JP2014029945A - Component mounting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting system which shortens the inspection time in a component inspection device even when a component, which is newly mounted on a substrate, is supplied to a component mounting device.SOLUTION: A component mounting system 100 includes: a component mounting device 30 which mounts components 2 and 3 on a substrate 1; and a component appearance inspection device 40 which inspects the mounting state of the component 2 mounted on the substrate 1 by the component mounting device 30. When the components 2 and 3 are supplied to the component mounting device 30, the component appearance inspection device 40 performs inspections on initial components 2a and 3a, which are first components mounted on the substrate 1 from among the supplied components 2 and 3, to determine the mounting state of the initial components 2a and 3a on the substrate 1.

Description

  The present invention relates to a component mounting system, and particularly to a component mounting system including a component mounting apparatus and a component inspection apparatus.

  2. Description of the Related Art Conventionally, a component mounting system including a component mounting apparatus and a component inspection apparatus is known (for example, see Patent Document 1).

  Patent Document 1 discloses a component mounting system including a component mounting apparatus and a mounting board inspection apparatus (component inspection apparatus), and a mounting board inspection method applied to the component mounting system. In the mounting board inspection method applied to this component mounting system, first, electronic components are mounted on each board in a component mounting apparatus in which boards with identification information such as serial numbers are sequentially carried. Thereafter, component information (information that can identify individual electronic components such as a component name, a component number, and a component shape) mounted on each substrate is transmitted to the mounting substrate inspection apparatus together with the substrate identification information. In the mounting board inspection apparatus, based on the received identification information and component information of each board, the inspection program is sequentially switched for each component mounted on one board and the appearance inspection of all the mounted parts is performed. Configured to be done. Further, such inspection is repeatedly performed on all substrates flowing through the inspection line.

Japanese Patent No. 3673552

  However, in the mounting board inspection method applied to the component mounting system described in Patent Document 1, the mounting board inspection apparatus (component inspection apparatus) performs visual inspection of all the boards (mounting parts) flowing through the production line. Therefore, even when the same type of component is mounted over a plurality of substrates, it is considered that all mounted components are inspected for each substrate. In this case, even if an additional replenishment of the same part by the operator in the component mounting apparatus or a replenishment of a part due to a switching operation to a new part occurs, the first inspected part is mounted in the component inspection apparatus regardless of this. In addition, not only the first board, but also the board on which the second and subsequent supply parts are mounted, all the supply parts are inspected in the same manner, and there is a problem that the inspection time increases.

  The present invention has been made to solve the above-described problems. One object of the present invention is to provide a component mounting apparatus in which a component to be newly mounted on a board is supplied. It is an object of the present invention to provide a component mounting system capable of shortening the inspection time in a component inspection apparatus.

  In order to achieve the above object, a component mounting system according to one aspect of the present invention includes a component mounting device for mounting a component on a substrate, and a component inspection device for inspecting the mounting state of the component on the substrate by the component mounting device. When a component is supplied to the component mounting device, the component inspection device inspects the mounting state of the first product on the substrate for the first product mounted on the substrate for the first time. Has been.

  In the component mounting system according to one aspect of the present invention, as described above, the component mounting device and the component inspection device are provided, and when a component is supplied to the component mounting device, the substrate is the first among the supplied components. By configuring the first product to be mounted to inspect the mounting state of the first product on the substrate by the component inspection device, the component inspection device is the first to be mounted on the substrate for the first time among the replenished components. Since only the inspection of the mounting state on the board for the product is performed, the inspection time is saved because the inspection of the mounting state for all components mounted on the board including the first product is not performed. . That is, even when a component newly mounted on the board is supplied to the component mounting apparatus, the inspection time in the component inspection apparatus can be shortened.

  In the component mounting system according to the one aspect described above, preferably, the component information supplied to the component mounting apparatus is configured to be stored in the component mounting apparatus when the component is supplied, and the component information stored in the component mounting apparatus is stored. The first product is determined based on the above, and the mounting state of the first product on the board is inspected by the component inspection device. With this configuration, it is possible to easily determine whether or not the inspection of the mounting state of the first product on the board is performed by effectively using the component information stored in the component mounting apparatus when the component is replenished.

  The component mounting system according to the one aspect preferably further includes an imaging unit that images the mounting state of the component, and the component inspection apparatus is based on the imaging result of the mounting state of the initial product on the substrate captured by the imaging unit. Thus, it is configured to inspect the mounting state of the first product on the board. If comprised in this way, based on the result which imaged the mounting state (appearance) of the first goods mounted on the board | substrate using the imaging part, it can test | inspect the quality of the mounting condition on the board | substrate of the first goods easily. it can.

  In the component mounting system according to the above aspect, preferably, when the first product is mounted on the board in the component mounting device, the first product mounting information related to the mounting position of the first product and the first product is transmitted to the component inspection device. The component inspection apparatus is configured to inspect the mounting state of the initial product on the board based on the initial product mounting information transmitted from the component mounting apparatus. With this configuration, in the component inspection apparatus, the board of the first product is specified in a state in which the board on which the first product is mounted and the mounting position of the first product on this board are reliably specified based on the first product mounting information. The mounting state (appearance) can be inspected.

  In the component mounting system according to the above aspect, the component mounting apparatus preferably includes an imaging unit that images the mounting state of the component, and is imaged by the imaging unit when the first product is mounted on the substrate in the component mounting apparatus. The component inspection apparatus is configured to inspect the mounting state of the first product on the substrate based on the imaging result of the mounting state of the first product on the substrate. With this configuration, when the first product is mounted on the board in the component mounting device, the mounting state of the first product on the board can be imaged using the imaging unit of the component mounting device. Compared with the case where the mounting state of the first product on the board is inspected by moving the imaged board to the component inspection apparatus after being moved from the component mounting apparatus to the component inspection apparatus, the first time in the component inspection apparatus. Even without loading the board on which the product is mounted, it is possible to perform only the inspection (good / bad determination) of the mounting state of the first product based on the imaging result of the mounting state by the component mounting apparatus. As a result, the inspection time can be further shortened. In addition, immediately after the mounting state of the first product on the board is imaged in the component mounting apparatus, the inspection of the mounting state of the first product based on the imaging result of the mounting state by the component mounting apparatus (pass / fail judgment) is performed in the component inspection apparatus. If a mounting failure is discovered, the production line (mounting operation by the component mounting apparatus) can be stopped when the mounting failure is detected. Therefore, repeated mounting defects of components can be immediately avoided on a board subsequent to the board on which the first product is mounted. Also by this, the productivity of the production line can be improved because the substrate having mounting defects is not continuously manufactured.

  In this case, it is preferable that image data of a mounting state of the first product imaged by the imaging unit is transmitted from the component mounting apparatus to the component inspection apparatus. On the basis of the image data transmitted from, the first product mounted on the board is inspected. If comprised in this way, in a component test | inspection apparatus, the test | inspection (good / bad determination) of the mounting state to the board | substrate of the first goods based on the image data transmitted from the component mounting apparatus can be performed easily.

  According to the present invention, as described above, it is possible to shorten the inspection time in the component inspection apparatus even when the component newly mounted on the board is supplied to the component mounting apparatus.

1 is a system diagram showing a configuration of a component mounting system according to a first embodiment of the present invention. It is the top view which showed the structure of the component mounting apparatus applied to the component mounting system by 1st Embodiment of this invention. It is a side view at the time of seeing the component mounting apparatus applied to the component mounting system by 1st Embodiment of this invention along the depth direction (Y2 direction). It is the top view which showed the board | substrate with which the component mounting produced in the component mounting system by 1st Embodiment of this invention was carried out. It is the top view which showed the structure of the component external appearance inspection apparatus applied to the component mounting system by 1st Embodiment of this invention. It is the figure which showed the control processing flow of the control part at the time of the operator performing the setup work regarding component replenishment in the component mounting apparatus applied to the component mounting system by 1st Embodiment of this invention. It is the figure which showed the control processing flow of the control part when the mounting operation | movement of the component to a board | substrate is performed in the component mounting apparatus applied to the component mounting system by 1st Embodiment of this invention. It is the figure which showed the control processing flow of the control part at the time of the test | inspection of a mounting state (appearance inspection) in the component external appearance inspection apparatus applied to the component mounting system by 1st Embodiment of this invention. It is the figure which showed the control processing flow of the control part at the time of the mounting operation of the component to a board | substrate in the component mounting apparatus applied to the component mounting system by 2nd Embodiment of this invention. It is the figure which showed the control processing flow of the control part at the time of the test | inspection of a mounting state (appearance inspection) in the component external appearance inspection apparatus applied to the component mounting system by 2nd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
First, the configuration of the component mounting system 100 according to the first embodiment of the present invention will be described with reference to FIGS.

  In the component mounting system 100 according to the first embodiment of the present invention, as shown in FIG. 1, a loader 10 and a printing machine are provided from the upstream side (X1 side) to the downstream side (X2 side) of the circuit board production line 101. 20, a component mounting device 30, a component appearance inspection device 40, a reflow furnace 50, and an unloader 60 are arranged in this order. The component mounting system 100 includes a management computer that is communicably connected to each of the loader 10, the printing machine 20, the component mounting apparatus 30, the component appearance inspection apparatus 40, the reflow furnace 50, and the unloader 60 via the network hub 70. 80. The component appearance inspection device 40 is an example of the “component inspection device” in the present invention.

  Each device (loader 10, printing machine 20, component mounting device 30, component appearance inspection device 40, reflow furnace 50, and unloader 60) constituting component mounting system 100 is a self-supporting type having control units 10a to 60a. The operation of each device is individually controlled by each control unit 10a to 60a. In addition, the management computer 80 includes a control unit 80a and a storage unit 80b. The management computer 80 has a role of executing the control program (production program) to control the entire component mounting system 100. The storage unit 80b stores production management information related to the production of the component mounting system 100. Yes. That is, the management computer 80 (the control unit 80a) and each device (the control units 10a to 60a) transmit and receive information on the production plan as needed, so that the production of the substrate 1 on which the components 2 and 3 are mounted in the component mounting system 100. Is configured to be performed.

  Next, the configuration of each device constituting the component mounting system 100 will be described. In the following description, the component mounting apparatus 30 and the component appearance inspection apparatus 40 will be described in detail, and detailed descriptions of the loader 10, the printing machine 20, the reflow furnace 50, and the unloader 60 will be omitted.

  The loader 10 (see FIG. 1) has a role of holding the board (wiring board) 1 before mounting the components 2 and 3 and the like and carrying it into the circuit board production line 101. Here, the component 2 (3) indicates a small piece of electronic component such as an LSI, an IC, a transistor, a capacitor, or a resistor. The printing machine 20 is a screen printing machine and has a function of applying cream solder on the surface of the substrate 1.

  The component mounting apparatus 30 (see FIG. 1) has a function of mounting (mounting) a plurality of components 2 at a predetermined mounting position of the substrate 1 on which cream solder is printed. Specifically, as shown in FIG. 2, the component mounting apparatus 30 includes a base 31, a substrate transport unit 32 provided on the base 31 (front side of the paper surface), and an upper side (paper surface) of the substrate transport unit 32. The head unit 33 is movable along the XY plane. Multiple rows (plurality) of tape feeders 34 are arranged on both sides (Y1 side and Y2 side) of the substrate transport unit 32. Each tape feeder 34 holds a reel (not shown) around which a tape holding a plurality of components 2 at a predetermined interval is wound. The reel 2 is rotated and the tape is delivered, so that the component 2 is supplied from the tip.

  In addition to the tape feeder 34, a tray unit 35 on which a plurality of components 3 made of large package components such as a semiconductor package are placed is disposed on the side (Y2 side) of the substrate transport unit 32. . Here, a barcode 35 a created in association with the information on the component 3 is attached to the tray unit 35. The head unit 33 has a function of acquiring the components 2 and 3 from the tape feeder 34 and the tray unit 35 and individually mounting these components 2 and 3 on the substrate 1 based on a predetermined mounting program. doing.

  Therefore, as shown in FIG. 4, a plurality of components 2 and 3 having various sizes (shapes) are directed to a predetermined direction according to the wiring pattern of the substrate 1 on the substrate 1 that has passed through the component mounting apparatus 30. It is implemented in the state.

  As shown in FIG. 1, the component appearance inspection device 40 is an optical inspection device, and the mounting state (the substrate 1 and the substrate) of the substrate 1 (see FIG. 4) before reflow on which the plurality of components 2 and 3 are mounted. 1 has the function of inspecting the appearance of the components 2 and 3 mounted in 1 using visible light. As a result, it is determined whether or not there is a mounting failure, and when there is a mounting failure, the operator is immediately informed.

  Here, in the first embodiment, when the components 2 and 3 are supplied to the component mounting apparatus 30 in operation by the operator's setup work, the components are mounted on the board 1 for the first time among the supplied components 2 and 3. With respect to the first products 2a and 3a (first product parts), the component appearance inspection device 40 is configured to inspect the mounting state of the first products 2a and 3a on the substrate 1. Referring to FIG. 4, for example, among the components 2 mounted on the substrate 1 by the component mounting apparatus 30, the component 2 a is the first product 2 a (first product component) mounted on the substrate 1 for the first time. In this case, only the mounting state of the first product 2a is inspected by the component visual inspection apparatus 40. Similarly, of the components 3 mounted on the substrate 1, when the component 3a is the first product 3a mounted on the substrate 1 for the first time, only the mounted state of the first product 3a is the component appearance inspection device 40. Inspected. Therefore, since the plurality of components 2b (3b) other than the initial product 2a (3a) do not correspond to the “first product” mounted for the first time on the board 1, the inspection by the component visual inspection apparatus 40 is performed. Absent. On the other hand, when the board 1 on which the first component 2b or the component 3b is mounted as the first product passes through the component mounting device 30 at the time of past production, this point is recognized on the component mounting device 30 side. The component 2b and the component 3b mounted on the board 1 at that time are designated as inspection target components (initial product components) in the component visual inspection apparatus 40.

  The case where the components 2 and 3 are replenished to the component mounting apparatus 30 in operation by the operator means, for example, a new one in which a plurality of components 2 are held by removing an empty tape feeder 34 (see FIG. 2). A plurality of parts 3 can be transferred from the empty tray portion 35 (see FIG. 2) by switching to the tape feeder 34, performing splicing to join a new tape part to the remaining tape part of the part 2 in the same tape feeder 34, or the like. This means that the component mounting apparatus 30 is replenished with the components 2 and 3 to be mounted, for example, by replacing with the new tray portion 35 placed. Therefore, for example, when the first IC chip newly supplied by the operator to the component mounting apparatus 30 is mounted on the substrate 1, even if the IC chip is of the same type, the first IC chip is inspected. Is performed by the component visual inspection apparatus 40. At this time, even if the mounting position on the substrate 1 of the IC chip before supply and the IC chip after supply is the same, the first IC chip to be mounted for the first time after supply corresponds to the “first product”. In this way, only the first product that is mounted on the substrate 1 for the first time, such as the components 2a and 3a, is subjected to the appearance inspection by the component appearance inspection apparatus 40, so that an erroneous determination (false report) occurs even in the inspection result. Even so, the number of times the operator responds one by one is reduced. Even if the inspection program (inspection data) is inaccurate, the operator's response frequency is low, so there is no inconvenience even if this inspection method is used.

  Further, in the first embodiment, the information on the component 2 and the component 3 supplied to the component mounting apparatus 30 can be individually stored in the component mounting apparatus 30 when the components are supplied. For example, when the operator replenishes the component mounting apparatus 30 with the new component 3 placed on the tray unit 35, the barcode 35 a (see FIG. 2) of the tray unit 35 is used in advance using the barcode reader 301 (see FIG. 2). The information of the component 3 to be replenished is stored in the component mounting device 30. The same applies to the replacement (exchange) of the tape feeder 34 and the tape splicing, and the bar code reader 301 is used to read a bar code (not shown) attached to the tape feeder 34 to store information on the component 2 to be replenished. It is configured to be. In addition, information on the parts to be supplied is also managed on the management computer 80 side. Then, based on the information on the component 2 and the component 3 stored in the component mounting apparatus 30 and the information (substrate ID) of the board 1 carried into the component mounting apparatus 30, each component becomes the above-mentioned “first product”. It is determined whether this is the case. Further, based on the determination result in the component mounting apparatus 30, the mounting state of the first product 2 a (3 a) recognized as the “first product” by the component appearance inspection device 40 on the board 1 is inspected. Yes.

  As shown in FIG. 2, the component mounting apparatus 30 includes a support unit 36 that supports the head unit 33 so as to be movable in the X direction, and a moving mechanism unit 37 that moves the entire support unit 36 in the Y direction. The head unit 33 has a slide portion 33a to which a ball nut (not shown) is attached. The support portion 36 is provided with a ball screw shaft 36a extending in the X direction, a servo motor 36b, and a guide portion 36c extending along the ball screw shaft 36a. Thereby, the head unit 33 is moved in the X direction with the rotation of the ball screw shaft 36a while the slide portion 33a is guided by the guide portion 36c. A ball nut 36d (broken line) is attached to the support portion 36, and a ball screw shaft 37a and a servo motor 37b extending in the Y direction are provided in the moving mechanism portion 37. Accordingly, the support portion 36 is moved in the Y direction together with the ball nut 36d screwed to the ball screw shaft 37a as the ball screw shaft 37a rotates. Therefore, the head unit 33 is configured such that the ball screw shafts 36a and 37a can be rotated to move on the base 31 to any position along the XY plane.

  As shown in FIG. 3, the head unit 33 includes a head portion 33b fixed to the slide portion 33a and an imaging unit 38 attached to an end portion (X2 side) of the head portion 33b. The head portion 33b further includes a plurality (six) of suction nozzles 33c arranged on the lower surface (Z1 side) facing the substrate 1 and arranged in the X direction. Each suction nozzle 33c has a function of sucking and holding the components 2 and 3 by the negative pressure generated at the tip of the nozzle by a negative pressure generator (not shown). On the base 32, an imaging unit 39 is mounted for imaging the suction state of the component 2 to the suction nozzle 33c from below.

  The component mounting apparatus 30 includes an operation unit 300 as shown in FIG. The operation unit 300 is provided with the barcode reader 301 described above, and the operation unit 300 is configured to be able to input information read by the barcode reader 301 in addition to information input by the keyboard 302. Yes. Further, the control unit 30a of the component mounting apparatus 30 drives the servo motor 36b, the servo motor 37b, and the suction nozzle 33c based on the production program distributed from the management computer 80 and its own mounting program, and the suction nozzle 33c. A negative pressure generating mechanism (not shown) and the imaging units 38 and 39 are controlled.

  In the component mounting apparatus 30, as shown in FIG. 3, a cover 306 is attached to a casing 307 provided on the base 31. The cover 306 is rotatable upward (in the direction of the arrow U) with respect to the casing 307, and is configured so that the operator can access the substrate transfer unit 32.

  As shown in FIG. 5, the component appearance inspection apparatus 40 includes a base 41, a substrate transport unit 42 provided on the base 41 (front side of the paper), and the upper side of the substrate transport unit 42 on the XY plane. And an imaging unit 43 that can move along. The imaging unit 43 has a function of performing an appearance inspection of the component 2 by imaging the component 2 mounted (temporarily mounted) on the substrate 1 fixed on the substrate transport unit 42 at a predetermined position.

  Here, in the first embodiment, when the mounted state of the first products 2a and 3a (first product components) mounted on the substrate 1 for the first time among the replenished components 2 and 3 is inspected by the component appearance inspection device 40. The mounting states of the first products 2a and 3a are inspected based on the imaging results (image data) of the mounting states of the first products 2a and 3a on the substrate 1 imaged by the imaging unit 43.

  In the first embodiment, when the first products 2a and 3a are mounted on the board 1 in the component mounting apparatus 30, the first products 2a and 3a and the first product 2a and 3a mounting positions on the board 1 The “product mounting information” is transmitted to the component appearance inspection apparatus 40. The component appearance inspection device 40 is configured to inspect the mounting state of the first products 2 a and 3 a on the substrate 1 based on the “first product mounting information” transmitted from the component mounting device 30. .

  This point will be specifically described. That is, as shown in FIG. 4, each substrate 1 is provided with a barcode 1e. The bar code 1e includes information corresponding to the board ID such as the serial number of the board 1. In this case, the board 1 includes the divided boards 1a to 1d, and the barcode 1e includes information such that the divided boards 1a to 1d have different wiring patterns. The component mounting apparatus 30 is configured such that the board ID is recognized for each board 1 that is carried in based on the production program. Furthermore, in the component mounting apparatus 30, since the components 2 and 3 to be mounted are individually identified as described above, all of the components 2 and 3 mounted on the individual substrates 1 recognized based on the substrate ID. The content is specified in advance.

  Therefore, in the component mounting apparatus 30, which part of the board 1 (the split boards 1 a to 1 d) is mounted (which part is scheduled to be mounted) is grasped together with the mounting operation including board loading and the like. That is, when the initial products 2a and 3a are mounted at predetermined positions on the substrate 1 (the split substrate 1a), this becomes “initial product mounting information” regarding the mounting positions of the initial products 2a and 3a on the substrate 1, It is configured to be transmitted to the appearance inspection device 40. In the example of FIG. 4, “initial product mounting information” is generated that two types of initial products 2a and 3a as the initial products are mounted one by one at the positions shown in the drawing of the split substrate 1a. Further, such “first product mounting information” is also stored (updated) as needed in the storage unit 80b of the management computer 80 (see FIG. 1).

  Therefore, the component appearance inspection apparatus 40 is configured to inspect the mounting state of the first products 2a and 3a on the board 1 based on the “first product mounting information” transmitted from the component mounting device 30. . When the mounted substrate 1 is carried in and “initial product mounting information” is attached to the substrate 1, as shown in FIG. 5, the imaging unit 43 of the component appearance inspection apparatus 40 detects the initial products 2a and 3a. And images of the appearance of the first products 2a and 3a including the identification marks “0831” and “1036” (see FIG. 4) of the respective parts. Then, based on the imaged image data, whether the parts treated as the first products 2a and 3a on the split board 1a are mounted without making a mistake in the parts themselves, and whether the parts are mounted on the split board 1a are determined. Whether the direction (X direction, Y direction) is correct or not is determined.

  As shown in FIG. 4, the board transport section 42 in the component appearance inspection apparatus 40 includes a carry-in conveyor 42 a that carries in the board 1 after component mounting, a carry-out conveyor 42 b that carries out the board 1 after inspection, An inspection conveyor 42c provided between the carry-in conveyor 42a and the carry-out conveyor 42b is provided. The inspection conveyor 42c is provided with a ball nut (not shown), a ball screw shaft 42d extending in the Y direction, and a servo motor 42e. Thereby, the inspection conveyor 42c is moved in the Y direction together with the ball nut screwed to the ball screw shaft 42d as the ball screw shaft 42d rotates.

  The component appearance inspection apparatus 40 includes a support unit 44 that supports the imaging unit 43 so as to be movable in the X direction. The support portion 44 is provided with a ball nut (not shown), a ball screw shaft 44a extending in the X direction, and a servo motor 44b. As a result, the imaging unit 43 is moved in the X direction together with the ball nut screwed onto the ball screw shaft 44a as the ball screw shaft 44a rotates. Therefore, in the component appearance inspection apparatus 40, the servo motor 42e and the servo motor 44b are rotationally driven to move the imaging unit 43 in the XY directions relative to the inspection conveyor 42c. Thereby, as described above, the appearance image of the part on which the first products 2a and 3a of the board 1 (split board 1a) are mounted is sequentially captured by the imaging unit 43, and the appearance inspection of the mounted part is performed based on the captured image. Is done.

  The control unit 40a of the component appearance inspection apparatus 40 is configured to control the servo motor 42e, the servo motor 44b, the imaging unit 43, and the like based on the production program distributed from the management computer 80 and its own inspection program. ing.

  As shown in FIG. 1, the reflow furnace 50 has a role of melting the solder by performing heat treatment and joining the component 2 to the electrode portion on the substrate 1. Further, the unloader 60 has a role of discharging the substrate 1 after the component 2 is mounted from the circuit board production line 101. In this way, the component mounting system 100 in the first embodiment is configured.

  Next, referring to FIG. 2 and FIG. 6, control of the control unit 30 a (see FIG. 1) when the operator performs setup work (replacement work) of the component 2 to be mounted on the board 1 with respect to the component mounting apparatus 30. A processing flow will be described.

  This control flow is executed together with the setup work (replacement work) of the part 2 (see FIG. 2) by the operator. For example, the operator temporarily takes out the empty tray portion 35 (see FIG. 2) from the component mounting apparatus 30 (see FIG. 2), and mounts the tray portion 35 on which the new component 3 (see FIG. 2) is placed. Set at a predetermined position of the device 30. At this time, the operator reads the barcode 35a (see FIG. 2) attached to the tray unit 35 using the barcode reader 301 (see FIG. 2). The following control flow is executed on the premise of such an operator's setup work.

  Specifically, as shown in FIG. 6, first, in step S1, it is determined whether or not the part 3 (see FIG. 2) has been replaced (refilled) by the control unit 30a (see FIG. 1). If the barcode 35a of the replacement part is not read using the barcode reader 301 (see FIG. 2) and it is determined that the part 3 is not replaced by the operator (No determination), this control ends. Is done.

  If it is determined in step S1 that the parts 3 have been replaced (Yes determination), the process proceeds to step S2. That is, when the operator sets the tray unit 35 on which a plurality of new components 3 are placed on the component mounting apparatus 30, the information on the barcode 35 a read using the barcode reader 301 is received by the component mounting apparatus 30. If it is determined that the part 3 has been replaced, it is determined that

  In step S2, information on the component 3 of the tray unit 35 corresponding to the read barcode 35a is stored in the component mounting apparatus 30 based on a command from the control unit 30a, and this control is terminated. In the component mounting apparatus 30, information regarding the component 3 that has been switched in this way is registered before the mounting operation.

  Next, a control processing flow of the control unit 30a (see FIG. 1) when the mounting operation of the components 2 and 3 is performed in the component mounting apparatus 30 will be described with reference to FIG. 1, FIG. 2, FIG. 4, and FIG. To do.

  As shown in FIG. 7, in step S <b> 21, the substrate transport unit 32 (see FIG. 2) is driven by the control unit 30 a (see FIG. 1), and the printed board 1 (see FIG. 1) is mounted on the component mounting apparatus 30 ( (See FIG. 2). In step S22, the mounting operation of the components 2 and 3 (see FIG. 4) is performed according to the production program (mounting program).

  Here, in the first embodiment, in step S23, it is determined whether or not there are components (initial products 2a and 3a (see FIG. 4)) that are mounted on the substrate 1 for the first time among the components 2 and 3. To be judged. That is, in the component mounting apparatus 30, the management computer 80 (the board ID of the board 1 carried into the component mounting apparatus 30 and the contents (component information) of the components 2 and 3 to be mounted on the board 1 are included. Since the first products 2a and 3a to be mounted for the first time on this board 1 exist, “first product mounting information” is generated. Therefore, in the control unit 30a, the determination in step S23 is performed based on the “first product mounting information”. If it is determined that the first products 2a and 3a to be mounted for the first time on the substrate 1 do not exist (No determination), the process proceeds to step S26, and the substrate transport unit 32 is driven, both of which are applicable to the first product. The mounted substrate 1 (see FIG. 1) on which only the plurality of components 2 (2b) and 3 (3b) are mounted is carried out. And this control is complete | finished.

  Further, when it is determined in step S23 that the first products 2a and 3a to be mounted for the first time on the substrate 1 among the plurality of components 2 and 3 based on the “first product mounting information” (Yes determination), In step S <b> 24, the “initial product mounting information” generated in step S <b> 23 is stored in the component mounting apparatus 30.

  Thereafter, in step S25, the initial product mounting information is updated. That is, with respect to the board 1 that is carried into the component mounting apparatus 30 next (after) the board 1 having “initial product mounting information”, the first products 2 a and 3 a ( 4), data processing for adding information that “This board 1 is no longer the first product (is treated as inspected components 2b and 3b)” is performed. Thereby, for the next (rear) board 1, the initial product mounting information accompanying the previous (front) board 1 is not generated. Then, it progresses to step S26, the board | substrate conveyance part 32 is driven, and the board | substrate 1 after mounting in which the some components 2 and 3 including the first goods 2a (3a) were mounted is carried out. Thereby, this control is complete | finished.

  Next, referring to FIG. 1, FIG. 4, FIG. 5, and FIG. 8, the control process flow of the control unit 40a (see FIG. 1) when the appearance inspection of the component mounting state is performed in the component appearance inspection apparatus 40. explain.

  As shown in FIG. 8, in step S31, the substrate 1 (see FIG. 4) on which the plurality of components 2 and 3 (see FIG. 4) are mounted is carried to the inspection position by the control unit 40a (see FIG. 1). . In step S32, the “initial product mounting information” generated by the component mounting apparatus 30 (see FIG. 1) is read into the component appearance inspection apparatus 40 (see FIG. 5) via the network hub 70 (see FIG. 1). .

  Here, in the first embodiment, in step S33, the first product mounted on the substrate 1 for the first time among the plurality of components 2 and 3 based on the “first product mounting information” regarding the substrate 1 by the control unit 40a. It is determined whether 2a and 3a exist. If it is determined that the first products 2a and 3a to be mounted for the first time on the substrate 1 do not exist (No determination), the process proceeds to step S35, and the substrate transport unit 42 (the unloading conveyor 42b) is driven to The mounted substrate 1 on which the components 2 and 3 are mounted is carried out. That is, the board 1 is unloaded from the component appearance inspection apparatus 40 without being inspected for mounting (appearance inspection). And this control is complete | finished.

  If it is determined in step S33 that the first products 2a and 3a to be mounted for the first time on the substrate 1 among the plurality of components 2 and 3 are present based on the first product mounting information (Yes determination), step S34 is performed. Then, according to the production program (inspection program), inspection of the mounting state (appearance inspection) of the first products 2a and 3a is performed. That is, in the component appearance inspection apparatus 40, the imaging unit 43 (see FIG. 5) is inspected by the inspection conveyor 42c (see FIG. 5) when the servo motor 42e (see FIG. 5) and the servo motor 44b (see FIG. 5) are rotationally driven. ), The appearance of the portion where the initial products 2a and 3a of the substrate 1 are mounted is sequentially imaged by the imaging unit 43, and the mounted component (initial product) is based on the captured image data. Appearance inspection of parts) is performed. And it progresses to step S35, the board | substrate conveyance part 42 (conveying conveyor 42b) is driven, and the board | substrate 1 after mounting in which the some components 2 and 3 including the first goods 2a (3a) were mounted is carried out. Thereby, this control is complete | finished.

  In the first embodiment, as described above, the component mounting device 30 and the component appearance inspection device 40 are provided, and when the components 2 and 3 are supplied to the component mounting device 30, the components 2 and 3 are replenished. In the component appearance inspection apparatus 40, the component appearance inspection device 40 inspects the mounting state of the first products 2a and 3a on the substrate 1 with respect to the first products 2a and 3a mounted on the substrate 1 for the first time. In the replenished parts 2 and 3, only the inspection of the mounting state of the first product 2a and 3a mounted on the substrate 1 for the first time on the substrate 1 is performed, so the first product 2a and 3a are included. Since the inspection of the mounting state for all the components 2 and 3 mounted on the board 1 is not performed, the inspection time is saved. That is, even when a plurality of components 2 and 3 to be newly mounted on the board 1 are supplied to the component mounting apparatus 30, the inspection time in the component appearance inspection apparatus 40 can be shortened.

  In the first embodiment, the information on the components 2 and 3 supplied to the component mounting apparatus 30 is configured to be stored in the component mounting apparatus 30 when the components 2 and 3 are supplied, and is stored in the component mounting apparatus 30. The first products 2a and 3a are determined based on the information on the components 2 and 3, and the component appearance inspection device 40 is used to inspect the mounting state of the first products 2a and 3a on the substrate 1. This makes it easy to check whether or not the initial products 2a and 3a are mounted on the board 1 by effectively using the information on the components 2 and 3 stored in the component mounting apparatus 30 when the components 2 and 3 are replenished. Can be determined.

  In the first embodiment, the component appearance inspection apparatus 40 includes an imaging unit 43 that images the mounting state of the components 2 and 3, and the first products 2 a and 3 a captured by the imaging unit 43 are applied to the substrate 1. Based on the imaging result of the mounting state, the mounting state of the first products 2a and 3a on the substrate 1 is inspected. Thereby, the quality of the mounting state of the initial products 2a and 3a on the substrate 1 is easily determined based on the result of imaging the mounting states (appearance) of the initial products 2a and 3a mounted on the substrate 1 using the imaging unit 43. Can be inspected.

  In the first embodiment, when the first products 2a and 3a are mounted on the substrate 1 in the component mounting apparatus 30, the “first product mounting information” regarding the mounting positions of the first products 2a and 3a and the first products 2a and 3a is the component. The component appearance inspection device 40 is configured to be transmitted to the appearance inspection device 40, and the component appearance inspection device 40 applies the initial products 2 a and 3 a to the substrate 1 based on the “initial product mounting information” transmitted from the component mounting device 30. It is configured to inspect the mounting state. As a result, in the component appearance inspection apparatus 40, the board 1 on which the first product is mounted and the mounting positions of the first products 2a and 3a on the board 1 are reliably specified based on the first product mounting information. The mounting state (appearance) of the product on the substrate 1 can be inspected.

(Second Embodiment)
Next, a second embodiment will be described with reference to FIGS. 1, 2, 4, 5, 9, and 10. In the component mounting system 200 according to the second embodiment of the present invention, unlike the first embodiment, when the component mounting apparatus 30 determines that it is the “first product” in the mounting stage, the component mounting apparatus 30 itself has an appearance of the component. (Mounting state) is imaged and the image data is transferred to the component appearance inspection device 40, and the component appearance inspection device 40 performs the pass / fail judgment of the mounting state for the image data to inspect the initial product component. ing. In the figure, components similar to those in the first embodiment are denoted by the same reference numerals as those in the first embodiment.

  In the component mounting system 200 (see FIG. 1) according to the second embodiment of the present invention, the imaging unit 38 (see FIG. 2) attached to the head unit 33 of the component mounting apparatus 30 is used, The first product 2a and 3a (refer to FIG. 4) determined to be “product” are configured to take an image of the mounting state on the substrate 1. Thereby, the board | substrate 1 carried out from the component mounting apparatus 30 like the said 1st Embodiment is carried in into the component external appearance inspection apparatus 40, and is first used using the imaging part 43 (refer FIG. 5) of the component external appearance inspection apparatus 40. FIG. It is not necessary to inspect the product, and only the image data relating to the appearance of the first products 2a and 3a imaged by the component mounting device 30 is sent to the component appearance inspection device 40 (see FIG. 1) via the network hub 70 (see FIG. 1). The parts appearance inspection device 40 is configured to inspect the first products 2a and 3a based on the transferred image data. Therefore, it is possible to inspect the mounting state of the first products 2a and 3a without requiring time for the board 1 to be unloaded from the component mounting apparatus 30 and loaded into the component appearance inspection apparatus 40.

  First, a control processing flow of the control unit 30a (see FIG. 1) when the mounting operation of the components 2 and 3 is performed in the component mounting apparatus 30 will be described with reference to FIG. 1, FIG. 2, FIG. 4, and FIG. .

  As shown in FIG. 9, in step S51, the substrate transport unit 32 (see FIG. 2) is driven by the control unit 30a (see FIG. 1), and the printed substrate 1 (see FIG. 1) is carried to the mounting position. The In step S52, the mounting operation of the components 2 and 3 is performed according to the production program (mounting program). In step S53, it is determined whether or not the first products 2a and 3a (see FIG. 4) to be mounted for the first time on the substrate 1 are present among the plurality of components 2 and 3. If it is determined that the first products 2a and 3a to be mounted for the first time on the substrate 1 do not exist (No determination), the process proceeds to step S59, and the substrate transport unit 32 is driven, both of which are applicable to the first product. The mounted substrate 1 on which the plurality of components 2 (2b) and the component 3 (3b) not mounted are mounted is carried out. Thereby, this control is complete | finished.

  Here, in the second embodiment, when it is determined in step S53 that the first products 2a and 3a to be mounted for the first time on the board 1 among the plurality of components 2 and 3 exist based on the “first product mounting information”. In (Yes determination), in step S54, the imaging unit 38 (see FIG. 2) attached to the head unit 33 is driven by the control unit 30a (see FIG. 1), and the first products 2a and 3a already mounted on the substrate 1 are driven. The mounting state is imaged.

  In step S55, the image data of the first products 2a and 3a (see FIG. 4) imaged by the imaging unit 38 is transmitted to the component appearance inspection apparatus 40 (see FIG. 1), and at the same time, to the component appearance inspection apparatus 40. A request for appearance inspection regarding the image data is made.

  Thereafter, in step S56, the inspection result is acquired from the component appearance inspection apparatus 40 by the control unit 30a. In step S57, it is determined whether the inspection result is acceptable. If it is determined in step S57 that it has failed (No determination), in step S58, an alarm sound or a warning color lamp is activated, and the production program (mounting program) is stopped. Thereby, the mounting operation of the components 2 and 3 on the subsequent board 1 is stopped. Then, the process proceeds to step S59, where the board transport unit 32 is driven, and the mounted board 1 (defective product) on which a plurality of components 2 and 3 including the initial products 2a and 3a having a poor mounting state are mounted is carried out. The Thereby, this control is complete | finished.

  If it is determined that the result is acceptable in step S57 (Yes determination), the process proceeds to step S59, where the substrate transport unit 32 is driven and a plurality of other components 2 and 3 including the initial products 2a and 3a in good mounting state. The mounted substrate 1 (inspection pass product) on which is mounted is carried out. Thereby, this control is complete | finished.

  Next, referring to FIG. 1, FIG. 4, FIG. 5 and FIG. 10, the control processing flow of the control unit 40a (see FIG. 1) when the appearance inspection of the component mounting state is performed in the component appearance inspection apparatus 40. explain.

  As shown in FIG. 10, in step S <b> 61, it is determined by the control unit 40 a (see FIG. 1) whether or not a request for mounting state inspection (appearance inspection) has been received from the component mounting apparatus 30 (see FIG. 1). At the same time, this determination is repeated until it is determined that a request for appearance inspection is received from the component mounting apparatus 30.

  When it is determined in step S61 that a request for appearance inspection has been received from the component mounting apparatus 30, the image data of the first products 2a and 3a is acquired from the component mounting apparatus 30 in step S62. In step S63, the mounting state of the first products 2a and 3a based on the image data is inspected according to the production program (inspection program). In step S64, processing for transmitting the inspection result to the component mounting apparatus 30 is performed, and this control is terminated.

  In the second embodiment, as described above, the component mounting apparatus 30 includes the imaging unit 38 that images the mounting state of the component 2, and when the first products 2 a and 3 a are mounted on the substrate 1 in the component mounting apparatus 30. Based on the imaging result of the mounting state of the first products 2a and 3a on the substrate 1 imaged by the imaging unit 38, the component appearance inspection apparatus 40 inspects the mounting state of the first products 2a and 3a on the substrate 1. It is configured. Thus, when the first products 2a and 3a are mounted on the substrate 1 in the component mounting apparatus 30, the mounting state of the first products 2a and 3a on the substrate 1 can be imaged using the imaging unit 38 of the component mounting apparatus 30. Since the substrate 1 on which the first products 2a and 3a are mounted is moved from the component mounting device 30 to the component appearance inspection device 40, the substrate 1 of the first products 2a and 3a is imaged by the component appearance inspection device 40. Compared with the case where the mounting state is inspected, the component appearance inspection apparatus 40 is based on the imaging result of the mounting state by the component mounting apparatus 30 without carrying the board 1 on which the first products 2a and 3a are mounted. Only the inspection (good / bad determination) of the mounting state of the initial products 2a and 3a can be performed. As a result, the inspection time can be further shortened.

  Further, in the second embodiment, after the mounting state of the initial products 2a and 3a on the substrate 1 is imaged in the component mounting apparatus 30, the initial products 2a and 3a based on the imaging result of the mounting state by the component mounting apparatus 30 immediately. When the mounting appearance inspection (good / bad judgment) is performed in the component appearance inspection device 40 and a mounting failure is found, the circuit board production line 101 (mounting operation by the component mounting device 30) is detected when the mounting failure is found. Can be stopped. Therefore, the mounting defects of the components 2b and 3b (see FIG. 4) at the same positions as the positions where the initial products 2a and 3a are mounted are repeated on the substrate 1 subsequent to the substrate 1 on which the initial products 2a and 3a are mounted. Can be avoided immediately. Also by this, the productivity of the circuit board production line 101 can be improved by the amount that the board 1 having mounting defects is not continuously produced.

  In the second embodiment, the image data of the mounting state of the initial products 2 a and 3 a captured by the imaging unit 38 on the substrate 1 is transmitted from the component mounting apparatus 30 to the component appearance inspection apparatus 40. The component appearance inspection apparatus 40 is configured to inspect the mounting state (appearance) of the first products 2 a and 3 a on the board 1 based on the image data transmitted from the component mounting apparatus 30. Thereby, in the component visual inspection apparatus 40, the inspection (good / bad determination) of the mounting state of the first products 2a and 3a on the board 1 based on the image data transmitted from the component mounting apparatus 30 can be easily performed. The remaining effects of the second embodiment are similar to those of the aforementioned first embodiment.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first and second embodiments, an example in which the component appearance inspection device 40 is disposed immediately adjacent to the downstream side of the component mounting device 30 has been described, but the present invention is not limited to this. For example, the “component inspection apparatus” of the present invention may be arranged on the downstream side of the reflow furnace 50 in the component mounting system 100.

  In the first and second embodiments, an example in which each device in the component mounting system 100 is comprehensively controlled by the management computer 80 is shown, but the present invention is not limited to this. In the present invention, it is not necessary to provide a management computer, and the first product 2a mounted on the board 1 for the first time based on mutual communication between the component mounting device 30 (control unit 30a) and the component appearance inspection device 40 (control unit 40a). 3a and 3a may be inspected.

  In the first and second embodiments, an example in which, for example, the barcode 35 a attached to the tray unit 35 is read when the information of the component 3 to be replenished is stored in the component mounting apparatus 30 has been described. The invention is not limited to this. For example, information on the component 3 to be replenished may be stored in the component mounting apparatus 30 using a two-dimensional code such as a QR code (registered trademark).

  Moreover, in the said 1st and 2nd embodiment, although the board | substrate 1 used as mounting object showed about the example containing the split boards 1a-1d, this invention is not limited to this. The present invention can also be applied to mounting the components 2 and 3 on a single board that is not a split board.

  In the second embodiment, after the mounting operation of the components 2 and 3 on the substrate 1 is completed, the imaging unit 38 attached to the head unit 33 is moved above the initial products 2a and 3a, and the initial products 2a and 3a are moved. Although an example of imaging 3a has been shown, the present invention is not limited to this. When the first products 2a and 3a are mounted while the components 2 and 3 are mounted, the imaging unit 38 is immediately moved to the position of the suction nozzle 33c on which the first products 2a and 3a are mounted to capture the first products 2a and 3a. May be. Then, since it is possible to immediately perform an appearance inspection in the component appearance inspection apparatus 40 based on the image data after imaging, the mounting operation of the other components 2b and 3b other than the initial product 2a and 3a is completed. As a result, the inspection time (cycle time) can be further shortened because the mounting operation and the inspection of the mounting state of the first products 2a and 3a can be performed in parallel.

  In the second embodiment, when the first products 2a and 3a after mounting are imaged, the head unit 33 of the component mounting apparatus 30 is driven to move the imaging unit 38 to image the first products 2a and 3a. However, the present invention is not limited to this. The imaging unit 38 may be attached to an independent moving mechanism unit different from the head unit 33 so as to image the first products 2a and 3a after mounting. That is, immediately after mounting the first products 2a and 3a by the head unit 33, the imaging unit 38 driven by another moving mechanism unit is immediately moved above the first products 2a and 3a to image the first product. It becomes possible. Then, since it is possible to immediately perform an appearance inspection in the component appearance inspection apparatus 40 based on the image data after imaging, it is not necessary to complete the mounting operation of the other components 2b and 3b. Since the inspection of the mounting state 2a and 3a can be performed in parallel, the inspection time (cycle time) can be further shortened.

  In the first and second embodiments, for convenience of explanation, the control process of the control unit 30a of the component mounting apparatus 30 and the control process of the control unit 40a of the component appearance inspection apparatus 40 are processed in order along the process flow. Although the example described with reference to the flow-driven flowchart for performing the above is shown, the present invention is not limited to this. In the present invention, the control processing of the control units 30a and 40a may be performed by event driven type (event driven type) processing that executes processing in units of events. In this case, it may be performed by a complete event drive type or a combination of event drive and flow drive.

DESCRIPTION OF SYMBOLS 1 Board | substrate 2, 3 Components 2a, 3a First goods 2b, 3b Components 30 Component mounting apparatus 38, 39 Image pick-up part 40 Component appearance inspection apparatus (component inspection apparatus)
100, 200 component mounting system

Claims (6)

A component mounting apparatus for mounting components on a substrate;
A component inspection device for inspecting the mounting state of the component on the substrate by the component mounting device;
When the component is replenished to the component mounting apparatus, the initial state of the replenished component mounted on the substrate for the first time is changed to the mounting state of the initial product on the substrate by the component inspection device. A component mounting system configured to inspect. Information on the component to be replenished to the component mounting apparatus is configured to be able to be stored in the component mounting apparatus when the component is replenished,
The first product is determined based on information on the component stored in the component mounting apparatus, and the mounting state of the first product on the board is inspected by the component inspection device. The component mounting system according to 1. It further comprises an imaging unit that images the mounting state of the component,
The component inspection apparatus is configured to inspect the mounting state of the initial product on the substrate based on the imaging result of the mounting state of the initial product on the substrate captured by the imaging unit. The component mounting system according to claim 1 or 2. When the first product is mounted on the substrate in the component mounting apparatus, the first product mounting information on the mounting position of the first product and the first product is configured to be transmitted to the component inspection device,
The component inspection apparatus is configured to inspect a mounting state of the initial product on the board based on the initial product mounting information transmitted from the component mounting apparatus. The component mounting system according to claim 1. The component mounting apparatus includes an imaging unit that images the mounting state of the component,
When the first product is mounted on the board in the component mounting apparatus, the first product is used in the component inspection apparatus based on the imaging result of the mounting state of the first product imaged by the imaging unit on the board. The component mounting system according to any one of claims 1 to 3, wherein the component mounting system is configured to inspect a mounting state on the board. The image data of the mounting state of the first product imaged by the imaging unit on the substrate is configured to be transmitted from the component mounting device to the component inspection device,
The component mounting system according to claim 5, wherein the component inspection device is configured to inspect a mounting state of the initial product on the board based on the image data transmitted from the component mounting device. .

Images