JP2014060277A - Ledアレイ - Google Patents
Ledアレイ Download PDFInfo
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- JP2014060277A JP2014060277A JP2012204631A JP2012204631A JP2014060277A JP 2014060277 A JP2014060277 A JP 2014060277A JP 2012204631 A JP2012204631 A JP 2012204631A JP 2012204631 A JP2012204631 A JP 2012204631A JP 2014060277 A JP2014060277 A JP 2014060277A
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- light emitting
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- 239000004065 semiconductor Substances 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 230000000737 periodic effect Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 173
- 238000000034 method Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 230000005496 eutectics Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/86—Series electrical configurations of multiple OLEDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/385—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending at least partially onto a side surface of the semiconductor body
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】基板と、当該基板上に設けられ、第1の導電型の第1の半導体層、当該第1の半導体層上に形成された活性層、及び当該活性層上に形成された第2の導電型の第2の半導体層を含む半導体構造層と、を含み、当該半導体構造層は、当該半導体構造層に形成された溝部によって複数の発光部に区画され、隣接する当該発光部同士の対向する側面の各々は、凹凸構造を有しており、当該隣接する発光部の対向する側面のうちの一方の側面の凸部と他方の側面の凹部とが対向し、当該一方の側面の凹部と当該他方の側面の凸部とが対向し、当該隣接する発光部は当該一方の側面の凸部の頂部を結んだ線分が当該他方の側面と接するかまたは当該他方の側面の凸部を貫通するように配置する。
【選択図】図1A
Description
11 支持基板
13 絶縁層
14A、14B 給電パッド
15 第1の接合層
17 LED素子
19 第2の接合層
21 反射電極層
23 半導体構造層
25 絶縁膜
27 n電極
29 p電極
31 p型半導体層
33 活性層
35 n型半導体層
37 成長基板
Claims (5)
- 基板と、
前記基板上に設けられ、第1の導電型の第1の半導体層、前記第1の半導体層上に形成された活性層、及び前記活性層上に形成された第2の導電型の第2の半導体層を含む半導体構造層と、を含み、
前記半導体構造層は、前記半導体構造層に形成された溝部によって複数の発光部に区画され、
隣接する前記発光部同士の対向する側面の各々は、凹凸構造を有しており、前記隣接する発光部の対向する側面のうちの一方の側面の凸部と他方の側面の凹部とが対向し、前記一方の側面の凹部と前記他方の側面の凸部とが対向し、前記隣接する発光部は前記一方の側面の凸部の頂部を結んだ線分が前記他方の側面と接するかまたは前記他方の側面の凸部を貫通するように配されていることを特徴とするLEDアレイ。 - 前記凹凸構造が周期的な形状であることを特徴とする請求項1に記載のLEDアレイ。
- 前記凹凸構造が曲線波形状であることを特徴とする請求項1または2に記載のLEDアレイ。
- さらに、前記発光部同士の対向する側面以外の前記発光部の側面にも凹凸構造が形成されていることを特徴とする請求項1乃至3のいずれか1に記載のLEDアレイ。
- 前記発光部は、前記支持基板上に一列に配列されていることを特徴とする請求項1乃至4のいずれか1に記載のLEDアレイ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012204631A JP6068073B2 (ja) | 2012-09-18 | 2012-09-18 | Ledアレイ |
EP13020099.1A EP2709171B1 (en) | 2012-09-18 | 2013-09-16 | LED array |
US14/029,674 US9093603B2 (en) | 2012-09-18 | 2013-09-17 | LED array |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012204631A JP6068073B2 (ja) | 2012-09-18 | 2012-09-18 | Ledアレイ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014060277A true JP2014060277A (ja) | 2014-04-03 |
JP6068073B2 JP6068073B2 (ja) | 2017-01-25 |
Family
ID=49230491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012204631A Active JP6068073B2 (ja) | 2012-09-18 | 2012-09-18 | Ledアレイ |
Country Status (3)
Country | Link |
---|---|
US (1) | US9093603B2 (ja) |
EP (1) | EP2709171B1 (ja) |
JP (1) | JP6068073B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11749790B2 (en) * | 2017-12-20 | 2023-09-05 | Lumileds Llc | Segmented LED with embedded transistors |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11163414A (ja) * | 1997-11-26 | 1999-06-18 | Rohm Co Ltd | 発光装置 |
JP2003110136A (ja) * | 2001-09-28 | 2003-04-11 | Toyoda Gosei Co Ltd | 発光素子 |
JP2004006662A (ja) * | 2002-03-28 | 2004-01-08 | Nichia Chem Ind Ltd | 窒化ガリウム系化合物半導体素子 |
JP2009059969A (ja) * | 2007-08-31 | 2009-03-19 | Seiwa Electric Mfg Co Ltd | 半導体発光素子、発光装置、照明装置、表示装置及び半導体発光素子の製造方法 |
JP2009152240A (ja) * | 2007-12-18 | 2009-07-09 | Rohm Co Ltd | 半導体発光素子およびその製造方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5650586A (en) * | 1979-10-01 | 1981-05-07 | Mitsubishi Electric Corp | Light emitting diode |
JPH05129586A (ja) * | 1991-10-31 | 1993-05-25 | Hitachi Cable Ltd | ハイブリツド型光集積回路及びその製造方法と要素光学素子 |
KR100697803B1 (ko) * | 2002-08-29 | 2007-03-20 | 시로 사카이 | 복수의 발광 소자를 갖는 발광 장치 |
US7285801B2 (en) * | 2004-04-02 | 2007-10-23 | Lumination, Llc | LED with series-connected monolithically integrated mesas |
JP4599111B2 (ja) | 2004-07-30 | 2010-12-15 | スタンレー電気株式会社 | 灯具光源用ledランプ |
JP3802911B2 (ja) | 2004-09-13 | 2006-08-02 | ローム株式会社 | 半導体発光装置 |
US8399895B2 (en) * | 2008-01-11 | 2013-03-19 | Rohm Co., Ltd. | Semiconductor light emitting device |
CN103022282B (zh) * | 2008-07-07 | 2016-02-03 | 格罗有限公司 | 纳米结构led |
TWI451596B (zh) * | 2010-07-20 | 2014-09-01 | Epistar Corp | 一種陣列式發光元件 |
WO2012077974A2 (ko) * | 2010-12-07 | 2012-06-14 | 엘지전자 주식회사 | 복수의 콤포넌트 캐리어를 지원하는 무선통신 시스템에서 셀 간 간섭을 제어하기 위한 방법 및 이를 위한 기지국 장치 |
DE112011104636B4 (de) * | 2010-12-28 | 2023-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Licht abstrahlende Baugruppe, Licht abstrahlende Vorrichtung, Beleuchtungsvorrichtung und Verfahren zum Herstellen einer Licht abstrahlenden Baugruppe |
TWI562423B (en) * | 2011-03-02 | 2016-12-11 | Semiconductor Energy Lab Co Ltd | Light-emitting device and lighting device |
US20130050653A1 (en) * | 2011-08-23 | 2013-02-28 | Stanley Electric Co., Ltd. | Led array capable of reducing uneven brightness distribution |
US8937323B2 (en) * | 2011-09-02 | 2015-01-20 | Stanley Electric Co., Ltd. | LED array capable of reducing uneven brightness distribution |
JP2014056984A (ja) * | 2012-09-13 | 2014-03-27 | Stanley Electric Co Ltd | 半導体発光素子、車両用灯具及び半導体発光素子の製造方法 |
US9257481B2 (en) * | 2012-11-26 | 2016-02-09 | Epistar Corporation | LED arrray including light-guiding structure |
-
2012
- 2012-09-18 JP JP2012204631A patent/JP6068073B2/ja active Active
-
2013
- 2013-09-16 EP EP13020099.1A patent/EP2709171B1/en active Active
- 2013-09-17 US US14/029,674 patent/US9093603B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11163414A (ja) * | 1997-11-26 | 1999-06-18 | Rohm Co Ltd | 発光装置 |
JP2003110136A (ja) * | 2001-09-28 | 2003-04-11 | Toyoda Gosei Co Ltd | 発光素子 |
JP2004006662A (ja) * | 2002-03-28 | 2004-01-08 | Nichia Chem Ind Ltd | 窒化ガリウム系化合物半導体素子 |
JP2009059969A (ja) * | 2007-08-31 | 2009-03-19 | Seiwa Electric Mfg Co Ltd | 半導体発光素子、発光装置、照明装置、表示装置及び半導体発光素子の製造方法 |
JP2009152240A (ja) * | 2007-12-18 | 2009-07-09 | Rohm Co Ltd | 半導体発光素子およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2709171B1 (en) | 2020-03-04 |
JP6068073B2 (ja) | 2017-01-25 |
EP2709171A2 (en) | 2014-03-19 |
EP2709171A3 (en) | 2016-04-06 |
US20140077155A1 (en) | 2014-03-20 |
US9093603B2 (en) | 2015-07-28 |
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