JP2014042050A5 - - Google Patents

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Publication number
JP2014042050A5
JP2014042050A5 JP2013214264A JP2013214264A JP2014042050A5 JP 2014042050 A5 JP2014042050 A5 JP 2014042050A5 JP 2013214264 A JP2013214264 A JP 2013214264A JP 2013214264 A JP2013214264 A JP 2013214264A JP 2014042050 A5 JP2014042050 A5 JP 2014042050A5
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JP
Japan
Prior art keywords
layer
pad
solder joint
opening
passivation layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2013214264A
Other languages
English (en)
Japanese (ja)
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JP2014042050A (ja
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Publication date
Application filed filed Critical
Priority to JP2013214264A priority Critical patent/JP2014042050A/ja
Priority claimed from JP2013214264A external-priority patent/JP2014042050A/ja
Publication of JP2014042050A publication Critical patent/JP2014042050A/ja
Publication of JP2014042050A5 publication Critical patent/JP2014042050A5/ja
Withdrawn legal-status Critical Current

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JP2013214264A 2013-10-11 2013-10-11 ポストパッシベーション法を使用した高性能システムオンチップ Withdrawn JP2014042050A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013214264A JP2014042050A (ja) 2013-10-11 2013-10-11 ポストパッシベーション法を使用した高性能システムオンチップ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013214264A JP2014042050A (ja) 2013-10-11 2013-10-11 ポストパッシベーション法を使用した高性能システムオンチップ

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2001267522A Division JP5683765B2 (ja) 2001-09-04 2001-09-04 集積回路チップ及びその形成方法

Publications (2)

Publication Number Publication Date
JP2014042050A JP2014042050A (ja) 2014-03-06
JP2014042050A5 true JP2014042050A5 (cg-RX-API-DMAC7.html) 2014-04-17

Family

ID=50394010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013214264A Withdrawn JP2014042050A (ja) 2013-10-11 2013-10-11 ポストパッシベーション法を使用した高性能システムオンチップ

Country Status (1)

Country Link
JP (1) JP2014042050A (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116705758A (zh) * 2023-07-18 2023-09-05 江苏帝奥微电子股份有限公司 一种降低高速开关通道金属寄生电容金属结构及制备工艺

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