JP2014056932A - Sheet-sticking apparatus, and sheet-sticking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To omit complicated component exchange work and to adjust a warping direction of a sheet-stuck body in which an adhesive sheet is stuck to a body to be stuck with a sheet.SOLUTION: A sheet-sticking apparatus 10 comprises: supply means 11 for supplying an adhesive sheet AS towards a face WF1 to be stuck with the adhesive sheet AS of a wafer WF which is relatively moved at a predetermined moving speed; force application means 12 for applying a pressing force to the supplied adhesive sheet AS to make it press the face WF1 to be stuck with the adhesive sheet AS; and control means 14. The force application means 12 feeds the adhesive sheet AS in a relative moving direction of the wafer WF. The control means 14 controls, with respect to the moving speed of the wafer WF, a speed of the supply means 11 supplying the adhesive sheet AS and a speed of the force application means 12 feeding the adhesive sheet AS, and adjusts a warping direction of the sheet-stuck body WFA.

Description

  The present invention relates to a sheet sticking apparatus and a sticking method, and more particularly to a sheet sticking apparatus and a sticking method capable of adjusting a warping direction of a sheet adhesive formed by sticking an adhesive sheet to an adherend.

  Conventionally, a sheet sticking apparatus for sticking a protective adhesive sheet to a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) as an adherend has been widely used. Patent Document 1 discloses this. The sheet sticking device of Patent Document 1 presses the adhesive sheet against the wafer by rolling on the adhesive sheet supplied by the supply means and the supply means for supplying the adhesive sheet above the relatively moving wafer. And a pressing roller to be attached. In the sheet sticking device of the same document, in order to reduce the residual stress of the attached adhesive sheet and reduce the warpage of the thinned wafer, the diameter dimension and material are changed at the center and both ends of the pressure roller, The table mounting surface is configured to have a concave curved shape.

JP 2006-19500 A

  However, in the sheet sticking device disclosed in Patent Document 1, the diameter and material of the pressure roller must be changed depending on conditions such as the shape and material of the adhesive sheet and wafer. This causes the inconvenience that troublesome parts replacement work must be performed. In addition, in the same document, the warpage of the wafer is in one direction, that is, when the adhesion surface of the wafer to which the adhesive sheet is attached faces upward, the warpage occurs only in the direction in which the outer peripheral portion of the wafer is lifted from the central portion ( Paragraph [0056] of the same literature, FIG. 11 and FIG.

[Object of invention]
An object of the present invention is to perform any warping direction of a sheet bonded body in which an adhesive sheet is adhered to an adherend without performing troublesome parts replacement work even if there is a change in the adhesive sheet or the adherend. It is providing the sheet sticking apparatus and sticking method which can be set.

To achieve the above object, the present invention provides a sheet sticking apparatus for sticking an adhesive sheet to an adherend surface of an adherend that relatively moves at a predetermined moving speed to form a sheet adhesive body,
Supply means for supplying the adhesive sheet toward the adherend surface;
Applying force to the adhesive sheet supplied by the supply means in the direction of the adherend, and applying means for sending the adhesive sheet in the relative movement direction;
Control means for controlling the operation of the entire sheet sticking apparatus,
The control means controls the sheet supply speed at which the supply means supplies the adhesive sheet and the sheet feed speed at which the force applying means sends the adhesive sheet with respect to the moving speed of the adherend, whereby the sheet The configuration is such that the warping direction of the adhesive body can be adjusted.

  In this invention, it is good to employ | adopt the structure that the said application means is provided with the frictional resistance increase means which enlarges the frictional resistance with the said adhesive sheet.

Furthermore, the sheet sticking method of the present invention is a sheet sticking method in which an adhesive sheet is attached to an adherend surface of an adherend that relatively moves at a predetermined moving speed to form a sheet adhesive.
A supplying step of supplying the adhesive sheet toward the adherend surface;
Applying a pressing force in the direction of the adherend to the adhesive sheet to be supplied, and an applying force step for sending the adhesive sheet in the relative movement direction,
In the force applying step, a warping direction adjusting step of adjusting a warping direction of the sheet adhesive is performed by controlling the sheet feeding speed and the sheet feeding speed with respect to the moving speed of the adherend. The method is taken.

  According to the present invention, the control means controls the adhesive sheet supply speed of the supply means and the sheet feed speed of the force applying means with respect to the relative movement speed of the adherend with respect to the sheet sticking apparatus, and warps the sheet adhesive body. Since the direction can be adjusted, it is possible to control the residual stress of at least one of the adhesive sheet and the adherend after sticking the adhesive sheet, and prevent the sheet adhesive from warping, or the sheet It is possible to positively generate warpage in the bonded body. Therefore, even if the adhesive sheet or the adherend is changed, the warping direction of the sheet adhesive can be arbitrarily set without performing troublesome parts replacement work.

  Moreover, when it has a frictional resistance increasing means, it can prevent that an adhesive sheet slips with respect to a rolling member during sticking of an adhesive sheet, and can make it easy to give the stress to an adhesive sheet.

(A) is a side view of the sheet sticking apparatus according to the embodiment, (B) is an explanatory view showing a pressing point of the adhesive sheet, and (C) is an explanatory view of an applying means according to a modification.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Note that the X axis, Y axis, and Z axis in this specification are orthogonal to each other, the X axis and Y axis are axes in a horizontal plane, and the Z axis is an axis that is orthogonal to the horizontal plane. Furthermore, in the present embodiment, when viewed from a direction parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis, “down” is the opposite direction, and “left” is X In the arrow direction of the axis, “right” is the opposite direction, “front” is the arrow direction of the Y axis, and “rear” is the opposite direction.

  1A and 1B, a sheet sticking apparatus 10 sticks an adhesive sheet AS to an adherend surface WF1 (upper surface) of a wafer WF as an adherend that relatively moves at a predetermined movement speed VA. Adhesive WFA is formed, supplying means 11 for supplying adhesive sheet AS toward adherend surface WF1, and adhesive sheet AS supplied by supplying means 11 in the direction of adherend (downward) WD And a force applying means 12 for applying a repulsive output in the relative movement direction (left and right direction) TD and a control means 14 for controlling the operation of the entire sheet sticking apparatus 10 to support the wafer WF. The supporting means 15 is disposed above a moving means 16 for moving the supporting means 15 relative to the sheet sticking apparatus 10 via a frame (not shown).

  The supply means 11 includes a support shaft 22 that supports a belt-shaped original fabric RS, on which an adhesive sheet AS is temporarily attached to one surface of a strip-shaped release sheet RL, and a raw material fed from the support shaft 22. The release sheet RL is sandwiched between the release plate 23 that peels the adhesive sheet AS from the release sheet RL, the drive roller 25 driven by the rotation motor DM1 as a drive device, and the drive roller 25 by folding the RS. A pinch roller 26 and a winding shaft 28 that winds the release sheet RL with a predetermined torque by a driving device (not shown) are supported by the frame FL.

  The force applying means 12 is a frictional resistance between the adhesive sheet AS and a rolling member 30 supported by a rotating motor DM2 as a driving device and an output shaft DM2A of the rotating motor DM2 and formed with a plurality of suction holes 31. And frictional resistance increasing means 33 for increasing. The frictional resistance increasing means 33 is provided so that the rolling member 30 can slide and rotate on the outer peripheral surface, and a suction chamber such as a vacuum pump or a vacuum ejector (not shown) communicating with the air chamber 32A and the air chamber 32A. And a slit 32B is formed in the lower part thereof.

  The control means 14 is composed of a sequencer, a personal computer or the like, and is connected to input means (not shown) such as an operation panel or a keyboard, and the operation conditions and data of each means can be input by this input means. . The control unit 14 is electrically connected to the rotation motors DM1 and DM2 by a cable, a wireless structure, or the like. The sheet supply speed VB at which the supply unit 11 supplies the adhesive sheet AS via the rotation motor DM1, and the rotation motor. The force applying means 12 controls the sheet feeding speed VC for feeding the adhesive sheet AS in the relative movement direction TD via the DM 2 so that the warp direction of the sheet adhesive WFA can be adjusted. Note that the adhesive sheet supply speed VB is the speed of the X-axis component in the adhesive sheet AS when the adhesive sheet AS is peeled off by the release plate 23 and fed out, and the sheet feed speed VC is when the rolling member 30 rotates. This is the peripheral speed at the outer periphery of the rolling member 30.

  The support means 15 is connected to a suction means such as a decompression pump or a vacuum ejector (not shown) so as to be able to suck and hold the wafer WF on the upper surface. It is supported.

  Next, a method for applying the adhesive sheet AS according to the embodiment will be described.

  First, as shown in FIG. 1A, the operator sets the original fabric RS on the supply means 11, and then the sheet supply speed VB by the supply means 11 in accordance with the movement speed VA of the support means 15 by the movement means 16. And the sheet feed speed VC by the force applying means 12 are input to the control means 14. Then, when an operation start command is input to the control means 14, the supply means 11 drives the rotation motor DM <b> 1, feeds the raw fabric RS, and the leading edge of the adhesive sheet AS peels from the leading edge of the peeling plate 23 by a predetermined length. When this is detected by a sensor (not shown), the supply unit 11 stops driving the rotation motor DM1 and enters a standby state.

  Next, the moving unit 16 drives the linear motor 35 to move the support unit 15 supporting the wafer WF relative to the sheet pasting unit 10 at the moving speed VA. When a sensor (not shown) detects that the wafer WF has reached a predetermined position, the force applying means 12 drives the rotation motor DM2 to roll the rolling member 30 on the upper surface of the wafer WF. Thereafter, the supply means 11 drives the rotation motor DM1 at a predetermined timing, and the frictional resistance increasing means 33 drives a suction means (not shown), and the adhesive sheet is passed through the suction hole 31 of the rolling member 30 at the position of the slit 32B. The adhesive sheet AS is supplied at the sheet supply speed VB while sucking the AS. Thereby, the adhesive sheet AS is pressed against the adherend surface WF1 by the rolling member 30, the entire adhesive sheet AS is adhered to the wafer WF, and the adhesive sheet AS is adhered to the adherent surface WF1 of the wafer WF. After that, the same operation as described above is repeated.

  Here, when the moving speed VA, the sheet supply speed VB, and the sheet feed speed VC are set to the same speed, the adhesive sheet AS is applied with a pressing force by the force applying means 12, so that the adhesive sheet AS is applied while being stretched in the right direction. The overall length in the left-right direction (hereinafter, simply referred to as “total length”) tends to increase by 0.01 to 3%, sometimes 3% or more, compared to the case where no load is applied. Then, as the elongation tends to shrink, a residual stress is generated in the adhesive sheet AS, and as shown by a two-dot chain line in FIG. 1B, a sheet adhesive WFA whose outer edge warps upward is formed. .

On the other hand, when the sheet supply speed VB and the sheet feed speed VC are set higher than the movement speed VA, the adhesive sheet AS is attached to the wafer WF while being contracted, so that the elongation of the adhesive sheet AS is reduced. Alternatively, the adhesive sheet AS can be contracted and attached to the wafer WF as compared with the case where the elongation is eliminated or no load is applied. As a result, the warp of the sheet adhesive WFA is formed in the opposite direction indicated by the two-dot chain line in FIG. 1B, that is, the sheet adhesive WFA whose outer edge warps downward, or the sheet adhesive WFA without warpage is formed. You can do it. The frictional resistance increasing means 33 can adsorb and hold the adhesive sheet AS on the rolling member 30 side and affix the adhesive sheet AS to the wafer WF, so that the adhesive sheet AS does not depend on the moving speed VA. Depending on the sheet feeding speed VC, it can be attached to the wafer WF. As a result, the frictional resistance increasing means 33 can positively shrink the adhesive sheet AS and affix it to the wafer WF as compared with the case where no load is applied.
As a theoretical value, if the sheet supply speed VB and the sheet feed speed VC are set to a speed obtained by multiplying a value obtained by (total length + elongation) / (total length), the sheet adhesive WFA without warping can be obtained. Although the sheet feeding speed VB and the sheet feeding speed VC can be formed, empirical values derived from experience can be set.

Contrary to the above, when the sheet supply speed VB and the sheet feed speed VC are set lower than the movement speed VA, the degree to which the adhesive sheet AS is attached to the wafer WF while being stretched increases. Sheet adhesive WFA in which the warpage in the direction indicated by the two-dot chain line 1 (B) is increased can be formed.
Further, since the sheet supply speed VB and the sheet feed speed VC can be arbitrarily set, it is possible to adjust the warpage of the sheet adhesive WFA.

  Therefore, according to such an embodiment, it is possible to prevent the sheet adhesive body WFA from warping or to positively generate warpage to the sheet adhesive body WFA simply by controlling the speeds by the control means 14. You can make it. Even if the size of the adhesive sheet AS or the wafer WF is changed, the warp direction of the sheet adhesive WFA can be arbitrarily set without performing troublesome parts replacement work. In addition, by storing the speeds corresponding to the thicknesses and planar shapes of various adhesive sheets AS and wafers WF in the control means 14, even if the thicknesses and shapes are changed, the warping is immediately performed. Therefore, it is possible to prevent the sticking ability from being lowered.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

For example, the force applying means 12 can be replaced with the configuration shown in FIG. In this case, the force applying means 12 includes a frictional resistance increasing means 33, a rotating motor DM2 as a driving device, a driving pulley 42 supported by an output shaft DM2A of the rotating motor DM2, a frictional resistance increasing means 33, and a drive. A rolling member 41 having a plurality of suction holes 43 formed therein, and an additional chamber 45 connected to suction means such as a decompression pump and a vacuum ejector (not shown) are configured by a closed loop belt member wound around the pulley 42. And. Thereby, the rolling member 41 can enlarge the contact area with respect to the adhesive sheet AS compared with the rolling member 30 of the said embodiment, and prevents the adhesive sheet AS from slipping with respect to the rolling member 41 more reliably. Thus, the expansion and contraction of the adhesive sheet AS can be easily controlled.
In the above embodiment, the operator measures the elongation of the adhesive sheet AS attached to the wafer WF, and the operator inputs the value of the elongation to the control means 14, so that the control means 14 has the above theoretical value. You may comprise so that it may calculate.
Further, relative movement between the sheet sticking apparatus 10 and the support means 15 may be performed by stopping the support means 15 and moving the sheet sticking apparatus 10 or by moving both the sheet sticking apparatus 10 and the support means 15. Also good.
Further, the control unit 14 is configured to control the moving speed VA at which the support unit 15 relatively moves the wafer WF via the linear motor 35 of the moving unit 16, or controls a suction unit (not shown) of the support unit 15. Or may be configured.
Further, the force applying means adopts a configuration in which vibration is applied to the adhesive sheet AS by a vibrator, an ultrasonic vibration device or the like, and a pressing force in the adherend direction WD and a repetitive output in the relative movement direction TD are applied. May be.

Further, the type and material of the adherend and the adhesive sheet AS in the present invention are not particularly limited. For example, the adhesive sheet AS has a base sheet and an adhesive layer, and an intermediate layer between them. 3 or more layers, such as having a cover layer on the upper surface of the base sheet, or a so-called double-sided adhesive sheet that can peel the base sheet from the adhesive layer. Such a double-sided adhesive sheet may have a single layer or a multilayer intermediate layer, or may be a single layer or a multilayer without an intermediate layer.
Furthermore, the adhesive sheet AS may be a protective sheet, a dicing tape, a die attach film, or the like. At this time, the wafer WF can be exemplified by a silicon semiconductor wafer, a compound semiconductor wafer, etc., and the adhesive sheet AS to be attached to such a wafer WF is not limited to these, and any use such as any sheet, film, tape, An adhesive sheet having a shape can be applied.
Further, the adherend may be an appropriate article (for example, a food or a resin container), and the adhesive sheet AS may be a label, the adherend is a substrate of an optical disk, and the adhesive sheet AS is a recording layer. It may have a resin layer which constitutes. As described above, as an adherend, not only other plate-like members such as glass plates, steel plates, earthenware, wood plates, resin plates, etc., but also members and articles in any form can be targeted.
Yes.

  Further, the drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 11 Supply means 12 Force means 14 Control means 33 Friction resistance increasing means AS Adhesive sheet WF Semiconductor wafer (adhered body)
WF1 Adhering surface WFA sheet adhesive

Claims (3)

In a sheet sticking device for forming a sheet adhesive by sticking an adhesive sheet to the adherend surface of the adherend that relatively moves at a predetermined moving speed,
Supply means for supplying the adhesive sheet toward the adherend surface;
Applying force to the adhesive sheet supplied by the supply means in the direction of the adherend, and applying means for sending the adhesive sheet in the relative movement direction;
Control means for controlling the operation of the entire sheet sticking apparatus,
The control means controls the sheet supply speed at which the supply means supplies the adhesive sheet and the sheet feed speed at which the force applying means sends the adhesive sheet with respect to the moving speed of the adherend, whereby the sheet A sheet sticking device, wherein the warping direction of the adhesive body is adjustable.   2. The sheet sticking apparatus according to claim 1, wherein the force applying means includes a frictional resistance increasing means for increasing a frictional resistance with the adhesive sheet. In the sheet sticking method in which the adhesive sheet is attached to the adherend surface of the adherend that relatively moves at a predetermined moving speed to form the sheet adhesive,
A supplying step of supplying the adhesive sheet toward the adherend surface;
Applying a pressing force in the direction of the adherend to the adhesive sheet to be supplied, and an applying force step for sending the adhesive sheet in the relative movement direction,
Performing the warp direction adjusting step of adjusting the warp direction of the adhesive sheet by controlling the sheet supply speed and the sheet feed speed with respect to the moving speed of the adherend in the force applying step. The sheet sticking method characterized by this.

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