JP2014041553A5 - - Google Patents

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Publication number
JP2014041553A5
JP2014041553A5 JP2012184533A JP2012184533A JP2014041553A5 JP 2014041553 A5 JP2014041553 A5 JP 2014041553A5 JP 2012184533 A JP2012184533 A JP 2012184533A JP 2012184533 A JP2012184533 A JP 2012184533A JP 2014041553 A5 JP2014041553 A5 JP 2014041553A5
Authority
JP
Japan
Prior art keywords
region
wall
heat pipe
housing
description
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2012184533A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014041553A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012184533A priority Critical patent/JP2014041553A/ja
Priority claimed from JP2012184533A external-priority patent/JP2014041553A/ja
Priority to PCT/JP2013/057933 priority patent/WO2014030376A1/en
Priority to US14/014,222 priority patent/US9277675B2/en
Priority to US14/186,299 priority patent/US9277676B2/en
Publication of JP2014041553A publication Critical patent/JP2014041553A/ja
Publication of JP2014041553A5 publication Critical patent/JP2014041553A5/ja
Abandoned legal-status Critical Current

Links

JP2012184533A 2012-08-23 2012-08-23 電子機器 Abandoned JP2014041553A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012184533A JP2014041553A (ja) 2012-08-23 2012-08-23 電子機器
PCT/JP2013/057933 WO2014030376A1 (en) 2012-08-23 2013-03-13 Electronic apparatus
US14/014,222 US9277675B2 (en) 2012-08-23 2013-08-29 Electronic apparatus
US14/186,299 US9277676B2 (en) 2012-08-23 2014-02-21 Electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012184533A JP2014041553A (ja) 2012-08-23 2012-08-23 電子機器

Publications (2)

Publication Number Publication Date
JP2014041553A JP2014041553A (ja) 2014-03-06
JP2014041553A5 true JP2014041553A5 (enExample) 2014-10-09

Family

ID=50149699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012184533A Abandoned JP2014041553A (ja) 2012-08-23 2012-08-23 電子機器

Country Status (3)

Country Link
US (1) US9277675B2 (enExample)
JP (1) JP2014041553A (enExample)
WO (1) WO2014030376A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103151318A (zh) * 2013-03-07 2013-06-12 北京中石伟业科技股份有限公司 电子设备中发热芯片与壳体之间的散热管理系统及方法
JP6311222B2 (ja) * 2013-04-30 2018-04-18 日本電気株式会社 電子機器及び放熱方法
US9282681B2 (en) * 2014-01-21 2016-03-08 Seagate Technology Llc Dissipating heat during device operation
US10698458B2 (en) 2014-06-02 2020-06-30 Microsoft Technology Licensing, Llc Integrated vapor chamber for thermal management of computing devices
JP6392015B2 (ja) * 2014-07-18 2018-09-19 株式会社東芝 電子機器
CN105704978A (zh) * 2014-11-26 2016-06-22 英业达科技有限公司 电子装置
US9659466B1 (en) * 2016-03-04 2017-05-23 Penetek Technology, Inc. POS apparatus and display device
TWI656827B (zh) * 2017-06-15 2019-04-11 廣達電腦股份有限公司 電子裝置
JP2020173662A (ja) * 2019-04-11 2020-10-22 レノボ・シンガポール・プライベート・リミテッド カバー付き携帯用情報機器
US10921869B2 (en) * 2019-06-27 2021-02-16 Intel Corporation Chassis embedded heat pipe
JP7508312B2 (ja) * 2020-08-27 2024-07-01 新光電気工業株式会社 ループ型ヒートパイプ
JP7212288B2 (ja) * 2021-05-13 2023-01-25 富士通クライアントコンピューティング株式会社 電子機器

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03247994A (ja) 1990-02-26 1991-11-06 Mitsubishi Heavy Ind Ltd ヒートパイプ機能を有するサンドイッチパネル
US6352103B1 (en) * 1996-05-22 2002-03-05 Intel Corporation High performance notebook PC cooling system
US5818693A (en) * 1997-01-09 1998-10-06 Thermal Corp. Heat dissipating computer case having oriented fibers and heat pipe
JPH10290088A (ja) 1997-04-16 1998-10-27 Pfu Ltd 電子機器用筺体およびその製造方法
JP3037931B2 (ja) 1998-06-30 2000-05-08 三菱電機株式会社 サーモサイホン及びサーモサイホンの製造方法及び情報処理装置
JP2000094108A (ja) 1998-09-22 2000-04-04 Sharp Corp 電子機器筐体の製造方法
JP2002344186A (ja) * 2001-05-15 2002-11-29 Sharp Corp 電子機器
JP3709868B2 (ja) * 2002-12-18 2005-10-26 株式会社日立製作所 電子機器に用いる冷却システム
JP2006074029A (ja) * 2005-08-12 2006-03-16 Hitachi Ltd 熱輸送デバイス
JP4167700B2 (ja) 2006-05-31 2008-10-15 株式会社東芝 電子機器
US7907407B2 (en) * 2008-04-14 2011-03-15 Chidae Electronics Co., Ltd. Heat dissipating device
JP2010211740A (ja) * 2009-03-12 2010-09-24 Toshiba Corp 電子機器
DE202010014106U1 (de) 2010-10-08 2011-01-20 Congatec Ag Wärmeverteiler mit flexibel gelagertem Wärmerohr

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