light is generated by heat generated in the light absorbing film by the laser light irradiation. A glass substrate processing method comprising a step of partially removing the light absorbing film formed on the reinforcing layer while generating a cracked portion or an altered portion in the reinforcing layer in contact with the absorbing film.

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