JP2014063950A5 - - Google Patents
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- JP2014063950A5 JP2014063950A5 JP2012209398A JP2012209398A JP2014063950A5 JP 2014063950 A5 JP2014063950 A5 JP 2014063950A5 JP 2012209398 A JP2012209398 A JP 2012209398A JP 2012209398 A JP2012209398 A JP 2012209398A JP 2014063950 A5 JP2014063950 A5 JP 2014063950A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- wiring
- forming
- insulating layer
- wiring layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012209398A JP6092555B2 (ja) | 2012-09-24 | 2012-09-24 | 配線基板の製造方法 |
| US14/027,648 US9006103B2 (en) | 2012-09-24 | 2013-09-16 | Method of manufacturing wiring substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012209398A JP6092555B2 (ja) | 2012-09-24 | 2012-09-24 | 配線基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014063950A JP2014063950A (ja) | 2014-04-10 |
| JP2014063950A5 true JP2014063950A5 (cg-RX-API-DMAC7.html) | 2015-09-24 |
| JP6092555B2 JP6092555B2 (ja) | 2017-03-08 |
Family
ID=50339249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012209398A Active JP6092555B2 (ja) | 2012-09-24 | 2012-09-24 | 配線基板の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9006103B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6092555B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017141983A1 (ja) | 2016-02-18 | 2017-08-24 | 三井金属鉱業株式会社 | プリント配線板の製造方法 |
| MY188258A (en) | 2016-02-18 | 2021-11-24 | Mitsui Mining & Smelting Co Ltd | Copper foil for printed circuit board production, copper foil with carrier, and copper-clad laminate plate, and printed circuit board production method using copper foil for printed circuit board production, copper foil with carrier, and copper-clad laminate plate |
| US10096542B2 (en) | 2017-02-22 | 2018-10-09 | Advanced Semiconductor Engineering, Inc. | Substrate, semiconductor package structure and manufacturing process |
| US11576267B2 (en) * | 2017-10-26 | 2023-02-07 | Mitsui Mining & Smelting Co., Ltd. | Ultra-thin copper foil, ultra-thin copper foil with carrier, and method for manufacturing printed wiring board |
| TWI751554B (zh) * | 2020-05-12 | 2022-01-01 | 台灣愛司帝科技股份有限公司 | 影像顯示器及其拼接式電路承載與控制模組 |
| KR20220116623A (ko) * | 2021-02-15 | 2022-08-23 | 삼성전자주식회사 | 배선 구조체를 포함하는 집적회로 칩 |
| TW202410319A (zh) * | 2022-08-26 | 2024-03-01 | 日商Ｍｇｃ電子科技股份有限公司 | 積層體、及無芯基板之製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003008228A (ja) * | 2001-06-22 | 2003-01-10 | Ibiden Co Ltd | 多層プリント配線板およびその製造方法 |
| JP2007059821A (ja) * | 2005-08-26 | 2007-03-08 | Shinko Electric Ind Co Ltd | 配線基板の製造方法 |
| JP5092547B2 (ja) | 2007-05-30 | 2012-12-05 | 凸版印刷株式会社 | 印刷配線板の製造方法 |
| JP5092662B2 (ja) | 2007-10-03 | 2012-12-05 | 凸版印刷株式会社 | 印刷配線板の製造方法 |
| JP5479073B2 (ja) * | 2009-12-21 | 2014-04-23 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
| JP5603600B2 (ja) * | 2010-01-13 | 2014-10-08 | 新光電気工業株式会社 | 配線基板及びその製造方法、並びに半導体パッケージ |
| JP2011199077A (ja) * | 2010-03-19 | 2011-10-06 | Ngk Spark Plug Co Ltd | 多層配線基板の製造方法 |
| US8319318B2 (en) * | 2010-04-06 | 2012-11-27 | Intel Corporation | Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages |
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2012
- 2012-09-24 JP JP2012209398A patent/JP6092555B2/ja active Active
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2013
- 2013-09-16 US US14/027,648 patent/US9006103B2/en active Active