JP2014041553A - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
JP2014041553A
JP2014041553A JP2012184533A JP2012184533A JP2014041553A JP 2014041553 A JP2014041553 A JP 2014041553A JP 2012184533 A JP2012184533 A JP 2012184533A JP 2012184533 A JP2012184533 A JP 2012184533A JP 2014041553 A JP2014041553 A JP 2014041553A
Authority
JP
Japan
Prior art keywords
region
heat
wall
housing
heat pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2012184533A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014041553A5 (enExample
Inventor
Nobuto Fujiwara
伸人 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2012184533A priority Critical patent/JP2014041553A/ja
Priority to PCT/JP2013/057933 priority patent/WO2014030376A1/en
Priority to US14/014,222 priority patent/US9277675B2/en
Priority to US14/186,299 priority patent/US9277676B2/en
Publication of JP2014041553A publication Critical patent/JP2014041553A/ja
Publication of JP2014041553A5 publication Critical patent/JP2014041553A5/ja
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2012184533A 2012-08-23 2012-08-23 電子機器 Abandoned JP2014041553A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012184533A JP2014041553A (ja) 2012-08-23 2012-08-23 電子機器
PCT/JP2013/057933 WO2014030376A1 (en) 2012-08-23 2013-03-13 Electronic apparatus
US14/014,222 US9277675B2 (en) 2012-08-23 2013-08-29 Electronic apparatus
US14/186,299 US9277676B2 (en) 2012-08-23 2014-02-21 Electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012184533A JP2014041553A (ja) 2012-08-23 2012-08-23 電子機器

Publications (2)

Publication Number Publication Date
JP2014041553A true JP2014041553A (ja) 2014-03-06
JP2014041553A5 JP2014041553A5 (enExample) 2014-10-09

Family

ID=50149699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012184533A Abandoned JP2014041553A (ja) 2012-08-23 2012-08-23 電子機器

Country Status (3)

Country Link
US (1) US9277675B2 (enExample)
JP (1) JP2014041553A (enExample)
WO (1) WO2014030376A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014216610A (ja) * 2013-04-30 2014-11-17 Ｎｅｃカシオモバイルコミュニケーションズ株式会社 放熱構造体及び電子機器
JP2016024575A (ja) * 2014-07-18 2016-02-08 株式会社東芝 電子機器
JP2017518476A (ja) * 2014-06-02 2017-07-06 マイクロソフト テクノロジー ライセンシング，エルエルシー コンピューティングデバイスの熱管理のための一体型ベイパーチャンバー
JP2020173662A (ja) * 2019-04-11 2020-10-22 レノボ・シンガポール・プライベート・リミテッド カバー付き携帯用情報機器
JP2022038851A (ja) * 2020-08-27 2022-03-10 新光電気工業株式会社 ループ型ヒートパイプ
JP2022175425A (ja) * 2021-05-13 2022-11-25 富士通クライアントコンピューティング株式会社 電子機器

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103151318A (zh) * 2013-03-07 2013-06-12 北京中石伟业科技股份有限公司 电子设备中发热芯片与壳体之间的散热管理系统及方法
US9282681B2 (en) * 2014-01-21 2016-03-08 Seagate Technology Llc Dissipating heat during device operation
CN105704978A (zh) * 2014-11-26 2016-06-22 英业达科技有限公司 电子装置
US9659466B1 (en) * 2016-03-04 2017-05-23 Penetek Technology, Inc. POS apparatus and display device
TWI656827B (zh) * 2017-06-15 2019-04-11 廣達電腦股份有限公司 電子裝置
US10921869B2 (en) * 2019-06-27 2021-02-16 Intel Corporation Chassis embedded heat pipe

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03247994A (ja) 1990-02-26 1991-11-06 Mitsubishi Heavy Ind Ltd ヒートパイプ機能を有するサンドイッチパネル
US6352103B1 (en) * 1996-05-22 2002-03-05 Intel Corporation High performance notebook PC cooling system
US5818693A (en) * 1997-01-09 1998-10-06 Thermal Corp. Heat dissipating computer case having oriented fibers and heat pipe
JPH10290088A (ja) 1997-04-16 1998-10-27 Pfu Ltd 電子機器用筺体およびその製造方法
JP3037931B2 (ja) 1998-06-30 2000-05-08 三菱電機株式会社 サーモサイホン及びサーモサイホンの製造方法及び情報処理装置
JP2000094108A (ja) 1998-09-22 2000-04-04 Sharp Corp 電子機器筐体の製造方法
JP2002344186A (ja) * 2001-05-15 2002-11-29 Sharp Corp 電子機器
JP3709868B2 (ja) * 2002-12-18 2005-10-26 株式会社日立製作所 電子機器に用いる冷却システム
JP2006074029A (ja) * 2005-08-12 2006-03-16 Hitachi Ltd 熱輸送デバイス
JP4167700B2 (ja) 2006-05-31 2008-10-15 株式会社東芝 電子機器
US7907407B2 (en) * 2008-04-14 2011-03-15 Chidae Electronics Co., Ltd. Heat dissipating device
JP2010211740A (ja) * 2009-03-12 2010-09-24 Toshiba Corp 電子機器
DE202010014106U1 (de) 2010-10-08 2011-01-20 Congatec Ag Wärmeverteiler mit flexibel gelagertem Wärmerohr

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014216610A (ja) * 2013-04-30 2014-11-17 Ｎｅｃカシオモバイルコミュニケーションズ株式会社 放熱構造体及び電子機器
JP2017518476A (ja) * 2014-06-02 2017-07-06 マイクロソフト テクノロジー ライセンシング，エルエルシー コンピューティングデバイスの熱管理のための一体型ベイパーチャンバー
US10698458B2 (en) 2014-06-02 2020-06-30 Microsoft Technology Licensing, Llc Integrated vapor chamber for thermal management of computing devices
JP2016024575A (ja) * 2014-07-18 2016-02-08 株式会社東芝 電子機器
JP2020173662A (ja) * 2019-04-11 2020-10-22 レノボ・シンガポール・プライベート・リミテッド カバー付き携帯用情報機器
JP2022038851A (ja) * 2020-08-27 2022-03-10 新光電気工業株式会社 ループ型ヒートパイプ
JP7508312B2 (ja) 2020-08-27 2024-07-01 新光電気工業株式会社 ループ型ヒートパイプ
JP2022175425A (ja) * 2021-05-13 2022-11-25 富士通クライアントコンピューティング株式会社 電子機器

Also Published As

Publication number Publication date
US9277675B2 (en) 2016-03-01
US20140055953A1 (en) 2014-02-27
WO2014030376A1 (en) 2014-02-27

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